Intel Denverton Series User manual

Technical Manual
Of
Intel Denverton Series CPU
Based SBC
NO.G03-NF699-F
Revision: 1.0
Release date: July 12, 2018
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iii
ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... iv
USER’S NOTICE .................................................................................................................. v
MANUAL REVISION INFORMATION................................................................................... v
ITEM CHECKLIST ................................................................................................................ v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................ 1
1-2 SPECIFICATION .................................................................................................... 2
1-3 LAYOUT DIAGRAM ............................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................. 6
2-2 CONNECTORS AND HEADERS ............................................................................ 10
2-2-1 CONNECTORS ......................................................................................... 10
2-2-2 HEADERS ................................................................................................. 15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................. 18
3-2 BIOS MENU SCREEN ............................................................................................ 19
3-3 FUNCTION KEYS................................................................................................... 20
3-4 GETTING HELP...................................................................................................... 20
3-5 MEMU BARS.......................................................................................................... 21
3-6 MAIN MENU ........................................................................................................... 22
3-7 ADVANCED MENU ................................................................................................ 23
3-8 INTEL RC SETUP MENU ....................................................................................... 33
3-9 EVENT LOGS MENU.............................................................................................. 36
3-9 CHIPSET MENU..................................................................................................... 33
3-10 SECURITY MENU .................................................................................................. 38
3-11 BOOT MENU.......................................................................................................... 41
3-12 SAVE & EXIT MENU .............................................................................................. 42
TABLE OF CONTENT

iv
Environmental Safety Instruction
 Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
 Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
 The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
 Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition July 12, 2018
Item Checklist
 Motherboard
 User’s Manual
 DVD for motherboard utilities
 Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
 Intel® Denverton series SoC Processor
 4*288-pin U-DIMM/R-DIMM slots support 4* DDR4 2133/2400MHz ECC SDRAM,
up to 256GB memory
 Support 2 * Intel i210AT GbE & 4 * 10GbE SPF+ ports
 Support 4 * SATA III & M.2 (M key, SATA interface, 2242/2260/2280) storage
 1 * full size Mini-PCIe slot & 1 * PCIe x8 (use PCIe x16 slot) for riser card
expansion
 3 * External USB3.0 & 2 * Internal USB2.0
 1 * Internal VGA pin header
 Support Intel AES NI and on-board TPM to secure customers’ data
 Support Smart FAN function
 Compliance with ErP standard
 Support Watchdog function
 Solution for Surveillance, IoT & Networking Appliance

2
1-2 Specification
Spec Description
Design  Mini-ITX form factor ;
 PCB size: 17.0 x 17.0 cm
Embedded
CPU
 Intel® Denverton series SoC Processor
* for detailed CPU support information please visit our website
Memory Slot
 4* 288-pin U-DIMM/R-DIMM DDR4 slot
 Support 4* DDR4 2133/2400 MHz U-DIMM/R-DIMM SDRAM up to
256GB
 Support dual channel function (*refer to P-14 for installation guide )
Expansion Slot  1* Full-size Mini-PCIE slot (MPE)
 1* PCIE x8 slot (PCIEX8)
Storage  4* SATAIII 6Gb/s port (SATA1/2/3/4)
 1* M.2 Slot (Socket 3, M-key, support type-2242/2260/2280 SSD)
Networking  Integrated with 2* Intel I210AT PCI-E Gigabit LAN chips
 Support 2 * RJ-45 GbE ports & 4 * SPF+ 10GbE ports
BIOS  AMI Flash ROM
Rear Panel I/O
 3* USB 3.0 port
 2* RJ-45 LAN port
 4* SPF+ port
Internal I/O
 1*24-pin main power connector
 1*8-pin 12V power connector
 1*CPUFAN connector & 1* SYSFAN connector
 1*Front panel header
 1* 9-Pin USB 2.0/1.1 header for 2* USB 2.0/1.1 ports
 1* GPIO header
 1* Front VGA port header (Max. Resolution: 1920x1200@60Hz)
 2* RS232 serial port header (COM1/2)

3
* Note: Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher
USB speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within
platforms. However, legacy operating systems (OS) may not natively recognize XHCI controllers. You
might need to pre-install XHCI driver while desiring to install a non-XHCI OS on Intel platforms which do
not include EHCI controllers. Please contact your representative for more details.
1-3 Layout Diagram
Rear IO Panel Diagram:
USB 3.0 Ports
RJ-45 LAN Ports
SFP+ Ports
SFP+ Ports
Reset Switch
Power LED

4
Internal Diagram-Back Side:
* JP2: JTAG option, for in-house test purpose only.
SATAIII Ports
GPIO Port
Header
VGA Port
Header
Intel
CPU
DDR4
U-DIMM/R-DIMM
Slot x 4
ATX 12V
Power Connector
ATX Main
Power Connector
Front Panel
Header
SYSFAN
Connector
USB 3.0 Port
RJ-45 LAN Ports
Over USB 3.0 Ports
SFP+ Ports
C
OM2
Serial Port
Header
USB 2.0 Port
Header
Full
-
size
Mini-
PCIE Slot
(MPE)
CPUFAN
Connector
PCIE x8 Slot
C
OM1
Serial Port
Header
M.2 M Key
Socket 3
Slot
JP3
JP4
COPEN
JBAT
*JP2
JP1

5
Jumper
P/N Function Description
JBAT Pin (1-2): Clear CMOS
Pin (3-4): Clear RTC
Pin (5-6): Flash Override
Pin (7-8): ME Recovery
8-Pin Block
COPEN Case Open Message Display Select 2-Pin Block
JP1 Power Switch Selection 3-Pin Block
JP3 COM1 Header Pin9 Function Select 4-Pin Block
JP4 COM2 Header Pin9 Function Select 4-Pin Block
Connectors
Connector Name
ATXPWR Main Power Connector
ATX12V CPU Power Connector
CPUFAN CPUFAN Connector
SYSFAN SYSFAN Connector
SATA1/2/3/4 SATAIII Port Connector
USB3 USB 3.0 Port Connector
UL1/UL2 Top: RJ-45 LAN Port Connector
Bottom: USB 3.0 Port Connector
SFP1/ SFP2 Small Form-factor Pluggable Connector
MPE Full-size Mini-PCIE Slot
M2 M.2 Socket 3 Slot