Hitachi S10Mini SV.Link User manual

First Edition, July 2001, SME-1-116(A)
All Rights Reserved, Copyright 2001, Hitachi, Ltd.
The contents of this publication may be revised without prior notice.
No part of this publication may be reproduced in any form or by any means without permission
in writing from the publisher.
Printed in Japan.
BI-NR-HS<HE-HE>(FL-MW97)

SAFETY PRECAUTIONS
Be sure to read this manual and all other attached documents carefully before installing, operating
inspecting or conducting maintenance on this unit. Always use this unit properly. Be sure to
carefully read the information about the device, the safety information and precautions before using
this unit. Be sure that the person(s) responsible for maintenance receives and understands this
manual completely.
This manual divides the safety precautions into DANGERs and CAUTIONs.
: Failure to observe these warnings may result in death or serious injury.
: Failure to observe these cautions may result in injury or property damage.
Failuretoobserveany may lead to serious consequences.
All of these DANGERs and CAUTIONs provide very important precautions and should always be
observed.
Additional safety symbols representing a prohibition or a requirement are as follows:
DANGER
CAUTION
: Prohibition. For example, “Do not disassemble” is represented by:
: Requirement. For example, if a ground is required, the following will be shown:
CAUTION

DANGER
iDevise an emergency stop circuit, interlock circuit, and other similar circuits
outside the programmable controller. Disregarding this rule may result in
damage to the equipment or cause an accident if the programmable controller
fails.
iKeep it in mind that this hardware unit operates on a high voltage. If the user
touches a high-voltage terminal inadvertently during connection or disconnection
of this hardware unit or its cable, he or she may suffer from an electric shock.
Also, this hardware unit may be damaged due to a short circuit or noise. Be
sure to switch off the hardware unit before connecting or disconnecting it or its
cable.
iTurn off the power before making connections to the terminal block. Wiring
with the power turned on may incur electrical shock hazards.
CAUTION
iThis hardware unit may fail if the ambient temperature is too high. The
hardware unit may also malfunction due to interference by electromagnetic
waves from adjacent hardware. To dissipate heat and reduce electromagnetic
interference, provide the specified mount of space between the cubicle and this
programmable controller and between the programmable controller and other
ones.
iAfter installing this hardware unit, measure temperatures near the in-cubicle
controller and the mount base during operation, and check whether the
measurements are within the limits. If the specified amount of space cannot be
provided or the measured temperature is too high, use a cooling fan.
iAt an extremely high temperature, this hardware unit may fail. Secure the
mount base to a vertical surface. If the mount base is secured horizontally,
heat does not dissipate efficiently, resulting in an extremely high temperature.
This may further cause the hardware unit to fail or its parts to deteriorate.
iThis hardware unit may be damaged due to static electricity. Ground yourself
before setting switches or connecting or disconnecting cables or connectors with
the hardware unit.
iThis hardware unit may be damaged during its installation or removal unless the
following rules are observed:
・Check that the connector pins are not damaged (bent or broken), are aligned
straight and are free from dust.
・Move the hardware unit along an imaginary vertical surface to the face of the
mount base. If the product is inserted or removed slantwise from the
connector on the mount base, connector pins may be bent.
iTurn off the power before operating the MAIN/SUB selector switch or the CPU
No. selector switch. Operating these switches with the power turned on may
cause the module to fail.

REQUIREMENT
iAn electric shock may lead to a death or burn. Noise may cause the system to
malfunction. Ground the line ground (LG), frame ground (FG), and shield
(SHD) terminals, as described below.
・Electrically insulate the mount base from the cubicle. To assure this, do not
remove the insulating sheet from the mount base.
・Ground the LG and FG terminals separately to prevent mutual interference.
The LG terminal is grounded to prevent intrusion of power line noise, while
FG and SHD terminals are grounded to suppress intrusion of line noise into
external interfaces for remote I/O modules, interface modules, and other
modules.
REQUIREMENT
iExcessive accumulation of heat in the cubicle may cause a fire or hardware
failure. When the temperature in the cubicle reaches 48℃or higher, the
maximum output current of the power supply module is limited. At 55℃, for
instance, it is limited to 5.85 A. Where this is very likely, install a cooling fan in
the cubicle or reduce the number of modules installed therein.
iIf a part in a module is damaged, do not replace the part, but replace the faulty
module in its entirety.

WARRANTY AND SERVICING
Unless a special warranty contract has been arranged, the following warranty is applicable to this
product.
1. Warranty period and scope
Warranty period
The warranty period for this product is for one year after the product has been delivered to the
specified delivery site.
Scope
If a malfunction should occur during the above warranty period while using this product under
normal product specification conditions as described in this manual, please deliver the
malfunctioning part of the product to the dealer or Hitachi Engineering Service Co., Ltd. The
malfunctioning part will be replaced or repaired free of charge. If the malfunctioning part is
shipped, however, the shipment charge and packaging expenses must be paid for by the customer.
This warranty is not applicable if any of the following are true.
iThe malfunction was caused by handling or use of the product in a manner not specified in the
product specifications.
iThe malfunction was caused by a unit other than that which was delivered.
iThe malfunction was caused by modifications or repairs made by a vendor other than the
vendor that delivered the unit.
iThe malfunction was caused by a relay or other consumable which has passed the end of its
service life.
iThe malfunction was caused by a disaster, natural or otherwise, for which the vendor is not
responsible.
The warranty mentioned here means the warranty for the individual product that is delivered.
Therefore, we cannot by held responsible for any losses or lost profits that result from the
operation of this product or from malfunctions of this product. This warranty is valid only in
Japan and is not transferable.
2. Range of services
The price of the delivered product does not include on-site servicing fees by engineers. Extra
fees will by charged for the following:
iInstruction for installation and adjustments, and witnessing trial operations.
iInspections, maintenance and adjustments.
iTechnical instruction, technical training and training schools.
iExaminations and repairs after the warranty period is concluded.
iEven if the warranty is valid, examination of malfunctions that are caused by reasons outside
the above warranty scope.

i
PREFACE
We greatly appreciate your making use of the CPU option SV.LINK module.
This hardware manual on the option SV.LINK describes how to handle the SV.LINK module. Read
this manual carefully to use the module properly.
* MELSEC is a trademark of MITSUBISHI ELECTRIC CORPORATION.
* Microsoft® Windows® operating system, Microsoft® Windows® 95 operating system and
Microsoft® Windows® 98 operating system are registered trademarks of Microsoft Corporation in
the United States and/or other countries.

ii
CONTENTS
1. BEFORE USE ······················································································································ 1
1.1 CPU mount base ············································································································ 2
1.2 Mounting Optional Modules··························································································· 2
1.3 Ground Wiring ················································································································ 4
2. SPECIFICATIONS··············································································································· 5
2.1 Usage······························································································································· 6
2.2 Specifications ·················································································································· 6
2.2.1 System specifications································································································ 6
2.2.2 Line specifications ···································································································· 7
2.2.3 High-speed I/O communication specifications ························································· 7
3. NAMES AND FUNCTIONS OF EACH PART AND CABLING······································ 9
3.1 Names and Functions of Each Part ················································································· 10
3.2 Cabling ···························································································································· 12
4. USER GUIDE······················································································································· 15
4.1 System Configuration of 10BASE-5··············································································· 16
4.2 10BASE-T System Configuration··················································································· 22
4.3 System Definition Information························································································ 24
4.3.1 Physical address ········································································································ 24
4.3.2 IP address ·················································································································· 24
4.3.3 Subnetwork mask······································································································ 26
4.3.4 Route information ····································································································· 26
4.4 Software Configuration of ET.NET················································································ 27
4.5 SV.LINK System Programs ···························································································· 28
4.5.1 High-speed I/O communication program·································································· 28
4.5.2 UDP program ············································································································ 28
4.5.3 IP program················································································································· 28
4.5.4 Driver ························································································································ 28
4.6 User-created Program······································································································ 29
4.6.1 Ladder program········································································································· 29
4.7 Status and Communication Parameter Areas·································································· 30
4.8 Communication Start Procedure and Communication Delay Time Setup······················ 37
4.8.1 Communication start procedure················································································ 37

iii
4.8.2 Communication delay time setup ·············································································· 38
4.9 Ladder Program Example································································································ 39
4.10 Relationship to CPU Module ·························································································· 41
4.11 Communication Cycle ····································································································· 42
4.12 Limitations······················································································································· 43
5. OPERATION ························································································································ 45
5.1 Start-up Procedure ··········································································································· 46
6. MAINTENANCE ················································································································· 49
6.1 Maintenance Inspection··································································································· 50
6.2 Troubleshooting··············································································································· 51
6.2.1 Procedure··················································································································· 51
6.2.2 Before suspecting a failure ························································································ 52
6.3 Errors and Actions To Be Taken ····················································································· 54
6.3.1 CPU LED display messages ······················································································ 54
6.3.2 Hardware errors········································································································· 55
6.3.3 Communication error codes ······················································································ 58
7. APPENDIX ··························································································································· 61
7.1 SV.LINK State Transitions······························································································ 62
7.2 CPU Memory Map ·········································································································· 63
7.3 Memory Map of SV.LINK Module················································································· 64
7.4 Trouble Investigation Sheet····························································································· 65

THIS PAGE INTENTIONALLY LEFT BLANK.

1 BEFORE USE

1 BEFORE USE
- 2 -
1.1 CPU mount base
There are three types of CPU mount bases:
 2-slot mount base (model: HSC-1020)
 4-slot mount base (model: HSC-1040)
 8-slot mount base (model: HSC-1080)
On the 8-slot mount base, for example, up to eight
modules, except the power supply module and
CPU module, can be mounted.
1.2 Mounting Optional Modules
CPU mount base: HSC-1080
PS slot: A slot into which the CPU power
supply (LQV000, LQV020 or
LQV100) module is inserted.
CPU slot: A slot into which the CPU module
(LQP000, LQP010, LQP011 or
LQP120) is inserted.
Slots 0 to 7: Slots into which optional modules or
I/O modules.
CAUTION
 Insert SV.LINK modules sequentially into the slots, starting from the leftmost
slot, without creating any empty slots in between. Do not insert I/O modules
between SV.LINK modules.
 When mounting the SV.LINK module and ET.NET module on the same mount
base, perform setup so that the main module and submodule are distinctively
defined.
Example: If the ET.NET module is defined as the main module, be sure to define
the SV.LINK module as the submodule. If the ET.NET module is defined as
the submodule, be sure to define the SV.LINK module as the main module.
 A total of up to two modules (ET.NET and SV.LINK modules) can be mounted
on the same mount base.
 Even if no ET.NET module is installed, you can mount only one SV.LINK
module.
CPU mount base
8-slot mount base (HSC-1080)
Option slots
CPU mount base
CPU powe
r
supply module
CPU
module
SV.LINK module
(Insert modules of this type sequentially into
the slots, starting from the leftmost slot.)

1 BEFORE USE
- 3 -
When mounting an option module, observe following rules.
 Mount the module straight to the front of the CPU mount base. If it is mounted at a slant as
shown in the bad examples, the connectors may be damaged and the option module may
malfunction.
[Bad examples] [Good example]
CAUTION
When the CPU mount base is located over the head because of the cabinet
structure used, take care not to mount the optional modules aslant by using a
stepladder or the like.

1 BEFORE USE
- 4 -
1.3 Ground Wiring
Ground the unit according to the following figure:
 Grounding for 10BASE-5
GND
12V
10BASE
-T
10BASE
-5
FG
Class D grounding
Within 2 m
2 mm2or more
12 VDC
 Grounding for 10BASE-T (Do not connect the FG of the SV.LINK module.)
2 mm2or more
GND
12V
10BASE
-T
10BASE
-5
FG
Class D grounding
Within 2 m
* Class D grounding is defined in the Technical Standard for Electrical Facilities of Japan.
This standard states that the grounding resistance must be 100 ohms or less for equipment
operating on 300 VAC or less, and 500 ohms or less for devices that shut down automatically
within 0.5 seconds when shorting occurs in low tension lines.
REQUIREMENT
 Ground the FG (frame ground) terminal as follows: Connect the FG terminal on
each module provided with external terminals to the grounding terminal on the
mount base. Make sure that the line used for grounding is at most 2 m long.
Perform Class D grounding for the grounding terminal on the mount base.
 Use ground lines whose size is 2mm2or more.
 Do not touch the 10BASE-5 connector during power-on. Otherwise, the system
may malfunction due to static electricity, etc.

2 SPECIFICATIONS

2 SPECIFICATIONS
- 6 -
2.1 Usage
The SV.LINK module (Model LQE021) is used in conjunction with the MELSEC A Series
sequencer or motion controller from Mitsubishi Electric Corp. (hereinafter abbreviated to
Mitsubishi) to exercise the high-speed I/O communication function on a peer-to-peer basis.
The high-speed I/O communication function is exercised to rapidly exchange I/O data between
the S10mini and MELSEC device over an IEEE802.3-compliant physical line by using the
UDP/IP protocol.
Transmission area
Reception area
Reception area
Transmission area
Up to four areas can be
specified for transmission or
reception.
S10mini Mitsubishi's MELSEC A Series
S10mini I/O memory MELSEC I/O memory
IEEE802.3-compliant physical line
Memory transfer
2.2 Specifications
2.2.1 System specifications
Item Specification
Model LQE021
Maximum number of installable SV.LINK
modules
1 per CPU. (Insert SV.LINK modules
sequentially into the slots, starting from the
leftmost slot.)
Module width One slot wide
Weight 240 g
NOTE
When using 10BASE-5 connections, a 12-VDC external power supply is required.

2 SPECIFICATIONS
- 7 -
2.2.2 Line specifications
Item Specification
Transmission method Serial (bit serial) transmission
Electrical interface Conforming to IEEE 802.3 (conforming to CSMA/CD)
standard
Coding system Manchester
Protocol UDP/IP or high-speed I/O communication protocol
Maximum number of connectable units 10BASE-5: 1 per segment
10BASE-T: 1 per hub
Maximum number of stations 2 per network (one unit of S10mini and MELSEC each)
Connection cable 10BASE-5 coaxial cable : Up to 500 m per segment
10BASE-5 transceiver cable : Up to 50 m
10BASE-T twisted-pair cable: Up to 100 m per segment
Data transmission rate 10 Mbps
2.2.3 High-speed I/O communication specifications
Item Specifications
Communication style Peer-to-peer communication (between the S10mini and
MELSEC)
Applicable Mitsubishi sequencer Sequencer or motion controller in which the MELSEC
A Series Ethernet interface unit (Model AJ71E71 or
equivalent) is mounted
Port number used Fixed at 34100 (decimal notation; for both the S10mini
and MELSEC)
IP address used Any address is usable. However, the S10mini and
MELSEC must agree with each other in network
address.
Supported communication function Cyclic communication based on the MELSEC's fixed-
buffer communication function (asynchronous)
S10mini communication areas Bit registers: X, Y, J, Q, R, M, G, and E registers
Word registers: DW and FW registers
Up to four areas can be specified for transmission and
reception each.
Transmission/reception
communication word count
Bit register: 40 words max.
Word register: 256 words max.
(256 words maximum for a total of four areas)
Communication cycle Determined according to the transmission/reception
word count, communication delay time, and MELSEC
response time. See Section 4.11, "Communication
Cycle."
I/O data consistency guarantee unit One word
Note: For the fixed-buffer communication function (asynchronous) of MELSEC, refer to the
MELSEC documentation.

2 SPECIFICATIONS
- 8 -
NOTE
 The physical line between the S10mini and MELSEC must be exclusively used
for high-speed I/O communications. Ensure that nothing is connected to the
physical line except for the S10mini and MELSEC.
 When using two high-speed I/O communication channels, provide a physical line
for each channel.

3 NAMES AND FUNCTIONS
OF EACH PART AND
CABLING

3 NAMES AND FUNCTIONS OF EACH PART AND CABLING
- 10 -
3.1 Names and Functions of Each Part
No. Name Function
①TX LED Lights during data transfer.
②RX LED Lights when data flows on the transmission line
(when a carrier is detected).
③ERR LED Lights when a hardware error or user setup
parameter error is detected.
④Module
number switch
Specifies the main module or submodule and also
sets a communication port type. The setting of this
switch becomes effective when resetting of the
computer system is completed.
Module No.
Main Sub Description
0 1 Communication using 10BASE-5
connections
2 3 Communication using 10BASE-T
connections
4 5 Error
6 7 Error
8 9 Error
A B Error
C D Error
E F Error
⑤10BASE-5
connector
Connects to Mitsubishi's MELSEC sequencer or
motion controller.
⑥10BASE-T
connector
Connects to Mitsubishi's MELSEC sequencer or
motion controller.
⑦Power input
terminal
Connects with the power supply (12 VDC) for a
transceiver which is connected with 10BASE-5.
⑧Frame ground Connected to the shield line of the transceiver cable.
CAUTION
When setting the module No. switch, turn off the power switch. Otherwise, the
system may malfunction.
①
②
③
④
⑤
⑥
⑦
⑧
LQE021 SV.LINK
TX
RX
ERR
MODU.
NO
10BASE
-5
10BASE
-T
12V
GND
FG