Huawei E173 Technical specifications

Product Description
HUAWEI E173 HSPA USB Stick
V100R001
Issue 01
Date 2010-03-10
HUAWEI TECHNOLOGIES CO., LTD.

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service.
Please feel free to contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: [email protected]
Copyright © Huawei Technologies Co., Ltd. 2010. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
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All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The information in this document is subject to change without notice. Every effort has been made in the
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recommendations in this document do not constitute the warranty of any kind, express or implied.
Issue 01 (2010-03-10) Commercial in Confidence Page 2 of 21

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Product Description
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About This Document
Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI E173 HSPA USB Stick
(hereinafter referred to as the E173).
The following table lists the contents of this document.
Chapter Describes
1 Overview The supported network modes, basic services
and functions, and the appearance of the
E173.
2 Features The supported features and technical
specifications of the E173.
3 Services and Applications The services and applications of the E173.
4 System Architecture The architecture of the E173.
5 Technical Reference The technical references of the E173.
6 Packing List The items contained in the package of the
E173.
A Acronyms and Abbreviations The acronyms and abbreviations mentioned in
this document.

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Product Description
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History
Issue Details Date Author Approved by
01 Initial draft completed. 2010-03-10 Wang zhiyong 66144 He jinjun 42931

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Contents
1 Overview..........................................................................................................................6
2 Features...........................................................................................................................8
2.1 Features........................................................................................................................................... 8
2.2 Technical Specifications ................................................................................................................... 8
2.2.1 Hardware................................................................................................................................. 8
2.2.2 Dashboard............................................................................................................................. 10
3 Services and Applications ...........................................................................................12
3.1 Packet Data Service....................................................................................................................... 12
3.2 SMS................................................................................................................................................ 12
4 System Architecture.....................................................................................................13
4.1 System Architecture ....................................................................................................................... 13
4.2 Functional Modules........................................................................................................................ 14
5 Technical Reference .....................................................................................................16
5.1 Layer 1 Specifications (Physical) ................................................................................................... 16
5.2 Layer 2 Specifications (MAC/RLC)................................................................................................. 16
5.3 Layer 3 Specifications (RRC)......................................................................................................... 16
5.4 Layer 3 NAS/Core Network (MM/CM)............................................................................................16
5.5 GSM Protocol Specifications.......................................................................................................... 17
5.6 GPRS Protocol Specifications........................................................................................................ 17
5.7 General Specifications ................................................................................................................... 17
5.8 Performance/Test Specifications.................................................................................................... 18
5.9 SIM Specifications.......................................................................................................................... 18
6 Packing List...................................................................................................................19
A Acronyms and Abbreviations......................................................................................20

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1 Overview
HUAWEI E173 HSPA USB Stick (hereinafter referred to as the E173) is a high-speed
ck stick. It is a multi-mode wireless
term
SDPA) TS)
on (EDGE)
z
SM)
e
zEDGE/GPRS packet data service
eceive messages/emails without wire connections. The
E173 is fast, reliable, and easy to operate. Thus, mobile users can enjoy many new
features and services with the E173. These features and services can enable a large
number of users to use the E173 and increase the Average Revenue Per User (ARPU)
of operators substantially.
pa et access (HSPA) universal serial bus (USB)
inal.
The E173 supports the following standards:
zHigh-Speed Uplink Packet Access (HSUPA)
zHigh-Speed Downlink Packet Access (H
zUniversal Mobile Telecommunications System (UM
zEnhanced Data Rates for GSM Evoluti
General Packet Radio Service (GPRS)
zGlobal System for Mobile communications (G
Th E173 provides the following services:
zHSUPA/HSDPA/UMTS packet data service
zWCDMA/GSM Short Message Service (SMS)
You can connect the E173 with the USB interface of a PC.
In the service area of the HSUPA/HSDPA/UMTS/EDGE/GPRS/GSM network, you can
browse the Internet, send/r

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Product Description
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Figure 1-1 shows the profile of the E173.
Figure 1-1 E173 profile
This is a sketch for E173. The actual product may differ.

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2 Features
2.1 Featur s
following features:
MHz or 2100/900MHz or 2100/1900/850MHz and
rvice of up to 236.8 kbit/s
WCDMA
D) r
zStandard USB interface (Type A)
zMicro Secure Digital Memory (Micro SD) Card
/ Vista, Mac OS and Linux
2.2 Techn
2.2.1 Hardw
T -1 lists the hard ons.
e
The E173 supports the
zHSUPA/HSDPA/UMTS 2100
EDGE/GPRS/GSM 1900/1800/900/850 MHz
zHSPA equalizer
zReceive diversity (optional)
zHSDPA data service of up to 7.2 Mbit/s
zUMTS PS domain data service of up to 384 kbit/s
zEDGE packet data se
zGPRS packet data service of up to 85.6 kbit/s
zSMS based on CS/Packet Switched (PS) domain of GSM and
zPlug and Play (PnP)
zUnstructured Supplementary Service Data (USS
zNetwork Driver Interface Specification (NDIS)/Modem drive
zWindows 7/ Windows 2000/ XP
ical Specifications
are
able 2 ware specificati

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Table 2-1 Hardware specifications
Item Specifications
Technical zHSUPA R6
standard zWCDMA/HSDPA R5
zGSM/GPRS/EDGE R99
Operating
frequency 0 MHz:
0 MHz:
00 MHz:
MHz:
Hz:
MHz:
z
HSUPA/HSDPA/UMTS 210
zUplink: 1920–1980 MHz
zDownlink: 2110–2170 MHz
HSUPA/HSDPA/UMTS 190
zUplink: 1850–1910 MHz
zDownlink: 1930–1990 MHz
HSUPA/HSDPA/UMTS 9
Uplink: 880MHz~915MHz
Downlink: 925MHz~960MHz
HSUPA/HSDPA/UMTS 850
zUplink: 824–849 MHz
zDownlink: 869–894 MHz
EDGE/GPRS/GSM 1900 M
zUplink: 1850–1910 MHz
zDownlink: 1930–1990 MHz
EDGE/GPRS/GSM 1800
zUplink: 1710–1785 MHz
zDownlink: 1805–1880 MHz
EDGE/GPRS/GSM 900 MHz:
zUplink: 880–915 MHz
zDownlink: 925–960 MHz
EDGE/GPRS/GSM 850MHz
Uplink: 824–849 MHz
zDownlink: 869–894 MHz
USB interface: supporting USB 2.0 high speedExternal interfaces
Standard micro SD card interface
SIM/USIM card: standard 6-pin SIM card interface
HSUPA/HSDPA/UMTS 2100 MHz or 2100/900MH
2100/1900/850 MHz: +24 dBm (Power Class 3) Z or
GSM/GPRS 850/900 MHz: +33 dBm (Power Class 4)
GSM/GPRS 1800 MHz/1900 MHz: +30 dBm (Power Class 1)
EDGE 850/900MHz: +27 dBm (Power Class E2)
Maximum
transmitter power
Hz: +26 dBm (Power Class E2)
EDGE 1800MHz/1900M

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Item Specifications
HSUPA/HSDPA/UMTS 2100 MHz or 2100/900MHz or
2100/1900/850M: compliant with 3GPP TS 25.101 (R6)
Static receiver
sensitivity
EDGE/GPRS/GSM 850/900/1800/1900 MHz: compliant with
3GPP TS 05.05 (R99)
Whole-syste
consumption
m ≤2.5W
Power supply 5V/500mA
LED Indicates the sstatu of the E173
Dimensions
(D × W × H) 71 mm×26 mm×12.5 mm
Weight <40g
Temperature zOperating: –10℃to +45℃
orage: –20℃to +70℃
zSt
Humidity 5% to 95%
N3GPP = The 3rd Generation Partnership Project
LED = light-emitting diode
ntity module
hnical specification
otes:
SIM = subscriber ide
TS = tec
USIM = UMTS subscriber identity module
2.2.2 Dashboard
T -2 lists the dashbo
Table 2-2 Dashboard spec
able 2 ard specifications.
ifications
Item Description
Writing/Sending/Receiving messages
eceiving extra-long messagesSending/R
Group sending
Storage: The messages are saved in the hard disk of the
PC.
Sorting
Importing: You can import messages from the SIM/USIM
card to a laptop.
SMS
t (visual prompt/audio prompt)New message promp

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Item Description
Current connection:
zDuration
zSend/Receive flow
zSend/Receive rate
Flow display and
statistics (data
mation of a
services)
Traffic statistics: You can view the traffic infor
current day, month, or year.
Capacity: It depends on the SIM/USIM card capacity or the
hard disk space.
Messages can be sent from the phonebook.
Phonebook
Importing/Exporting: Import/Ex
or a file of supported formats.
port contacts between the
SIM/USIM card and a laptop
Network connection
setup elete, edit, import, and
zAPN management: Create, d
export APNs.
zSetting up network connection.
Software installation Automatic installation (PNP)
Network connection settings:
rk selection and registration
zAutomatic network selection and registration
zManual netwo
Network status display: signal, operator name, and system
mode.
Selection of network connection types, for example:
z
z3G preferred
GPRS preferred
Other
ck PIN by the PUK.
PIN management: Activate/Deac
change PIN, and unblo tivate PIN, PIN lock,
System requirement z
t upgrades
zLinux 2.6.18 or later
Your computer’s hardware system should meet or
ecommended system requirements for the
version of OS
Display resolution: 800 × 600 or above
Windows 7, Windows 2000 SP4, Windows XP SP3,
Windows Vista SP2
zMac OS X 10.4, 10.5 and 10.6 with lates
z
exceed the r
installed
z
Notes:
APN = Access point name
PIN = Personal identification number
PUK = PIN unblocking key

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3 Services and Applications
3.1 Packet Data Service
and the
client software are installed on the PC automatically. You can configure APN through
gs) and set up a network
conn he network through
wire
To u teps:
1. Enter *99# or *98# to launch the packet data service.
2. In the Choose Connection Type dropdown box, choose a network type, for
example: 3G preferred, GPRS preferred.
3.2 SMS
s message writing/sending/receiving and group sending (up to 20
ontacts at a time). You can manage messages through the dashboard, such as
sorting the messages by telephone number or time. You can also import/export
messages between the SIM/USIM card and a laptop.
The E173 supports the PS domain data service based on HSUPA/HSDPA/UMTS
/EDGE/GPRS.
After you connect the E173 to a PC with a USB interface, the E173 driver
the E173 application (or directly use the default settin
ection. Then you can send or receive E-mail, access t
less connection, and download files through wireless data channels.
se the data service, perform the following s
The E173 support
c

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4 System Architecture
4.1 System Architecture
Figure 4-1 shows the system architecture.
Figure 4-1 System architecture
E173
Hardware module
Application
system
Protocol stack
processing
Bottom layer drivers
(including USB driver)
Platform service subsystem
PC
User
interface USB Hub
Power
Radio
frequency
module
Baseband
signal
processing
USB interface
Background module
PC driver
Application
management
Dashboard
USB driver
USB interface

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4.2 Functional Modules
Radio Frequency Module
It sends/receives radio signals and modulates/demodulates the radio frequency (RF)
signals and baseband signals.
Baseband Signal Processing
It implements the digital processing of HSUPA/HSDPA/WCDMA/EDGE/GPRS/GSM
baseband signals, including:
zModulating/Demodulating WCDMA/HSDPA/HSUPA baseband signals
zModulating/Demodulating GSM/GPRS/EDGE baseband signals
zEncoding/Decoding WCDMA/HSDPA/HSUPA channels
zEncoding/Decoding GSM/GPRS/EDGE channels
Bottom Layer Driver
The bottom layer drivers include drivers of the radio frequency (RF) module, FLASH,
and all the peripherals such as the SIM card, USB device, NDIS device. The USB
device driver is the bottom layer software at the PC side. It is used to implement
functions such as the interaction between the background software and the SIM card,
auto-setup, and NDIS driving.
Platform Service Subsystem
It initializes programs, diagnoses, downloads data and serves as a watchdog.
Protocol Stack System
It processes the HSUPA /HSDPA/UMTS/EDGE/GPRS/GSM Layer 2 and Layer 3
protocols.
Application System
It sends laptop commands to the bottom layer protocol for processing and returns the
value to the laptop.
Existing applications include the following:
zCall management
zMessage management
zCS/PS domain service management
User Interface
It provides interfaces to connect peripherals. Interfaces are for Micro SD, USB
interface, LED and SIM/USIM.
Application Management
It includes management of the following dashboards:
zTesting dashboard

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zMaintaining dashboard
zAssembling/manufacturing dashboard
Dashboard
It enables the PC side to display initiating or answering a call and send/receive
messages. It provides the interface for CS/PS domain network accessing and
periodically refreshes the interface of the current USB stick status. The interface is
provided to the end users.

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5 Technical Reference
5.1 Layer 1 S
znel Coding and Multiplexing TR 25.944
Channels onto Physical Channels
3
4
zPhysical Layer–Measurements (FDD) TS 25.215
z3GPP HSDPA overall description 25.308
5.2 Layer 2 Specifications (MAC/RLC)
zMAC Protocol Specification TS 25.321
5.3 Layer 3 S
zUE Interlayer Procedures in Connected Mode TS 25.303
zUE Procedures in Idle Mode TS 25.304
5.4 Layer 3 N
ode TS 23.122
zMobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
pecifications (Physical)
Examples of Chan
zPhysical Layer–General Description TS 25.201
zPhysical Channels and Mapping of Transport
(FDD) TS 25.211
zMultiplexing and Channel Coding (FDD) TS 25.212
zSpreading and Modulation (FDD) TS 25.21
zPhysical Layer–Procedures (FDD) TS 25.21
z3GPP UE radio access capabilities 25.306
zRLC Protocol Specification TS 25.322
pecifications (RRC)
zRRC Protocol Specification TS 25.331
AS/Core Network (MM/CM)
zArchitectural Requirements for Release 1999 TS 23.121
zNAS Functions Related to Mobile Station (MS) in Idle M

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zMobile Radio Interface Layer 3 Specifi
zPP SMS Support on Mobile Radio Intecation–Core Network TS 24.008
rface TS24.011
5.5 GSM P o
ocol
k (DL) Layer
zunications System (Phase 2+); Multiplexing and
zup GERAN; Channel coding TS 05.03
zDigital Cellular Telecommunications System (Phase 2+); Radio Subsystem Link
Control TS 05.08 (Phase 2+); Radio Subsystem
5.6 GPRS r
z
zace Layer 3 Specification: Radio Resource Control Protocol
zS): Mobile Station (MS)–Base Station
/MAC)
ical Link Control
S 04.64
g GPRS Support Node (MS–SGSN); Subnetwork
S 04.65 2
zRadio Transmission and Reception TS 05.05
zGeneral Packet Radio Service (GPRS); Stage 1 TS 22.060
ent (MexE) TS 23.057
ice (GPRS) Service description; stage 2 TS 23.060
5.7 General Specifications
zVocabulary TR 25.990
r tocol Specifications
zMobile Radio Interface Layer 3 Specification, Radio Resource Control Prot
TS 04.18
zMobile Station–Base Station System (MS–BSS) interface; Data Lin
Specification TS 04.06
Digital Cellular Telecomm
Multiple Access on the Radio Path TS 05.02
Technical Specification Gro
zDigital Cellular Telecommunications System
Synchronization TS 05.10
P otocol Specifications
zOverall Description of the GPRS Radio Interface; stage 2 TS 3.64
Mobile Radio Interface Layer 3 Specification TS 04.08
Mobile Radio Interf
TS 04.18
General Packet Radio Service (GPR
System (BSS) interface; Radio Link Control/Medium Access Control (RLC
protocol TS 04.60
zMobile Station–Serving GPRS Support Node (MS–SGSN) Log
(LLC) Layer Specification T
zMobile Station–Servin
Dependent Convergence Protocol (SNDCP) T
zMultiplexing and Multiple Access on the Radio Path TS 05.0
zChannel Coding TS 05.03
zModulation TS 05.04
zMobile Execution Environm
zGeneral Packet Radio Serv
zUE Capability Requirements TR 21.904
zUE Radio Access Capabilities TR 25.926

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zRadio Interface Protocol Architecture TS 25.3
zServices Provided by the Physical Layer TS 201
5.302
5.8 Perfor a
znsmission and Reception (FDD) TS 25.101
zrmance Testing Functions TS 34.109
zTerminal Conformance Specification TS 34.121
formance Specification; Part 1: Protocol Conformance
z2: Protocol Conformance
5.9 SIM Specifications
SIM and IC Card Requirements TS 21.111
z3rd Gen. Partnership Proj Tech. Spec. Group Terminals; SIM App. Toolkit (USAT)
TS 31.111
zSynchronization in UTRAN Stage 2 TS 25.402
m nce/Test Specifications
UE Radio Tra
zCommon Test Environments for User Equipment (UE) TS 34.108
Special Confo
zUser Equipment (UE) Con
TS 34.123-1
User Equipment (UE) Conformance Specification; Part
TS 34.123-2
z

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Product Description
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6 Packing List
T -1 lists the items contained in the packa 17
T
able 6 ge of the E 3.
able 6-1 Packing list of the E173
Item Quantity Remarks
HUAWEI E173 HSPA USB Stick 1 Standard
HUAWEI E173
Start HSPA USB Stick Quick 1 Standard
USB Extension Cable 1 Optional
MicroSD card 1 Optional

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Product Description
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A Acronyms and Abbreviations
Numerics
he Third Generation
R daptive Multirate Codec
U er
hed Domain
GE nhanced Data Rates for GSM Evolution
RS eneral Packet Radio Service
ions
A Packet Access
C card
n Number
3G T
3GPP 3rd Generation Partnership Project
A
AM A
ARP Average Revenue Per Us
C
CS Circuit Switc
D
DL Down Link
E
ED E
EGPRS Enhanced GPRS
G
GP G
GSM Global System for Mobile Communicat
H
HSDP High Speed Downlink
L
LED Light-emitting Diode
P
PC/S Personal computer/Smart
PIN Personal Identificatio