HPE ProLiant XL170r Gen10 Assembly instructions

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE ProLiant XL170r Gen10 Server
HPE ProLiant XL190r Gen10 Server
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
ItemDescription
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies(PCA)
With a surface greater than 10 sq cm
23
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containingcomponents
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode RayTubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
5
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractoryceramic fibers
0
1.0 Items Requiring Selective Treatment

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01
ItemDescription
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactivesubstances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
T15
T20
Philips screw driver
Cross No.1
Cross No. 2
Hex socket
Sharp Nose Pliers
screw driver flat type
Tweezer
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. System Board Battery - Remove the battery from the system board.
2. Capacitance which is inserted by operator–First, let tin touch the two pin of the capacitance ,second, soldering tin
the points with Soldering Station which set the temperature to 330 士10oC for L/F model , if non-L/F model,set the
temperature to 300士10oC, remove capacitance from PCB afrer tin completely melting,and then put it into Recycled
Box (Remark:if capacitance which is disassembled is GND ,Set the Soldering Station(Gao
Zhou)temperature to 385oC).
3. Capacitors in 800W power supply (Chicony) => Remove the power supply from the system.With a Philips screw
driver remove the screws securing the top cover and loosen the screws securing the PCA. Then use Sharp Nose
Pliers to remove the daughter card, and electrolyte-capacitor.
4. Capacitors in 800W and 1400W PSU (Delta) => Push latch and remove PSU from the system. With a Philips
screw driver remove the screws securing the cover and take the PCA out. Then use Sharp Nose Pliers to
remove the daughter card, and electrolyte-capacitor. Then use Sharp Nose Pliers to remove the daughter card,
and electrolyte- capacitor.
5.
6.
7.
8.
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the
items contained in the product that require selective treatment (with descriptions and arrows identifying
locations).

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01
System battery location
System battery location –BH1

MF877-00
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HPE instructions for this template are available at MF877-01
800W PSU (Chicony) Disassemble

MF877-00
Template Revision A
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HPE instructions for this template are available at MF877-01

MF877-00
Template Revision A
Page 6
HPE instructions for this template are available at MF877-01
SMC: System Exploding drawing