HPE ProLiant DL380 Gen9 Assembly instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE ProLiant DL380 Gen9
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
8
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Depending on Power Supply Model
1
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T15
Torx Driver
T10
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Open the retaining latch fully and lift access panel up and off of the server.
2. Pinch both locking latches to unlock the air baffle, lift the air baffle to remove.
3. Rotate up the fan cage handle to unlock the fan cage from the chassis, lift the fan cage straight up and out of the
chassis.
4. Grasp the fan by the finger grooves, pull the fan straight up and out of the fan cage.
5. Disconnect all external cables connected to any installed expansion boards.
6. Loosen the two PCI riser cage thumbscrews by lifting the tabs and rotating them counter clockwise, 180 degrees until
the thumbscrews pop up and disengage from the system board.
7. Lift up evenly on the PCI riser cage to unseat the PCI riser boards from the system board and remove the PCI riser
cage from the server chassis
8. Remove all expansion boards if installed.
9. Loosen the two hex screws that secure the serial port cable to the rear bracket to disconnect the serial port cable
10. Disconnect all mini SAS cables connected to any installed PCAs.
11. Disconnect all power cables connected to any installed PCAs.
12. Disconnect all front cage cables connected to any installed PCAs.
13. Loosen the three thumbscrews that secure the AROC card to the system board, carefully pull the AROC card out of the
system board.
14. Open the DIMMs slot latches, lift the DIMMs up and out of the DIMMs slot
15. Using a cross-torque technique, loosen the four captive T-15 Torx screws in a diagonal pattern to disconnect the heat
sink from the system board, lift the heat sink straight up and out of the chassis.
16. Open the processor socket retaining bracket and the processor locking lever, labeled “Open lever 1st”.
17. Open the second processor locking lever.
18. Remove the processor from the processor socket retaining braket.
19. Press the release tab toward the power cord connector, grasp the power supply handle and pull the power supply out
of the power supply bay.
20. Carefully pull the FlexibleLOM option away from the system board to disengage its connector to the system board.
21. Lift the FlexibleLOM option up and out of the server chassis.
22. Slide the hard drive cage out the front of the server.

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
23. Disconnect the mega cell cable from the system board, lift the mega cell to remove it out of the chassis.
24. Loosen the two screws that secure the hard-drive backplane to the front cage, carefully remove the hard-drive
backplane out of the chassis.
25. Loosen the thumbscrew that secure the system board to the chassis.
26. Grasp the system board by the system board handle and slide it toward the front of the server until it stops.
27. Carefully lift the system board out of the chassis.
28. Capacitors > 2.5CM -- Remove the power supply(s) from the system. With #2 Philips screw driver remove the screws
securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the PCB with a medium flat
head screw driver and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1 –System Battery Location. Remove and dispose of properly
Attachment 2- Location of mega cell. Remove and dispose of properly
Attachment 3~9-- Capacitor location by model number of power supply. Remove and dispose of properly

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01