Intel M50CYP1UR Series User manual

Intel® Server System
M50CYP1UR Family
System Integration and Service Guide
A guide providing instructions for the insertion and
extraction of system components and available
Intel accessories and spares
Rev. 1.0
May 2021
Delivering Breakthrough Data Center System Innovation –Experience What’s Inside!

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Intel® Server System M50CYP1UR Family System Integration and Service Guide
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Document Revision History
Date
Revision
Changes
May 2021
1.0
Initial production release

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact your Intel representative to obtain the latest Intel product specifications.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

Intel® Server System M50CYP1UR Family System Integration and Service Guide
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Safety Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power button DOES NOT turn off the system AC power. To remove power from
the system, you must unplug the AC power cord. Make sure the AC power cord is unplugged before you
open the chassis, add, or remove any components.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the server and disconnect the power cord,
telecommunications systems, networks, and modems attached to the server before opening it. Otherwise,
personal injury or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can damage the computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge
•Remove all jewelry
•Disconnect all power cables and cords attached to the server before performing any integration or
service
•Touch any unpainted metal surface of the chassis before performing any integration or service
•Hold all circuit boards and other electronic components by their edges only
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive workbench pad. Do not place
electronic devices on to the outside of any protective packaging.

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Caution: Slide / Rail mounted equipment is not to be used as a shelf or a workspace
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a verified
backup. Failure to do so or to comply with other user notices in the product user guide and specification
documents may result in loss of or access to data.
Weight of the system:
•Due to the weight of a system, Intel recommends carrying the system with two people supporting the
system from the sides or using a mechanical lift or a cart when moving the system from one location
to another.
•If your system has rack handles installed, do not lift or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.

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Table of Contents
1. Introduction............................................................................................................................................................... 14
1.1 Reference Documents and Support Collaterals................................................................................................16
2. L6 Integrated System –Essential System Component Installation .............................................................. 18
2.1 Chassis Component Identification..........................................................................................................................19
2.2 System Cover Removal / Installation.....................................................................................................................19
2.2.1 System Cover Removal................................................................................................................................................19
2.2.2 System Cover Installation...........................................................................................................................................21
2.3 Processor Assembly and Installation.....................................................................................................................21
2.3.1 Processor Heat Sink Module (PHM) Assembly ..................................................................................................23
2.3.2 Processor Installation...................................................................................................................................................26
2.4 Memory Module Installation .....................................................................................................................................28
2.4.1 DIMM Installation ...........................................................................................................................................................28
2.5 Power Supply Module Installation..........................................................................................................................30
2.5.1 Power Supply Module Installation..........................................................................................................................30
3. System Options / Accessory Kit Installation...................................................................................................... 31
3.1 System Cover Removal / Installation.....................................................................................................................32
3.1.1 System Cover Removal................................................................................................................................................32
3.1.2 System Cover Installation...........................................................................................................................................33
3.2Riser Card Assembly / Add-in Card Assembly Installation / Removal.....................................................34
3.2.1 Riser Card Bracket Removal.......................................................................................................................................36
3.2.2 Riser Card Installation ..................................................................................................................................................36
3.2.3 PCIe* Add-in Card Installation..................................................................................................................................37
3.2.4 Add-in Card Assembly Installation –Riser Slot #1, Riser Slot #2, and
PCIe* Interposer Riser Slot..........................................................................................................................................39
3.3 2.5” SSD Drive Removal, Assembly, and Installation ......................................................................................39
3.3.1 2.5” SSD Drive Assembly for 7 mm Drives ..........................................................................................................40
3.3.2 2.5” SSD Drive Installation .........................................................................................................................................41
3.3.3 2.5” SSD Drive / Drive Blank Removal...................................................................................................................43
3.4 Ethernet Network Adapter for OCP* –Installation / Removal ...................................................................44
3.4.1 OCP* Adapter Bay Filler Removal / Installation ................................................................................................45
3.4.2 OCP* Adapter with Pull Tab Installation ..............................................................................................................46
3.4.3 OCP* Adapter with Pull Tab Removal ...................................................................................................................46
3.4.4 OCP* Adapter with Ejector Latch Installation.....................................................................................................47
3.4.5 OCP* Adapter with Ejector Latch Removal..........................................................................................................47
3.4.6 OCP* Adapter with Internal Lock Installation.....................................................................................................47
3.4.7 OCP* Adapter with Internal Lock Removal..........................................................................................................49
3.5 M.2 Storage Device Installation / Removal..........................................................................................................49
3.5.1 M.2 SSD Installation......................................................................................................................................................50

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3.5.2 M.2 SSD Removal ...........................................................................................................................................................50
3.6 Trusted Platform Module (TPM) Installation......................................................................................................51
3.7 Intel® VROC 7.5 Key Installation / Removal ........................................................................................................51
3.7.1 Intel® VROC 7.5 (VMD NVMe* RAID) Key Installation......................................................................................52
3.7.2 Intel® VROC 7.5 (VMD NVMe* RAID) Key Removal ...........................................................................................53
3.8 Intel® SAS Interposer Card and SAS RAID Module Installation / Removal ............................................53
3.8.1 Intel® SAS Interposer Card Installation.................................................................................................................54
3.8.2 Intel® SAS Interposer Card Removal ......................................................................................................................55
3.8.3 Intel® SAS RAID Module Installation ......................................................................................................................56
3.8.4 Intel® SAS RAID Module Removal............................................................................................................................57
3.9 Intel® RAID Maintenance Free Backup Unit (RMFBU) and
Mounting Bracket Installation / Removal.............................................................................................................57
3.9.1 Intel® RMFBU Mounting Bracket Installation...................................................................................................... 59
3.9.2 Intel® RMFBU Mounting Bracket Removal ...........................................................................................................59
4. System Software Updates and Configuration.................................................................................................... 60
5. System Service –System Features Overview..................................................................................................... 61
5.1 Front Drive Bay Options..............................................................................................................................................61
5.2 Back Panel, Front Control Panel, Front I/O Features......................................................................................61
5.3 Drive Bay LED Identification ......................................................................................................................................63
5.4 Server Board Features..................................................................................................................................................64
5.5 System Configuration and Recovery Jumpers ..................................................................................................66
6. System Service and FRU Replacement................................................................................................................ 67
6.1 System Cover Removal / Installation.....................................................................................................................67
6.1.1 System Cover Removal................................................................................................................................................68
6.1.2 System Cover Installation...........................................................................................................................................69
6.2 System Fan Replacement ...........................................................................................................................................69
6.3 Memory Module Replacement .................................................................................................................................71
6.4 Power Supply Replacement.......................................................................................................................................73
6.5 Processor Replacement...............................................................................................................................................74
6.5.1 Processor Heat Sink Module (PHM) and Processor Removal......................................................................74
6.5.2 PHM and Processor Installation...............................................................................................................................76
6.6 2.5” SSD Drive Removal, Assembly, and Installation ......................................................................................81
6.7 Backplane Replacement..............................................................................................................................................85
6.7.1 4 x 2.5” Backplane Replacement .............................................................................................................................85
6.7.2 12 x 2.5” Backplane Replacement...........................................................................................................................88
6.7.3 4 x 2.5” Backplane and 12 x 2.5” Backplane Cabling......................................................................................89
6.8 System Battery Replacement....................................................................................................................................91
6.9 Server Board Replacement ........................................................................................................................................92
Appendix A. Getting Help.......................................................................................................................................... 94
Appendix B. Internal Cable Routing Channels...................................................................................................... 95
Appendix C. General Memory Population Rules.................................................................................................. 96
C.1 DDR4 DIMM Population Rules ..................................................................................................................................96

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C.2Intel® Optane™ Persistent Memory 200 Series Module Rules.....................................................................97
Appendix D. System Status LED Operating States and Definition................................................................... 99
Appendix E. POST Code Diagnostic LED Decoder............................................................................................. 101
E.1 Early POST Memory Initialization MRC Diagnostic Codes......................................................................... 102
E.2 BIOS POST Progress Codes.................................................................................................................................... 104
Appendix F. POST Code Errors .............................................................................................................................. 107
F.1 POST Error Beep Codes ........................................................................................................................................... 113
F.2 Processor Initialization Error Summary............................................................................................................. 114
Appendix G. System Packaging Assembly Instructions.................................................................................... 116
Appendix H. Safety Instructions............................................................................................................................. 119
Appendix I. Glossary ............................................................................................................................................... 131

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List of Figures
Figure 1. Chassis Component Identification..................................................................................................................................19
Figure 2. System Top Cover Panel Shipping Screws.................................................................................................................. 20
Figure 3. System Cover Removal........................................................................................................................................................20
Figure 4. System Cover Installation...................................................................................................................................................21
Figure 5. 1U Heat Sinks...........................................................................................................................................................................22
Figure 6. Processor Heat Sink Module (PHM) Reference Diagram .......................................................................................22
Figure 7. Installing Processor Carrier Clip onto Processor –Part 1 .....................................................................................23
Figure 8. Installing Processor Carrier Clip onto Processor –Part 2 .....................................................................................24
Figure 9. Removing Heat Sink from its Packaging.......................................................................................................................24
Figure 10. Setting the Processor Heat Sink Anti-tilt Wires to the Outward Position ................................................... 25
Figure 11. Pin 1 Indicator of Processor Carrier Clip....................................................................................................................25
Figure 12. Socket Protective Cover Removal ................................................................................................................................26
Figure 13. PHM Alignment with Socket Assembly......................................................................................................................26
Figure 14. PHM Installation onto Server Board............................................................................................................................27
Figure 15. Tighten Heat Sink Extension Fasteners .....................................................................................................................27
Figure 16. DIMM Blank Removal.........................................................................................................................................................28
Figure 17. Memory Module Installation...........................................................................................................................................29
Figure 18. Power Supply Installation................................................................................................................................................30
Figure 19. System Top Cover Panel Shipping Screws...............................................................................................................32
Figure 20. System Cover Removal .....................................................................................................................................................33
Figure 21. System Cover Installation ................................................................................................................................................33
Figure 22. Bracket for Riser Card on Riser Slot #1–Two Views............................................................................................. 34
Figure 23. Bracket for Riser Card on Riser Slot #2–Two Views............................................................................................. 34
Figure 24. Bracket for Riser Card on Riser Slot #3–Two Views (Support for NVMe* Riser Only) ...........................35
Figure 25. Bracket for PCIe* Interposer Riser Card –Two Views ..........................................................................................35
Figure 26. Riser Card Bracket Removal............................................................................................................................................36
Figure 27. Riser Card Installation onto the Bracket....................................................................................................................36
Figure 28. PCIe* Add-in Card Installation for Riser Card on Riser Slot #1 or PCIe* Interposer Riser Card .........37
Figure 29. PCIe* Add-In Card Installation for Riser Card on Riser Slot #2........................................................................38
Figure 30. Add-in Card Assembly Installation ..............................................................................................................................39
Figure 31. 2.5” Drive Bay Components ............................................................................................................................................40
Figure 32. Separating Top and Bottom Parts of Drive Blank..................................................................................................40
Figure 33. Attaching the Drive Blank to 7 mm SSD ....................................................................................................................41
Figure 34. 2.5” 7 mm Drive Outside Chassis, Ready for Installation....................................................................................41
Figure 35. 2.5” 7 mm Drive Installation............................................................................................................................................42
Figure 36. 2.5” 15 mm Drive Outside Chassis, Ready for Installation.................................................................................42
Figure 37. 2.5” 15 mm Drive Installation......................................................................................................................................... 43
Figure 38. 2.5” 7 mm Drive Removal.................................................................................................................................................43
Figure 39. 2.5” 15 mm Drive Removal.............................................................................................................................................. 44

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Figure 40. OCP* Adapter Bay Filler Removal.................................................................................................................................45
Figure 41. OCP* Adapter Bay Filler Installation............................................................................................................................45
Figure 42. OCP* Adapter with Pull Tab Installation....................................................................................................................46
Figure 43. OCP* Adapter with Pull Tab Removal.........................................................................................................................46
Figure 44. OCP* Adapter with Ejector Latch Installation..........................................................................................................47
Figure 45. OCP* Adapter with Ejector Latch Removal...............................................................................................................47
Figure 46. Internal Lock with Unlock and Lock Orientation....................................................................................................48
Figure 47. OCP* Adapter with Internal Lock Installation..........................................................................................................48
Figure 48. OCP* Adapter with Internal Lock Removal...............................................................................................................49
Figure 49. M.2 SSD Connector Location..........................................................................................................................................49
Figure 50. M.2 SSD Installation ...........................................................................................................................................................50
Figure 51. M.2 SSD Removal ................................................................................................................................................................50
Figure 52. Trusted Platform Module (TPM) Installation ...........................................................................................................51
Figure 53. Intel® VROC Key Insertion................................................................................................................................................52
Figure 54. Intel® VROC Key Removal ................................................................................................................................................53
Figure 55. SAS Interposer Card Installation...................................................................................................................................54
Figure 56. Intel® SAS Interposer Card Removal............................................................................................................................55
Figure 57. Intel® SAS RAID Module Installation............................................................................................................................ 56
Figure 58. Intel® SAS RAID Module Removal.................................................................................................................................57
Figure 59. Installing Latch on the Plastic Case .............................................................................................................................58
Figure 60. Insert Super Cap ..................................................................................................................................................................58
Figure 61. Intel® RMFBU Mounting Bracket Installation ...........................................................................................................59
Figure 62. Intel® RMFBU Mounting Bracket Removal - Chassis.............................................................................................59
Figure 63. 4 x 2.5” Front Drive Bay Configuration.......................................................................................................................61
Figure 64. 12 x 2.5” Front Drive Bay Configuration ....................................................................................................................61
Figure 65. Back Panel Features ...........................................................................................................................................................61
Figure 66. Front Control Panel Features .........................................................................................................................................62
Figure 67. Front I/O Features...............................................................................................................................................................62
Figure 68. Hot Swap Drive Bay LED Identification.......................................................................................................................63
Figure 69. Intel® Server Board M50CYP2SB1U Component / Feature Identification...................................................64
Figure 70. Intel® light-Guided Diagnostics –LED Identification ............................................................................................65
Figure 71. Exploded View of POST Code Diagnostic, System ID, and System Status LEDs Area............................65
Figure 72. Intel® light-Guided Diagnostics - DIMM Fault LEDs...............................................................................................66
Figure 73. Reset and Recovery Jumper Block Locations..........................................................................................................66
Figure 74. System Top Cover Panel Shipping Screws...............................................................................................................68
Figure 75. System Cover Removal .....................................................................................................................................................68
Figure 76. System Cover Installation ................................................................................................................................................69
Figure 77. Individual Fan Removal.....................................................................................................................................................70
Figure 78. Individual Fan Installation................................................................................................................................................70
Figure 79. Memory Module Removal................................................................................................................................................71
Figure 80. Memory Module Installation...........................................................................................................................................72

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Figure 81. Power Supply Removal.....................................................................................................................................................73
Figure 82. Power Supply Installation................................................................................................................................................73
Figure 83. PHM Assembly Removal from Processor Socket...................................................................................................74
Figure 84. Reinstall the Socket Cover...............................................................................................................................................75
Figure 85. Processor Removal from PHM Assembly..................................................................................................................75
Figure 86. Processor Carrier Clip Removal from PHM Assembly..........................................................................................76
Figure 87. Installing Processor Carrier Clip onto Processor –Part 1...................................................................................77
Figure 88. Installing Processor Carrier Clip onto Processor –Part 2...................................................................................77
Figure 89. Removing Heat Sink from its Packaging.................................................................................................................... 78
Figure 90. Setting the Processor Heat Sink Anti-tilt Wires to the Outward Position ................................................... 78
Figure 91. Pin 1 Indicator of Processor Carrier Clip....................................................................................................................79
Figure 92. Socket Protective Cover Removal ................................................................................................................................79
Figure 93. PHM Alignment with Socket Assembly......................................................................................................................80
Figure 94. PHM Installation onto Server Board............................................................................................................................80
Figure 95. Tighten Heat Sink Extension Screws...........................................................................................................................81
Figure 96. Drive Bay Components......................................................................................................................................................82
Figure 97. 2.5” 7 mm Drive Removal.................................................................................................................................................82
Figure 98. 2.5” 15 mm Drive Removal.............................................................................................................................................. 82
Figure 99. Separating Top and Bottom Parts of Drive Blank..................................................................................................83
Figure 100. Assembling the 2.5” SSD Drive with the Top Part of Drive Blank ................................................................83
Figure 101. 2.5” 7 mm Drive Outside Chassis, Ready for Installation.................................................................................84
Figure 102. 2.5” 7 mm Drive Installation......................................................................................................................................... 84
Figure 103. 2.5” 15 mm Drive Outside Chassis, Ready for Installation ..............................................................................84
Figure 104. 2.5” 15 mm Drive Installation......................................................................................................................................85
Figure 105. 4 x 2.5” Backplane Removal ......................................................................................................................................... 86
Figure 106. 4 x 2.5” Backplane Installation....................................................................................................................................87
Figure 107. 12 x 2.5” Backplane Removal ......................................................................................................................................88
Figure 108. 12 x 2.5” Backplane Installation .................................................................................................................................89
Figure 109. System Cable Routing Channels ................................................................................................................................90
Figure 110. Replacing the System Battery......................................................................................................................................91
Figure 111. Server Board Removal ....................................................................................................................................................92
Figure 112. Server Board Installation...............................................................................................................................................93
Figure 113. System Cable Routing Channels ................................................................................................................................95
Figure 114. Intel® Server System M50CYP1UR Family Memory Slot Layout...................................................................96
Figure 115. Onboard POST Diagnostic LEDs ............................................................................................................................. 101

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List of Tables
Table 1. Intel® Server M50CYP Family Reference Documents and Support Collaterals ............................................16
Table 2. Supported Intel® Ethernet Network Adapters for OCP*..........................................................................................44
Table 3. Drive Status LED States.........................................................................................................................................................63
Table 4. Drive Activity LED States ......................................................................................................................................................63
Table 5. Intel® Optane™ Persistent Memory 200 Series Module Support.........................................................................98
Table 6. Standard DDR4 DIMMs Compatible with Intel® Optane™ Persistent Memory 200 Series Module .......98
Table 7. System Status LED State Definitions...............................................................................................................................99
Table 8. POST Progress Code LED Example............................................................................................................................... 102
Table 9. MRC Progress Codes........................................................................................................................................................... 102
Table 10. MRC Fatal Error Codes..................................................................................................................................................... 103
Table 11. POST Progress Codes...................................................................................................................................................... 104
Table 12. POST Error Messages and Handling.......................................................................................................................... 108
Table 13. POST Error Beep Codes.................................................................................................................................................. 113
Table 14. Integrated BMC Beep Codes ......................................................................................................................................... 113
Table 15. Mixed Processor Configurations Error Summary................................................................................................. 114

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1. Introduction
The Intel® Server System M50CYP1UR family is a purpose-built rack mount server that delivers power and
performance within a 1U form factor. The system supports up to two 3rd Gen Intel® Xeon® Scalable
processors, delivering high core count and new hardware-enhanced security features. Previous generation
Intel® Xeon® processor and Intel® Xeon® Scalable processor families are not supported.
The Intel® Server System M50CYP1UR family supports up to 32 DDR4 DIMMs, providing high memory
bandwidth for memory intensive workloads. The product family supports Intel® Optane™ DC persistent
memory 200 series modules.
For details on all system features, refer to the Intel® Server System M50CYP1UR Family Technical Product
Specification (TPS). See Section 1.1.
Refer to Section 1.1 for a complete list of available product documentation. For the latest revision of this
document, go to:
https://www.intel.com/content/www/us/en/support/products/77593/server-products/server-systems.html

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About This Document
This document provides system integrators and service technicians with instructions for the installation and
removal of system components. The document also covers available Intel accessories supported by this
server system.
The document is organized into two sections. The first section (Chapters 2 through 4) is focused on the
installation of system components and accessories into an L6 or L9 integrated server system
1
.
The second section (Chapters 5, 6, and appendices A-G) is focused on system service. The section provides
the service technician with valuable system information and procedures necessary to successfully identify
and replace a faulty system component.
System Integration
Chapter 2 –L6 System Integration –Essential System Components –Installation procedures for the
following system components: Processors, Memory, and Power Supply. Removal and installation of the
system top cover are covered.
Chapter 3 –L9 System Integration - Provides detailed instructions necessary to enhance system
configurations by installing additional components and/or available accessory kits.
Chapter 4 –System Software Update and Configuration –A short overview describing the system
software stack installed on new Intel servers and where to get the latest revisions.
System Service
Chapter 5 –System Service –System Features Overview. An overview that identifies and locates the
features associated with the Intel® Server System M50CYP1U family.
Chapter 6 –System Service and FRU Replacement. Installation procedures for system field replaceable
units (FRUs).
Appendix A –Getting Help. Provides server system support and contact information.
Appendix B –Internal Cable Routing Channels. Provides cable routing guidance.
Appendix C –General Memory Population Rules. Provides a summary of general memory population
rules.
Appendix D –System Status LED Operating States and Definition. System status LED operating states
and definition.
Appendix E –POST Code Diagnostic LED Decoder. Lists of Diagnostic LED codes.
Appendix F –POST Code Errors. List of POST code errors that represent specific failures, warnings, or
information.
Appendix G –System Packaging Assembly Instructions. Provides detailed instructions to repack the
server system into the original Intel packaging.
1
An L6 integrated system requires essential components to be installed to make it power-on ready. An L9
integrated system is power-on ready but may require additional options and/or accessories to be installed to
enable specific system features.

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1.1 Reference Documents and Support Collaterals
For additional information, see the product support collaterals specified in the following table. The following
webpage provides support information for the M50CYP family:
https://www.intel.com/content/www/us/en/support/products/200321.html
Table 1. Intel® Server M50CYP Family Reference Documents and Support Collaterals
Topic
Document Title or Support Collateral
Document
Classification
For system integration
instructions and service guidance
Intel® Server System M50CYP2UR Family System Integration and Service
Guide
Public
For system integration
instructions and service guidance
Intel® Server System M50CYP1UR Family System Integration and Service
Guide
Public
For technical system-level
description
Intel® Server System M50CYP2UR Family Technical Product Specification
Public
For technical system-level
description
Intel® Server System M50CYP1UR Family Technical Product Specification
Public
For technical board-level
description
Intel® Server Board M50CYP2SB Family Technical Product Specification
Public
For server configuration guidance
and compatibility
Intel® Server M50CYP Family Configuration Guide
Public
For information on the Integrated
BMC Web Console
Intel® Integrated Baseboard Management Controller Web Console
(Integrated BMC Web Console) User Guide
For the Intel® Server Board D50TNP and M50CYP Families
Public
For BIOS technical information
on Intel® Server M50CYP Family
BIOS Firmware External Product Specification (EPS)
For the Intel® Server Board D50TNP and M50CYP Families
Intel
Confidential
For BIOS setup information on
Intel® Server M50CYP Family
BIOS Setup Utility User Guide
For the Intel® Server Board D50TNP and M50CYP Families
Public
For BMC technical information on
Intel® Server M50CYP Family
Integrated Baseboard Management Controller Firmware External Product
Specification
For the Intel® Server System D50TNP and M50CYP Families
Intel
Confidential
Base specifications for the IPMI
architecture and interfaces
Intelligent Platform Management Interface Specification Second
Generation v2.0
Intel
Confidential
Specifications for the PCIe* 3.0
architecture and interfaces
PCIe* Base Specification, Revision 3.0
http://www.pcisig.com/specifications
Public
Specifications for the PCIe* 4.0
architecture and interfaces
PCIe* Base Specification, Revision 4.0
http://www.pcisig.com/specifications
Public
Specification for OCP*
Open Compute Project* (OCP*) Specification
Intel
Confidential
TPM for PC Client specifications
TPM PC Client Specifications, Revision 2.0
Intel
Confidential
Functional specifications of 3rd
Gen Intel® Xeon® Scalable
processor family
3rd Generation Intel® Xeon® Scalable Processors, Codename Ice Lake-SP
External Design Specification (EDS): Document IDs: 574451, 574942,
575291
Intel
Confidential
BIOS and BMC Security Best
Practices
Intel® Server Systems Baseboard Management Controller (BMC) and BIOS
Security Best Practices White Paper
https://www.intel.com/content/www/us/en/support/articles/000055785/s
erver-products.html
Public
Managing an Intel Server
Overview
Managing an Intel Server System 2020
https://www.intel.com/content/www/us/en/support/articles/000057741/s
erver-products.html
Public

Intel® Server System M50CYP1UR Family System Integration and Service Guide
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Topic
Document Title or Support Collateral
Document
Classification
For technical information on
Intel® Optane™ persistent
memory 200
Intel® Optane™ Persistent Memory 200 Series Operations Guide
Intel
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Intel® Optane™ Persistent Memory Startup Guide
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Intel® System Update Package (SUP) for Intel® Server M50CYP Family
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Intel® System Firmware Update Utility User Guide
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Intel® SYSINFO Utility for Intel® Server M50CYP Family
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Intel® System Information Utility User Guide
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Intel® SYSCFG Utility for Intel® Server M50CYP Family –Various operating
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Intel® System Configuration Utility User Guide
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Intel® Server System M50CYP1UR Family System Integration and Service Guide
18
2. L6 Integrated System – Essential System Component
Installation
The Intel® Server System M50CYP1UR family is offered with different level of system integration. System
configurations that are not power-on ready are identified as L6 integrated systems. An L6 integrated system
requires essential components (sold separately) to be installed. If your Intel system did not come pre-
installed with any of the following components, then follow the procedures in this chapter:
•1 (Required) or 2 (Optional) processors –3rd Gen Intel® Xeon® Scalable processor family
•Memory –Up to 32 DDR4 DIMMs
•1 (Required) or 2 (Optional) power supplies
If your Intel server system came pre-installed with all the components listed above, then skip this chapter
and go to Chapter 3 for installation procedures associated with all other system options and accessories.
Before You Begin
Before integration of any system components, review all the safety and ESD precautions found in the Safety
Warnings section at the beginning of this document.
System Reference
In the following procedures, all references to left, right, front, top, and bottom assume the reader is facing
the front of the server chassis.
Instruction Format
Each procedure described in this chapter follows an illustration first format. This format gives the reader the
option to follow a quicker path to component integration by first seeing an illustration of the intended
procedure. If necessary, the reader can then follow the step-by-step instructions that accompany each
procedure.

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2.1 Chassis Component Identification
The following figure shows the chassis components.
Figure 1. Chassis Component Identification
2.2 System Cover Removal / Installation
The system top cover consists of two panels –one over the front half of the system and one over the back
half of the system. To maintain system thermals, both top cover panels must always be in place when the
system is operational.
Required Tools and Supplies
•Anti-static wrist strap and conductive workbench pad (recommended)
•Phillips* head screwdriver #1
2.2.1 System Cover Removal
Removal of both top cover panels is necessary when installing or replacing any system component within the
server chassis. Before removing the top cover, power down the system, and unplug all peripheral devices
and the power cable(s).
System Fans

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Figure 2. System Top Cover Panel Shipping Screws
The system ships from the factory with the front system cover panel and back system cover panel screwed
to the chassis. A total of four screws, one on each side of the front panel and one on each side of the back
panel, need to be removed to detach both top cover panels from the chassis.
Note:A non-skid surface or a stop behind the server system may be needed to prevent the server system
from sliding on the work surface.
Figure 3. System Cover Removal
For each top cover panel:
1. While pushing down on both the left and right buttons of the given top panel (see Letter A), slide the top
cover panel towards the front (front panel) or back (back panel) of the chassis (see Letter B).
2. Carefully lift the top cover panel up and away from the chassis.
Note: Each top cover panel can slide along the chassis base for 10 mm and then needs to be lifted.