MF877-00
Template Revision A
HPE instructions for this template are available at MF877-01
Quantity
of items
included
in product
Components, parts and materials containing
radioactivesubstances
List the type and size of the tools that would typically be used to disassemble the product to a point where
components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1.
System Board Battery - Remove the battery from the system board.
2.
Capacitance which is inserted by operator–First, let tin touch the two pin of the capacitance ,second, soldering tin
the
points with Soldering Station which set the temperature to 330 士10oC for L/F model , if non-L/F model,set the
temperature to 300士10oC, remove capacitance from PCB afrer tin completely melting,and then put it into Recycled
Box (Remark:if capacitance which is disassembled is GND ,Set the Soldering Station(Gao
Zhou)temperature to
385oC).
3.
Capacitors in 800W power supply (Chicony) => Remove the power supply from the system.With a Philips screw
driver
remove the screws securing the top cover and loosen the screws securing the PCA. Then use Sharp Nose
Pliers to
remove the daughter card, and electrolyte-capacitor.
4.
Capacitors in 800W and 1400W PSU (Delta) => Push latch and remove PSU from the system. With a Philips
screw
driver remove the screws securing the cover and take the PCA out. Then use Sharp Nose Pliers to
remove the
daughter card, and electrolyte-capacitor. Then use Sharp Nose Pliers to remove the daughter card,
and electrolyte-
capacitor.
5.
6.
7.
8.
9.
3.2
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the
items
contained in the product that require selective treatment (with descriptions and arrows identifying
locations).
