Freescale Semiconductor MPC8349EA PowerQUICC II Pro User manual

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© Freescale Semiconductor, Inc., 2006. All rights reserved.
Freescale Semiconductor
Technical Data
The MPC8349EA contains a PowerPC™ processor core
(built on Power Architecture™ technology) with system
logic for networking, storage, and general-purpose
embedded applications. For functional characteristics of the
processor, refer to the MPC8349EA PowerQUICC™ II Pro
Integrated Host Processor Reference Manual.
To locate published errata or updates for this document,
contact your Freescale sales office.
NOTE
The information in this document is accurate
for revision 3.0 silicon and later. For
informationonrevision1.1siliconandearlier
versions, see the MPC8349E
PowerQUICC™ II Pro Integrated Host
Processor Hardware Specifications. See
Section 23.1, “Part Numbers Fully
Addressed by this Document,” for silicon
revision level determination.
MPC8349EAEC
Rev. 2, 8/2006
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 7
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 12
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 21
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 24
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8. Ethernet: Three-Speed Ethernet, MII Management . 34
9. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
11. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
13. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
14. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
15. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
17. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
18. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 75
19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
21. System Design Information . . . . . . . . . . . . . . . . . . 103
22. Document Revision History . . . . . . . . . . . . . . . . . . 109
23. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 109
MPC8349EA PowerQUICC™ II Pro
Integrated Host Processor Hardware
Specifications

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
2Freescale Semiconductor
Overview
1 Overview
This section provides a high-level overview of the MPC8349EA features. Figure 1 shows the major
functional units within the MPC8349EA.
Figure 1. MPC8349EA Block Diagram
Major features of the MPC8349EA are as follows:
• Embedded PowerPC e300 processor core; operates at up to 667 MHz
— High-performance, superscalar processor core
— Floating-point, integer, load/store, system register, and branch processing units
— 32-Kbyte instruction cache, 32-Kbyte data cache
— Lockable portion of L1 cache
— Dynamic power management
— Software-compatible with the other Freescale processor families that implement the PowerPC
architecture
• Double data rate, DDR1/DDR2 SDRAM memory controller
— Programmable timing supporting DDR1 and DDR2 SDRAM
— 32- or 64-bit data interface, up to 400 MHz data rate
— Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable
— DRAM chip configurations from 64 Mbits to 1 Gbit with x8/x16 data ports
— Full error checking and correction (ECC) support
Coherent System Bus
PCI1
10/100/1Gb
MII, GMII, TBI,
RTBI, RGMII
MII, GMII, TBI,
RTBI, RGMII
SPI
Serial
IRQs
ROM
10/100/1Gb
I2C
TSEC
I2C Interfaces TSEC
DDR/DDR2
Memory Controller
Local Bus Controller
Programmable Interrupt
Controller
DUART
e300 Core
DMA Controller
Serial Peripheral
Interface
32-Kbyte L1
Instruction
Cache
32-Kbyte
L1 Data
Cache
Sequencer
SEQ
64/32b PCI Controller
PCI2
0/32b PCI Controller
Security Engine
Arbiter Bus
Monitor
USB Hi-Speed
Host Device
General Purpose I/O
USB0
USB1
GPIO
SDRAM
DDR/DDR2
SDRAM
DMA

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 3
Overview
— Support for up to 16 simultaneous open pages (up to 32 pages for DDR2)
— Contiguous or discontiguous memory mapping
— Read-modify-write support
— Sleep-mode support for SDRAM self refresh
— Auto refresh
— On-the-fly power management using CKE
— Registered DIMM support
— 2.5-V SSTL2 compatible I/O for DDR1, 1.8-V SSTL2 compatible I/O for DDR2
• Dual three-speed (10/100/1000) Ethernet controllers (TSECs)
— Dual controllers designed to comply with IEEE Std. 802.3™, 802.3u, 820.3x, 802.3z, 802.3ac
— Ethernet physical interfaces:
– 1000 Mbps IEEE Std. 802.3 GMII/RGMII, IEEE Std. 802.3z TBI/RTBI, full-duplex
– 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex
— Buffer descriptors are backward-compatible with MPC8260 and MPC860T 10/100
programming models
— 9.6-Kbyte jumbo frame support
— RMON statistics support
— Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module
— MII management interface for control and status
— Programmable CRC generation and checking
• Dual PCI interfaces
— Designed to comply with PCI specification revision 2.3
— Data bus width options:
– Dual 32-bit data PCI interfaces operating at up to 66 MHz
– Single 64-bit data PCI interface operating at up to 66 MHz
— PCI 3.3-V compatible
— PCI host bridge capabilities on both interfaces
— PCI agent mode on PCI1 interface
— PCI-to-memory and memory-to-PCI streaming
— Memory prefetching of PCI read accesses and support for delayed read transactions
— Posting of processor-to-PCI and PCI-to-memory writes
— On-chip arbitration supporting five masters on PCI1, three masters on PCI2
— Accesses to all PCI address spaces
— Parity supported
— Selectable hardware-enforced coherency
— Address translation units for address mapping between host and peripheral
— Dual address cycle for target

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
4Freescale Semiconductor
Overview
— Internal configuration registers accessible from PCI
• Security engine is optimized to handle all the algorithms associated with IPSec, SSL/TLS, SRTP,
IEEE Std. 802.11i™, iSCSI, and IKE processing. The security engine contains four
crypto-channels, a controller, and a set of crypto execution units (EUs):
— Public key execution unit (PKEU) :
– RSA and Diffie-Hellman algorithms
– Programmable field size up to 2048 bits
– Elliptic curve cryptography
– F2m and F(p) modes
– Programmable field size up to 511 bits
— Data encryption standard (DES) execution unit (DEU)
– DES and 3DES algorithms
– Two key (K1, K2) or three key (K1, K2, K3) for 3DES
– ECB and CBC modes for both DES and 3DES
— Advanced encryption standard unit (AESU)
– Implements the Rijndael symmetric-key cipher
– Key lengths of 128, 192, and 256 bits
– ECB, CBC, CCM, and counter (CTR) modes
— XOR parity generation accelerator for RAID applications
— ARC four execution unit (AFEU)
– Stream cipher compatible with the RC4 algorithm
– 40- to 128-bit programmable key
— Message digest execution unit (MDEU)
– SHA with 160-, 224-, or 256-bit message digest
– MD5 with 128-bit message digest
– HMAC with either algorithm
— Random number generator (RNG)
— Four crypto-channels, each supporting multi-command descriptor chains
– Static and/or dynamic assignment of crypto-execution units through an integrated controller
– Buffer size of 256 bytes for each execution unit, with flow control for large data sizes
• Universal serial bus (USB) dual role controller
— USB on-the-go mode with both device and host functionality
— Complies with USB specification Rev. 2.0
— Can operate as a stand-alone USB device
– One upstream facing port
– Six programmable USB endpoints
— Can operate as a stand-alone USB host controller
– USB root hub with one downstream-facing port

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 5
Overview
– Enhanced host controller interface (EHCI) compatible
– High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations
— External PHY with UTMI, serial and UTMI+ low-pin interface (ULPI)
• Universal serial bus (USB) multi-port host controller
— Can operate as a stand-alone USB host controller
– USB root hub with one or two downstream-facing ports
– Enhanced host controller interface (EHCI) compatible
– Complies with USB specification Rev. 2.0
— High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations
— Direct connection to a high-speed device without an external hub
— External PHY with serial and low-pin count (ULPI) interfaces
• Local bus controller (LBC)
— Multiplexed 32-bit address and data operating at up to 133 MHz
— Eight chip selects for eight external slaves
— Up to eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by an on-chip memory controller
— Three protocol engines on a per chip select basis:
– General-purpose chip select machine (GPCM)
– Three user-programmable machines (UPMs)
– Dedicated single data rate SDRAM controller
— Parity support
— Default boot ROM chip select with configurable bus width (8-, 16-, or 32-bit)
• Programmable interrupt controller (PIC)
— Functional and programming compatibility with the MPC8260 interrupt controller
— Support for 8 external and 35 internal discrete interrupt sources
— Support for 1 external (optional) and 7 internal machine checkstop interrupt sources
— Programmable highest priority request
— Four groups of interrupts with programmable priority
— External and internal interrupts directed to host processor
— Redirects interrupts to external INTA pin in core disable mode.
— Unique vector number for each interrupt source
• Dual industry-standard I2C interfaces
— Two-wire interface
— Multiple master support
— Master or slave I2C mode support
— On-chip digital filtering rejects spikes on the bus

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
6Freescale Semiconductor
Overview
— System initialization data optionally loaded from I2C-1 EPROM by boot sequencer embedded
hardware
• DMA controller
— Four independent virtual channels
— Concurrent execution across multiple channels with programmable bandwidth control
— Handshaking (external control) signals for all channels: DMA_DREQ[0:3],
DMA_DACK[0:3], DMA_DDONE[0:3]
— All channels accessible to local core and remote PCI masters
— Misaligned transfer capability
— Data chaining and direct mode
— Interrupt on completed segment and chain
• DUART
— Two 4-wire interfaces (RxD, TxD, RTS, CTS)
— Programming model compatible with the original 16450 UART and the PC16550D
• Serial peripheral interface (SPI) for master or slave
• General-purpose parallel I/O (GPIO)
— 64 parallel I/O pins multiplexed on various chip interfaces
• System timers
— Periodic interrupt timer
— Real-time clock
— Software watchdog timer
— Eight general-purpose timers
• Designed to comply with IEEE Std. 1149.1™, JTAG boundary scan
• Integrated PCI bus and SDRAM clock generation

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 7
Electrical Characteristics
2 Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal charaistics for the
MPC8349EA. The MPC8349EA is currently targeted to these specifications. Some of these specifications
are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O
buffer design specifications.
2.1 Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1 Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic Symbol Max Value Unit Notes
Core supply voltage VDD –0.3 to 1.32 V
PLL supply voltage AVDD –0.3 to 1.32 V
DDR and DDR2 DRAM I/O voltage GVDD –0.3 to 2.75
–0.3 to 1.98
V
Three-speed Ethernet I/O, MII management voltage LVDD –0.3 to 3.63 V
PCI, local bus, DUART, system control and power management, I2C,
and JTAG I/O voltage
OVDD –0.3 to 3.63 V
Input voltage DDR DRAM signals MVIN –0.3 to (GVDD + 0.3) V 2, 5
DDR DRAM reference MVREF –0.3 to (GVDD + 0.3) V 2, 5
Three-speed Ethernet signals LVIN –0.3 to (LVDD + 0.3) V 4, 5
Local bus, DUART, CLKIN, system control and
power management, I2C, and JTAG signals
OVIN –0.3 to (OVDD + 0.3) V 3, 5
PCI OVIN –0.3 to (OVDD + 0.3) V 6
Storage temperature range TSTG –55 to 150 •C
Notes:
1. Functional and tested operating conditions are given in Tab l e 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on
reset and power-down sequences.
5. (M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6. OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 3.

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
8Freescale Semiconductor
Electrical Characteristics
2.1.2 Power Supply Voltage Specification
Table 2 provides the recommended operating conditions for the MPC8349EA. Note that the values in
Table 2 are the recommended and tested operating conditions. Proper device operation outside these
conditions is not guaranteed.
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8349EA.
Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD
Table 2. Recommended Operating Conditions
Characteristic Symbol Recommended
Value Unit Notes
Core supply voltage VDD 1.2 V ± 60 mV V 1
PLL supply voltage AVDD 1.2 V ± 60 mV V 1
DDR and DDR2 DRAM I/O voltage GVDD 2.5 V ± 125 mV
1.8 V ± 90 mV
V
Three-speed Ethernet I/O supply voltage LVDD1 3.3 V ± 330 mV
2.5 V ± 125 mV
V
Three-speed Ethernet I/O supply voltage LVDD2 3.3 V ± 330 mV
2.5 V ± 125 mV
V
PCI, local bus, DUART, system control and power
management, I2C, and JTAG I/O voltage
OVDD 3.3 V ± 330 mV V
Notes:
1. GVDD, LVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or
negative direction.
GND
GND – 0.3 V
GND – 0.7 V Not to Exceed 10%
G/L/OVDD + 20%
G/L/OVDD
G/L/OVDD + 5%
of tinterface1
1. tinterface refers to the clock period associated with the bus clock interface.
VIH
VIL
Note:

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 9
Electrical Characteristics
Figure 3 shows the undershoot and overshoot voltage of the PCI interface of the MPC8349EA for the
3.3-V signals, respectively.
Figure 3. Maximum AC Waveforms on PCI interface for 3.3-V Signaling
2.1.3 Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 3. Output Drive Capability
Driver Type Output Impedance
(Ω)
Supply
Voltage
Local bus interface utilities signals 42 OVDD = 3.3 V
PCI signals (not including PCI output clocks) 25
PCI output clocks (including PCI_SYNC_OUT) 42
DDR signal 20 GVDD = 2.5 V
DDR2 signal 16
32 (half strength mode)
GVDD = 1.8 V
TSEC/10/100 signals 42 LVDD = 2.5/3.3 V
DUART, system control, I2C, JTAG 42 OVDD = 3.3 V
GPIO signals 42 OVDD = 3.3 V,
LVDD = 2.5/3.3 V
Undervoltage
Waveform
Overvoltage
Waveform
11 ns
(Min)
+7.1 V
7.1 V p-to-p
(Min)
4 ns
(Max)
–3.5 V
7.1 V p-to-p
(Min)
62.5 ns
+3.6 V
0 V
4 ns
(Max)

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
10 Freescale Semiconductor
Electrical Characteristics
2.2 Power Sequencing
MPC8349EA does not require the core supply voltage and I/O supply voltages to be applied in any
particular order. Note that during the power ramp up, before the power supplies are stable, there may be a
period of time that I/O pins are actively driven. After the power is stable, as long as PORESET is asserted,
most I/O pins are tri-stated. To minimize the time that I/O pins are actively driven, it is recommended to
apply core voltage before I/O voltage and assert PORESET before the power supplies fully ramp up.

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Freescale Semiconductor 11
Electrical Characteristics

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
12 Freescale Semiconductor
Power Characteristics
3 Power Characteristics
The estimated typical power dissipation for the MPC8349EA device is shown in Table 4.
Table 4. MPC8349EA Power Dissipation 1
1
The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Ta b l e 5 .
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
Typical at TJ= 65 Typical 2
,3
2
Typical power is based on a voltage of Vdd = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3
Thermal solutions may need to design to a value higher than typical power based on the end application, TAtarget, and I/O
power.
Maximum 4
4
Maximum Power is based on a voltage of Vdd = 1.2 V, worst case process, a junction temperature of TJ= 105°C, and an
artificial smoke test.
Unit
TBGA
333 333 2.0 3.0 3.2 W
166 1.8 2.8 2.9 W
400 266 2.1 3.0 3.3 W
133 1.9 2.9 3.1 W
450 300 2.3 3.2 3.5 W
150 2.1 3.0 3.2 W
500 333 2.4 3.3 3.6 W
166 2.2 3.1 3.4 W
533 266 2.4 3.3 3.6 W
133 2.2 3.1 3.4 W
667 333 3.5 4.6 5 W

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 13
Power Characteristics
Table 5 shows the estimated typical I/O power dissipation for MPC8349EA.
Table 5. MPC8349EA Typical I/O Power Dissipation
Interface Parameter GVDD
(1.8 V)
GVDD
(2.5 V)
OVDD
(3.3 V)
LVDD
(3.3 V)
LVDD
(2.5 V) Unit Comments
DDR I/O
65% utilization
2.5 V
Rs = 20 Ω
Rt = 50 Ω
2 pair of
clocks
200 MHz, 32 bits 0.31 0.42 W
200 MHz, 64 bits 0.42 0.55 W
266 MHz, 32 bits 0.35 0.5 W
266 MHz, 64 bits 0.47 0.66 W
300 MHz, 32 bits 0.37 0.54 W
300 MHz, 64 bits 0.50 0.7 W
333 MHz, 32 bits 0.39 0.58 W
333 MHz, 64 bits 0.53 0.76 W
400 MHz, 32 bits 0.44
400 MHz, 64 bits 0.59
PCI I/O
Load = 30 pf
33 MHz, 64 bits 0.08 W
66 MHz, 64 bits 0.14 W
33 MHz, 32 bits 0.04 W Multiply by 2 if using 2 ports.
66 MHz, 32 bits 0.07 W
Local Bus I/O
Load = 25 pf
133 MHz, 32 bits 0.27 W
83 MHz, 32 bits 0.17 W
66 MHz, 32 bits 0.14 W
50 MHz, 32 bits 0.11 W
TSEC I/O
Load = 25 pf
MII 0.01 W Multiply by number of
interfaces used.
GMII or TBI 0.06 W
RGMII or RTBI 0.04 W
USB
12 MHz 0.01 W Multiply by 2 if using 2 ports.
480 MHz 0.2 W
Other I/O 0.01 W

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14 Freescale Semiconductor
Power Characteristics

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Freescale Semiconductor 15
Power Characteristics

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Power Characteristics

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Freescale Semiconductor 17
Power Characteristics

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
18 Freescale Semiconductor
Power Characteristics

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor 19
Clock Input Timing
4 Clock Input Timing
This section provides the clock input DC and AC electrical characteristics for the MPC8349EA.
4.1 DC Electrical Characteristics
Table 7 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8349EA.
4.2 AC Electrical Characteristics
The primary clock source for the MPC8349EA can be one of two inputs, CLKIN or PCI_CLK, depending
on whether the device is configured in PCI host or PCI agent mode. Table 7 provides the clock input
(CLKIN/PCI_CLK) AC timing specifications for the MPC8349EA.
Table 6. CLKIN DC Electrical Characteristics
Parameter Condition Symbol Min Max Unit
Input high voltage — VIH 2.7 OVDD+0.3 V
Input low voltage — VIL –0.3 0.4 V
CLKIN Input current 0V ≤VIN ≤ OVDD IIN — ±10 μA
PCI_SYNC_IN Input current 0V ≤VIN ≤ 0.5 V or
OVDD – 0.5 V ≤VIN ≤ OVDD
IIN — ±10 μA
PCI_SYNC_IN Input current 0.5 V ≤VIN ≤ OVDD - 0.5 V IIN — ±50 μA
Table 7. CLKIN AC Timing Specifications
Parameter/Condition Symbol Min Typical Max Unit Notes
CLKIN/PCI_CLK frequency fCLKIN ——66MHz1
CLKIN/PCI_CLK cycle time tCLKIN 15 — — ns —
CLKIN/PCI_CLK rise and fall time tKH, tKL 0.6 1.0 2.3 ns 2
CLKIN/PCI_CLK duty cycle tKHK/tCLKIN 40 — 60 % 3
CLKIN/PCI_CLK jitter — — — +/– 150 ps 4, 5
Notes:
1. Caution: The system, core, USB, security, and TSEC must not exceed their respective maximum or minimum
operating frequencies.
2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be <500 kHz at -20 dB. The bandwidth must be set
low to allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter.

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 2
20 Freescale Semiconductor
Clock Input Timing