HP QL322A Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HP/3PAR Drive Chassis 16-Disk (QL322A)
HP/3PAR Drive Chassis 16-Disk (QL243A)
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
18 to 26
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
10
External electrical cables and cords
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
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PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips Screwdriver
#1
Screwdriver
Slotted
Description #3
plier
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. SBOD unit from the System
2. Remove the Power Supplies from Back Side
3. Remove the IO modules from the Back Side
4. Remove the Hard Drives from the Front Side
5. Remove the Control Panel from Back Side
6. Remove Center Plane from Chassis
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Disassembling SBOD Power Supplies (PS):
At the rear of the Drive chassis, grasp each latch between the thumb and forefinger of each hand. Squeeze thumb and forefinger
together to release the latch. Pull the latches forward to cam the module out of the enclosure. Grip the latch handles and withdraw the
module.

EL-MF877-00 Page 3
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PSG instructions for this template are available at EL-MF877-01
Use the following diagram for power supply disassembly:
AC PSU:

EL-MF877-00 Page 4
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PSG instructions for this template are available at EL-MF877-01
Item Material
A Sheet Metal
B Plastic
C Steel
D Polycarbonate
E ABS
Item Materials Hazards
Power Socket Polycarbonate, steel...
Switch Polycarbonate, steel...
Fan
Steeel, iron, plastic, PCB, copper
Lead
Large PCB Copper, aluminium alloy... Lead
Small PCB Copper, aluminium alloy... Lead
Remove Chassis cover screws.

EL-MF877-00 Page 5
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PSG instructions for this template are available at EL-MF877-01
Disconnect Fan connectors.
Remove 4 screws from the small PCBA.
Cut the tie wraps and disconnect from large PCBA.
Disconnect from switch PCBA.
Remove Support Tray.

EL-MF877-00 Page 6
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Remove the large capacitor from the Small PCBA.
Remove the Connector PCBA
Remove standoffs and the large PCBA screws.
Remove the 4 caps from the main PCBA.
DC PSU:
Remove the power supply from the drive chassis using the same method as AC PSU:

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Use the same legend as AC PSU.
Disassembling SBOD IO Modules:
At the rear of the drive chassis, grasp each latch between
the thumb and forefinger of each hand. Squeeze thumb and
forefinger together to release the latch. Pull the latches
forward to cam the module out of the enclosure.
Grip the latch handles and withdraw the
module.
Item Material Hazards
A
Aluminium Alloy
B
Polycarbonate
C
PCB
Lead
All Screws, nuts and washers are zinc plated steel
Remove PCBA by removing the four screws from the bottom
of the IOM.

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Disassembling Hard Drive Modules:
Release the carrier handle by pressing
the latch in the handle towards the right
Withdraw the module from the drive bay.
To remove hard drive: remove the 2 screws from the rear PCBA (if present) and remove the 4 screws from the bottom.

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PSG instructions for this template are available at EL-MF877-01
Item
Material
Hazards
A
Hard Disk Drive
B Aluminium alloy A380
C Plain spring steel
D
Zinc alloy 3
E
Polycarbonate
G
Beryllium copper 190 alloy XHM. ASTM B194 1996
Lead
H Silicon Grease
I
PCB
Lead
All Screws, nuts and washers are zinc plated steel
Disassembling Control Panel:
At the rear of the drive chassis, remove the two screws
shown and pull out the PCBA. Remove the four screws from the PCBA to bracket assy to remove the PCBA.

EL-MF877-00 Page 10
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PSG instructions for this template are available at EL-MF877-01
Item
Material Hazards
A Aluminium Alloy 380
B PCB Lead
C Polycarbonate
All Screws, nuts and washers are zinc plated steel
Disassembling Center Plane (aka Mid-Plane) PCBA:
Remove the EMI fingers from all of the drive bays.
Remove one drive wall screw from each drive wall from the top, and one screw from each drive wall the bottom.
Remove the three mid drive-walls.
Remove the midplane screws to remove the midplane.

EL-MF877-00 Page 11
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Item
Material
Hazards
A
ZINTEC A/F
B Aluminium
C
Polycarbonate
D PCB Lead
E
Tin-lead plate Copper
ECP 0613/08 bright tin plate
Lead
F
Polycarbonate with aluminium inserts
Gaskets
All Screws, nuts and washers are zinc plated steel