HPE ANW AP-654 Assembly instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
HPE ANW AP-654 Campus AP
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Torx screwdriver
TT10
Description #2 Static electric tweezers
NA
Description #3 Torx screwdriver
DEC
Description #4 Torx screwdriver
PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
(1) Put the unit onto the fixture and remove the two screws on the bracket at the position shown in the figure
with torque force equipment. (Type：PH2)
(2) Put the unit onto the fixture reversely and remove the four screws from the die cast with torque force
equipment. (Type: TT10)
(3) Remove 8 caps and nuts and spacers (Type: Hex socket - Diameter 8mm)
(4) Push the external antenna out of the antenna hole on the top cover and remove the top cover.
(5) Remove the seven screws and separate the antenna board from the bottom cover (Type:PH1)
(6) Remove 2 screws from PCBA(Type:PH1)
(7) Unbuckle 10 cables.
(8) Separate PCBA from antenna board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
1.Put the unit onto the fixture and remove the two screws on the bracket at the position shown
in the figure with torque force equipment. (Type：PH2)
2.Put the unit onto the fixture reversely and remove the four screws from the die cast with
torque force equipment. (Type: TT10)

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3.Remove 8 caps and nuts and spacers (Type:Hex socket - Diameter 8mm)
4.Push the external antenna out of the antenna hole on the top cover and remove the top cover.

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
5. Remove the seven screws and separate the antenna board from the bottom cover(Type:PH1)
6. Remove 2 screws from PCBA(Type:PH1)
7. Unbuckle 10 cables.
8. Separate PCBA from antenna board.