HPE Edgeline EL300 Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Edgeline EL300 Converged Edge System
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HPE products to remove components and materials requiring selective treatment, as
defined by EU directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Tool Description
Tool Size (if
applicable)
Torx driver
T10/T15
Philps Driver
#2
Flat Head Screw Driver
Medium
Hexagon Screw Driver
5.0mm
Hex Key
8.0mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. The adapter can’t be disassemble and please dispose it and cable properly.
2. Use Philps Driver#2 to remove screws and take off the metal piece on bottom side.
3. Use Torx Driver#10 to remove screws on left and right sides.
4. Use Flat Head Screw Driver to remove heatsink.
5. Use Hexagon Screw Driver (5.0mm) and Hex Key (8.0mm) to remove screws and hex nuts.
6. Remove the top cover and locate the battery on the system board. With a medium flat head screw driver remove the
battery and dispose of properly.
7. Use Torx driver (T10&T15) to remove screws that fixed on 2 PCBA.
8. Use Torx driver (T10&T15) to remove screws fixed on mother board please refer to pictures.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1:
Attachment 1 – System Coin Battery location
Attachment 2 – Capacitor location by model number of supply

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
Attachment 2: