IBM pSeries 670 User manual

pSeries 670
Service Guide
SA38-0615-03
ERserver
򔻐򗗠򙳰

pSeries 670
Service Guide
SA38-0615-03
ER s e r v e r
򔻐򗗠򙳰

Fourth Edition (July 2003)
Before using this information and the product it supports, read the information in “Safety Notices” on page xi,
Appendix A, “Environmental Notices”, on page 963, and Appendix B, “Notices”, on page 965.
©Copyright International Business Machines Corporation, 2001, 2003. All rights reserved.
Note to U.S. Government Users -- Documentation related to restricted rights -- Use, duplication or disclosure is
subject to restrictions set forth is GSA ADP Schedule Contract with IBM Corp.

Contents
Safety Notices .................................xi
Electrical Safety .................................xi
Laser Safety Information ..............................xiii
Laser Compliance ...............................xiii
Data Integrity and Verification ...........................xv
About This Book ................................xvii
ISO 9000 ...................................xvii
Accessing Information ..............................xvii
Related Publications ...............................xvii
Trademarks ..................................xviii
Chapter 1. Reference Information ..........................1
pSeries 670 Overview ...............................1
Hardware Management Console (HMC).........................3
Partition Standby and Full System Partition Power-On Options ...............3
Partition Requirements ..............................4
Service Focal Point ...............................4
Capacity Upgrade on Demand............................10
Processor CUoD................................10
Memory CUoD ................................10
On/Off Capacity on Demand ...........................10
Trial Capacity on Demand ............................11
Capacity Planning ...............................11
Software Licenses and Processor CUoD .......................12
Activation Process for CUoD Features ........................13
Powering the System On and Off ..........................13
pSeries 670 Data Flow ..............................14
Power-On Self-Test ................................15
POST Indicators .................................15
POST Keys ..................................15
1Key....................................15
5Key....................................15
6Key....................................15
8Key....................................16
pSeries 670 System Locations ...........................16
UEPO Switch .................................19
7040 Model 671 Processor Subsystem Locations....................20
Media Subsystem Locations ...........................22
Disturbance or System Attention LED ........................24
Accessing System Log Error Information .......................24
Resetting the System Attention LED ........................25
7040 Model 61D I/O Subsystem Locations .......................27
7040 Model 61D I/O Subsystem Front View......................27
7040 Model 61D I/O Subsystem Rear View ......................28
I/O Subsystem DASD Locations ..........................29
I/O Subsystem PCI and PCI-X PHB and PCI and PCI-X Slot Locations ...........30
I/O and Media Subsystem Connections .......................30
I/O Subsystem Internal SCSI Distribution .......................31
I/O Subsystem Power Distribution .........................31
Power Subsystem Locations ............................32
Power Distribution Cabling .............................33
iii

I/O Subsystem Power Distribution Cabling .......................36
Integrated Battery Feature Locations .........................36
Subsystem Positioning and Cabling ..........................37
Operator Panel Cable and Diskette Drive Cable to the Media Subsystem (Rear View) ......37
I/O Subsystem Positions, Fully Populated Rack (Rear View without IBF) ...........38
I/O Subsystem Positions, Fully Populated Rack (Rear View with IBFs) ............39
RIO and RIO-2 Cabling Rules ...........................40
I/O Subsystem (One Side of Subsystem 1 with IBF) RIO Cabling to I/O Books, Two I/O Planar Loop
Configuration ................................41
I/O Subsystems (1 through 3 ) RIO Cabling to I/O Books, Two I/O Planar Loop Configuration . . . 42
I/O Subsystems (1 through 3 ) RIO-2 Cabling to I/O Books, Two I/O Planar Loop Configuration. . . 43
I/O Subsystem (One Side of Subsystem 1 with IBF) RIO-2 Cabling to I/O Books, Two I/O Planar
Loop Configuration ..............................44
I/O Subsystem (One Side of Subsystem 1 with IBF) RIO-2 Cabling to I/O Books, One I/O Planar
Loop Configuration ..............................45
I/O Subsystems (1 through 2) RIO-2 Cabling to I/O Books, One I/O Planar Loop Configuration . . . 46
Power and SCSI Cables to the Media Subsystem ...................47
IBM Hardware Management Console for Eserver pSeries (HMC) to the Primary I/O Book ....48
System Memory .................................49
Memory to Processor Relationships.........................49
Memory Requirements .............................49
I/O Subsystem Features ..............................51
I/O to Processor Relationships ..........................51
I/O Subsystem Power Supply (DCA) LED Status ....................51
Logical and Physical Locations ...........................53
Physical Location Codes ..............................53
Location Code Format..............................53
Multiple FRU Callout Instructions ..........................54
FRU Identify LEDs ...............................54
AIX Location Codes ...............................55
Non-SCSI Devices ...............................55
SCSI Devices .................................56
AIX and Physical Location Code Reference Tables ...................57
System Requirements for Adding Processor MCMs ...................91
Number of Bulk Power Regulators (BPR) FC 6186 Required as a Function of MCMs and I/O
Drawers ..................................92
Specifications ..................................94
pSeries 670 Physical Specifications and Loads ....................94
Weight Distribution ...............................99
Total System Power Consumption .........................103
Service Inspection Guide .............................105
Preventive Maintenance .............................105
Processor Subsystem Air Filters .........................105
Chapter 2. Diagnostics Overview .........................107
Maintenance Analysis Procedures (MAPs) .......................107
Checkpoints ..................................107
FRU Isolation .................................109
FRU Identify LEDs ...............................109
Service Agent for the Eserver pSeries 670 ......................110
Using the Service Processor and Service Agent Features .................110
Running Diagnostics on the Native Serial Port on a Full Machine Partition with an HMC Attached 110
Chapter 3. Maintenance Analysis Procedures (MAPs) .................111
Entry MAP...................................111
Quick Entry MAP ................................113
iv Eserver pSeries 670 Service Guide

Quick Entry MAP Table of Contents ........................113
MAP 1020: Problem Determination .........................120
Purpose of This MAP .............................120
MAP 1320: Service Focal Point ...........................125
MAP 1321: Quick Entry MAP for Systems with Service Focal Point..............126
MAP 1322: End of Call MAP for Systems with Service Focal Point ..............135
MAP 1420: Recovery Procedures for Hot-Pluggable PCI Adapters ..............140
MAP 1421: Partition Will Not Boot Due to Faulty Adapter ................140
MAP 1422: Slot is Empty Even When Populated ...................141
MAP 1520: Power ................................144
MAP 1521: The System Will Not Power On And No Error Codes Are Available ........148
MAP 1522: UEPO Switch On The BPC Is In The Bypass Position .............151
MAP 1523: There Is a Bulk Power Regulator (BPR) Communications Fault..........152
MAP 1524: An Open Room EPO Switch Has Been Detected From One Side .........152
MAP 1525: There Is a 350 Volt Bulk Failure .....................154
MAP 1526: There Is An Integrated Battery Feature (IBF) Failure ..............157
MAP 1527: An Airflow Loss Has Been Detected ....................160
MAP 1528: There Is A Processor (Critical/Warning) Overtemperature Fault ..........162
MAP 1529: There Is A Bulk Power Assembly (BPA) Communication Failure .........163
MAP 152a: Loss of ac Power or Phase Missing ....................165
MAP 152b: 2.5 V Current/Voltage Problem in Processor Subsystem ............167
MAP 152c: 1.8 V Current/Voltage Problem in Processor Subsystem ............173
MAP 152d: 1.5 V Auxiliary Current/Voltage Problem in Processor Subsystem .........180
MAP 152e: 1.5 V CPU Current/Voltage Problem in Processor Subsystem ..........188
MAP 152f: 3.3 V Current/Voltage Problem in Processor Subsystem ............193
MAP 152g: 5.0 V Current/Voltage Problem in Processor Subsystem ............200
MAP 152h: 3.3V Current/Voltage Problem in I/O Subsystem ...............206
MAP 152i: 5.0 V Current/Voltage Problem in I/O Subsystem ...............214
MAP 152j: 2.5 V Current/Voltage Problem in I/O Subsystem ...............222
MAP 152k: 12.0 V Current/Voltage Problem in I/O Subsystem ..............230
MAP 152l: -12.0V Current/Voltage Problem in I/O Subsystem ...............239
MAP 152m: Cable Problem in Power Subsystem ...................246
MAP 152n: DASD Subsystem Power Problem ....................250
MAP 1540: Problem Isolation Procedures .......................253
MAP 1541: JTAG Problem Isolation ........................254
MAP 1542: I/O Problem Isolation .........................261
MAP 1543: MCM Module Problem Isolation .....................280
MAP 1544: Inner L3 Module Problem Isolation ....................282
MAP 1545: Outer L3 Module Problem Isolation ....................284
MAP 1546: Memory Book Problem Isolation .....................286
MAP 1547: I/O Book Problem Isolation .......................288
MAP 1548: Memory and Processor Problem Isolation..................290
MAP 1549: Attention Problem Isolation .......................293
MAP 154A: I2C Bus Problem Isolation .......................301
MAP 154B: Insufficient Hardware Resources Problem Isolation ..............305
Chapter 4. Checkpoints .............................307
IPL Flow ...................................307
Service Processor Checkpoints ...........................310
Firmware Checkpoints ..............................317
Boot Problems ................................342
Chapter 5. Error Code to FRU Index ........................345
Performing Slow Boot ..............................345
Confirming Initial Error Code ............................346
Four-Character Checkpoints ............................347
Contents v

Replacing the Media Subsystem Operator Panel ....................347
Replacing the Network Adapter ...........................347
Determining Location Code ............................347
Checkpoints and Error Codes Index .........................348
Operator Panel Error Codes ............................351
SPCN Error Codes ...............................352
Firmware/POST Error Codes ............................413
Service Processor Error Codes ...........................441
System Firmware Update Messages .........................680
Capacity Upgrade on Demand (CUoD) Messages ....................680
Scan Dump Messages ..............................680
Common Firmware Error Codes ..........................681
HMC Surveillance Error Codes ..........................693
Problem Determination-Generated Error Codes .....................695
Hypervisor Dump Retrieval Procedure ........................696
Hypervisor Dump Indications ...........................696
Chapter 6. Using the Online and Standalone Diagnostics ................699
Operating Considerations for Online and Standalone Diagnostics ..............699
Identifying the Terminal Type to the Diagnostics ....................700
Undefined Terminal Types ............................700
Resetting the Terminal .............................700
Online Diagnostics Modes of Operation ........................700
Service Mode ................................700
Concurrent Mode ...............................702
Maintenance Mode ..............................703
Standalone Diagnostic Operation ..........................704
Considerations for Running Standalone Diagnostics on a Partitioned System .........704
Considerations for Running Standalone Diagnostics from CD-ROM.............704
Running Standalone Diagnostics from a Network Installation Management (NIM) Server .....706
Booting Standalone Diagnostics from the NIM Server on a System with an HMC Attached ....707
Booting Standalone Diagnostics from the NIM Server on a System with No HMC Attached ....708
Chapter 7. Using the Service Processor .......................709
Service Processor Menus .............................709
Accessing the Service Processor Menus Locally ...................709
Accessing the Service Processor Menus Remotely...................710
Saving and Restoring Service Processor Settings ...................710
Menu Inactivity ................................710
General User Menu ...............................711
Privileged User Menus ..............................712
Main Menu .................................712
Service Processor Setup Menu ..........................714
Passwords .................................715
System Power Control Menu ...........................720
System Information Menu ............................724
Language Selection Menu ............................735
Call-In/Call-Out Setup Menu ...........................736
Modem Configuration Menu ...........................737
Serial Port Selection Menu ...........................738
Serial Port Speed Setup Menu ..........................739
Telephone Number Setup Menu..........................739
Call-Out Policy Setup Menu ...........................741
Customer Account Setup Menu ..........................742
Call-out Test .................................742
Service Processor Parameters in Service Mode (Full System Partition) ............742
vi Eserver pSeries 670 Service Guide

System Power-On Methods ............................742
Service Processor Reboot/Restart Recovery ......................744
Boot (IPL) Speed ...............................744
Failure During Boot Process ...........................744
Failure During Normal System Operation ......................744
Service Processor Reboot/Restart Policy Controls ...................744
System Firmware Updates.............................745
General Information on System Firmware Updates ...................746
Determining the Level of Firmware on the System ...................747
System Firmware Update in AIX Using a Locally Available Image .............748
Update Diskette Images and Instructions ......................748
Updating System Firmware From the Service Processor Menus ..............749
Updating System Firmware from the AIX Service Aids .................749
Updating System Firmware from the AIX Command Line ................750
Recovery Mode................................751
Configuring and Deconfiguring Processors or Memory ..................752
Run-Time CPU Deconfiguration (CPU Gard) .....................752
Service Processor System Monitoring - Surveillance ...................752
System Firmware Surveillance ..........................752
Operating System Surveillance ..........................754
Call-Out (Call-Home)...............................755
Console Mirroring ................................756
System Configuration .............................756
Service Processor Error Logs ...........................757
LCD Progress Indicator Log ............................758
Resetting the Service Processor ..........................758
Service Processor Operational Phases ........................760
Pre-Standby Phase ..............................760
Standby Phase ................................761
Bring-Up Phase ...............................761
Run-Time Phase ...............................762
Chapter 8. Using System Management Services ...................763
Select Language ................................764
Change Password Options ............................765
View Error Log .................................765
Setup Remote IPL (Initial Program Load) .......................766
Change SCSI Settings ..............................768
Select Console .................................768
Select Boot Options ...............................769
Select Boot Devices ...............................771
Display Current Settings .............................773
Restore Default Settings .............................774
Multiboot Startup ................................774
Exiting System Management Services ........................774
Chapter 9. Removal and Replacement Procedures...................775
Introduction ..................................778
Handling Static-Sensitive Devices .........................778
Powering Off and Powering On the System ......................779
Powering Off the System With an HMC Attached and AIX Installed .............779
Powering Off the System With an HMC Attached and Linux Installed ............780
Powering the System On ............................780
Powering On the System Using the Service Processor .................780
Hot-Pluggable FRUs ...............................781
Power Subsystem ................................783
Contents vii

Bulk Power Assembly (BPA) ...........................783
Bulk Power Regulator (BPR) ...........................783
Bulk Power Controller (BPC) ...........................784
Bulk Power Distributor (BPD)...........................785
Bulk Power Fan (BPF) .............................786
Bulk Power Enclosure (BPE) ...........................787
Unit Emergency Power Off (UEPO) Card Assembly ..................788
Integrated Battery Feature (IBF) .........................789
Processor Subsystem..............................791
Installing the MCM/L3/Passthrough Plug Map.....................791
I/O Books and I/O Blanks ............................792
Battery ...................................795
Processor Subsystem DCA (Distributed Converter Assembly) Books and DCA Blanks ......797
Capacitor Books and Blanks ...........................798
MCM Module (Processor) and Pass Through Modules .................799
L3 Cache Modules ..............................819
Capacity Upgrade on Demand (CUoD) VPD Module ..................839
VPD Card ..................................841
System Clock Card ..............................842
Aluminum Backplane Stiffener ..........................843
Processor Subsystem Chassis ..........................845
Memory Books and Memory Blanks ........................847
Fan Controller ................................848
Processor Fan Assemblies ...........................849
Fan Chassis .................................849
Processor Subsystem Air Filters .........................849
I/O Subsystem .................................850
I/O Subsystem PCI Slot LED Definitions ......................850
PCI Adapters ................................851
Replacing a Double-Wide Blind-Swap Adapter ....................920
Updating Xilinx Code on an SP Switch2 PCI Attachment Adapter .............921
Hot-Plug Steps for the SP Switch2 PCI Attachment Adapter ...............923
I/O Subsystem RIO Riser Card ..........................924
I/O Subsystem Distributed Converter Assembly (DCA) .................925
I/O Subsystem I/O Backplane Assembly.......................927
I/O Subsystem DASD Hard Disk Drive Assembly ...................929
I/O Subsystem DASD 4-Pack ..........................931
I/O Subsystem Fan ..............................932
I/O Subsystem Chassis .............................933
Media Subsystem ................................936
CD-ROM, DVD-RAM, or Tape Drive ........................936
Diskette Drive ................................937
Operator Panel ................................938
Media Subsystem Chassis............................939
Media Subsystem Internal Cables .........................940
Chapter 10. Parts Information ...........................941
7040 Model 61R Rack Subsystem ..........................942
7040 Model 671 Processor Subsystem (Front) .....................944
7040 Model 671 Processor Subsystem (Front) .....................946
7040 Model 671 Processor Subsystem (Rear) .....................949
7040 Model 671 Media Subsystem .........................951
Power and SCSI Cables to the Media Subsystem ....................953
7040 Model 61D I/O Subsystem ..........................955
Front ...................................955
Rear ....................................956
viii Eserver pSeries 670 Service Guide

Power Cabling .................................957
RIO Cables and I/O Power Cables..........................959
Keyboards and Mouse ..............................960
System Power Cables ..............................961
Tools ....................................962
Appendix A. Environmental Notices ........................963
Product Recycling and Disposal...........................963
Environmental Design ..............................963
Acoustical Noise Emissions ............................964
Declared Acoustical Noise Emissions........................964
Appendix B. Notices ..............................965
Appendix C. Service Processor Setup and Test ....................967
Service Processor Setup Checklist..........................967
Testing the Service Processor Setup .........................968
Testing Call-In ................................968
Testing Call-Out ...............................968
Serial Port Configuration ............................969
Appendix D. Modem Configurations ........................971
Sample Modem Configuration Files .........................971
Generic Modem Configuration Files ........................971
Specific Modem Configuration Files ........................971
Configuration File Selection ............................972
Examples for Using the Generic Sample Modem Configuration Files ............973
Customizing the Modem Configuration Files .....................974
IBM 7852-400 DIP Switch Settings ........................974
Xon/Xoff Modems ...............................975
Ring Detection ................................975
Terminal Emulators ..............................975
Recovery Procedures .............................975
Transfer of a Modem Session ...........................976
Recovery Strategy...............................977
Prevention Strategy ..............................977
Modem Configuration Sample Files .........................978
Sample File modem_m0.cfg ...........................978
Sample File modem_m1.cfg ...........................981
Sample File modem_z.cfg ............................983
Sample File modem_z0.cfg ...........................986
Sample File modem_f.cfg ............................989
Sample File modem_f0.cfg ...........................992
Sample File modem_f1.cfg ...........................995
Appendix E. Ground Path ............................999
Index ....................................1001
Contents ix

xEserver pSeries 670 Service Guide

Safety Notices
Adanger notice indicates the presence of a hazard that has the potential of causing death or serious
personal injury. Danger notices appear on the following pages:
vxii
v144
v778
v797
v925
Acaution notice indicates the presence of a hazard that has the potential of causing moderate or minor
personal injury. Caution notices appear on the following pages:
vxi
vxiii
v97
v144
v778
v795
v845
v936
v872
v882
For a translation of the safety notices contained in this book, see the System Unit Safety Information,
order number SA23-2652.
Electrical Safety
Observe the following safety instructions any time you are connecting or disconnecting devices attached to
the system.
DANGER
An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of
the system or the devices that attach to the system. It is the responsibility of the customer to
ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Use one hand, when possible, to connect or disconnect signal cables to prevent a possible
shock from touching two surfaces with different electrical potentials.
During an electrical storm, do not connect cables for display stations, printers, telephones, or
station protectors for communications lines.
D06
CAUTION:
This product is equipped with a four-wire (three-phase and ground) power cable for the user’s
safety. Use this power cable with a properly grounded electrical outlet to avoid electrical shock.
C27
xi

DANGER
To prevent electrical shock hazard, disconnect all power cables from the electrical outlet before
relocating the system.
D01
CAUTION:
This unit has more than one power supply cord. Follow procedures for removal of power from the
system when directed.
C28
CAUTION:
Energy hazard, remove power before servicing.
C22
CAUTION:
Energy hazard, remove all jewelry before servicing.
C29
xii Eserver pSeries 670 Service Guide

Laser Safety Information
CAUTION:
This product may contain a CD-ROM, DVD-ROM, or laser module on a PCI card, which are class 1
laser products.
C30
Laser Compliance
All lasers are certified in the U.S. to conform to the requirements of DHHS 21 CFR Subchapter J for class
1 laser products. Outside the U.S., they are certified to be in compliance with the IEC 825 (first edition
1984) as a class 1 laser product. Consult the label on each part for laser certification numbers and
approval information.
CAUTION:
All IBM laser modules are designed so that there is never any human access to laser radiation
above a class 1 level during normal operation, user maintenance, or prescribed service conditions.
Data processing environments can contain equipment transmitting on system links with laser
modules that operate at greater than class 1 power levels. For this reason, never look into the end
of an optical fiber cable or open receptacle. Only trained service personnel should perform the
inspection or repair of optical fiber cable assemblies and receptacles.
C25, C26
Preface xiii

xiv Eserver pSeries 670 Service Guide

Data Integrity and Verification
IBM computer systems contain mechanisms designed to reduce the possibility of undetected data corruption
or loss. This risk, however, cannot be eliminated. Users who experience unplanned outages, system failures,
power fluctuations or outages, or component failures must verify the accuracy of operations performed and
data saved or transmitted by the system at or near the time of the outage or failure. In addition, users must
establish procedures to ensure that there is independent data verification before relying on such data in
sensitive or critical operations. Users should periodically check the IBM support websites for updated
information and fixes applicable to the system and related software.
xv

xvi Eserver pSeries 670 Service Guide

About This Book
This book provides maintenance information that is specific to the Eserver pSeries 670, as well as
adapters, and attached devices that do not have their own service information. It also contains
Maintenance Analysis Procedures (MAPs) that are not common to other systems.
MAPs that are common to all systems are contained in the RS/6000 and Eserver pSeries Diagnostic
Information for Multiple Bus Systems.
This book is used by the service representative to repair system failures. This book assumes that the
service representative has had training on the system.
ISO 9000
ISO 9000 registered quality systems were used in the development and manufacturing of this product.
Accessing Information
Documentation for the IBM Eserver pSeries is available online. Visit the IBM Eserver pSeries
Information Center at http://publib16.boulder.ibm.com/pseries/en_US/infocenter/base.
vTo access the pSeries publications, click Hardware documentation.
vTo view information about the accessibility features of Eserver pSeries hardware and the AIX operating
system, click AIX and pSeries accessibility.
Related Publications
The following publications are available:
vThe System Unit Safety Information, order number SA23-2652, contains translations of safety
information used throughout this book.
vThe IBM Hardware Management Console for pSeries Installation and Operations Guide, order number
SA38-0590, contains information on how to set up and cable the hardware system console and verify
system operation.
vThe IBM Hardware Management Console for pSeries Maintenance Guide, order number SA38-0603,
contains MAPS, removal and replacement procedures, error codes, and parts information that help
trained service representatives diagnose and repair the hardware system console.
vThe Eserver pSeries 670 Installation Guide, order number SA38-0613, contains information on how to
set up and cable the system, install and remove options, and verify system operation.
vThe Eserver pSeries 670 User’s Guide, order number SA38-0614, contains information on how to use
the system, use diagnostics, use service aids, and verify system operations.
vThe RS/6000 and Eserver pSeries Diagnostic Information for Multiple Bus Systems, order number
SA38-0509, contains common diagnostic procedures, error codes, service request numbers, and failing
function codes. This manual is intended for trained service technicians.
vThe RS/6000 and Eserver pSeries Adapters, Devices, and Cable Information for Multiple Bus
Systems, order number SA38-0516, contains information about adapters, external devices, and cabling.
This manual is intended to supplement information found in the RS/6000 and Eserver pSeries
Diagnostic Information for Multiple Bus Systems.
vThe PCI Adapter Placement Reference, order number SA38-0538, contains information regarding slot
restrictions for adapters that can be used in this system.
vThe Site and Hardware Planning Information, order number SA38-0508, contains information to help
you plan your installation.
xvii

vThe Electronic Service Agent For pSeries and RS/6000 User’s Guide, order number LCD4-1060,
contains information for use by the service representative to help set up and use the Service Director
package.
vThe AIX Installation Guide and Reference, order number SC23-4389, contains information to help you
plan and install systems to use a network server to do functions such as installing the operating system
or diagnostics on systems connected to the network.
Trademarks
The following terms are trademarks of International Business Machines Corporation in the United States,
other countries, or both:
vAIX
ve (logo)
vpSeries
vRS/6000
vLANstreamer
Other company, product, and service names may be trademarks or service marks of others.
xviii Eserver pSeries 670 Service Guide