Intel Xeon LV User manual

Order Number: 315879-002
Dual-Core Intel®Xeon®Processor LV
and Intel®3100 Chipset
Development Kit
User’s Manual
January 2007

Dual-Core Intel®Xeon®Processor LV and Intel®3100 Chipset Development Kit
User’s Manual January 2007
2Order Number: 315879-002
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Copyright © 2006, Intel Corporation. All Rights Reserved.

Dual-Core Intel®Xeon®Processor LV and Intel®3100 Chipset Development Kit
January 2007 User’s Manual
Order Number: 315879-002 3
Contents
Contents
1.0 Product Description...................................................................................................7
1.1 Overview ..........................................................................................................7
1.1.1 Feature Summary ...................................................................................7
1.1.2 Board Layout ..........................................................................................9
1.2 Processors........................................................................................................11
1.3 System Memory................................................................................................11
1.3.1 DDR2-400 DIMM Slot Populations.............................................................11
1.3.2 DDR2 DIMM Ordering Overview................................................................13
1.4 Intel®3100 Chipset...........................................................................................15
1.4.1 On-Board Peripherals.............................................................................. 15
1.4.2 On-Board I/O......................................................................................... 16
1.4.3 I/O Slots for Expansion Capabilities ..........................................................18
1.4.4 Rear Panel I/O Connectors.......................................................................19
1.4.5 Hardware Server Management Features ....................................................20
1.5 Supported Operating Systems.............................................................................21
1.6 Supported BIOS Features...................................................................................22
1.6.1 ACPI.....................................................................................................22
1.7 Power Supply.................................................................................................... 23
1.8 Thermal and Mechanical Components...................................................................23
1.8.1 Heatsinks..............................................................................................24
1.9 Physical and Mechanical Board Specifications ........................................................26
1.9.1 Mounting Holes......................................................................................26
1.10 Debug Ports .....................................................................................................26
1.11 Real Time Clock (RTC), CMOS SRAM, and Battery..................................................26
2.0 Platform Setup ........................................................................................................27
2.1 Connecting the Wires.........................................................................................27
2.1.1 Connect SATA cables ..............................................................................28
2.1.2 Plugging In Memory................................................................................28
2.1.3 Connecting the Processor ........................................................................29
2.1.4 Connecting Heatsinks and Fans................................................................29
2.2 Connecting Other Peripherals..............................................................................31
2.2.1 Add-in Connectors..................................................................................31
2.2.2 Rear Panel Connectors ............................................................................32
2.2.3 Connecting a Floppy Drive.......................................................................33
2.2.4 Changing and/or Updating the BIOS Chip ..................................................33
2.2.5 Changing the CMOS Battery and Clearing CMOS.........................................34
2.3 Connect Power.................................................................................................. 34
2.4 Turning On and Resetting the Board ....................................................................37
3.0 Technical Reference ................................................................................................38
3.1 Memory Resources ............................................................................................38
3.2 DMA Channels ..................................................................................................38
3.3 Fixed I/O Map................................................................................................... 38
3.4 Interrupts .......................................................................................................38
3.5 PCI Conventional Interrupt Routing Map...............................................................39
3.6 Connectors.......................................................................................................40
3.6.1 Back Panel Connectors............................................................................40
3.6.2 Component Side Connectors ...................................................................40
3.7 Jumper Block....................................................................................................44
3.8 Mechanical Considerations..................................................................................47
3.8.1 Form Factor...........................................................................................47

Contents
Dual-Core Intel®Xeon®Processor LV and Intel®3100 Chipset Development Kit
User’s Manual January 2007
4Order Number: 315879-002
3.9 Electrical Considerations.....................................................................................48
3.9.1 DC Loading............................................................................................48
3.9.2 Add-in Board Considerations ...................................................................49
3.9.3 Fan Connector Current Capability..............................................................49
3.9.4 Power Supply Considerations ...................................................................49
3.10 Thermal Considerations .....................................................................................49
4.0 Overview of BIOS Features ......................................................................................51
4.1 Introduction......................................................................................................51
4.2 Resource Configuration.......................................................................................52
4.2.1 PCI Auto Configuration ............................................................................52
4.3 System Management BIOS (SMBIOS) ..................................................................52
4.4 Legacy USB Support...........................................................................................52
4.5 BIOS Updates ...................................................................................................53
4.5.1 Language Support .................................................................................53
4.6 Boot Options ....................................................................................................53
4.6.1 CD-ROM Boot ........................................................................................53
4.6.2 Network Boot.........................................................................................53
4.6.3 USB Boot...............................................................................................54
4.6.4 Booting without Attached Devices ............................................................54
4.6.5 Changing the Boot Device........................................................................54
4.7 BIOS Security Features ......................................................................................54
5.0 Error Messages and Beep Codes...............................................................................55
5.1 Speakers..........................................................................................................55
5.2 BIOS Beep Codes ..............................................................................................55
5.3 BIOS Error Messages .........................................................................................55
5.4 Port 80h POST Codes ........................................................................................55
Figures
1 Board Components .................................................................................................... 9
2 Four-DIMM Implementation .......................................................................................13
3 Example of Single-Rank DIMM Population ....................................................................14
4 Example of Single-Rank and Dual-Rank DIMM Mixing Population.....................................14
5 Example of Dual-Rank DIMM Population ......................................................................14
6Intel
®3100 Chipset Block Diagram.............................................................................15
7 PCI On-Board Video Chip...........................................................................................16
8 Floppy Drive Connector .............................................................................................16
9 Front Panel Header...................................................................................................17
10 XDP Connector.........................................................................................................17
11 Rear Panel I/O Connectors.........................................................................................19
12 Intel®3100 Chipset Active Heatsink ...........................................................................24
13 Processor Active Heatsink..........................................................................................25
14 Intel®3100 Chipset Passive Heatsink Design ...............................................................26
15 SATA Ports ..............................................................................................................28
16 DIMM Sockets..........................................................................................................29
17 Processor Socket......................................................................................................29
18 Processor Fan Mounting Bracket .................................................................................30
19 Screwing the Processor Fan into the Mounting Bracket...................................................30
20 Fan Power Connectors...............................................................................................31
21 PCI Express* Connectors...........................................................................................32
22 Floppy Drive Connector .............................................................................................33
23 Firmware Hub ..........................................................................................................33
24 CMOS Battery..........................................................................................................34

Dual-Core Intel®Xeon®Processor LV and Intel®3100 Chipset Development Kit
January 2007 User’s Manual
Order Number: 315879-002 5
Contents
25 CMOS Clear Jumper..................................................................................................34
26 Power Connector......................................................................................................35
27 ATX Power Connector ...............................................................................................35
28 Power Connector Cables............................................................................................36
29 Power and Reset Buttons ..........................................................................................37
30 Back Panel Connectors.............................................................................................. 40
31 ATX Power Connector ...............................................................................................41
32 SATA Power Connector .............................................................................................41
33 Front Panel Connector .............................................................................................42
34 Jumper Block Locations and Pin Connectors .................................................................44
35 Form Factor ............................................................................................................48
36 Menu Bar................................................................................................................51
Tables
1 Feature Summary ......................................................................................................7
2 Development Kit Contents...........................................................................................8
3 Component Layout Description ....................................................................................9
4 Supported Microprocessors........................................................................................11
5 Supported DDR2-400 DIMM Populations......................................................................11
6 Supported BIOS Features..........................................................................................22
7 Effects of Pressing the Power Switch...........................................................................22
8 Thermal and Mechanical Components .........................................................................23
9 DMA Channels ......................................................................................................... 38
10 I/O x APIC Interrupts ...............................................................................................39
11 PCI Interrupt Routing Map PCI Interrupt Source...........................................................40
12 Front Chassis Fan and Rear Chassis Fan Connectors .....................................................40
13 Main Power Connector Pin ......................................................................................... 41
14 SATA Power Connector .............................................................................................42
15 Auxiliary Front Panel Power and Reset Connector Pin .................................................... 42
16 Front Panel Connector ..............................................................................................42
17 Jumper Block Locations.............................................................................................45
18 DC Loading Characteristics Mode................................................................................49
19 Fan Connector Current Capability...............................................................................49
20 BIOS Setup Program Menu Bar ..................................................................................51
21 BIOS Setup Program Function Keys ............................................................................51
22 Beep Code Types .....................................................................................................55
23 BIOS Error Messages................................................................................................55
24 Port 80h POST Code Ranges......................................................................................56
25 Typical Port 80h POST Sequence................................................................................56

Revision History
Dual-Core Intel®Xeon®Processor LV and Intel®3100 Chipset Development Kit
User’s Manual January 2007
6Order Number: 315879-002
Revision History
Date Revision Description
January 2007 002 Changed order of steps in Chapter 2.0, “Platform Setup”.
December 2006 001 Initial public release.

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
January 2007 User’s Manual
Order Number: 315879-002 7
Product Description
1.0 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Customer Reference Board (CRB).
Table 1. Feature Summary
Feature Description
Form Factor ATX (12.00 inches by 10.75 inches)
Processors Dual-Core Intel®Xeon®Processor LV
(Additional processor support can be found in Figure 4, “Supported
Microprocessors” on page 11.)
Memory Support for 400 MHz DDR2 Registered ECC Support for up to 16 GB of system memory
Support for registered ECC only
Chipset Intel®3100 Chipset
Video On-board PCI ATI Rage* Mobility Video Chip
I/O Control Low Pin Count (LPC) Bus I/O Controller
USB Support for USB 1.1 and 2.0 devices
Total of four USB ports UHCI or EHCI configurations
Peripheral Interfaces
Two serial ports
One parallel port
Total of six SATA Ports (two available modes):
• Enhanced IDE mode- Utilizes four SATA ports
• AHCI mode- Utilizes Six SATA ports
One floppy drive interface
PS/2* keyboard and mouse ports
BIOS Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, SMBIOS, and Intel® Active Management Technology (Intel® AMT)
LAN Support Supports Dual Port PCI Express* Gigabit NIC
Expansion Capabilities Three PCI Express* x4 bus add-in card connectors
One PCI 32/33 bus add in card connector compliant with Specification 2.2
Hardware Monitor Subsystem
Hardware monitoring and fan control ASI
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Four fan connectors
Four fan sense inputs use to monitor fan activity
Fan speed control

Product Description
Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
User’s Manual January 2007
8Order Number:315879-002
Table 2 describes what is included in the Development Kit.
Table 2. Development Kit Contents
Feature Description
PCB CRB, Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
Processor Dual-Core Intel®Xeon®Processor LV
Memory Two 1 GB DDR2 DIMMs
Chipset Intel®3100 Chipset
Processor Heatsink Coolermaster* Active Heatsink
Network Card Intel PCI Express* Gigabit NIC
Firmware Hub Socketed Firmware Hub (BIOS)
Software Driver CD
Additional Peripherals
Standoffs (with installation hardware) for Benchtop use
Warning:
Placing the board on an unknown surface without standoffs may
short the CRB and result in damage. If CRB is not mounted in a
chassis, Intel recommends using provided Standoffs to prevent
risk of the bottom of the CRB shorting on a conductive surface.

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
January 2007 User’s Manual
Order Number: 315879-002 9
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Table 3 lists the components shown in Figure 1.
Figure 1. Board Components
B5793-01
4
31
10
21 3568
911 12 13 14 15 16
17
18
19
20
24
21
23
22
2526272829
32
33
7
39
37
35
38
36
34
30
Table 3. Component Layout Description (Sheet 1 of 2)
Callout Description
132-bit/33MHzPCIconnector
2 Port B x4 only PCI Express* using x8 connector
3 Port A x4 only PCI Express* using x8 connector (A1)
4On-board PCI ATI Rage* Mobility Video Chip if available (if not on-board a
PCI add-in Card is supplied)
5 Port A x4 only PCI Express* using x8 connector (A0)
6CMOSbattery
7 Power button
8Resetbutton
9 On-board speaker
10 Back panel 15 Pin VGA connector
11 USB ports (2) 2 top / 3 bottom

Product Description
Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
User’s Manual January 2007
10 Order Number:315879-002
12 USB ports (2) 0 top / 1 bottom
13 Serial com port 2
14 Parallel port
15 Serial com port 1
16 PS/2* top = mouse / bottom = keyboard
17 DIMM0
18 DIMM1
19 DIMM2
20 DIMM3 (closest to edge of board)
21 AUX FAN 1
22 XDP connector
23 JTAG connector
24 AUX FAN 0
25 Intel®3100 Chipset with active fan Connected to FAN1
26 Processor with active fan plugged into processor FAN
27 ATX 12 V for SATA power
28 ATX power connector
29 Floppy drive connector
30 Port 80 seven segment displays
31 Port 80 chip
32 Firmware hub (BIOS)
33 Plug For validation only
34 SATA port 0
35 SATA port 1
36 SATA port 2
37 SATA port 3
38 SATA port 4
39 SATA port 5
Table 3. Component Layout Description (Sheet 2 of 2)
Callout Description

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
January 2007 User’s Manual
Order Number: 315879-002 11
Product Description
1.2 Processors
The CRB is designed to support the following processors with a 667MHz FSB speed.
Use only the processors listed below in Table 4. Use of unsupported processors can
damage the CRB, the processor, and the power supply.
Note: In this document Processor refers to all processor SKUs listed in Table 4.
1.3 System Memory
The CRB has four DIMM sockets and supports the following memory features:
• DDR2-400 MHz registered ECC
•SEC/DED
• Up to four ranks of memory
• Minimum total system memory: 512 MB, maximum of 16 GB
• ECC DIMMs, 8 bits ECC
• Single channel operation only
• Supports x4 and x8 DDR2-512 Mb and DDR2-1 Gb technologies and x4 DDR2-2 Gb
technologies
1.3.1 DDR2-400 DIMM Slot Populations
Table 5 shows the supported DDR2-400 DIMM populations.
Table 4. Supported Microprocessors
Microprocessor FSB
Speed Parity
Intel® Pentium® M Processor 745 (1.8 GHz) 400 MHz No
Intel® Pentium® M Processor LV 738 (1.4 GHz) 400 MHz No
Intel® Celeron® M Processor ULV 373 (1.0 GHz) 400 MHz No
Intel® Celeron® M Processor 370 (1.5 GHz) 400 MHz No
Intel® Celeron® Processor (1.66 GHz) 667 MHz Yes
Dual-Core Intel® Xeon® Processor LV ( 2.16 GHz, 2.0 GHz, 1.66 GHz) 667 MHz Yes
Dual-Core Intel® Xeon® Processor ULV (1.66 GHz) 667 MHz Yes
Table 5. Supported DDR2-400 DIMM Populations
DIMM Configuration DIMM0 DIMM1 DIMM2 DIMM3
1 Single-rank Empty Empty Empty Single-rank
1 Dual-rank Empty Empty Empty Dual-rank
2 Single-rank Empty Empty Single-rank Single-rank
1 Dual-rank, 1 Single-rank Empty Empty Single-rank Dual-rank
2 Dual-rank Empty Empty Dual-rank Dual-rank

Product Description
Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
User’s Manual January 2007
12 Order Number:315879-002
3 Single-rank Empty Single-rank Single-rank Single-rank
1 Dual-rank, 2 Single-rank Empty Single-rank Single-rank Dual-rank
4 Single-rank Single-rank Single-rank Single-rank Single-rank
Table 5. Supported DDR2-400 DIMM Populations
DIMM Configuration DIMM0 DIMM1 DIMM2 DIMM3

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
January 2007 User’s Manual
Order Number: 315879-002 13
Product Description
1.3.2 DDR2 DIMM Ordering Overview
Figure 2 shows the DIMM ordering and location.
Note: Figure 2, “Four-DIMM Implementation” on page 13 * signifies that the chipselect is also
routed to these DIMMS.
The platform requires DDR2-400 DIMMs to be populated in order, starting with the
DIMM furthest from Intel®3100 Chipset in a “fill-farthest” approach (see Figure 2 on
page 13). In addition, dual-rank DIMMs must be populated farthest from Intel®3100
Chipset when a combination of single-rank and dual-rank DIMMs are used. This
recommendation is based on the chip select and on-die termination signals routing
requirements of the DDR2-400 interface. Intel recommends that you check for correct
DIMM placement during BIOS initialization and that all designs follow the DIMM
ordering, clock enable routing, command clock routing, and chip select routing shown
in Figure 2 on page 13. This addressing must be maintained to be compliant with the
BIOS code.
The two DIMMs that are provided with the development kit are 1Gb single-rank DIMMs.
If other memory is used follow the illustrations in Figure 3, Figure 4, and Figure 5.
Figure 3 shows how to populate four single-rank DIMMs. Figure 4 shows how to
populate one dual-rank and two single-rank DIMMs. Figure 5 shows how to populate
two dual-rank DIMMs.
Figure 2. Four-DIMM Implementation
Intel® 3100
Chipset
D
I
M
M
3
D
I
M
M
2
D
I
M
M
1
D
I
M
M
0
Fill Fourth Fill Third Fill Second Fill First
Dual-Rank DIMMs
Single-Rank DIMMs utilize all 4 DIMMs

Product Description
Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
User’s Manual January 2007
14 Order Number:315879-002
Figure 3. Example of Single-Rank DIMM Population
Figure 4. Example of Single-Rank and Dual-Rank DIMM Mixing Population
Figure 5. Example of Dual-Rank DIMM Population
Intel® 3100
Chipset
Single Rank DIMM 3 Single Rank DIMM 1 Single Rank DIMM 0
Single Rank DIMM 2
Intel® 3100
Chipset
Dual Rank DIMM 3
Single Rank DIMM 1
Empty 0
Single Rank DIMM 2
Intel® 3100
Chipset
Dual Rank DIMM 3
Empty 1 Empty 0
Dual Rank DIMM 2

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
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Product Description
1.4 Intel®3100 Chipset
1.4.1 On-Board Peripherals
Super I/O and PCI Video are included as on-board peripherals.
1.4.1.1 Super I/O
Super I/O includes a Low Pin Count (LPC) driven Super I/O device that can be disabled
by removing a resistor.
1.4.1.2 PCI Video
An ATI Rage* Mobility-M integrated video controller is located on the 32-bit, 33 MHz
PCI bus. Figure 7, “PCI On-Board Video Chip” on page 16 is a picture of the on board
chip.
Figure 6. Intel®3100 Chipset Block Diagram
B5990-01
FSB
PCI Express*
1x8 configurable as 2x4 or 2x1
PCI Express*
1x4 or 4x1
Serial ATA
6 Drives
LPC
SM Bus x2
PCI 32/33
2 UART
4 USB-2.0
38 GPIOs
WDT
Port A
Port B
Single-Memory
Channel
Registered ECC
DDR2 400
EDMA
Intel®3100 Chipset
IICH IMCH
Processor
* Other names and brands may be claimed as the property of others.

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Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
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16 Order Number:315879-002
1.4.2 On-Board I/O
The following sections include all of the on-board I/O.
1.4.2.1 Serial ATA (SATA)
The CRB provides a total of six SATA interface connectors.
• Four usable SATA connectors in a SATA mode (BIOS setting) (SATA 0-3)
• Six SATA ports available in an AHCI mode (BIOS setting) (SATA 0-5)
• There are no RAID Capabilities on the chipset. Of course SW RAID is always and
option.
1.4.2.2 Serial Connector
The CRB has one 10-pin, dual-row header.
• Provides the COM3 port from the Super I/O
1.4.2.3 Floppy Drive
The CRB supplies a 34-pin, dual-row header.
• Floppy drive support comes from Super I/O
• The BIOS setup program configures the floppy drive interface
1.4.2.4 LPC Debug Port
The CRB includes one 60-pin card edge connector for LPC.
• Aligned with PCI connector (used for Intel Validation Only)
Figure 7. PCI On-Board Video Chip
Figure 8. Floppy Drive Connector

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Product Description
1.4.2.5 Front Panel Control Pins
The CRB includes a 10-pin, dual-row header.
• Provides Power Switch pins
• Provides Reset Switch pins
•ProvidesLEDPower-Onpins
• Provides LED HD Status pins
1.4.2.6 XDP Connector
The CRB includes one 60-pin XDP connector. XDP stands for Extended Debug Port and
can be used for debugging and testing components of the board.
Figure 9. Front Panel Header
B5786-0
1
Front Panel Header
Figure 10. XDP Connector

Product Description
Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
User’s Manual January 2007
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1.4.2.7 USB
The CRB has a 10-pin, dual-row header to route two USB Ports to an external USB
connector.
• Allows two USB 1.1 or 2.0 ports to be routed to the dual-stack rear I/O or
optionally to the 10-pin header from the internal I/O. These USB ports are Port 2
and Port 3. Rear panel ports 2 and 3 are not simultaneously functional.
• By default, routing for USB is to the dual-stack header on the rear panel I/O.
• In conjunction with the rear panel USB Ports there are only a total of four USB
ports.
More information is available in Section 1.4.4.3, “USB Ports” on page 19.
1.4.3 I/O Slots for Expansion Capabilities
1.4.3.1 PCI Express*
The CRB provides a total of 3 x4 PCI Express* ports.
• Port A provides two x4 connections through two x8 connectors
• Port B provides one x4 connection through one x8 connector
• 32-bit ECRC (Port A only) stays with packet ensuring correct data at destination
• 256 opportunistic combining for read completions to improve performance
• ONLY Port A provides posted writes between each x4 port
• ONLY Port A provides memory-to-I/O DMA
Note: The PCI Express* Ports are x8 connectors, but ONLY have the functionality of a x4
connector. This enables you to use a x8 card on the CRB but it has the bandwidth and
functionality of the x4.
Warning: Hot-Plug is NOT supported on this platform.
1.4.3.2 PCI
The CRB provides one PCI slot. It has the following characteristics:
• Specification 2.2 compliant
•32-bit
•33MHz
• 120 MB/s throughput
• 64-bit addressing through the DAC protocol

Dual-Core Intel® Xeon® Processor LV and Intel®3100 Chipset
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Product Description
1.4.4 Rear Panel I/O Connectors
1.4.4.1 Serial COM ports
The CRB provides two Serial COM Ports.
• 9-pin male D-sub connectors
• COM1 port (closest to PS/2 ports on left, when looking at the back panel) and
COM2 port (closest to the USB ports)
1.4.4.2 PS2 Mouse and Keyboard Connectors
The CRB has two stacked circular DIN PS2 connectors. Turn off power before a
keyboard or mouse is connected or disconnected.
• One for the keyboard (bottom)
• One for the mouse (top)
1.4.4.3 USB Ports
The rear panel provides two dual-stacked USB 2.0 ports. They cannot be run in both
modes simultaneously. Internal logic determines which interface is used.
• Total of four USB 2.0 ports
•TwoUSBmodes
—UHCI
—EHCI
• Two Universal Host Controller Interfaces (USB 1.1)
— Two ports for each controller
— Accessible by I/O space
— Running voltage requirement: 3.3V
• One Enhanced Host Controller Interface (USB 2.0)
— Four ports
— Accessible by memory space
— Running voltage requirement: 400mV
Figure 11. Rear Panel I/O Connectors

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1.4.4.4 Parallel Port
The CRB provides one parallel port on the rear panel. The Parallel Port can be viewed in
Figure 11, “Rear Panel I/O Connectors” on page 19
• 25-pin female D-sub connector (above COM ports)
1.4.4.5 VGA Port
The CRB provides one VGA connector for on-board video.
• 15-pin male D-sub connector
• On-board ATI RAGE Mobility PCI video
• If no “on-board Video”, a PCI video card is supplied with kit
1.4.5 Hardware Server Management Features
The CRB provides several server management features like a voltage monitor and
temperature monitor. It also provides control for overall protection of the platform.
1.4.5.1 Voltage Monitor
The CRB uses a Heceta* 7 (LM93) to monitor and communicate through the SMBus.
1.4.5.2 Watch Dog Timer (WDT)
The Watch Dog Timer (WDT) provides output from the Intel®3100 Chipset to generate
one of the following:
• PCI_RESET
•IlluminateanLED
1.4.5.3 Sleep States and Soft Off
• S0, S3 and S5 sleep states
• Soft off capability (S5)
— Operating system dependent
— Requires a complete OS boot when the system wakes
1.4.5.4 Wake Events
• Power switch
1.4.5.5 Hardware Clock Throttling
• Provides support for hardware clock throttling through STOPCLK#