HPE Aruba AP15-US Assembly instructions

MF877-00 Page 1
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
AP15-US/APIN0315
AP15-RW/APIN0315
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and
lithium coin or button style batteries
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays
with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Plastic topcover and lightpipe contain no
brominated flame retardants.
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Topcover pad printing include ink and
lightpipe contains titanium dioxide
pigment.
2

MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity of items
included in
product
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx screwdriver
T9
Static electric tweezers
NA
PH1 screwdriver
PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
2.
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
1.Use T9 screwdriver to remove the 4 screws on the chassis.
2.Remove the top cover
3.Remove 12 screws from antenna panel with PH1 screwdriver
4.Open the antenna plate 45 degrees, then remove the PCBA and antenna board

MF877-00 Page 4
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
5.Use tweezers to remove antennas 4, 5, 6 and 7, and then remove the antenna plate