HTC ROSE User manual

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REV.
Issued Date 2008/8/12
. Revised Date 2008/11/13 A02
Doc. Title ROSE Service Manual Page 1 of 94
HTC CONFIDENTIAL
SM-TP001-0812
HTC Corporation
ROSE
Service Manual
UHTC Proprietary
Confidential Treatment Requested
Rev. A03
HTC Corp.
Engineering Mobility

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REV.
Issued Date 2008/8/12
. Revised Date 2008/11/13 A02
Doc. Title ROSE Service Manual Page 2 of 94
HTC CONFIDENTIAL
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REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/8/12 Fist Draft PSE Clement_Chen DVT
A01 2008/10/3 First Release Complete SM PSE Clement_Chen PVT
A02 2008/10/31
Modify Board Level 2.5
Repair section PSE Clement_Chen MV
A03 2008/11/13
1) Add SIM door holder
assembly/disassembly
procedure into service
manual
2) Update feature sheet
content to the updated
version
3) Add idle/Sleep modes
power test criteria
PSE Clement_Chen MV

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. Revised Date 2008/11/13 A02
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HTC CONFIDENTIAL
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HTC Corporation
1. INTRODUCTION ....................................................................................................................................................................4
1.1 PRODUCT FEATURES..........................................................................................................................................5
1.2 PRODUCT OVERVIEW........................................................................................................................................10
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................17
2.1 TOOLS LIST......................................................................................................................................................17
2.2 DISASSEMBLING PROCEDURE............................................................................................................................18
2.3 ASSEMBLING PROCEDURE ................................................................................................................................30
3. ROM RE-FLASH PROCEDURE........................................................................................................................................41
3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY)................................................................................41
3.2 ROM IMAGE UPGRADE THRU SD CARD .............................................................................................................45
4. DIAGNOSTIC PROGRAM..................................................................................................................................................47
4.1 LIST OF DIAGNOSTIC TEST ITEMS......................................................................................................................47
5. POWER MEASUREMENT TEST ......................................................................................................................................60
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................60
5.2 BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................65
6. COSMETIC INSPECTION CRITERIA...............................................................................................................................71
6.1 CLASSES DEFINITION OF INSPECTIVE AREA.........................................................................................................71
6.2 DISPLAY INSPECTION........................................................................................................................................73
6.3 MAIN UNIT INSPECTION .....................................................................................................................................74
7. GENERIC TROUBLESHOOTING .....................................................................................................................................77
8. GENERIC LABELING PLAN..............................................................................................................................................82
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................85
9.1 SPLFOR REPAIR..............................................................................................................................................85
9.2 BOARD LEVEL 2.5 REPAIRS ..............................................................................................................................90
10. RF ANTENNA SPECIFICATION...................................................................................................................................93

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1. Introduction
This manual provides the technical information to support the service activities of this product.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
zChapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter, you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
zChapter 2: Device Disassembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
disassemble the unit to prevent from damaging the unit.
zChapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
zChapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
zHow to use the diagnostic program to perform unit function test
zHow to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc…)
zChapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
zChapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc…
zChapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
zChapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc…
zChapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts
reference list and photos for repairing, including unit and Board level.
zChapter 10: RF Antenna Specification- Reference Spec for RF test.

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1.1 Product Features

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1.2 Product overview

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zInstalling the SIM card

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zInstalling the SD card

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zTo install / remove the battery

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zCharging the battery
zUsing the Strap Holder

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2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
5 Memory Card with Diag. test program (need be encoded
by HTC) HTC design DCT-00060
6 Memory card for ROM codere-flash ( must be encoded by
HTC) HTC design DCT-00060
7 3pin battery holder HTC special tools MLT-00008
8 Universal Leakage Current Tester HTC special tools MLT-00001
9 Power supply
10 Current Meter
L 1
11 Mobile tester
12 Special Made Plastic Stick HTC special tools RTT-00006
13 Hand tools
14 Oven for rework purpose HTC special tools RTT-00007
L 2
15 Barcode label printer (400dpi resolution and up)
16 Lead-free Soldering station
L 2.5 17 Hot air gun

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2.2 Disassembling procedure
1. CLEANING CLOTH
2. ESD GLOVE OR ESD WRIST
STRAP
3. PLASTIC TWEEZERS
4. FLAT PLASTIC STICK (P/N:
RTT-00006)
5. PHILLIPS SCREW-DRIVER T4X30
6. PHILLIPS SCREW-DRIVER
PH000X50
7. OVEN FOR REPAIR /REWORK
PURPOSE (P/N: RTT-00007)
1. REMOVE THE BATTERY COVER
AS SHOWN.

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1. TAKE OUT THE BATTERY AS
SHOWN.
2. LOOSEN THE 4INDICATED
SCREWS FROM THE HOUSING.
1. EXTEND THE KEYBOARD BY
SLIDING THE DISPLAY UP.
2. INSERT THE FLAT PLASTIC
STICK BETWEEN THE HOUSING
AND QWERTY KEYBOARD
AND THEN FOLLOW THE ARROW
DIRECTION.
1. DISASSEMBLE THE HOUSING
AS SHOWN.

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1. USE PLASTIC TWEEZER TO
DISCONNECT THE SPEAKER AT
THE LOCATION INDICATED.
CAUTION: AVOID DAMAGE THE
SPEAKER
1. USE THE FLAT PLASTIC STICK
TO DISCONNECT THE RF CABLE
WIRE FROM THE M/B AT THE
LOCATION INDICATED.
1. USE THE PLASTIC TWEEZERS
TO REMOVE THE KAPTONTAPES
AT THE LOCATION INDICATED.