JEOL JEM-2100F User manual

JEM
-
2100F
FIELD EMISSION
ELECTRON
MICROSCOPE
For the proper use of the instrument, be sure to
read this instruction manual. Even after you
read it, please keep the manual on hand so that
you can consult it whenever necessary.
IEM210F-1 (17200)
APR2003-01120554
Printed in Japan
INSTRUCTIONS

EM210F-1
JEM-2100F
FIELD EMISSION
ELECTRON
MICROSCOPE

EM210F-1
NOTICE
· This instrument generates, uses, and can radiate radio-frequency energy and,
if not installed and used in accordance with the instruction manual, may cause
harmful interference to the environment, especially radio communications.
· This instrument must not be modified, and products other than those manufac-
tured by JEOL Ltd. must not be attached to this instrument, without prior writ-
ten permission. If any such modification or attachment is made, all the stipu-
lated warranties and services contracted by JEOL Ltd. or its affiliated company
will be void.
· Replacement parts for maintenance of the instrument performance are available
for seven years from the date of installation. Thereafter, some of those parts may
be available for a certain period of time, and in this case, an extra service charge
may be applied for servicing with those parts. Please contact your JEOL service
office for details.
· After installation of the instrument, when the instrument will be moved or
transported, be sure to contact your JEOL service office. If the instrument is
moved or transported by people other than engineers employed or specified by
JEOL, JEOL Ltd. cannot accept responsibility for any of the accidents and prob-
lems with the instrument after transport.
· The information in this manual, which is based on specifications believed cor-
rect at the time of publication, is subject to change without notice due to im-
provements made in the instrument.
· In order to assist us in preparing future documentation, please advise your JEOL
service office if you find any errors in this manual. Kindly note that while the
instrument can be used in combination with various attachments to serve a
number of purposes, this special feature of the instrument is only briefly de-
scribed in this manual, which chiefly provides information on basic operations.
· In no event will JEOL Ltd. be liable for direct, indirect, incidental or conse-
quential damages resulting from the use of software described in this manual.
· This manual is copyrighted. All rights are reserved. This document may not, in
whole or part, be copied, photocopied, reproduced, translated or reduced to any
electronic medium or machine readable form without prior consent, in writing,
from JEOL Ltd.
· When this manual or the software described in this manual is furnished under a
license agreement, it may only be used or copied in accordance with the terms
of such license agreement.
Copyright Ó2003 JEOL Ltd.
MANUFACTURER
JEOL Ltd.
1-2 Musashino 3-chome Akishima Tokyo 196-8558 Japan
Telephone: [phone]
Facsimile: 81-42-528-3385
Note: For servicing or inquires, please contact your JEOL service office.

EM210F-1
NOTATIONAL CONVENTIONS AND GLOSSARY
■
General notations
DANGER: An imminent hazardous situation which, if not avoided, will result
in death or serious injury.
WARNING: A potentially hazardous situation which, if not avoided, could
result in death or serious injury.
CAUTION: A potentially hazardous situation which, if not avoided, could
result in minor or moderate injury. Also could mean a potentially
hazardous situation which could result in serious damage to facili-
ties and acquired data.
— CAUTION — : Points requiring great care and attention when operating the device
to avoid damage to the device itself.
?: Additional points to remember regarding the operation.
F: A reference to another section, chapter or manual.
1, 2, 3: Numbers indicate a series of operations that achieve a task.
◆: A diamond indicates a single operation that achieves a task.

EM210F-1 C-1
CONTENTS
SAFETY PRECAUTIONS
1. GENERAL
2. SPECIFICATIONS
2.1 PERFORMANCE ..................................................................................2-1
2.2 ELECTRON OPTICAL SYSTEM.........................................................2-2
2.2.1 Illuminating System........................................................................2-2
2.2.2 Image Forming System ...................................................................2-2
2.3 SPECIMEN STAGE...............................................................................2-2
2.4 CAMERA CHAMBER..........................................................................2-3
2.5 EVACUATION SYSTEM......................................................................2-3
2.5.1 For Microscope Column..................................................................2-3
2.5.2 For Electron Gun Chamber.............................................................2-3
2.5.3 Vacuum Valves................................................................................2-3
2.6 CONTROL SYSTEM ............................................................................2-3
2.7 INSTALLATION REQUIREMENTS....................................................2-4
2.7.1 Power, Water and Nitrogen Gas......................................................2-4
2.7.2 Installation Room............................................................................2-4
2.8 NITROGEN AND GAS SUPPLIES......................................................2-4
2.9 DIMENSIONS AND WEIGHT (MM AND KG)..................................2-5
2.10 WARRANTY.........................................................................................2-5
3. COMPOSITION AND CONSTRUCTION
3.1 COMPOSITION.....................................................................................3-1
3.2 ACCESSORIES .....................................................................................3-1
3.3 CONSTRUCTION OF COLUMN.........................................................3-2
3.3.1 Column Exterior..............................................................................3-2
3.3.2 Column Interior...............................................................................3-3
3.3.3 Location of Coils and Lenses..........................................................3-4
3.4 LOCATION OF CONTROL PANELS ..................................................3-5
3.5 RAY DIAGRAMS..................................................................................3-6
3.5.1 Illumination System........................................................................3-6
3.5.2 Image Forming System ...................................................................3-7
4. DESCRIPTION OF CONTROLS
4.1 COLUMN .............................................................................................4-1
4.1.1 Condenser Aperture Assembly........................................................4-1
4.1.2 Condenser Mini Lens Shift Screws.................................................4-1
4.1.3 Specimen Holder.............................................................................4-1
4.1.4 Goniometer......................................................................................4-1
4.2 CONTROL PANELS..............................................................................4-3
4.2.1 Control Panel L1 .............................................................................4-3
4.2.2 Control Panel R1.............................................................................4-6
4.2.3 Control Panel L2 .............................................................................4-8

CONTENTS
C-2 EM210F-1
4.2.4 Control Panel R2..............................................................................4-9
4.2.5 Control Panel SC...........................................................................4-10
4.2.6 Power Supply Console...................................................................4-11
4.3 MONITOR DISPLAY..........................................................................4-14
4.3.1 Page 1 ............................................................................................4-14
4.3.2 Page 2 ............................................................................................4-15
4.3.3 Page 3 ............................................................................................4-16
4.3.4 Page 4 ............................................................................................4-16
4.3.5 Page 5 ............................................................................................4-17
4.4 PC SCREENS.......................................................................................4-18
4.4.1 Application Start-up......................................................................4-18
4.4.2 TEM Controller Screen.................................................................4-19
4.4.3 Switches.........................................................................................4-19
4.4.4 Main Screen...................................................................................4-20
4.4.5 Menu Bar.......................................................................................4-22
4.4.6 Screens from the Menu Bar...........................................................4-24
4.4.7 Emergency Screen.........................................................................4-45
5. OPERATION
5.1 EMERGENCIES....................................................................................5-1
5.1.1 Power Suspension............................................................................5-1
5.1.2 Cooling Water Suspension...............................................................5-1
5.1.3 Faulty Operation..............................................................................5-1
5.2 METHOD A...........................................................................................5-2
5.2.1 Startup Procedure ............................................................................5-2
5.2.2 Shut Down Procedure......................................................................5-2
5.2.3 Film Loading...................................................................................5-2
5.2.4 Electron Beam Generation...............................................................5-8
5.2.5 Aperture Insertion..........................................................................5-15
5.2.6 Photographing................................................................................5-17
5.2.7 Image Observation.........................................................................5-20
5.2.8 Film Processing.............................................................................5-22
5.3 METHOD B..........................................................................................5-25
5.3.1 Conditions for High Resolution Microscopy.................................5-25
5.3.2 Illumination System Alignment.....................................................5-28
5.3.3 Condenser Lens Astigmatism Correction......................................5-29
5.3.4 Beam Deflector Adjustment..........................................................5-29
5.3.5 Voltage/current Center Adjustment...............................................5-30
5.3.6 Objective Lens Astigmatism Correction.......................................5-32
5.3.7 Image Focusing..............................................................................5-34
5.3.8 Focusing with Fine Structure.........................................................5-37
5.4 SPECIAL OBSERVATION..................................................................5-38
5.4.1 Bright Field Image.........................................................................5-38
5.4.2 Dark Field Image...........................................................................5-38
5.4.3 Low Magnification Image.............................................................5-39
5.4.4 Minimum Dose Exposure (MDS)..................................................5-41
5.5 ELECTRON DIFFRACTION..............................................................5-43
5.5.1 Selected Area Diffraction..............................................................5-43
5.5.2 Microbeam Electron Diffraction ...................................................5-44

CONTENTS
EM210F-1 C-3
5.5.3 High Dispersion Electron Diffraction...........................................5-45
5.6 USE OF THE ANTICONTAMINATION DEVICE............................5-47
5.6.1 Filling the Refrigerant Tank...........................................................5-47
5.6.2 Raising the Trap Temperature to Room Temperature ....................5-48
5.7 SPECIAL OPERATION.......................................................................5-51
5.7.1 Alignment Data Saving.................................................................5-51
5.7.2 Free Lens Control (FLC)...............................................................5-52
5.8 APPENDIX..........................................................................................5-53
5.8.1 Microscope Console and Column.................................................5-53
5.8.2 Objective Aperture........................................................................5-54
5.8.3 Vacuum Pumps..............................................................................5-54

EM210F-1 S-1
SAFETY PRECAUTIONS
For the proper use of the instrument, be sure to read the following safety precautions
prior to starting operation or maintenance. They contain important information related to
safety. Contact your JEOL service office whenever you are unclear about any operation
or maintenance.
The signs for safety precautions and their meanings used in this instruction manual are as
follows:
DANGER: An imminent hazardous situation which, if not avoided, will result
in death or serious injury.
WARNING: A potentially hazardous situation which, if not avoided, could
result in death or serious injury.
CAUTION: A potentially hazardous situation which, if not avoided, could re-
sult in minor or moderate injury. Also could mean a potentially
hazardous situation which could result in serious damage to facili-
ties and acquired data.
Parts of this instrument where safety precautions are required are labeled with illustration
signs as shown below. Do not touch the parts labeled with these signs:
Use the instrument in a proper manner and within the scope of the purposes and usage
contained in the brochures and instruction manuals. Never make modifications such as
removing protective parts, exchanging component parts, and defeating safety measures.
Be sure to read the “Safety Precautions” given in the instruction manuals of the optional
attachments for information about the attachments of this instrument.
WARNINGS
· Since the inner pressure of the SF6 gas cylinder is very high (about 3
times that of Freon 12 gas at room temperature), attach a reducing valve
to the mouthpiece of the cylinder to reduce the secondary pressure
when it is used.
· To avoid any accident of oxygen shortage, exercise care to keep ventila-
tion of the workplace good.
Beware of high
temperature
Beware of
getting caught
Don’t
disassemble
Beware of
electric shock

SAFETY PRECAUTIONS
S-2 EM210F-1
· When discharge occurs in the electron gun gas chamber or high voltage
tank, in which contains moisture, etc., poisonous gas may be generated.
In order to prevent discharge, attention should be paid to humidity,
needless to say cleaning of the chamber or tank
· To avoid any accident of oxygen shortage, exercise care to keep ventila-
tion of the workplace good.
CAUTIONS
· Do not remove the grounding wire. Improper grounding may cause elec-
trical shock
· Do not remove the grounding wire. Improper grounding may cause elec-
trical shock.
· Do not mount on the operating table and/or console.
· Do not dismount and/or reassemble the microscope column. The column
dismounting and reassembling are allowed to only JEOL engineer. Con-
tact your nearest JEOL subsidiary when dismounting and/or reassem-
bling the column is/are required.
· If any abnormality occurs, immediately shut down the instrument and
contact your nearest JEOL subsidiary.
· Be careful not to pinch your fingers between the specimen holder and
goniometer when inserting the holder into the goniometer.
· Do not touch the Wehnelt unless the Wehnelt is grounded by the
grounding rod when exchanging the electron gun filament in order to
avoid electrical shock.
· Do not put your hand between the upper and lower electron gun cham-
bers while the electron gun lift is functioning.
· Never deactivate the safety devices.
Do not make any modification such as removing protective parts, ex-
changing component parts, or unlocking or defeating safety devices.
· The instrument and related attachments should be installed by JEOL en-
gineers. Please contact your nearest JEOL subsidiary if installation is
required.
· Please consult with a JEOL subsidiary before discarding and/or scrap-
ping the followings since they should be discarded/scrapped in the way
that JEOL approved.
・Main unit and attachments
・Insulating gas (SF6) in the high voltage tank
・Oil in the vacuum pump

EM210F-1
GENERAL