HPE Aruba AP-303P Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
AP-303P AP-303P,Aruba,XGP
AP-303P OAW-AP303P,Alcatel
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2 in product
2
Batteries All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Torx screwdriver T9
Description #2 Static electric tweezers NA
Description #3 Phillips screwdriver PH2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use T9 screwdriver to remove the 5 screws on the chassis.
2. Will the unit,open the top cover with 60 angle.
3. Use static electric tweezers to remove the antenna cable from the main board.
4. Remove the top cover,use PH2 screwdriver to remove one screw on the PSE board
5. Remove the PSE board,use PH2 Phillips screwdriver to remove screws on main board.
6. Remove the main board from the chassis.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1.Use T9 screwdriver to remove the 5 screws on the chassis and open the top cover with 60 angle.
2.Use static electric tweezers to remove the antenna cable from the main board.
3.Remove the top cover,use PH2 screwdriver to remove 1 screw on the PSE board
4.Remove the PSE board,use PH2 Phillips screwdriver to remove 1 screws on main board
5.Remove the main board from the chassis.