Kontron COMe-cBW6 User manual


USER GUIDE
COMe-cBW6
Doc. User Guide, Rev. 1.2 (CBW6M100)
Doc. ID: 1060-3230

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
COME
-CBW6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on
the part of Kontron with respect to technical processes described in the user guide or any product characteristics set
out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no
license or title under any patent, copyright or mask work rights to these products and makes no representations or
warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this user guide are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this user guide only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products and
thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2019 by Kontron Europe GmbH
Kontron Europe GmbH
Gutenbergstraße. 2
85737 Ismaning
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR
RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION
SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE
SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT,
OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO
DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK
APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
You find the most recent version of the “General Safety Instructions“ online in the download
area of this product.

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Revision History
Revision
Brief Description of Changes
Date of Issue
1.0
Initial Issue
2016-Apr-14
1.1
Updated the carries Accessories
2020-Jul-23
1.2
Ethernet controller i211AT replaced by i210AT
2022-April-25
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms
& Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting Kontron Support: https://www.kontron.com/en/support-and-services.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product expertise
coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of mind to
build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron training
academy, and more visit https://www.kontron.com/en/support-and-services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron Support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this manual:
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
Please refer also to the "High-Voltage Safety Instructions" portion below in this section.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol informs of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user manual.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Follow the “General Safety Instructions” supplied with the
product.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols .................................................................................................................................................................................................................5
For Your Safety....................................................................................................................................................................................................6
High Voltage Safety Instructions ..................................................................................................................................................................6
Special Handling and Unpacking Instruction ............................................................................................................................................6
Lithium Battery Precautions...........................................................................................................................................................................7
General Instructions on Usage.......................................................................................................................................................................7
Quality and Environmental Management ..................................................................................................................................................7
Disposal and Recycling.....................................................................................................................................................................................7
WEEE Compliance...............................................................................................................................................................................................7
Table of Contents .............................................................................................................................................................................................. 8
List of Figures .....................................................................................................................................................................................................11
1/ Introduction..........................................................................................................................................................................................12
1.1. Product Description...................................................................................................................................................................................12
1.2. Naming clarification.................................................................................................................................................................................12
1.3. Understanding COM Express® Functionality...................................................................................................................................12
1.4. COM Express® Documentation.............................................................................................................................................................13
1.5. COM Express® Benefits...........................................................................................................................................................................13
2/ Product Specification ........................................................................................................................................................................14
2.1. Module definition ......................................................................................................................................................................................14
2.2. Functional Specification.........................................................................................................................................................................14
2.2.1. Processor..................................................................................................................................................................................................14
2.2.2. Memory ....................................................................................................................................................................................................16
2.2.3. Graphics Core .........................................................................................................................................................................................16
2.2.4. Monitor Output......................................................................................................................................................................................16
2.2.5. LVDS...........................................................................................................................................................................................................16
2.2.6. Display Interfaces.................................................................................................................................................................................16
2.2.7. Storage......................................................................................................................................................................................................16
2.2.8. Connectivity ............................................................................................................................................................................................17
2.2.9. Ethernet....................................................................................................................................................................................................17
2.2.10. Misc. Interfaces and Features.........................................................................................................................................................17
2.2.11. Kontron Features .................................................................................................................................................................................17
2.2.12. Additional Features ............................................................................................................................................................................17
2.2.13. Power Features....................................................................................................................................................................................18
2.2.14. Power Consumption and Performance ......................................................................................................................................18
2.3. Block Diagram............................................................................................................................................................................................19
2.4. Accessories ...............................................................................................................................................................................................20
2.4.1. Product Specific Accessories............................................................................................................................................................20
2.4.2. General Accessories............................................................................................................................................................................20
2.5. Electrical Specifications ........................................................................................................................................................................22
2.5.1. Supply Voltage.......................................................................................................................................................................................22
2.5.2. Power Supply Rise Time ....................................................................................................................................................................22
2.5.3. Supply Voltage Ripple.........................................................................................................................................................................22
2.5.4. Power Consumption............................................................................................................................................................................ 22
2.5.5. Power Supply Modes ..........................................................................................................................................................................23
2.5.5.1. ATX Mode .............................................................................................................................................................................................23
2.5.6. Single Supply Mode.............................................................................................................................................................................23

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2.6. Power Control...........................................................................................................................................................................................24
2.6.1. Power Supply .........................................................................................................................................................................................24
2.6.2. Power Button (PWRBTN#)................................................................................................................................................................24
2.6.3. Power Good (PWR_OK) ......................................................................................................................................................................24
2.6.4. Reset Button (SYS_RESET#)............................................................................................................................................................24
2.6.5. SM-Bus Alert (SMB_ALERT#) ..........................................................................................................................................................24
2.7. Environmental Specification................................................................................................................................................................ 25
2.7.1. Temperature Specification ................................................................................................................................................................ 25
2.7.2. Humidity ..................................................................................................................................................................................................25
2.8. Standards and Certifications...............................................................................................................................................................26
2.8.1. RoHS II.......................................................................................................................................................................................................26
2.8.2. Component Recognition UL 60950-1.............................................................................................................................................26
2.8.3. WEEE Directive......................................................................................................................................................................................26
2.8.4. Conformal Coating ..............................................................................................................................................................................26
2.8.5. Shock & Vibration ................................................................................................................................................................................26
2.8.6. EMC...........................................................................................................................................................................................................26
2.9. MTBF............................................................................................................................................................................................................ 27
2.10. Mechanical Specification ....................................................................................................................................................................28
2.10.1. Dimension..............................................................................................................................................................................................28
2.10.2. Height .....................................................................................................................................................................................................28
2.11. Module Dimensions ...............................................................................................................................................................................28
2.12. Thermal Management, Heatspreader and Cooling Solutions ................................................................................................28
3/ Features and Interfaces..................................................................................................................................................................30
3.1. Onboard eMMC Flash..............................................................................................................................................................................30
3.2. Secure Digital Card...................................................................................................................................................................................31
3.3. S5 Eco Mode ...............................................................................................................................................................................................31
3.4. LPC.................................................................................................................................................................................................................31
3.5. Serial Peripheral Interface (SPI) ......................................................................................................................................................... 32
3.6. SPI boot.......................................................................................................................................................................................................32
3.6.1. Recommended SPI boot flash types for 8-SOIC package ....................................................................................................... 33
3.6.2. Using an external SPI flash...............................................................................................................................................................34
3.6.3. External SPI flash on Modules with Intel® ME ...........................................................................................................................34
3.7. M.A.R.S.........................................................................................................................................................................................................34
3.8. UART ............................................................................................................................................................................................................34
3.9. Fast I2C........................................................................................................................................................................................................35
3.10. Dual Staged Watchdog Timer............................................................................................................................................................36
3.10.1. Basics......................................................................................................................................................................................................36
3.10.2. Time-out events.................................................................................................................................................................................36
3.10.3. WDT Signal ...........................................................................................................................................................................................36
3.11. Speedstep Technology .........................................................................................................................................................................36
3.12. C-States ....................................................................................................................................................................................................36
3.13. ACPI Suspend Modes and Resume Events .................................................................................................................................... 37
4/ Pinout List ............................................................................................................................................................................................38
4.1. General Signal Description....................................................................................................................................................................38
4.2. Connector X1A Row A .............................................................................................................................................................................39
4.3. Connector X1A Row B.............................................................................................................................................................................42
4.4. Connector X1B Row C.............................................................................................................................................................................45
4.5. Connector X1B Row D.............................................................................................................................................................................47
5/ BIOS Operation ...................................................................................................................................................................................49

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5.1. Determining the BIOS Version..............................................................................................................................................................49
5.2. BIOS Update...............................................................................................................................................................................................49
5.3. POST Codes................................................................................................................................................................................................49
5.4. Setup Guide................................................................................................................................................................................................49
5.4.1. Menu Bar .................................................................................................................................................................................................50
5.4.2. Legend Bar .............................................................................................................................................................................................50
5.4.3. Selecting an Item..................................................................................................................................................................................50
5.4.4. Displaying Submenus.........................................................................................................................................................................50
5.4.5. Item Specific Help Window ...............................................................................................................................................................50
5.4.6. General Help Window.........................................................................................................................................................................50
5.5. BIOS Setup...................................................................................................................................................................................................51
5.5.1. Main............................................................................................................................................................................................................51
5.5.1.1. Platform Information........................................................................................................................................................................ 52
5.5.2. Advanced................................................................................................................................................................................................. 53
5.5.2.1. Trusted Computing ...........................................................................................................................................................................54
5.5.2.2. ACPI Settings ...................................................................................................................................................................................... 55
5.5.2.3. Miscellaneous....................................................................................................................................................................................56
5.5.2.4. Watchdog.............................................................................................................................................................................................57
5.5.2.5. H/W Monitor.......................................................................................................................................................................................58
5.5.2.6. Serial Port Console Redirection ...................................................................................................................................................60
5.5.2.7. Legacy Console Redirection Settings ..........................................................................................................................................61
5.5.2.8. Con sole Redirection Settings (Disabled) ................................................................................................................................. 62
5.5.2.9. CPU Configuration.............................................................................................................................................................................64
5.5.2.10. CPU Thermal Configuration......................................................................................................................................................... 65
5.5.2.11. PPM Configuration...........................................................................................................................................................................66
5.5.2.12. Thermal Configuration .................................................................................................................................................................. 67
5.5.2.13. SATA Configuration ........................................................................................................................................................................68
5.5.2.14. Software Feature Mask Configuration .................................................................................................................................... 70
5.5.2.15. Chipset Miscellaneous Configuration........................................................................................................................................71
5.5.2.16. LPSS & SCC Configuration............................................................................................................................................................ 72
5.5.2.17. System Component ........................................................................................................................................................................ 73
5.5.2.18. AMI Graphic Output Protocol Policy..........................................................................................................................................74
5.5.2.19. SIO Configuration .............................................................................................................................................................................75
5.5.2.20. Serial Port 0/1 Configuration...................................................................................................................................................... 76
5.5.2.21. PCI Subsystem Settings .................................................................................................................................................................77
5.5.2.22. Network Stack Configuration ..................................................................................................................................................... 79
5.5.2.23. CSM Configuration .........................................................................................................................................................................80
5.5.2.24. NVMe Configuration.......................................................................................................................................................................81
5.5.2.25. USB Configuration ..........................................................................................................................................................................82
5.5.2.26. Platform Trust Technology.........................................................................................................................................................83
5.5.2.27. Security Configuration ..................................................................................................................................................................84
5.5.2.28. IntelRMT Configuration................................................................................................................................................................85
5.5.3. Chipset .....................................................................................................................................................................................................86
5.5.3.1. North Bridge........................................................................................................................................................................................87
5.5.3.2. Intel IGD Configuration....................................................................................................................................................................88
5.5.3.3. GOP Related LCD Control................................................................................................................................................................90
5.5.3.4. LCD Control.........................................................................................................................................................................................92
5.5.3.5. Graphics Power Management Control.......................................................................................................................................94
5.5.3.6. South Bridge .......................................................................................................................................................................................95

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5.5.3.7. Security Configuration.....................................................................................................................................................................96
5.5.3.8. HD Audio Configuration .................................................................................................................................................................. 97
5.5.3.9. USB Configuration ............................................................................................................................................................................98
5.5.3.10. PCI Express Configuration............................................................................................................................................................99
5.5.3.11. PCI Express Root Port 1 (2, 3, 4) ................................................................................................................................................ 100
5.5.3.12. PCI Express S0ix Settings ........................................................................................................................................................... 102
5.5.4. Security.................................................................................................................................................................................................. 103
5.5.5. HDD Security Configuration ............................................................................................................................................................104
5.5.6. Boot......................................................................................................................................................................................................... 105
5.5.7. Save & Exit.............................................................................................................................................................................................107
List of Figures
Figure 1: Block Diagram of COMe-cBW6 ...................................................................................................................................................19
Figure 2: ROHS II symbol ...............................................................................................................................................................................26
Figure 3: UL symbol ........................................................................................................................................................................................26
Figure 4: Height of the COMe-cBW6 module .........................................................................................................................................28

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1/ Introduction
1.1. Product Description
The standard design of the COM Express® compact modules – Kontron COMe-cBW6 – supports the entire portfolio of
Intel® Pentium® and Celeron® Processor N3000 series. Integrated Intel® HD Graphic Gen 8 with 3 independent display
support for general mobile embedded applications. The memory of up to 2x 4GB has been laid out as dual-channel
DDR3L SODIMM. With onboard eMMC Flash option, SD card slot and 2x SATA3 ample storage options for OS and
application software are available. Substantial USB support is also offered with 4x USB 3.0/2.0 and 4x USB 2.0.
1.2. Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry
standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset
Codenames (XX) and the pin-out type (#) followed by the CPU Name.
1.3. Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called
Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules
feature the following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature
Pin-Out Type 1
Pin-Out Type 10
Pin-Out Type 2
Pin-Out Type 6
HD Audio
1x
1x
1x
1x
Gbit Ethernet
1x
1x
1x
1x
Serial ATA
4x
4x
4x
4x
Parallel ATA
-
-
1x
-
PCI
-
-
1x
-
PCI Express x1
6x
6x
6x
8x
PCI Express x16 (PEG)
-
-
1x
1x
USB Client
1x
1x
-
-
USB 2.0
8x
8x
8x
8x
USB 3.0
-
2x
-
4x
VGA
1x
-
1x
1x
LVDS
Dual Channel
Single Channel
Dual Channel
Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional
1x
3x shared with PEG
3x
LPC
1x
1x
1x
1x
External SMB
1x
1x
1x
1x
External I2C
1x
1x
1x
1x
GPIO
8x
8x
8x
8x
SDIO shared w/GPIO
1x optional
1x optional
-
1x optional
UART (2-wire COM)
-
2x
-
2x
FAN PWM out
-
1x
-
1x

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1.4. COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cBW6. Additional references are available at your Kontron Support or at PICMG®:
The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This
document is available at the PICMG® website by filling out the order form.
The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
1.5. COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is
based on the COM Express® specification. This standardization allows designers to create a single-system baseboard
that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility
can differentiate products at various price/performance points, or when designing future proof systems that have a
built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

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2/ Product Specification
2.1. Module definition
The COM Express® compact sized Computer-on-Module COMe-cBW6 (CBW6) follows pin-out Type 6 and is
compatible to PICMG specification COM.0 Rev 2.1. The COMe-cBW6 based on latest platform is available in different
variants to cover the demand of different performance, price and power:
Commercial grade modules (0°c to 60°c operating)
Part Number
Product Name
Processor
Memory
eMMC
TPM
mSD
Socket
VGA
analog
USB
2.0
USB
3.0
36020-0000-17-8
COMe-cBW6 N3710
N3710
2x DDR3L SODIMM
-
No
Yes
No
4
4
36020-0000-17-4
COMe-cBW6 N3160
N3160
2x DDR3L SODIMM
-
No
Yes
No
4
4
36020-0000-11-2
COMe-cBW6 N3010
N3010
1x DDR3L SODIMM
-
No
Yes
No
4
4
2.2. Functional Specification
2.2.1. Processor
The 14nm Intel@ Atom Celeron embedded (Braswell) CPU family with 25x27mm package size (FCBGA1170) supports:
Intel® 64
Intel® Virtualization Technology (VT-x)
Enhanced Intel SpeedStep® Technology
Idle States (C-States)
Thermal Monitoring Technologies
Optional available (with customized BIOS):
Advanced Encryption Standard Instructions (AES-NI)
The integrated Intel® HD Graphics supports:
GraphicsTechnology with 12 Execution Units
DirectX Support
OpenGL Support
# of Displays Suported: 3
Intel®
Pentium®
Celeron®
Celeron®
-
N3710
N3160
N3010
# of Cores
4
4
2
# of Threads
4
4
2
TDP Core Frequency (HFM)
1.6 GHz
1.6 GHz
1.04 GHz
Max Turbo Frequency 1 core
2.4 GHz
(2.56 Ghz)
2.08 GHz (2.24GHz)
2.08 GHz
(2.24 GHz)
Max Turbo Frequency 2 cores 2.4 GHz
(2.56 Ghz)
2.08 GHz
(2.24 GHz)
2.08 GHz
(2.24 GHz)
Scenario Design Power (SDP)
4W
4W
3W
TjMax
90°C
90°C
90°C

COMe-cBW6 – User Guide Rev. 1.0
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Intel®
Pentium®
Celeron®
Celeron®
-
N3710
N3160
N3010
Thermal Design Power (TDP)
6W
6W
4W
cTDP-Down
-
-
-
cTDP-Up
-
-
-
Power Limit 2 (PL2 max)
-
-
-
Smart Cache
-
-
-
Min Memory Type
DDR3L 1333
DDR3L 1333
DDR3L 1333
Max Memory Type
DDR3L 1600
DDR3L 1600
DDR3L 1600
Supported Memory Size SODIMM
8GB
8GB
8GB
Supported Size Memory down
-
-
-
# of Memory Channels
2
2
2
Graphics Model
Intel® HD Graphics
Intel® HD Graphics
Intel® HD Graphics
GFX Base Frequency 400 MHz 320 MHz 320 MHz
GFX Max Dynamic Frequ.
700 MHz
640 MHz
600 MHz
GFX Technology
Gen8LP 16EQ
Gen8LP 12EQ
Gen8LP 12EQ
# of Displays Supported
3
3
3
Quick Sync Video
Yes
Yes
Yes
InTru™ 3D
No
No
No
Wireless Display
Yes
Yes
Yes
Clear Video HD
Yes
Yes
Yes
vPRO™ (optional)
No
No
No
TXT (optional)
No
No
No
AES-NI (optional)
Yes
Yes
Yes
VT-x
Yes
Yes
Yes
VT-d
No
No
No
PCI Express Graphics x16 - - -

COMe-cBW6 – User Guide Rev. 1.0
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2.2.2. Memory
Sockets
Up to 2x DDR3L SO-DIMM (depending on variant)
Memory Type
DDR3L-1333/1600
Maximum Size
2x4GB
Technology
Dual Channel
2.2.3. Graphics Core
The integrated Intel® HD Graphics (Gen 8LP) supports:
Graphics Core Render Clock
Intel® HD Graphics (Gen 8LP)
Execution Units / Pixel Pipelines
GT1 16EU
Max Graphics Memory
tbd
GFX Memory Bandwidth (GB/s)
tbd
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
11.1
Shader Model
3.0
Hardware accelerated Video
H.264 / MPEG2 / VC1 / VP8
Independent/Simultaneous Displays
3
Display Port
tbd
HDCP support
HDCP / PAVP 2 (optional)
2.2.4. Monitor Output
CRT max Resolution
1920x1200@60Hz
TV out:
-
2.2.5. LVDS
LVDS Bits/Pixel
1x18/24, 2x18/24 with DP2LVDS
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
1920x1200
PWM Backlight Control:
YES
Supported Panel Data:
EDID/DID
2.2.6. Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
DP++ (optional VGA)
Digital Display Interface DDI3
-
Maximum Resolution on DDI
HDMI: 3840x2160 @30Hz, DP: 3840x2160 @ 30Hz
2.2.7. Storage
onboard SSD
2-64GB eMMC
SD Card support
1x mSD Socket onboard
IDE Interface
-
Serial-ATA
2x SATA 6Gb/s
SATA AHCI
AHCI
SATA RAID
-

COMe-cBW6 – User Guide Rev. 1.0
www.kontron.com // 17
2.2.8. Connectivity
USB 2.0
8x USB 2.0, no legacy EHCI controller (may cause
installation problems under some OS, Win7)
USB 3.0
4x USB 3.0
USB Client
-
PCI
-
PCI External Masters
-
PCI Express
3x PCIe x1 Gen2, no hot plug (Express Card) supported
Max PCI Express
4x PCIe x1 without LAN
PCI Express x2/x4 configuration
YES
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® i211AT
2.2.9. Ethernet
The Intel® i210AT Ethernet supports:
Jumbo Frames - 9K
MACsec IEEE 802.1 AE
Time Sync Protocol Indicator
WOL (Wake On LAN)
PXE (Preboot eXecution Environment)
IEEE1588
2.2.10. Misc. Interfaces and Features
Supported BIOS Size/Type
8MB SPI
Audio
HD Audio
Onboard Hardware Monitor
Nuvoton NCT7802Y
Miscellaneous
2x UART / PWM FAN
2.2.11. Kontron Features
External I2C Bus
Fast I2C, MultiMaster capable
Smart Battery (M.A.R.S.) support
YES
Embedded API
KEAPI3
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged
2.2.12. Additional Features
All solid capacitors (POSCAP). No tantalum capacitors used.
Optimized RTC Battery monitoring to secure highest longevity
Real fast I2C with transfer rates up to 40kB/s.

COMe-cBW6 – User Guide Rev. 1.0
www.kontron.com // 18
2.2.13. Power Features
Singly Supply Support
YES
Supply Voltage
8.5V - 20V
ACPI
ACPI 3.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
DPST 4.0, iFFS
2.2.14. Power Consumption and Performance
Full Load Power Consumption
tbd
Kontron Performance Index
tbd
Kontron Performance/Watt
tbd
*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0
Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at Kontron’s
Customer Section.

COMe-cBW6 – User Guide Rev. 1.0
www.kontron.com // 19
2.3. Block Diagram
Figure 1: Block Diagram of COMe-cBW6
VGA
GP
SPI
DP++
(DDI2)
PwrCtrl
SysMgmt
SD
LPC SPI
DP++
(DDI1)
(USB 3.0)
USB #4-7
(USB 2.0)
PCIe#3
PCIe#0-2
PCIe#3
GB LAN
SATA0
SATA1
HDA
eMMC
Intel® Atom™ Celeron®
Braswell-M/D SOC, 14nm Airmont Core
Connector Option
Standard
component
eMMC
4-32GB pSLC
8-64GB MLC
VCC
5VSB
VBAT
HWM
COM Express® connector CD – Pin-out Type 6
DDR3L
SODIMM
SMB
GBLan
Intel® I210AT
microSD
Socket
USB #0-3
(USB 3.0)
PWM
FAN1
I2C
SMB
LID
Sleep
LVDS
eDP
GPIO
Embedded Controller
(CPLD EPM570/1270)
HWM
NCT7802
CPU FAN0
DP2LVDS
NXP
PTN3460
Power sequencing
Watchdog
LPC2I2C
I2C
EEPROM
S5eco
Gen8
iGFX
XHCI
USBHub
USB2415 EHCI
SPI
BIOS Flash
GPIO
Ctrl
Mgmt
GPIO Buffer
COM Express® connector AB – Pin-out Type 6
DDR3L
SODIMM
DP2VGA
2xUART
Rx
Redriver
2xUART

COMe-cBW6 – User Guide Rev. 1.0
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2.4. Accessories
2.4.1. Product Specific Accessories
Product Number
Heatspreader and Cooling Solutions
Comment
36020-0000-99-0
HSP COMe-cBW6 thread
For all CPUs and temperature grades
36020-0000-99-1
HSP COMe-cBW6 through
For all CPUs and temperature grades
2.4.2. General Accessories
Part Number
COMe pin-out Type 6 compatible
Project Code
Comment
38116-0000-00-5 COM Express® Eval Carrier2 Type 6 ADT6 ATX Carrier with 5mm COMe
connector
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for
Evaluation Carrier
96007-0000-00-7
ADA-Type6-DP3
DVO6
(sandwich) Adapter Card for 3x
DisplayPort
96006-0000-00-2
COMe POST T6
NFCB
POST Code / Debug Card
38019-0000-00-0
ADA-COMe-Height-dual
EERC
Height Adapter
Part Number
Mounting
Comment
38017-0000-00-5
COMe Mount KIT 5mm 1set
Mounting Kit for 1 module including screws for 5mm connectors
38017-0100-00-5
COMe Mount KIT 5mm 100sets
Mounting Kit for 100 modules including screws for 5mm
connectors
38017-0000-00-0
COMe Mount KIT 8mm 1set
Mounting Kit for 1 module including screws for 8mm connectors
38017-0100-00-0 COMe Mount Kit 8mm 100sets Mounting Kit for 100 modules including screws for 8mm
connectors
Part Number
Cooling Solutions
Comment
36099-0000-99-0
COMe Active Uni Cooler
for CPUs up to 20W TDP, to be mounted on HSP
36099-0000-99-1
COMe Passive Uni Cooler
for CPUs up to 10W TDP, to be mounted on HSP
Part Number
Display Adapter
Comment
9-5000-0352
ADA-LVDS-DVI 18bit
LVDS to DVI converter
9-5000-0353
ADA-LVDS-DVI 24bit
LVDS to DVI converter
96006-0000-00-8
ADA-DP-LVDS
DP to LVDS adapter
96082-0000-00-0
KAB-ADAPT-DP-DVI
DP to DVI adapter cable
96083-0000-00-0
KAB-ADAPT-DP-VGA
DP to VGA adapter cable
96084-0000-00-0
KAB-ADAPT-DP-HDMI
DP to HDMI adapter cable
Part Number
Cables
Comment
96079-0000-00-0
KAB-HSP 200mm
Cable adapter to connect FAN to
module (COMe basic/compact)
96079-0000-00-2 KAB-HSP 40mm Cable adapter to connect FAN to
module (COMe basic/compact)
Part Number
Miscellaneous
Comment
18029-0000-00-0 MARS Smart Battery Kit Starterkit Kontron Mobile Application
platform for Rechargeable Systems