
Intel® Xeon® Processor 5500 Series 19
Specification Update, February 2014
1. Although these units are factory-configured for 1333 MHz integrated memory controller frequency, Intel
does not support operation beyond 1066 MHz; however, this processor has additional support to
override the integrated memory controller frequency.
2. Column indicates the number of frequency bins (133.33 MHz) of Intel® Turbo Boost Technology that are
available for 4, 3, 2, or 1 cores active respectively.
3. CPUID is 0000106Ash, where ‘s’ is the stepping number.
4. This is an Intel® Xeon Processor X5570 with 95W TDP (Thermal Design Power).
5. This is an Intel® Xeon Processor X5560 with 95W TDP (Thermal Design Power).
6. This is an Intel® Xeon Processor X5550 with 95W TDP (Thermal Design Power).
7. This is an Intel® Xeon Processor E5540 with 80W TDP (Thermal Design Power).
8. This is an Intel® Xeon Processor E5530 with 80W TDP (Thermal Design Power).
9. This is an Intel® Xeon Processor E5520 with 80W TDP (Thermal Design Power).
10. This is an Intel® Xeon Processor E5506 with 80W TDP (Thermal Design Power).
11. This is an Intel® Xeon Processor E5504 with 80W TDP (Thermal Design Power).
12. This is an Intel® Xeon Processor E5502 with 80W TDP (Thermal Design Power).
13. This is an Intel® Xeon Processor L5520 with 60W TDP (Thermal Design Power).
14. This is an Intel® Xeon Processor L5506 with 60W TDP (Thermal Design Power).
15. This is an Intel® Xeon Processor W5580 with 130W TDP (Thermal Design Power).
16. Column indicates the number of frequency bins (133.33 MHz) of Intel® Turbo Boost Technology that are
available for 4, 3, 2, or 1 cores active respectively.
17. This is an Intel® Xeon Processor 5500 Series with 60W TDP and elevated case temperature spec.
18. This is an Intel® Xeon Processor 5500 Series with 38W TDP and elevated case temperature spec.
19. This is an Intel® Xeon Processor L5518 with 60W TDP and elevated case temperature spec.
20. This is an Intel® Xeon Processor L5508 with 38W TDP and elevated case temperature spec.
21. This is an Intel® Xeon Processor W5590 with 130W TDP (Thermal Design Power).
22. This is an Intel® Xeon Processor E5507 with 80W TDP (Thermal Design Power).
23. This is an Intel® Xeon Processor L5530 with 60W TDP (Thermal Design Power).
24. This is an Intel® Xeon Processor E5503 with 80W TDP (Thermal Design Power).
Mixing Processor Within DP Platforms
Intel supports dual processor (DP) configurations consisting of processors:
1. From the same power optimization segment
2. That support the same maximum Intel® QuickPath Interconnect (Intel® QPI) and
DDR3 memory speeds.
3. That share symmetry across physical packages with respect to the number of
logical processors per package, number of cores per package, number of Intel QPI
Interfaces, and cache topology.
4. That have identical Extended Family, Extended Model, Processor Type, Family Code
and Model Number as indicated by the function 1 of the CPUID instruction.
Note: Processors must operate with the same Intel QPI, DDR3 memory and core frequency.
While Intel does nothing to prevent processors from operating together, some
combinations may not be supported due to limited validation, which may result in
uncharacterized errata. Coupling this fact with the large number of Intel Xeon
processor 5500 series attributes, the following population rules and stepping matrix
have been developed to clearly define supported configurations.
1. Processors must be of the same power-optimization segment. This insures
processors include the same maximum Intel QPI and DDR3 operating speeds and
cache sizes.
2. Processors must operate at the same core frequency. Note: Processors within the
same power-optimization segment supporting different maximum core frequencies
(for example, a 2.93 GHz / 95 W and 2.66 GHz / 95W) can be operated within a
system. However, both must operated at the highest frequency rating commonly
supported. Mixing components operating at different internal clock frequencies is
not supported and will not be validated by Intel.
3. Processors must share symmetry across physical packages with respect to the
number of logical processors per package, number of Intel QPI Interfaces, and
cache topology.