HPE Altoline 9960 LC1 Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE Altoline 9960 LC1 32x100G Line Card (JC912A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
AL-POLY capacitor
87
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver
M3
Nut spinner screwdriver
5mm
Nut spinner screwdriver
5.5mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the CPU board
1. Using a 5.5mm Nut spinner screwdriver, remove the 5pcs nuts attaching the CPU board.
2. Remove the CPU board off the chassis.
3. Repeat for the other CPU board.
2. Remove the spacers
1. Using a 5mm Nut spinner screwdriver, remove the 5pcs spacers under the CPU board.
2. Repeat for the other 5pcs spacers.
3. Remove the mainboard
1. Using a Phillips screwdriver, remove the 12pcs screws attaching the mainboard.
2. Remove the mainboard.
4. Remove the heatsink and bracket on the mainboard
1. Using a Phillips screwdriver, loose the 4pcs screws attaching the heatsink.
2. Remove the heatsink and bracket.
3. Repeat for the other heatsink.
5. Remove the luggage tab.

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01

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Template Revision B

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Template Revision B