IEI Technology DRPC-330-A7K Series User manual

DRPC-330-A7K Embedded System
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User Manual
MODEL:
DRPC-330-A7K
Fanless Embedded System with Marvell® ARMADA®
88F7040 CPU, 10GbE SFP+, Dual GbE, Isolated Serial Ports,
USB 3.2 Gen 1, M.2 Slots, 9V~36V DC Power Input,
DIN Rail Mounting Support and RoHS Compliant
Rev. 1.00 – January 7, 2021

DRPC-330-A7K Embedded System
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Revision
Date Version Changes
January 7, 2021 1.00 Initial release

DRPC-330-A7K Embedded System
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help reduce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.
HOT SURFACE
This symbol indicates a hot surface that should not be touched without
taking care.
IEC 60417-5009: STAND-BY

DRPC-330-A7K Embedded System
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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.2 FEATURES................................................................................................................... 3
1.3 FRONT PANEL............................................................................................................. 4
1.4 TOP PANEL ................................................................................................................. 5
1.5 TECHNICAL SPECIFICATIONS ...................................................................................... 6
1.6 DIMENSIONS............................................................................................................... 8
2 UNPACKING................................................................................................................. 9
2.1ANTI-STATIC PRECAUTIONS...................................................................................... 10
2.2 UNPACKING PRECAUTIONS....................................................................................... 10
2.3 PACKING LIST............................................................................................................11
2.4 OPTIONAL ITEMS...................................................................................................... 12
3 INSTALLATION ......................................................................................................... 13
3.1 INSTALLATION PRECAUTIONS................................................................................... 14
3.1.1 High Surface Temperature............................................................................... 14
3.2 INTERNALACCESS PANEL REMOVAL ........................................................................ 15
3.3 M.2 MODULE INSTALLATION.................................................................................... 16
3.4 SIM CARD INSTALLATION........................................................................................ 17
3.5 WIRELESS LAN MODULE INSTALLATION (OPTIONAL)............................................. 20
3.6 RS-232/422/485 SERIAL PORT CONNECTION ........................................................... 22
3.7 RS-232 SERIAL PORT CONNECTION ......................................................................... 22
3.8 CONSOLE CONNECTION............................................................................................ 23
3.9 LAN CONNECTION -1GBE ...................................................................................... 24
3.10 LAN CONNECTION -10GBESFP+......................................................................... 25
3.11 DIN RAIL MOUNTING ............................................................................................ 26
3.12 POWER-ON PROCEDURE......................................................................................... 28
3.12.1 Installation Checklist..................................................................................... 28
3.12.2 Terminal Block Pinouts.................................................................................. 28
3.12.3 Power-on Procedure ...................................................................................... 29

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3.13AVAILABLE DRIVERS .............................................................................................. 30
3.13.1 Driver Download ........................................................................................... 30
4 TROUBLESHOOTING AND MAINTENANCE..................................................... 32
4.1 SYSTEM MAINTENANCE OVERVIEW......................................................................... 33
4.2 SYSTEM TROUBLESHOOTING.................................................................................... 33
4.2.1 The System Doesn’t Turn On............................................................................ 33
4.2.2 The System Doesn’t Boot Up............................................................................ 34
4.2.3 More Troubleshooting...................................................................................... 34
4.3 JUMPER SETTINGS .................................................................................................... 35
4.3.1 Clear CMOS..................................................................................................... 35
4.3.2 Watchdog Timer Jumper .................................................................................. 36
5 INTERFACE CONNECTORS................................................................................... 37
5.1 PERIPHERAL INTERFACE CONNECTORS..................................................................... 38
5.2 INTERNAL PERIPHERAL CONNECTORS...................................................................... 39
5.2.1 Battery Connector (BAT1) ............................................................................... 39
5.2.2 I2C Connector (CN4) ....................................................................................... 40
5.2.3 LED Connector (JP3)...................................................................................... 40
5.2.4 M.2 2230 A-key Slot (J6).................................................................................. 40
5.2.5 M.2 2280 B-key Slot (M_2_B2) ....................................................................... 42
5.2.6 M.2 2242/2280 B-key Slot (M_2_B1) .............................................................. 43
5.2.7 SPI Flash Connector (JSPI1)........................................................................... 45
5.2.8 TPM Connector (TPM1).................................................................................. 45
A REGULATORY COMPLIANCE.............................................................................. 46
B SAFETY PRECAUTIONS......................................................................................... 51
B.1 SAFETY PRECAUTIONS............................................................................................. 52
B.1.1 General Safety Precautions............................................................................. 52
B.1.2 Anti-static Precautions .................................................................................... 53
B.1.3 Explanation of Graphical Symbols.................................................................. 53
B.1.4 Product Disposal............................................................................................. 54
B.2 MAINTENANCE AND CLEANING PRECAUTIONS ........................................................ 55
B.2.1 Maintenance and Cleaning.............................................................................. 55
B.2.2 Cleaning Tools................................................................................................. 55

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C WATCHDOG TIMER ................................................................................................ 57
D ERROR BEEP CODE ................................................................................................ 60
D.1 PEI BEEP CODES ..................................................................................................... 61
D.2 DXE BEEP CODES................................................................................................... 61
E HAZARDOUS MATERIALS DISCLOSURE ......................................................... 62
E.1 ROHS II DIRECTIVE (2015/863/EU)........................................................................ 63
E.2 CHINA ROHS........................................................................................................... 64

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List of Figures
Figure 1-1: DRPC-330-A7K Series.................................................................................................2
Figure 1-2: Front Panel ..................................................................................................................4
Figure 1-3: Top Panel.....................................................................................................................5
Figure 1-4: Physical Dimensions (millimeters)............................................................................8
Figure 3-1: Internal Access Panel Retention Screws................................................................15
Figure 3-2: M.2 Slot Locations ....................................................................................................16
Figure 3-3: Inserting the M.2 Module into the Slot at an Angle ...............................................16
Figure 3-4: Securing the M.2 Module..........................................................................................17
Figure 3-5: Unlock SIM Card Slot Cover ....................................................................................18
Figure 3-6: Unlock SIM Card Slot Cover ....................................................................................18
Figure 3-7: SIM Card Installation.................................................................................................19
Figure 3-8: Lock SIM Card Slot Cover........................................................................................19
Figure 3-9: Knockout Holes for Wireless Antenna....................................................................20
Figure 3-10: Connecting RF Cables............................................................................................21
Figure 3-11: Securing SMA Connector and External Antenna Installation ............................21
Figure 3-12: RJ-45 1GbE Connector...........................................................................................24
Figure 3-13: 10GbE SFP+ Connector..........................................................................................25
Figure 3-14: DIN Rail Mounting Bracket Installation.................................................................26
Figure 3-15: Attach the Mounting Bracket to the DIN Rail .......................................................27
Figure 3-16: Mounting the System..............................................................................................27
Figure 3-17: Power-on..................................................................................................................29
Figure 3-18: IEI Resource Download Center..............................................................................30
Figure 4-1: Clear CMOS Button Location...................................................................................35
Figure 4-2: Watchdog Timer Jumper Location..........................................................................36
Figure 5-1: Main Board Layout Diagram ....................................................................................38

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List of Tables
Table 1-1: Technical Specifications..............................................................................................7
Table 3-1: RS-232/422/485 Connector Pinouts..........................................................................22
Table 3-2: RS-232 DB-9 Connector Pinouts...............................................................................22
Table 3-3: RJ-45 Serial Port Pinouts...........................................................................................23
Table 3-4: 1GbE Port Pinouts......................................................................................................24
Table 3-5: RJ-45 1GbE Connector LEDs ....................................................................................24
Table 3-6: 10GbE Port Pinouts....................................................................................................25
Table 3-7: 10GbE SFP+Connector LEDs....................................................................................25
Table 3-8: 3-pin Power Terminal Block Pinouts........................................................................28
Table 4-1: Watchdog Timer Jumper Settings ............................................................................36
Table 5-1: Peripheral Interface Connectors...............................................................................39
Table 5-2: Battery Connector (BAT1) Pinouts...........................................................................39
Table 5-3: I2C Connector (CN4) Pinouts.....................................................................................40
Table 5-4: LED Connector (JP3) Pinouts....................................................................................40
Table 5-5: M.2 2230 A-key Slot (J6) Pinouts ..............................................................................41
Table 5-6: M.2 2280 B-key Slot (M_2_B2) Pinouts.....................................................................43
Table 5-7: M.2 2280 B-key Slot (M_2_B1) Pinouts.....................................................................44
Table 5-8: SPI Flash Connector (JSPI1) Pinouts.......................................................................45
Table 5-9: TPM Connector (TPM1) Pinouts................................................................................45
DRPC-330-A7K

DRPC-330-A7K Embedded System
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Chapter
1
1 Introduction

DRPC-330-A7K Embedded System
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1.1 Overview
Figure 1-1: DRPC-330-A7K Series
The DRPC-330-A7K fanless embedded system is powered by the Marvell®ARMADA®
88F7040 processor. It is designed for harsh environment applications, and supports DIN
rail mounting method.
The DRPC-330-A7K accepts a wide range of DC power input (9 V ~ 36 V), allowing it to
be powered anywhere. Two USB 3.2 Gen 1 (5Gb/s), two isolated RS-232/422/485, two
isolated RS-232, two GbE RJ-45 and one 10GbE SFP+ provide rich I/O options for
various applications.

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1.2 Features
The DRPC-330-A7K features are listed below:
Fanless design
Marvell®ARMADA®88F7040 processor (1.4GHz, quad-core)
On-board 4GB DDR4 memory
32GB eMMC 5.1 and one microSD slot for storage
Wide range DC power input (9 V ~ 36 V)
Extended temperature fanless design supports -20°C ~ 60°C
2.5kV isolated serial interfaces: two RS-232/422/485, two RS-232
Supports one 10GbE SFP+ and two GbE RJ-45
Three M.2 slots for expansions
Low power consumption
DIN rail mounting support
RoHS compliant

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1.3 Front Panel
The DRPC-330-A7K front panel contains:
1 x SFP+ 10 Gigabit LAN port
2 x RJ-45 Gigabit LAN port
2 x RS-232/422/485 serial port with 2.kV isolation
2 x RS-232 serial port with 2.kV isolation
1 x Console port
2 x USB 3.2 Gen 1 (5Gb/s) port
1 x Power LED (green)
1 x Storage LED (yellow)
1 x Alarm LED (red)
The overview of the front panels is shown in Figure 1-2.
Figure 1-2: Front Panel

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1.4 Top Panel
The DRPC-330-A7K top panel contains:
1 x 9 V ~ 36 V DC power terminal block
1 x microSD slot
1 x Power button
1 x Reset button
1 x Clear CMOS button
An overview of the top panel is shown in Figure 1-3 below.
Figure 1-3: Top Panel

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1.5 Technical Specifications
The DRPC-330-A7K technical specifications are listed in Table 1-1.
System
CPU (SoC) Marvell®ARMADA®88F7040 processor 1.4GHz (quad-core)
Memory On-board 4GB 2400MHz DDR4
Wireless 802.11a/b/g/n/ac (optional)
Watchdog Timer Software programmable, support 1~255 sec. system reset
Supported OS Linux Ubuntu 18.10
Storage
HDD One microSD slot
eMMC eMMC 5.1 supported (32 GB pre-installed)
I/O and Indicators
Ethernet 2 x GbE RJ-45 port by Marvell®88E1512
1 x 10GbE SFP+ port by Marvell®88F7040
Note: The 10GbE SPF+ port has no transceiver.
COM Port 1 x Console (RJ-45)
2 x RS-232/422/485 with AFC (DB-9, 2.5kV isolation)
2 x RS-232 (DB-9, 2.5kV isolation)
USB 2 x USB 3.2 Gen 1 (5Gb/s) ports
Digital I/O 8-bit, 4-bit input/4-bit output (DB-9)
TPM 1 x TPM 2.0 (2x10 pin) (optional)
Expansions 1 x M.2 2230 A-key slot (PCIe x1 / USB 2.0)
1 x M.2 2280 B-key slot (PCIe x1)
1 x M.2 2242/2280 B-key slot with SIM card slot (PCIe x1 /
USB 3.2 / USB 2.0)
LED Indicators 1 x Storage LED (yellow)
1 x Power LED (green)
1 x Alarm LED (red)

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Buttons Power button
Reset button
Clear CMOS button
Power
Power Input One power connector (3-pin terminal block)
9 V ~ 36 V DC
Power Consumption 36 V @ 0.86 A
Environmental and Mechanical
Mounting DIN rail
Operating Temperature -20°C~60°C with air flow
Storage Temperature -40°C~80°C with air flow
Operating Humidity 10%~95%, non-condensing
Storage Humidity 10%~90%, non-condensing
Chassis Construction Extruded aluminum alloy for fanless support
Color Black
Operating Shock Half-sine shock 5G, 11ms, 100 shocks per axis, IEC68-2-27
Operating Vibration MIL-STD-810G 514.6C-1
Safety CE/FCC
Weight (Net/Gross) 1.3 kg/1.45 kg
Physical Dimensions 174 mm x 58.75 mm x 130 mm (H x W x D)
Table 1-1: Technical Specifications

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1.6 Dimensions
The physical dimensions are shown below:
Figure 1-4: Physical Dimensions (millimeters)

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Chapter
2
2 Unpacking

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2.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during installation
may result in
permanent damage to the DRPC-330-A7K
and severe injury to the
user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the DRPC-330-A7K. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the DRPC-330-A7K or any other electrical component is
handled, the following anti-static precautions are strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board, touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the DRPC-330-A7K, place it on an
anti-static pad. This reduces the possibility of ESD damaging the
DRPC-330-A7K.
2.2 Unpacking Precautions
When the DRPC-330-A7K is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 2.1.
Make sure the packing box is facing upwards so the DRPC-330-A7K does not
fall out of the box.
Make sure all the components shown in Section 2.3 are present.