Intel E7500 Guide

Intel®E7500/E7505 Chipset
Thermal Design Guide
Intel®E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal
and Mechanical Design Guidelines
November 2002
Document Number: 298647-002
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2 Intel®E7500/E7505 Chipset MCH Thermal Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL
DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining
applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel®E7500/E7505 chipset MCH may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2002, Intel Corporation

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Intel®E7500/E7505 Chipset MCH Thermal Design Guide 3
Contents
1Introduction ..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents ..........................................................................................10
2Packaging Technology ......................................................................................................11
3Thermal Simulation............................................................................................................13
4Thermal Specifications ......................................................................................................15
4.1 Case Temperature and Thermal Design Power ...................................................15
4.2 Die Temperature...................................................................................................15
5Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements ..........................................................................17
5.1.1 0° Angle Attach Methodology ................................................................17
5.2 Power Simulation Software...................................................................................19
6Reference Thermal Solutions ............................................................................................21
6.1 Operating Environment .........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly ..................................................................................23
6.3.1 Heatsink Orientations ............................................................................25
6.3.2 Extruded Heatsink Profiles ....................................................................26
6.3.3 Mechanical Interface Material ...............................................................27
6.3.4 Thermal Interface Material ....................................................................27
6.3.5 Heatsink Clip .........................................................................................27
6.3.6 Clip Retention Anchors..........................................................................28
6.3.7 Board Level Component Keep-out Dimensions ....................................28
6.4 Reliability Guidelines.............................................................................................30
Appendix A: Thermal Solution Component Suppliers ...............................................................................31
Appendix B: Mechanical Drawings............................................................................................................33

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Figures
Figure 1. Thermal Design Process ......................................................................................8
Figure 2. MCH Package Dimensions (Side View) .............................................................11
Figure 3. MCH Package Dimensions (Top View)..............................................................12
Figure 4. 0 Angle Attach Methodology (Top View) ............................................................18
Figure 5. 0° Angle Attach Heatsink Modifications..............................................................18
Figure 6. Thermal Solution Decision Flowchart.................................................................19
Figure 7. Reference Heatsink Volumetric Envelope for the MCH .....................................22
Figure 8. Reference Thermal Solution Assembly..............................................................23
Figure 9. Reference Thermal Solution Assembly (Side View)...........................................24
Figure 10. Reference Thermal Solution (Top View) ..........................................................24
Figure 11. Preferred Heatsink Orientation.........................................................................25
Figure 12. Extruded Heatsink Profile.................................................................................26
Figure 13. Alternate Tall Heatsink Profile ..........................................................................26
Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece ..........................................27
Figure 15. Heatsink Retention Mechanism Layout............................................................28
Figure 16. Retention Mechanism Component Keep-out Zones ........................................29
Figure 17. MCH Heatsink Assembly..................................................................................34
Figure 18. MCH Heatsink Clip ...........................................................................................35
Tables
Table 1. Intel®E7500 Chipset MCH Thermal Specifications.............................................15
Table 2. Intel®E7505 Chipset MCH Thermal Specifications.............................................15
Table 3. Reliability Guidelines............................................................................................30
Table 4. Complete Thermal Solution Kits ..........................................................................31
Table 5. Extruded Heatsinks .............................................................................................31
Table 6. Interface Materials ...............................................................................................32
Table 7. Attach Hardware..................................................................................................32

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Intel®E7500/E7505 Chipset MCH Thermal Design Guide 5
Revision History
Revision
Number
Description Date
-001 Initial Release as an Intel®E7500 chipset specific document February 2002
-002 • Added Intel®E7505 chipset specific information and re-titled
document
• Updated E7500/E7505 chipset MCH thermal specifications
• Removed 90°C Angle Attach Die Temperature Measurement
Methodology
• Updated Supplier Contact Information
• All reference to Tdie-hs changed to Tcase
November 2002

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Introduction
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Intel®E7500/E7505 Chipset MCH Thermal Design Guide 7
1 Introduction
As the complexity of computer systems increase, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to
improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are:
• To specify the operating limits of the Intel®E7500/E7505 chipset MCH components.
• To describe a reference thermal solution that meets the thermal specifications of the
Intel®E7500/E7505 chipset MCH components.
Properly designed solutions provide adequate cooling to maintain the E7500/E7505 chipset MCH
die temperatures at or below thermal specifications. This is accomplished by providing a low
local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-
ambient thermal resistance. By maintaining the E7500/E7505 chipset MCH die temperature at or
below the specified limits, a system designer can ensure the proper functionality, performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance
and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heatsink can be varied to balance size and space
constraints with acoustic noise.
This document addresses thermal design and specifications for the E7500/E7505 chipset MCH
components only. For thermal design information on other chipset components, refer to the
respective component datasheet. For the P64H2, refer to the Intel®PCI-64 Hub 2 (P64H2)
Thermal Design Guidelines. For the ICH3-S, refer to the Intel®82801CA I/O Controller Hub 3
(ICH3-S) Datasheet. For the ICH4, refer to the Intel® 82801DB I/O Controller Hub 4 (ICH4)
Datasheet.
Note: Unless otherwise specified, the term “MCH” refers to both the E7500 chipset MCH and E7505
chipset MCH.

Introduction
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1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided to the
system designer. Figure 1 illustrates the design process implicit to this document and the tools
appropriate for each step.
Figure 1. Thermal Design Process
Step 1: Thermal Simulation
- Thermal Models
- Thermal Model Users
Guide
Step 2: Heatsink Selection
- Thermal Reference
- Mechanical Reference
Step 3: Thermal Validation
- Thermal Testing Software
- Software Users Guide
Therm_Design_Proc

Introduction
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Intel®E7500/E7505 Chipset MCH Thermal Design Guide 9
1.2 Definition of Terms
Term Definition
BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and
molding compound.
Intel®ICH3-S /
Intel®ICH4
I/O Controller Hub. The chipset component that contains the primary PCI interface,
LPC interface, USB, ATA-33, and other legacy functions.
MBGA Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH Memory Controller Hub. The chipset component that contains the processor interface
and the memory interface.
FC-BGA Flip Chip Ball Grid Array. A package type defined by a resin-fiber substrate where a die
is mounted using an underfilled C4 (Controlled Collapse Chipset Connection) attach
style. The primary electrical interface is an array of solder balls attached to the
substrate opposite the die. The device arrives at the customer with solder balls
attached. This is the packaging technology used for the MCH.
Intel®P64H2 Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
Tcase Maximum die temperature allows. This temperature is measured at the geometric
center of the top of the package die.
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target
power level.

Introduction
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10 Intel®E7500/E7505 Chipset MCH Thermal Design Guide
1.3 Reference Documents
Document Document
Number
Intel®Xeon™ Processor Thermal Design Guidelines
http://www.intel.com/design/Xeon/guides/298348.htm
298348
Intel®PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines 298648
Intel®Xeon™ Processor with 512-KB L2 Cache and Intel®E7500 Chipset Platform
Design Guide
298649
Intel®E7500 Chipset: E7500 Memory Controller Hub (MCH) Datasheet 290730
Intel®Xeon™ Processor and Intel®E7505 Chipset Platform Design Guide 251934
Intel®E7505 Chipset Memory Controller Hub (MCH) Datasheet 251932
Intel®82801CA I/O Controller Hub 3 (ICH3-S) Datasheet 290733
Intel®82801DB I/O Controller Hub 4 (ICH4) Datasheet 290744
Intel®82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet 290732
BGA/OLGA Assembly Development Guide Note 1
Thermal Design Suggestions for various form factors
http://www.formfactors.org
NOTES:
1. Contact your Intel Field Sales representative.