Intel JBOD2312S3SP Installation instructions

Intel®Storage System JBOD2312S3SP
Hardware Guide
A document providing a system level overview of product features, functions,
architecture, and support specifications
Revision 1.3
Mar 2016
Intel® Server Boards and Systems

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JBOD2000S3SP Hardware Guide
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Revision History
Date
Revision
Number
Modifications
November 2014
0.9
Pre-production release.
December 2014
1.0
Production version release.
May 2015
1.1
Removed references to PSU Cold Redundancy support.
October 2015
1.2
Added optional PSU and power cable references in the Power Subsystem
section.
March 2016
1.3
Converted to the new format.

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Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
course of performance, course of dealing, or usage in trade.
This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest
Hardware Guide.
The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.
Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others
© 2016 Intel Corporation.

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Table of Contents
1Introduction ..................................................................................................................................................................1
1.1 Server Product Use Disclaimer...............................................................................................................................................1
1.2 Product Errata...............................................................................................................................................................................1
2Product Family Overview...........................................................................................................................................2
2.1 Chassis Dimensions ....................................................................................................................................................................3
2.2 System Level Environmental Limits......................................................................................................................................4
2.3 System Features and Options Overview.............................................................................................................................5
2.3.1 Hot Swap Hard Drive Bay..................................................................................................................................................5
2.3.2 Front Control Panel..............................................................................................................................................................6
2.3.3 Back Panel Features ............................................................................................................................................................7
3System Storage and Peripheral Drive Bay Overview...........................................................................................8
3.1 3.5” Hard Disk Drive Support ..................................................................................................................................................8
3.2 3.5” Drive Hot-Swap Backplane Overview ........................................................................................................................9
3.2.1 Cypress* CY8C22545 Enclosure Management Controller............................................................................... 10
4Power Subsystem ..................................................................................................................................................... 11
4.1 Power Distribution Board (PDB) .......................................................................................................................................... 12
4.2 Mechanical Overview.............................................................................................................................................................. 14
4.3 Power Connectors..................................................................................................................................................................... 16
4.3.1 Power Supply Module Card Edge Connector ........................................................................................................ 16
4.3.2 Hot-Swap Backplane Power Connector...................................................................................................................16
4.4 Power Supply Module Efficiency......................................................................................................................................... 17
4.5 AC Power Cord Specification Requirements...................................................................................................................17
4.6 AC Input Specifications........................................................................................................................................................... 17
4.6.1 Power Factor ....................................................................................................................................................................... 17
4.6.2 AC Input Voltage Specification.................................................................................................................................... 18
4.6.3 AC Line Isolation Requirements.................................................................................................................................. 18
4.6.4 AC Line Dropout/Holdup ............................................................................................................................................... 18
4.6.5 AC Line Fuse ........................................................................................................................................................................ 19
4.6.6 AC Inrush............................................................................................................................................................................... 19
4.6.7 AC Line Transient Specification................................................................................................................................... 19
4.6.8 Susceptibility Requirements......................................................................................................................................... 20
4.6.9 Electrostatic Discharge Susceptibility ...................................................................................................................... 20
4.6.10 Fast Transient/Burst....................................................................................................................................................... 20
4.6.11 Radiated Immunity.......................................................................................................................................................... 20
4.6.12 Surge Immunity................................................................................................................................................................ 20
4.6.13 Voltage Interruptions..................................................................................................................................................... 20
4.6.14 Protection Circuits........................................................................................................................................................... 21
4.6.15 Over Current Protection (OCP) .................................................................................................................................. 21
4.6.16 Over Voltage Protection (OVP) .................................................................................................................................. 21

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4.6.17 Over Temperature Protection (OTP)........................................................................................................................ 21
4.7 Power Supply Status LED ...................................................................................................................................................... 21
5Thermal Management ............................................................................................................................................. 23
5.1 Thermal Operation and Configuration Requirements...............................................................................................23
5.2 Thermal Management Overview........................................................................................................................................ 23
5.3 Thermal Sensor Input for Fan Speed Control................................................................................................................ 23
5.4 System Fans ................................................................................................................................................................................ 24
5.5 Fan Speed Control.................................................................................................................................................................... 26
5.6 Power Supply Module Fan..................................................................................................................................................... 26
6JBOD2000S3SP Internal Connection Overview................................................................................................ 27
6.1 Expander Board......................................................................................................................................................................... 27
6.1.1 JBOD SAS Expander Port Numbering ...................................................................................................................... 29
6.1.2 JBOD2312S3SP Interconnection............................................................................................................................... 30
7JBOD2000S3SP External SAS Connection Mode Overview ........................................................................... 31
7.1 External SAS Controller Support ........................................................................................................................................ 31
7.2 External SAS Cable .................................................................................................................................................................. 31
7.3 Hard Drive Type......................................................................................................................................................................... 32
7.4 JBOD Cascade............................................................................................................................................................................ 32
7.5 Single-port JBOD2000S3SP External Connection Mode .........................................................................................32
7.5.1 Single JBOD2000S3SP Connection.......................................................................................................................... 32
7.5.2 Two JBOD2000S3SP Cascade..................................................................................................................................... 33
7.5.3 Dual-path Connection..................................................................................................................................................... 34
7.5.4 Dual-path with Cascaded JBOD2000S3SP............................................................................................................ 35

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List of Figures
Figure 1. 12 x 3.5” Drive JBOD2000S3 Product Drawing....................................................................................2
Figure 2. Chassis Dimensions................................................................................................................................3
Figure 3. System Components Overview..............................................................................................................5
Figure 4. 12 x 3.5" Drive JBOD2000S3SP Front View..........................................................................................5
Figure 5. Front Panel Options................................................................................................................................6
Figure 6. JBOD2312S3SP Back View ....................................................................................................................7
Figure 7. 3.5” Hard Drive Bay – 12-Drive Configuration......................................................................................8
Figure 8. 3.5” Drive Tray Assembly .......................................................................................................................8
Figure 9. Status and Activity LED on 3.5” Drive Tray...........................................................................................8
Figure 10. 3.5” Hot-Swap Backplane and Drive Bay Assembly ..........................................................................9
Figure 11. SFF-8482 Connector on 3.5” HSBP.....................................................................................................9
Figure 12. Components on 3.5” HSBP ................................................................................................................10
Figure 13. Power Supply Assembly ....................................................................................................................11
Figure 14. Power Distribution Board (PDB)........................................................................................................12
Figure 15. PDB Component Placement...............................................................................................................13
Figure 16. Fan Fault LED Block Diagram.............................................................................................................14
Figure 17. Power Supply Module Mechanical Drawing.....................................................................................15
Figure 18. Power Supply Module ........................................................................................................................15
Figure 19. AC Power Supply – Connector View..................................................................................................15
Figure 20. AC Power Cord ....................................................................................................................................17
Figure 21. System Fan Identification ..................................................................................................................24
Figure 22. System Fan Assembly.........................................................................................................................25
Figure 23. Internal SAS Expander Location........................................................................................................28
Figure 24: SAS Expander Port Numbering .........................................................................................................29
Figure 25. 12x3.5” Single-port JBOD2000S3SP Interconnection Diagram.....................................................30
Figure 26. SFF-8644 mini-SAS Cable..................................................................................................................31
Figure 27. Single JBOD2000S3SP Connection ..................................................................................................32
Figure 28. Two Single-port JBOD2000S3SP Cascade.......................................................................................33
Figure 29. Two Groups of Cascaded Single-port JBOD2000S3SP...................................................................33
Figure 30. Dual-path Connection ........................................................................................................................34
Figure 31. Dual-path with Cascaded JBOD2000S3SP.......................................................................................35

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List of Tables
Table 1. System Environmental Limits Summary................................................................................................4
Table 2. Power LED Functional States ..................................................................................................................6
Table 3. System Status LED State Definitions......................................................................................................6
Table 4. Status LED Status .....................................................................................................................................9
Table 5. Activity LED Status...................................................................................................................................9
Table 6: Auto Power On Jumper Options...........................................................................................................13
Table 7. Power Supply Module Output Power Connector Pin-out...................................................................16
Table 8. Hot-swap Backplane Power Connector Pin-out (“HSBP PWR”).........................................................17
Table 9. 460 Watt Power Supply Efficiency .......................................................................................................17
Table 10. AC Power Cord Specifications.............................................................................................................17
Table 11. Power Factor.........................................................................................................................................18
Table 12. AC Input Voltage Range.......................................................................................................................18
Table 13. AC Line Dropout/Holdup.....................................................................................................................18
Table 14. AC Line Sag Transient Performance ...................................................................................................19
Table 15. AC Line Surge Transient Performance................................................................................................19
Table 16. Performance Criteria............................................................................................................................20
Table 17. 460 Watt Power Supply Over Current Protection .............................................................................21
Table 18. Over Voltage Protection (OVP) Limits ................................................................................................21
Table 19. LED Indicators ......................................................................................................................................22
Table 20. System Fan Connector Pin-out ...........................................................................................................25
Table 21: PWM Settings .......................................................................................................................................26
Table 22: Temperature Notification Thresholds................................................................................................26
Table 23: External Cable List ...............................................................................................................................36

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1Introduction
This Hardware Guide provides system-level information for the Intel®Storage System JBOD2312S3SP.
This document describes the functions and features of this JBOD product and includes the chassis layout,
system boards, power subsystem, cooling subsystem, storage subsystem options, and available installable
options.
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 –Product Family Overview
Chapter 3 – System Storage and Peripheral Drive Bay Overview
Chapter 4 – Power Subsystem
Chapter 5 – Thermal Management
Chapter 6 – JBOD2000S3SP Internal Connection Overview
Chapter 7 – JBOD2000S3SP External SAS Connection Mode Overview
Appendix A – Qualified External Mini-SAS Cable List
Reference Documents
1.1 Server Product Use Disclaimer
It is the responsibility of the system integrator who chooses not to use Intel-developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required
for their specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail to operate correctly when used outside any of their published operating or non-operating
limits.
1.2 Product Errata
The products described in this document may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Product Errata are documented in the Intel®
Storage System JBOD2312S3SP Monthly Specification Update which can be downloaded from
http://www.Intel.com/support.

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2Product Family Overview
The Intel®Storage System JBOD2312S3SP offers the flexibility of adding additional storage to an existing
server system with support for 12Gb/s SAS or SATA hard disk drives or SSDs, redundant fan power and
power options, and SES communication with the server to monitor the health of the JBOD subsystems.
This chapter provides a high-level overview of the detail for each major system components and features
provided in the following sections.
Figure 1. 12 x 3.5” Drive JBOD2000S3 Product Drawing

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2.1 Chassis Dimensions
Figure 2. Chassis Dimensions

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2.2 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 1. System Environmental Limits Summary
Parameter
Limits
Temperature Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC1
1
(50ºF to 95ºF) with the
maximum rate of change not to exceed 10ºC per hour.
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hrs per year.
Shipping
-40ºC to 70ºC (-40ºF to 158ºF)
Altitude
Operating
Support operation up to 3050m with ASHRAE class deratings.
Humidity Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28ºC (at temperatures from
25ºC to 35ºC)
Shock
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25g, velocity change is based on packaged weight
Packaged
Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage
90 V AC to 132 V AC and 180 V AC to 264 V AC
Frequency
47 Hz to 63 Hz
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Non-
operating and
operating
Unidirectional
Line to earth Only
AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
ESD
Air Discharged
12.0 kV
Contact Discharge
8.0 kV
Acoustics Sound
Power Measured
Power in Watts
<300 W ≥300 W ≥600 W ≥1000 W
Servers/Rack
Mount BA
7.0 7.0 7.0 7.0
System 460W Redundant Power Supplies (CRPS) operate in spread-core flow conditions (positive pressure
to the power supply’s inlet) and incorporate a 40mm fan for its own thermal management. To ensure PS
thermal protection under all operating conditions the fan speed control has a closed loop algorithm based
on both the critical component temperature and the ambient temperature (inlet temperature). The PS over
Temperature Protection (OTP) protects against over temperature conditions created by the loss of fan
cooling or excessive ambient temperature. In an OTP condition the PS will shut down and restore power
1Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to
cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the
amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

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when the temperature drops to within specified limits. The OTP trip level for inlet temperature is 65ºC with a
minimum of 4ºC margin to prevent on and off oscillation.
Disclaimer Note: Intel ensures the unpackaged JBOD system meets the shock requirement mentioned above
through its own chassis development and system configuration. It is the responsibility of the system
integrator to determine the proper shock level of the JBOD system if the system integrator chooses a different
system configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or
the system boards do not operate correctly when used outside any of its published operating or non-
operating limits.
2.3 System Features and Options Overview
Figure 3. System Components Overview
2.3.1 Hot Swap Hard Drive Bay
Figure 4. 12 x 3.5" Drive JBOD2000S3SP Front View

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2.3.2 Front Control Panel
Figure 5. Front Panel Options
The Power Button toggles the system power on and off. Pressing this button sends a signal to the integrated
PDB board, which either powers on or powers off the system. The integrated LED is a single-color (Green)
indicator that supports different states as defined in the following table.
Table 2. Power LED Functional States
State
Power Mode
LED
Description
Power-off
Non-ACPI
Off
System power is off.
Power-on
Non-ACPI
On
System power is on.
The ID button has no function in this system.
The System Status LED is a bi-color (Green/Amber) indicator that shows the current health of the JBOD
system. The System Status LED states are driven by the platform management subsystem. The following
table provides a description of each supported LED state.
Table 3. System Status LED State Definitions
Color
State
Criticality
Description
Off
System is not
operating
Not ready
The system is powered off (AC and/or DC).
Green
Solid on
Ok
Indicates that the system status is “healthy”. The system is not
exhibiting any errors. AC power is present and has been
powered on.
Amber
Solid on
Warning
Threshold
Alert Event
Encountered

P12V has exceeded the warning threshold.
P5V has exceeded the warning threshold.
P3.3V has exceeded the warning threshold.
One of the power supply modules is in a degraded state
(No AC or failed).
Temperature has exceeded the warning threshold. Event
has been detected.
Amber
Blinking
Critical
Threshold
Alert Event
Encountered

P12V has exceeded the critical threshold.
P5V has exceeded the critical threshold.
P3.3V has exceeded the critical threshold.
A fan failure has been detected.

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2.3.3 Back Panel Features
Figure 6. JBOD2312S3SP Back View
Label
Description
A
SFF-8644 receptacle (label: A PRI)
B
SFF-8644 receptacle (label: B PRI)
C
PSU
D
Optional second power module

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3System Storage and Peripheral Drive Bay Overview
The Intel®Storage System JBOD2000S3SP product supports 12 Hot-swap 3.5” hard disk drives.
3.1 3.5” Hard Disk Drive Support
The server is available as a 3.5” hard disk configuration of 12 drives as illustrated below.
Figure 7. 3.5” Hard Drive Bay – 12-Drive Configuration
The drive bay can support either SATA or SAS hard disk drives. Mixing of drive types within the hard drive
bay is not supported. Hard disk drive type is dependent on the type of host bus controller used, SATA only
or SAS. Each 3.5” hard disk drive is mounted to a drive tray, allowing for hot-swap extraction and insertion.
Drive trays have a latching mechanism that is used to extract and insert the drives from the chassis, and lock
the tray in place.
Figure 8. 3.5” Drive Tray Assembly
Light pipes integrated into the drive tray assembly direct the light emitted from Amber drive status and
Green activity LEDs located next to each drive connector on the backplane, to the drive tray faceplate,
making them visible from the front of the system.
Figure 9. Status and Activity LED on 3.5” Drive Tray

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Table 4. Status LED Status
Amber
Off
No access and no fault.
Solid on
Hard drive fault has occurred.
Blink
RAID rebuild in progress (1 Hz);
Identify (2 Hz). (Dependent on
which RAID controller is used
and attached to the JBOD)
Table 5. Activity LED Status
Green
Condition
Drive Type
Behavior
Power on with no drive
activity
SAS
LED stays on.
SATA
LED stays off.
Power on with drive
activity
SAS
LED blinks off when processing a command.
SATA
LED blinks on when processing a command.
Power on and drive
spun down
SAS
LED stays off.
SATA
LED stays off.
Power on and drive
spinning up
SAS
LED blinks.
SATA
LED stays off.
3.2 3.5” Drive Hot-Swap Backplane Overview
Systems with 12-drive configurations have their own unique backplane. The backplanes mount to the back
of the drive bay assembly.
Figure 10. 3.5” Hot-Swap Backplane and Drive Bay Assembly
There are 12 hard disk drive interface connectors mounted on the front side of each backplane, each
providing both power and I/O signals to the attached hard disk drives.
Figure 11. SFF-8482 Connector on 3.5” HSBP

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On the back side of each backplane, there are several connectors, each of which is identified in the following
illustration.
Figure 12. Components on 3.5” HSBP
Label
Description
A
4-port mini-SAS HD SFF8643 connectors
B
Power connectors
C
SMBus connector (not used)
A– 4-port Mini-SAS HD SFF8643 Connectors – The backplane includes two or three multi-port mini-SAS
cable connectors, each providing SGPIO and I/O signals for four SAS/SATA hard drives on the backplane.
Cables can be routed from matching connectors on the Expander card. Each mini-SAS HD connector
includes a silk-screen identifying which drives the connector supports: Drives 0-3, Drives 4-7, and Drives 8-
11.
B– Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane.
Power is routed to the backplane via a power cable harness from the power distribution board (PDB).
3.2.1 Cypress* CY8C22545 Enclosure Management Controller
The backplanes support enclosure management using a Cypress* CY8C22545 Programmable System-on-
Chip (PSoC*) device. The CY8C22545 drives the hard drive activity/fault LED, hard drive present signal, and
controls hard drive power-up during system power-on.