Kontron Come-cbti6r e3845 8gb/16s User manual

COMe-cBTi6R

Document Revision 1.0

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» Table of Contents «

1 User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1.2 Co yright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Su ort......................................................................................................................... 7

2 Introduction........................................................................................8

2.1 Product Descri tion...................................................................................................................... 8

2.2 Naming clarification..................................................................................................................... 8

2.3 Understanding COM Ex ress® Functionality.......................................................................................8

2.4 COM Ex ress® Documentation.........................................................................................................9

2.5 COM Ex ress® Benefits.................................................................................................................. 9

3 Product S ecification..........................................................................10

3.1 Module definition....................................................................................................................... 10

3.2 Functional S ecification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 15

3.4 Accessories............................................................................................................................... 16

3.5 Electrical S ecification................................................................................................................17

3.5.1 Su ly Voltage........................................................................................................................... 17

3.5.2 Power Su ly Rise Time................................................................................................................17

3.5.3 Su ly Voltage Ri le.................................................................................................................. 17

3.5.4 Power Consum tion..................................................................................................................... 17

3.5.5 ATX Mode.................................................................................................................................. 18

3.5.6 Single Su ly Mode..................................................................................................................... 18

3.6 Power Control............................................................................................................................ 19

3.7 Environmental S ecification......................................................................................................... 20

3.7.1 Tem erature S ecification............................................................................................................20

3.7.2 Humidity................................................................................................................................... 20

3.8 Standards and Certifications.........................................................................................................21

3.9 MTBF........................................................................................................................................ 23

3.10 Mechanical S ecification.............................................................................................................. 24

3.11 Module Dimensions..................................................................................................................... 25

3.12 Onboard Fan Connector................................................................................................................ 26

3.13 Thermal Management, Heats reader and Cooling Solutions..................................................................27

4 Features and Interfaces.......................................................................28

4.1 Onboard eMMC Flash.................................................................................................................... 28

4.2 Secure Digital Card...................................................................................................................... 29

4.3 S5 Eco Mode.............................................................................................................................. 30

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COMe-cBTi6R /

4.4 Ra id Shutdown......................................................................................................................... 31

4.5 LPC.......................................................................................................................................... 33

4.6 Serial Peri heral Interface (SPI)....................................................................................................34

4.7 SPI boot.................................................................................................................................... 34

4.8 M.A.R.S.................................................................................................................................... 36

4.9 UART........................................................................................................................................ 37

4.10 Fast I2C.................................................................................................................................... 38

4.11 Dual Staged Watchdog Timer.........................................................................................................39

4.12 S eedste Technology................................................................................................................. 40

4.13 C-States.................................................................................................................................... 41

4.14 Gra hics Features....................................................................................................................... 42

4.15 ACPI Sus end Modes and Resume Events..........................................................................................43

4.16 USB......................................................................................................................................... 44

5 System Resources...............................................................................45

5.1 Internal I2C Bus......................................................................................................................... 45

5.2 External I2C Bus......................................................................................................................... 45

5.3 System Management (SM) Bus....................................................................................................... 45

6 Connectors........................................................................................46

6.1 Connector Location..................................................................................................................... 46

7 Pinout List.........................................................................................47

7.1 General Signal Descri tion............................................................................................................ 47

7.2 Connector X1A Row A................................................................................................................... 48

7.3 Connector X1A row B................................................................................................................... 50

7.4 Connector X1B Row C.................................................................................................................. 52

7.5 Connector X1B Row D................................................................................................................... 54

8 Connector J1 micro-SD Card..................................................................56

9 Connector J2 Fan Control......................................................................57

10 Connector J3 XDP SFF connector, not available on roduction revision..........58

11 Connector J4 JTAG CPLD.......................................................................59

12 BIOS O eration...................................................................................60

12.1 Determining the BIOS Version.......................................................................................................60

12.2 BIOS U date.............................................................................................................................. 60

12.3 POST Codes................................................................................................................................ 60

12.4 Setu Guide............................................................................................................................... 60

12.5 BIOS Setu ................................................................................................................................ 62

12.5.1 Main........................................................................................................................................ 62

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COMe-cBTi6R /

12.5.2 Advanced.................................................................................................................................. 67

12.5.3 Security.................................................................................................................................... 86

12.5.4 Boot........................................................................................................................................ 88

12.5.5 Exit.......................................................................................................................................... 89

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COMe-cBTi6R / User Information

1 User Information

1.1 About This Document

This document rovides information about roducts from Kontron Euro e GmbH and/or its subsidiaries. No warranty of

suitability, ur ose, or fitness is im lied. While every attem t has been made to ensure that the information in this

document is accurate, the information contained within is su lied “as-is” and is subject to change without notice.

For the circuits, descri tions and tables indicated, Kontron assumes no res onsibility as far as atents or other rights of

third arties are concerned.

1.2 Copyright Notice

translated into any language or com uter language, in any form or by any means (electronic, mechanical, hotoco ying,

recording, or otherwise), without the ex ress written ermission of Kontron Euro e GmbH.

DIMM-PC®, PISA®, ETX®, ETXex ress®, microETXex ress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or

registered trademarks of Kontron Euro e GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of com onents used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Cor .

» Microsoft is a registered trademark of Microsoft Cor .

» Intel is a registered trademark of Intel Cor .

» All other roducts and trademarks mentioned in this manual are trademarks of their res ective owners.

1.4 Standards

Kontron Euro e GmbH is certified to ISO 9000 standards.

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COMe-cBTi6R / User Information

1.5 arranty

For this Kontron Euro e GmbH roduct warranty for defects in material and workmanshi exists as long as the warranty

eriod, beginning with the date of shi ment, lasts. During the warranty eriod, Kontron Euro e GmbH will decide on its

discretion if defective roducts are to be re aired or re laced.

Within the warranty eriod, the re air of roducts is free of charge as long as warranty conditions are observed.

Warranty does not a ly for defects arising/resulting from im ro er or inadequate maintenance or handling by the buyer,

unauthorized modification or misuse, as well as the o eration outside of the roduct´s environmental s ecifications and

im ro er installation and maintenance.

Kontron Euro e GmbH will not be res onsible for any defects or damages to other roducts not su lied by Kontron

Euro e GmbH that are caused by a faulty Kontron Euro e GmbH roduct.

1.6 Technical Support

Technicians and engineers from Kontron Euro e GmbH and/or its subsidiaries are available for technical su ort. We are

committed to make our roduct easy to use and will hel you use our roducts in your systems.

Please consult our Website at htt ://www.kontron.com/su ort for the latest roduct documentation, utilities, drivers

and su ort contacts. Consult our customer section htt ://emdcustomersection.kontron.com for the latest BIOS

downloads, Product Change Notifications, Board Su ort Packages, DemoImages, 3D drawings and additional tools and

software. In any case you can always contact your board su lier for technical su ort.

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COMe-cBTi6R / Introduction

2 Introd ction

2.1 Product Description

The Kontron COMe-cBTi6R comes with an es ecially robust design and is tailored to suit shock- and vibration- roof mobile

and stationary a lications as well as the extended tem erature range of -40°C to +85°C. It is exclusively equi ed with

Intel® Atom™ E3800 family rocessors and soldered RAM. According to the different requirements of real-time controllers

or memory-hungry HMIs either u to 4GB LPDDR3 with ECC or u to 8GB LPDDR3 without ECC is available. The su ort of

Ra id Shutdown offers an extremely fast shutdown of a com uter system to minimize the risk of system or data tam ering

in mission critical a lications. Software and a lication data can be stored on the eMMC Flash and via 2 SATA interfaces.

Any eri herals can be connected via 1x USB 3.0, 1x USB OTG, 8x USB 2.0 or 4x PCIe x1.

2.2 Naming clarification

COM Ex ress® defines a Com uter-On-Module, or COM, with all com onents necessary for a bootable host com uter,

ackaged as a su er com onent.

» COMe-bXX# modules are Kontron's COM Ex ress® modules in basic form factor (125mm x 95mm)

» COMe-cXX# modules are Kontron's COM Ex ress® modules in com act form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Ex ress® modules in mini form factor (55mm x 84mm)

The roduct names for Kontron COM Ex ress® Com uter-on-Modules consist of a short form of the industry standard

(COMe-), the form factor (b=basic, c=com act, m=mini), the ca ital letters for the CPU and Chi set Codenames (XX) and

the in-out ty e (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Ex ress® basic and com act modules contain two 220 in connectors; each of it has two rows called Row

A & B on rimary connector and Row C & D on secondary connector. COM Ex ress® Com uter-on-modules feature the

following maximum amount of interfaces according to the PICMG module Pin-out ty e:

Feat re Pin-O t Type 1 Pin-O t Type 10 Pin-O t Type 2 Pin-O t Type 6

HD A dio 1x 1x 1x 1x

Gbit Ethernet 1x 1x 1x 1x

Serial ATA 4x 4x 4x 4x

Parallel ATA - - 1x -

PCI - - 1x -

PCI Express x1 6x 6x 6x 8x

PCI Express x16 (PEG) - - 1x 1x

USB Client 1x 1x - -

USB 2.0 8x 8x 8x 8x

USB 3.0 - 2x - 4x

VGA 1x - 1x 1x

LVDS Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI) 1x o tional 1x 3x shared with PEG 3x

LPC 1x 1x 1x 1x

External SMB 1x 1x 1x 1x

External I2C 1x 1x 1x 1x

GPIO 8x 8x 8x 8x

SDIO shared w/GPIO 1x o tional 1x o tional - 1x o tional

UART (2-wire COM) - 2x - 2x

FAN PWM o t - 1x - 1x

COMe-cBTi6R / Introduction

2.4 COM Express® Documentation

This roduct manual serves as one of three rinci al references for a COM Ex ress® design. It documents the

s ecifications and features of COMe-cBTi6R. Additional references are available at your Kontron Su ort or at PICMG®:

» The COM Ex ress® S ecification defines the COM Ex ress® module form factor, in-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Ex ress® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Ex ress® modules.

Some of the information contained within this roduct manual a lies only to certain

roduct revisions (CE: xxx). If certain information a lies to s ecific roduct revisions (CE:

xxx) it will be stated. Please check the roduct revision of your module to see if this

information is a licable.

2.5 COM Express® Benefits

COM Ex ress® modules are very com act, highly integrated com uters. All Kontron COM Ex ress® modules feature a

standardized form factor and a standardized connector layout which carry a s ecified set of signals. Each COM is based on

the COM Ex ress® s ecification. This standardization allows designers to create a single-system baseboard that can

acce t resent and future COM Ex ress® modules.

The baseboard designer can o timize exactly how each of these functions im lements hysically. Designers can lace

connectors recisely where needed for the a lication on a baseboard designed to o timally fit a system’s ackaging.

A single baseboard design can use a range of COM Ex ress® modules with different sizes and in-outs. This flexibility can

differentiate roducts at various rice/ erformance oints, or when designing future roof systems that have a built-in

u grade ath. The modularity of a COM Ex ress® solution also ensures against obsolescence when com uter technology

evolves. A ro erly designed COM Ex ress® baseboard can work with several successive generations of COM Ex ress®

modules.

A COM Ex ress® baseboard design has many advantages of a customized com uter-board design and, additionally,

delivers better obsolescence rotection, heavily reduced engineering effort, and faster time to market.

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COMe-cBTi6R / Product S ecification

3 Prod ct Specification

3.1 Module definition

The COM Ex ress® com act sized Com uter-on-Module COMe-cBTi6R (CVVR (Coyote Hills)) follows in-out Ty e 6 and is

com atible to PICMG s ecification COM.0 Rev 2.1. The COMe-cBTi6R, based on Intel's Bay Trail latform, is available in

different variants to cover the demand of different erformance, rice and ower:

Ind strial temperat re grade mod les (E2: -40°C to +85°C operating)

Part N mber Prod ct Name Processor Memory Down eMMC Flash mSD Socket TPM Ethernet PCIe

36016-8016-19-4 COMe-cBTi6R E3845 8GB/16S BayTrail-I Intel® Atom E3845 2x4GB non-ECC 16GB SLC Yes Yes Intel® i210IT 3×1

36016-8000-19-4 COMe-cBTi6R E3845 8GB BayTrail-I Intel® Atom E3845 2x4GB non-ECC - Yes Yes Intel® i210IT 3×1

36016-4032-19-4 COMe-cBTi6R E3845 4GB/32S BayTrail-I Intel® Atom E3845 1x4GB non-ECC 32GB SLC Yes Yes Intel® i210IT 3×1

36016-4000-19-4 COMe-cBTi6R E3845 4E BayTrail-I Intel® Atom E3845 1x4GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-17-2 COMe-cBTi6R E3827 2E BayTrail-I Intel® Atom E3827 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-15-2 COMe-cBTi6R E3826 2E BayTrail-I Intel® Atom E3826 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-2000-13-2 COMe-cBTi6R E3825 2E BayTrail-I Intel® Atom E3825 1x2GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

36016-1000-15-1 COMe-cBTi6R E3815 1E BayTrail-I Intel® Atom E3815 1x1GB ECC - Yes Yes SMSC LAN7500i 4×1 / 1×4

Memory config rations (36016-MMxx-xx-x)

» MM = 10: 1024MB DDR3L Memory

» MM = 20: 2048MB DDR3L Memory

» MM = 40: 4096MB DDR3L Memory

» MM = 80: 8192MB DDR3L Memory

Onboard Flash config rations, available on E3800 variants only (36016-xxFF-xx-x)

» FF = 00: without eMMC Flash

» FF = 20: 2GB onboard eMMC Flash

» FF = 40: 4GB onboard eMMC Flash

» FF = 80: 8GB onboard eMMC Flash

» FF = 16: 16GB onboard eMMC Flash

» FF = 32: 32GB onboard eMMC Flash

» FF = 64: 64GB onboard eMMC Flash

Optional hardware feat res

» ECC memory

» eMMC Flash

» PCIe Intel® i210IT instead of USB SMCS LAN7500i

Optional BIOS/Software feat res:

» TXE Firmware with Encry tion su ort (AES, PAVP …)

O tional hardware and BIOS features are available roject based only for variants not listed

above. Please contact your local sales for customized articles.

COMe-cBTi6R / Product S ecification

3.2 Functional Specification

Processor

The 32nm Intel® Atom™ E3800 (BayTrail-I) CPU family su orts:

» Intel® 64

» Enhanced Intel S eedSte ® Technology

» Thermal Monitoring Technologies

» Execute Disable Bit

» Virtualization Technology VT-x

» 2 Dis lay Pi es for dual inde endent dis lays

CPU specifications

Intel® Atom™ Atom™ Atom™ Atom™ Atom™

- E3845 E3827 E3826 E3825 E3815

# of Cores 4 2 2 2 1

# of Threads 4 2 2 2 1

CPU Nominal frequency 1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz

CPU Burst frequency - - - - -

LFM/LPM Frequency 533MHz 533MHz 533MHz 533MHz 533MHz

Tjunction 110°C 110°C 110°C 110°C 110°C

Thermal Design Power

(TDP)

10W 8W 7W 6W 5W

SDP - - - - -

C-States C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6

Smart Cache 2x1MB 2x512kB 2x512kB 2x512kB 512kB

Memory Ty e DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Size 2x8GB or 1x8GB ECC 2x8GB or 1x8GB ECC 2x8GB or 1x8GB ECC 8GB 8GB

ECC Memory(o tional) Yes Yes Yes Yes Yes

Gra hics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD®

GFX Base Frequency 542MHz 542MHz 533MHz 533MHz 400MHz

GFX Max Dynamic Frequ. 792MHz 792MHz 667MHz - -

GFX Technology GT1 4EU GT1 4EU GT1 4EU GT1 4EU GT1 4EU

AEC Q100 automtovie

Qual.

Yes Yes Yes Yes Yes

SDIO Yes Yes Yes Yes Yes

eMMC Yes Yes Yes Yes Yes

AES-NI (o tional) Yes Yes Yes Yes Yes

Memory

Sockets memory down

Memory Type DDR3L-1066/1333

Maxim m Size 1 - 4GB ECC or 1 - 8 GB nECC

Technology Dual Channel

COMe-cBTi6R / Product S ecification

Graphics Core

The integrated Intel® HD Gra hics (Gen 7) su orts:

Graphics Core Render Clock Intel® HD Gra hics (Gen 7), 400-542MHz Clock, 667-792MHz Turbo

Exec tion Units / Pixel Pipelines 4

Max Graphics Memory 2048MB

GFX Memory Bandwidth (GB/s) u to 21.3

GFX Memory Technology DVMT

API (DirectX/OpenGL) 11 / 3.0 + OCL 1.1

Shader Model 3.0

Hardware accelerated Video H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray

Independent/Sim ltaneo s Displays 2

Display Port DP 1.1a / eDP 1.3

HDCP s pport HDCP / PAVP 2 (o tional)

Monitor o tp t

CRT max Resol tion 2560x1600

TV o t: -

LVDS

LVDS Bits/Pixel 1x18/24, 2x18/24 with DP2LVDS

LVDS Bits/Pixel with dithering -

LVDS max Resol tion: 1920x1200

PWM Backlight Control: YES

S pported Panel Data: EDID/DID

Display Interfaces

Discrete Graphics 2x MIPI-CSI on PEG

Digital Display Interface DDI1 DP++

Digital Display Interface DDI2 DP++ muxed with LVDS

Digital Display Interface DDI3 -

Maxim m Resol tion on DDI 2560x1600@60Hz

Storage

onboard SSD 2-64GB eMMC

SD Card s pport 1x mSD Socket onboard, 1x SDIO for WiFi shared with GPIO

IDE Interface -

Serial-ATA 2x SATA 3Gb/s

SATA AHCI AHCI with NCQ, HotPlug, Staggered S inu ,

SATA RAID -

Connectivity

USB 7x USB 2.0

USB 3.0 1x USB 3.0

USB Client 1x USB Client (USB #7)

PCI -

PCI External Masters -

PCI Express 3x PCIe x1 Gen2 w/PCIe LAN

Max PCI Express 4x PCIe x1 Gen2 w/USB LAN

PCI Express x2/x4 config ration YES

Ethernet 10/100/1000

Ethernet controller SMSC LAN7500i or Intel i210IT

COMe-cBTi6R / Product S ecification
Feat re OS S pport Matrix
-  Windows 8  Windows 7  WEC  Tizen  Fedora/Yocto  Android 
-  E3800  Celeron E3800  Celeron E3800  Celeron E3800  E3800  Celeron E3800  Celeron
eMMC Storage  X  X  -  -  X  -  X  X  -  -  - 
eMMC Boot  X  X  -  -  X  -  X  X  -  X  X 
SD Storage  X  X  X  -  X  -  X  X  -  X  X 
SD Boot  -  -  X  -  X  -  X  X  -  X  X 
MIPI-CSI  -  -  -  -  -  -  -  X  -  -  - 
PCI Express Config ration
By default, the COMe-cBTi6R su orts x1 PCIex ress lane configuration only (Configuration 0). Following x2/x4 
configurations are available via Management Engine Softstra  O tions with a customized Flash Descri tor. 
PCIe  Port #0  Port #1  Port #2  Port #3 
Configuration 0  x1  x1  x1  x1 
Configuration 1  x2  x1  x1 
Configuration 2  x2  x2 
Configuration 3  x4 
- PCIe Port #3 is available with USB Ethernet Controller O tion only 
 - Configuration 0 is the default setting 
 - Configuration 1 - 3 are available with customized BIOS versions
Ethernet
The SMSC LAN7500i  or Intel i210IT ethernet su orts: 
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Feat res
S pported BIOS Size/Type  8MB SPI 
A dio  HD Audio 
Onboard Hardware Monitor  Nuvoton NCT7802Y 
Tr sted Platform Mod le  Atmel AT97SC3204 
Miscellaneo s  2x UART / PWM FAN / MIPI-CSI on PEG 
Kontron Feat res
External I2C B s  Fast I2C, MultiMaster ca able 
M.A.R.S. s pport  YES 
Embedded API  KEAPI3 
C stom BIOS Settings / Flash Back p  YES 
Watchdog s pport  Dual Staged 
Additional feat res
» All solid ca acitors (POSCAP). No tantalum ca acitors used.
» O timized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates u  to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
13
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COMe-cBTi6R / Product S ecification
Power Feat res
Singly S pply S pport  YES 
S pply Voltage  4.75 - 20V 
ACPI  ACPI 3.0 
S-States  S0, S3, S4, S5 
S5 Eco Mode  YES 
Misc Power Management  DPST 4.0, iFFS, Ra id Shutdown 
Power Cons mption and Performance
F ll Load Power Cons mption  3.5 - 13.5W 
Kontron Performance Index  9332 - 23937 
Kontron Performance/Watt  1944 - 2986 
Detailed Power Consum tion measurements in all states and bechmarks for CPU, Gra hics 
and Memory  erformance are available in A lication Note KEMAP054 at EMD Customer 
Section.
14
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COMe-cBTi6R / Product S ecification
3.3 Block Diagram
15
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COMe-cBTi6R / Product S ecification
3.4 Accessories
Prod ct specific accessories
Prod ct N mber  Heatspreader and Cooling Sol tions  Comment 
36016-0000-99-0  HSP COMe-cBTi6R thread  For all CPUs and tem erature grades 
36016-0000-99-1  HSP COMe-cBTi6R through  For all CPUs and tem erature grades 
General accessories 
Part N mber  COMe pin-o t Type 6 compatible accessories  Project Code  Comment 
38114-0000-00-0  COM Ex ress® Reference Carrier Ty e 6  ADAS  mITX Carrier with 8mm COMe connector 
38106-0000-00-0  COM Ex ress® Eval Carrier Ty e 6  To anga Canyon ATX Carrier with 5mm COMe connector 
96007-0000-00-3  ADA-PCIe-DP  APDP  PCIe x16 to DP Ada ter for Evaluation Carrier 
96007-0000-00-7  ADA-Ty e6-DP3  DVO6  (sandwich) Ada ter Card for 3x Dis layPort 
96006-0000-00-2  COMe POST T6  NFCB  POST Code / Debug Card 
38019-0000-00-0  ADA-COMe-Height-dual  EERC  Height Ada ter 
38106-0000-00-S  COMe Eval Starterkit T6  To anga Canyon Starterkit with COMe Evaluation Carrier T6 
38114-0000-00-S  COMe Ref. Starterkit T6  ADAS  Starterkit with COMe Reference Carrier T6 
Part N mber  Mo nting  Comment 
38017-0000-00-5  COMe Mount KIT 5mm 1set  Mounting Kit for 1 module including screws for 5mm connectors 
38017-0100-00-5  COMe Mount KIT 5mm 100sets  Mounting Kit for 100 modules including screws for 5mm connectors 
38017-0000-00-0  COMe Mount KIT 8mm 1set  Mounting Kit for 1 module including screws for 8mm connectors 
38017-0100-00-0  COMe Mount Kit 8mm 100sets  Mounting Kit for 100 modules including screws for 8mm connectors 
Part N mber  Cooling Sol tions  Comment 
36099-0000-99-0  COMe Active Uni Cooler  for CPUs u  to 20W TDP, to be mounted on HSP 
36099-0000-99-1  COMe Passive Uni Cooler  for CPUs u  to 10W TDP, to be mounted on HSP 
Part N mber  Display Adapter  Comment 
9-5000-0352  ADA-LVDS-DVI 18bit  LVDS to DVI converter 
9-5000-0353  ADA-LVDS-DVI 24bit  LVDS to DVI converter 
96006-0000-00-8  ADA-DP-LVDS  DP to LVDS ada ter 
96082-0000-00-0  KAB-ADAPT-DP-DVI  DP to DVI ada ter cable 
96083-0000-00-0  KAB-ADAPT-DP-VGA  DP to VGA ada ter cable 
96084-0000-00-0  KAB-ADAPT-DP-HDMI  DP to HDMI ada ter cable 
Part N mber  Cables  Comment 
96079-0000-00-0  KAB-HSP 200mm  Cable ada ter to connect FAN to module (COMe basic/com act) 
96079-0000-00-2  KAB-HSP 40mm  Cable ada ter to connect FAN to module (COMe basic/com act) 
Part N mber  Miscellaneo s  Comment 
18029-0000-00-0  MARS Smart Battery Kit  Starterkit Kontron Mobile A lication  latform for Rechargeable Systems 
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COMe-cBTi6R / Product S ecification
3.5 Electrical Specification
3.5.1 Supply Voltage
Following su ly voltage is s ecified at the COM Ex ress® connector:
VCC:  4.75 - 20V 
Standby:  5V DC +/- 5% 
RTC:  2.5V - 3.47V 
- 5V Standby voltage is not mandatory for o eration. 
- Extended / Industrial Tem erature (E1, XT, RXT) variants are validated for 12V su ly only
3.5.2 Power Supply Rise Time
» The in ut voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ram  of each DC in ut voltage from 10% to 90% of its final set- oint 
following the ATX s ecification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV  eak to  eak 0 – 20 MHz
3.5.4 Power Consumption
The maximum Power Consum tion of the different COMe-cBTi6R variants is 3.5 - 13.5W (100% CPU load on all cores; 90°C 
CPU tem erature). Further information with detailed measurements are available in A lication Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
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COMe-cBTi6R / Product S ecification
3.5.5 ATX Mode
By connecting an ATX  ower su ly with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and  owering on VCC. The ATX PSU is controlled by the PS_ON# signal 
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Com uter-on-Modules su orting a 
wide range in ut down to 4.75V the in ut voltage shall always be higher than 5V Standby (VCC > 5VSB). 
State  PWRBTN#  PWR_OK  V5_StdBy  PS_ON#  VCC 
G3  x  x  0V  x  0V 
S5  high  low  5V  high  0V 
S5   S0 →PWRBTN Event  low   high →5V  high   low →0 V  VCC →
S0  high  high  5V  low  VCC 
3.5.6 Single Supply Mode
In single su ly mode (or automatic  ower on after  ower loss) without 5V Standby the module will start automatically 
when VCC  ower is connected and Power Good in ut is o en or at high level (internal PU to 3.3V). PS_ON# is not used in 
this mode and VCC can be 4.75 - 20V.
To  ower on the module from S5 state  ress the  ower button or reconnect VCC. Sus end/Standby States are not 
su orted in Single Su ly Mode. 
State  PWRBTN#  PWR_OK  V5_StdBy  VCC 
G3  x  x  x  0 
G3   S0 →high  o en / high  x  connecting VCC 
S5  high  o en / high  x  VCC 
S5   S0 →PWRBTN Event  o en / high  x  reconnecting VCC 
Signals marked with “x” are not im ortant for the s ecific  ower state. There is no 
difference if connected or o en.
All ground  ins have to be tied to the ground  lane of the carrier board.
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COMe-cBTi6R / Product S ecification
3.6 Power Control
Power S pply
The COMe-cBTi6R su orts a  ower in ut from 4.75 - 20V. The su ly voltage is a lied through the VCC  ins (VCC) of the 
module connector.
Power B tton (PWRBTN#)
The  ower button (Pin B12) is available through the module connector described in the  inout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, ty ical 400ms) at low level (Power Button Event).
Pressing the  ower button for at least 4seconds will turn off  ower to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-cBTi6R  rovides an external in ut for a  ower-good signal (Pin B24). The im lementation of this subsystem 
com lies with the COM Ex ress® S ecification. PWR_OK is internally  ulled u  to 3.3V and must be high level to  ower on 
the module.
Reset B tton (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the  inout list. The module will stay in 
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chi set and active Management Engine do not allow to hold the 
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will 
reboot the module automatically
SM-B s Alert (SMB_ALERT#)
With an external battery manager  resent and SMB_ALERT# (Pin B15) connected the module always  owers on even if 
BIOS switch “After Power Fail” is set to “Stay Off”.
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COMe-cBTi6R / Product S ecification
3.7 Environmental Specification
3.7.1 Temperature Specification
Kontron defines following tem erature grades for Com uter-on-Modules in general. Please see cha ter 'Product 
S ecification' for available tem erature grades for the COMe-cBTi6R 
Temperat re Specification  Operating  Non-operating  Validated Inp t Voltage 
Commercial grade  0°C to +60°C  -30°C to +85°C  VCC: 4.75 - 20V
Extended Tem erature (E1)  -25°C to +75°C  -30°C to +85°C  VCC: 12V 
Industrial grade by Screening (XT)  -40°C to +85°C  -40°C to +85°C  VCC: 12V 
Industrial grade by Design (E2)  -40°C to +85°C  -40°C to +85°C  VCC: 4.75 - 20V
 Operating with Kontron heatspreader plate assembly 
The o erating tem erature defines two requirements:
» the maximum ambient tem erature with ambient being the air surrounding the module.
» the maximum measurable tem erature on any s ot on the heats reader's surface
Test specification: 
Temperat re Grade  Validation req irements 
Commercial grade  at 60°C HSP tem erature the CPU @ 100% load needs to run at nominal frequency 
Extended Tem erature (E1)  at 75°C HSP tem erature the CPU @ 75% load is allowed to start s eedste ing for thermal  rotection 
Industrial grade by Screening (XT)  at 85°C HSP tem erature the CPU @ 50% load is allowed to start throttling for thermal  rotection 
Industrial grade by Design (E2)  at 85°C HSP tem erature the CPU @ 50% load is allowed to start throttling for thermal  rotection 
 
 Operating witho t Kontron heatspreader plate assembly 
The o erating tem erature is the maximum measurable tem erature on any s ot on the module's surface. Please ensure, 
that all com onents are running within their required s ecification.
3.7.2 Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
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