HPE AP-585 Assembly instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
Aruba AP-585 Unified AP
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
1134
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
5 (AP585)
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Tamper Resistant Torx screwdriver
T25
Description #2 Tamper Resistant Torx screwdriver
T8
Description #3 Phillips Screwdriver
PH2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove accessories.
2. Remove four M5 screws using T25 Tamper Resistant Torx screwdriver from holder, then remove the holder and solar
mask.
3. Remove eight M5 screws using T25 Tamper Resistant Torx screwdriver, then remove Top Cover.
4. Remove five M3 screws using PH2 Phillips screwdriver.
5. Remove five Antenna cables from the Antenna Plate by hand, then remove it (include O-ring).
6. Remove ten M3 screws using PH2 Phillips screwdriver.
7. Remove GPS Antenna cables and PSU connector from the PCBA by hand, then remove PCBA.
8. Remove five M3 and one M4 screws using PH2 Phillips screwdriver, then remove the PSU.
9. Remove the air vent.
10. Remove four M3 screws using T8 Tamper Resistant Torx screwdriver, then remove GPS Cover.
11. Remove four M3 screws using PH2 Phillips screwdriver, then remove GPS PCBA.

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove accessories.
2. Remove four M5 screws using T25 Tamper Resistant Torx screwdriver from holder, then remove holder and
solar mask.
3. Remove eight M5 screws using T25 Tamper Resistant Torx screwdriver, then remove Top Cover.

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
4. Remove five M3 screws using PH2 Phillips Screwdriver.
5. Remove five Antenna cables from Antenna Plate by hand, then remove it (include O-ring).
6. Remove ten M3 screws using PH2 Phillips screwdriver.
7. Remove GPS Antenna cables and PSU connector from the PCBA by hand, then remove the PCBA.

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
8. Remove five M3 and one M4 screws using PH2 Phillips screwdriver, then remove the PSU.
9. Remove the air vent.
10. Remove four M3 screws using T8 Tamper Resistant Torx screwdriver, then remove GPS Cover.
11. Remove four M3 screws using PH2 Phillips screwdriver, then remove GPS PCBA.