Kontron CP6006-SA User manual


USER GUIDE
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CP6006-SA
User Guide, Rev. 0.5 Preliminary
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
CP6006
-SA - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue
0.1 Initial Issue 2017-Apr-04
0.2 Preliminary Version, Chapter “Introduction” 2017-Apr-18
0.3 Preliminary Version 2017-May-11
0.4 Chapter 2.7 updated 2017-Nov-14
0.5 Chapter 2.1 - 2.6 updated; chapters 3 -6 updated 2018-Mar-05
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products
. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbo
l and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols .................................................................................................................................................................................................................6
For Your Safety....................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ...............................................................................................................................................................................................9
List of Tables......................................................................................................................................................................................................12
List of Figures ....................................................................................................................................................................................................13
1/ Introduction..........................................................................................................................................................................................14
1.1. Board Overview ..........................................................................................................................................................................................14
1.2. System Expansion Capabilities.............................................................................................................................................................15
1.2.1. PMC Module .............................................................................................................................................................................................15
1.2.2. XMC Module.............................................................................................................................................................................................15
1.2.3. Rear I/O Module.....................................................................................................................................................................................15
1.3. Board Diagrams.........................................................................................................................................................................................16
1.3.1. Functional Block Diagram....................................................................................................................................................................16
1.3.2. Front Panel...............................................................................................................................................................................................17
1.3.3. Board Layout ...........................................................................................................................................................................................18
1.4. Technical Specification ...........................................................................................................................................................................21
1.5. Standards (preliminary; to be verified).............................................................................................................................................26
1.6. Related Publications ............................................................................................................................................................................... 27
2/ Functional Description.....................................................................................................................................................................28
2.1. Processor ....................................................................................................................................................................................................28
2.1.1. Graphics Controller...............................................................................................................................................................................29
2.2. Memory.......................................................................................................................................................................................................29
2.3. Watchdog Timer ......................................................................................................................................................................................29
2.4. Battery ........................................................................................................................................................................................................29
2.5. Flash Memory...........................................................................................................................................................................................30
2.5.1. SPI Boot Flash for uEFI BIOS..............................................................................................................................................................30
2.6. Security Options.......................................................................................................................................................................................30
2.6.1. Trusted Platform Module 2.0 ...........................................................................................................................................................30
2.7. Board Interfaces........................................................................................................................................................................................31
2.7.1. Front Panel LEDs....................................................................................................................................................................................31
2.7.2. USB Interfaces.......................................................................................................................................................................................34
2.7.3. VGA Interface.........................................................................................................................................................................................34
2.7.4. Serial Ports............................................................................................................................................................................................. 35
2.7.5. Gigabit Ethernet.................................................................................................................................................................................... 35
2.7.6. SATA Interfaces ....................................................................................................................................................................................36
2.7.7. PMC Interface ........................................................................................................................................................................................36
2.7.8. XMC Interface........................................................................................................................................................................................ 37
2.7.9. CompactPCI Interface ......................................................................................................................................................................... 37
2.7.10. CompactPCI Connectors...................................................................................................................................................................39

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2.7.11. High-Speed Serial Rear I/O Interconnection..............................................................................................................................49
3/ Configuration ......................................................................................................................................................................................50
3.1. DIP Switch Configuration.......................................................................................................................................................................50
3.1.1. DIP Switch SW1.......................................................................................................................................................................................50
3.1.2. DIP Switch SW2 .....................................................................................................................................................................................50
3.2. System Write Protection........................................................................................................................................................................51
3.3. CP6006(X)-SA-Specific Registers.......................................................................................................................................................51
3.3.1. Write Protection Register (WPROT) ............................................................................................................................................... 52
3.3.2. Reset Status Register (RSTAT) ........................................................................................................................................................ 53
3.3.3. Board ID High Byte Register (BIDH)................................................................................................................................................54
3.3.4. Geographic Addressing Register (GEOAD) ..................................................................................................................................54
3.3.5. Watchdog Timer Control Register (WTIM) .................................................................................................................................. 55
3.3.6. Board ID Low Byte Register (BIDL)................................................................................................................................................. 56
3.3.7. LED Configuration Register (LCFG)................................................................................................................................................. 56
3.3.8. LED Control Register (LCTRL) ...........................................................................................................................................................57
3.3.9. General Purpose Output Register (GPOUT)..................................................................................................................................57
3.3.10. General Purpose Input Register (GPIN).......................................................................................................................................58
4/ Power Considerations...................................................................................................................................................................... 59
4.1. CP6006(X)-SA Voltage Ranges ...........................................................................................................................................................59
4.1.1. Start-Up Requirement .........................................................................................................................................................................59
4.1.2. Power-Up Sequence............................................................................................................................................................................ 59
4.1.3. Regulation...............................................................................................................................................................................................60
4.2. Power Consumption...............................................................................................................................................................................60
4.2.1. Power Consumption of the CP6006(X)-SA Accessories .........................................................................................................62
4.2.2. Power Consumption per Gigabit Ethernet Port .........................................................................................................................62
4.2.3. Power Consumption per 10 Gigabit Ethernet Port (CP6006X-SA)....................................................................................... 62
4.2.4. Power Consumption of PMC Modules..........................................................................................................................................63
4.2.5. Power Consumption of XMC Modules .......................................................................................................................................... 63
5/ Thermal Considerations..................................................................................................................................................................64
5.1. Operational Limits for the CP6006(X)-SA........................................................................................................................................ 65
5.1.1. Peripherals...............................................................................................................................................................................................66
6/ Installation........................................................................................................................................................................................... 67
6.1. Safety ........................................................................................................................................................................................................... 67
6.2. General Instructions on Usage............................................................................................................................................................ 67
6.3. Board Installation.................................................................................................................................................................................... 67
6.3.1. Hot Swap Insertion............................................................................................................................................................................... 67
6.3.2. Hot Swap Removal ..............................................................................................................................................................................68
6.4. Installation of Peripheral Devices .....................................................................................................................................................69
6.4.1. SATA M.2 Module Installation.......................................................................................................................................................... 70
6.4.2. Installation of External SATA Devices .......................................................................................................................................... 70
6.4.3. PMC Module Installation ...................................................................................................................................................................70
6.4.4. XMC Module Installation...................................................................................................................................................................70
6.4.5. Rear Transition Module Installation.............................................................................................................................................. 70
6.5. Battery Replacement ............................................................................................................................................................................. 70
6.5.1. Updating the IPMI Firmware ..............................................................................................................................................................71
7/ uEFI BIOS (t.b.d.)................................................................................................................................................................................. 72
8/ IPMI Firmware..................................................................................................................................................................................... 73
8.1. Overview ..................................................................................................................................................................................................... 73
8.2. IPMI Firmware and KCS Interface Configuration .......................................................................................................................... 73