Huawei Y511-U030 Operating instructions

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XXXX Repair Manual
V1.0
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Date：
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Transient suppression diode 2
华为技术有限公司
Huawei Technologies Co.，Ltd.
版权所有 侵权必究
All rights reserved

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Date
Release version
Revision cause
Modify chapter
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description
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Catalogue
CHAPTER 1 PRODUCT PROFILE ..................................................................................................................4
1.1 PRODUCT PICTURE ....................................................................................................................................4
1.2 CHARACTERISTICS OF THE PRODUCT........................................................................................................4
CHAPTER 2 REPAIR INSTRUCTIONS...........................................................................................................6
1.3 DOCUMENTATION........................................................................................................................................6
1.4 REPAIR THE MATTERS NEEDINGATTENTION...............................................................................................6
1.5 REPAIR INFORMATION ACQUISITION GUIDE LINES ......................................................................................6
CHAPTER 3 PHONE EXPLOSION..................................................................................................................7
CHAPTER 4 PCBA COMPONENT LOCATION DIAGRAM.........................................................................9
CHAPTER 5 SW UPGRADE........................................................................................................................... 11
5.1 READY FOR UPGRADING ............................................................................................................................ 11
5.2 UPGRADE HARDWARE CONNECTION.......................................................................................................... 11
5.3 USB DRIVER INSTALLATION.......................................................................................................................12
5.4 UPGRADE PROCESS..................................................................................................................................15
5.4.1 USE“FLASH TOOL”TOOL ........................................................................................................................................15
5.4.2 CONFIGURE FLASHTOOL DOWNLOAD TOOL............................................................................................................15
5.5 SD UPGRADE .............................................................................................................................................20
5.6 EXCEPTION HANDLING...............................................................................................................................24
CHAPTER 6 SERVICE TOOL.........................................................................................................................25
CHAPTER 7 DISASSEMBLE STEP ..............................................................................................................27
CHAPTER 8 INSTALL STEP...........................................................................................................................30
CHAPTER 9 PRINCIPLE AND FAULT ANALYSIS .....................................................................................34
9.1 PRINCIPLE DIAGRAM AND INTRODUCTION.................................................................................................34
9.2 BASEBAND.................................................................................................................................................. 36
9.2.1 POWER MANAGEMENT CIRCUIT ............................................................................................................................36
9.2.2 CHARGING MANAGEMENT CIRCUIT .......................................................................................................................42
9.2.3 CLOCK CIRCUIT .......................................................................................................................................................44
9.2.4 FLASH CIRCUIT .......................................................................................................................................................46
9.3 RF UNIT ......................................................................................................................................................48
9.3.1 RECEPTION CHANNEL .................................................................................................................................................54
9.3.2 TRANSMITTING CHANNEL .............................................................................................................................................57
9.4 EXTERNAL CIRCUIT ........................................................................................................................................60
9.4.1 DISPLAY .................................................................................................................................................................60
9.4.2 KEYPAD .................................................................................................................................................................63
9.4.3 VIBRATION ..............................................................................................................................................................64
9.4.4 RECEIVER................................................................................................................................................................65
9.4.5 MIC .......................................................................................................................................................................67
9.4.6 EARPHONE................................................................................................................................................................69
9.4.7 SIM CARD ..............................................................................................................................................................70
9.4.8 INTERFACE ..............................................................................................................................................................73
9.4.9 SD CARD INTERFACE ................................................................................................................................................74
9.4.10 CAM ....................................................................................................................................................................75
9.4.11 BT/WIFI/FM/GPS FAILURE .................................................................................................................................78
9.4.12 OTHER COMMON FAILURE .....................................................................................................................................79

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Chapter 1 Product Profile
1.1 Product Picture
1.2 Characteristics of the Product.
Description: the product characteristics shall include information, the most
basic hardware characteristics such as: mobile phone appearance, size,
weight, type, frequency band, interface, the display parameters, cell
parameters.
Item
description.
Phone Size
132.8*67.4*10.5
Phone weight;
About 160g (Including battery)

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Antenna
Built-in antenna
SIM interface
Standard 6 PIN SIM interface
USB interface
Mini USB interface, Maintenance and supply for Telephones
Power interface
Mini USB interface
Power adapter
AC input：100V ~ 240V DC output ：5v---1A
LCM
4.5 inch、FWVGA、TN、1600 Million color、380cd/m2(typ)
Working Environment;
Working temperature：－10℃～＋55℃
Storage temperature：－40℃～＋70℃
Operating humidity：5％～95％RH
Technical Standard;
Standard mobile phone technology of WCDMA digital
Work Frequency Band
UMTS:900/2100
GSM/EDGE:900/1800
GSM 900MHz：upgoing;880MHz～915 MHz；down 925MHz～960MHz
GSM 1800MHz：upgoing;1710MHz～1785MHz；down 1805MHz～
1880MHz
Maximum Transmit Power
GSM900:890-915MHz;GSM1800:1710-1785MHz WCDMA: 1940
–1955 MHz
Receiving Sensitivity
GSM900:935-960MHz；GSM1800:1805-1880MHz；WCDMA: 2130 –
2145 MHz

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Chapter 2 Repair Instructions
1.3 Documentation
This document is used to guide the Huawei Company authorized outlets repair technicians to repair
service for Huawei Company products. This service manual only provides the Huawei Company has
authorized repair service outlets and the company use, and the contents of the confidential information.
Although we as far as possible to ensure the accuracy of this document, but may still be a mistake. If you
find any mistake or have more suggestions, please contact customer service staff and huawei.
Welding should meet the requirements of environmental protection, lead-free welding.
1.4 Repair the matters needing attention
Repair and adjustment only by qualified personnel operation.
Ensure all work is to wear anti-static belt and operation in anti-static studio.
Ensure that all components, screws and an insulator in the repair and adjustment are installed.
And to ensure that all cables and wires have been installed in place.
Welding should meet the requirements of environmental protection, lead-free welding.
1.5 Repair information acquisition guide lines
Relevant knowledge of products and repair information, please log in Huawei Company Website
Website：http://www.huaweidevice.com/cn/technicaIndex.do
Electrostatic discharge is the main reason for electronic products sensitive components
damaged, so each service center must attach great importance to the electrostatic protection,
also want to pay attention to the electrostatic protection of this manual.

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Chapter 3 Phone Explosion
Explain:
1. The explosion picture requires the use of 3D pictures, pictures of clear
structure, device on the picture to digital serial number label, and the
sequence number corresponding to that device list name, quantity.
2. Images need to use "the drawing canvas" frame up.
Explosion lists：
Describe the whole structure description graph is BOM explosion in the table below, can not be used as
a reference for spare parts：
No.
description
Huawei material
number
Single
dose
1
S98511A1 CTP
1
2
S98511A1 Light guide film
1
3
S98511A1 LCM
1
4
S98511A1 CTP Foam tape
1
5
S98511A1 front cover assembly
1

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No.
description
Huawei material
number
Single
dose
6
S98511A1 MIC
1
7
S98511A1 PCBA
1
8
S98511A1 Battery
1
9
S98511A1 Main antenna bracket assembly
1
10
S98511A1 Back cover assembly
1
11
Black bolt
4
12
S98511A1 Battery cover assembly
1
13
Silver screw
5
14
S98511A1 Camera lens
1
15
S98511A1 GPS/WIFI antenna
1
16
S98511A1 1020 Motor
1
17
S98511A1 2014 Speaker
1
18
S98511A1 side key FPC assembly
1
19
S98511A1 back CAM
1
20
S98511A1 front CAM
1
21
S98511A1 Proximity sensor
1
22
1506 receiver
1
23
Waterproof label
1

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Chapter 4 PCBA Component Location
Diagram
Explain ：
1. All PCBA host will need to provide a positive and negative picture, need to
mark the main device on a PCBA board, tagging content includes: No., device
name, damage caused by fault phenomenon.
2. Image requirements to clear: for the device image annotation, users can
find the real position corresponding to the need to use "; the picture frame
drawing canvas".
3.The picture on the label and instructions corresponding to the characters
must be editable.

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This list is for reference only, subject to change without notice, please obtain the latest information from
the relevant system Huawei company. If you have any questions, please contact the local technical
support.
BOM
描述
位号
15040238
Transient suppression diode 2
D1401,D700
J902 6PIN ZIF connector
Damage caused by fault:
TP function failure
CON2 T card seat connector
Damage caused by fault:: not
read T card
U101 BBIC
Damage caused by fault:
No boot, crash, RF breakdown
U402 FLASH memory
Damage caused by fault:
No boot, no download, SW
question
J1101, J1102 SIM card seat
Damage caused by fault:
Not read SIM card
CON301 battery interface
Damage caused by fault:
No boot, no charging
U301 power management chip
Damage caused by fault:
No boot, audio fault, not read SIM
card , not read T card, no
download. etc
U600 RF transceiver chip
caused by fault: RF fault
U1000 BT/WIFI/GPS/ FM Chip
caused by fault::
BT/WIFI/GPS/FM function fault
J0003 BTB interface
caused by fault:: rear
CAM function fault
J501 ear interface
Damage
caused by fault:: ear
function fault
CON 701 IO interface Micro
Damage caused by fault::: no
charging ,Data communication
fault
U1 RF power amplifier
Damage caused by fault: launch failure
U901 backlight chip
Damage caused by fault:
Screen backlight off
J6401 ZIF interface
Damage caused by fault:
Lcd function fault
J6401 Motion Chip
Damage caused by fault:
No effect of gravity
J700 RF test seat
Damage caused by fault:
No signal, weak signal, no
registration