HPE Aruba AP-514 Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
AP-514AP-514,Aruba,XGP
AP-514OAW-AP514,Alcatel
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,
as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Torx screwdriver
T9
Description #2 Static electric tweezers
NA
Description #3 Phillips screwdriver
PH2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Use Phillips screwdriver to remove the 2 screws on the MNT bracket.
2. Use T9 screwdriver to remove the 4 screws on the chassis.
3. Will the unit,open the top cover with 90 angle from USB side.Use static electric tweezers to
remove the antenna cable from the PCBA.
4. Remove the top cover,use PH2 Phillips screwdriver to remove 3 screws on the LED guide
beam and PCBA.
5. Remove the PCBA and LED guide beam from the chassis.

1. Use Phillips screwdriver to remove the 2 screws on the MNT bracket and remove it.
2. Use T9 screwdriver to remove the 4 screws on the chassis.
3. Will the unit, open the top cover with 90 angle from USB side. Use static electric
tweezers to remove the antenna cable from the PCBA.
4. Remove the top cover, use PH2 Phillips screwdriver to remove 3 screws on the LED
guide beam and PCBA.
6. Remove the PCBA and LED guide beam from the chassis.