Lenovo ThinkSystem SR860 V2 User manual

ThinkSystem SR860 V2
Maintenance Manual
Machine Types: 7Z59 and 7Z60

Note
Befo e using this info mation and the p oduct it suppo ts, be su e to ead and unde stand the safety
info mation and the safety inst uctions, which a e available at:
https://pubs.lenovo.com/safety_documentation/
In addition, be su e that you a e familia with the te ms and conditions of the Lenovo wa anty fo you se ve ,
which can be found at:
http://datacente suppo t.lenovo.com/wa antylookup
Tenth Edition (August 2022)
© Copyright Lenovo 2020, 2022
LIMITED AND RESTRICTED RIGHTS NOTICE: If data o softwa e is delive ed pu suant to a Gene al Se vices
Administ ation (GSA) cont act, use, ep oduction, o disclosu e is subject to est ictions set fo th in Cont act No. GS-35F-
05925.

Contents
Contents i
Safety iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1 Introduction 1
Specifications . . . . . . . . . . . . . . . . 2
Pa ticulate contamination . . . . . . . . . . 6
Fi mwa e updates . . . . . . . . . . . . . . . 7
Tech Tips . . . . . . . . . . . . . . . . . 11
Secu ity adviso ies . . . . . . . . . . . . . 11
Powe on the se ve . . . . . . . . . . . . . 12
Powe off the se ve . . . . . . . . . . . . . 12
Chapter 2 Server components 13
F ont view . . . . . . . . . . . . . . . . . 15
LCD diagnostics panel . . . . . . . . . . 17
Rea view . . . . . . . . . . . . . . . . . 22
Identifying connecto s . . . . . . . . . . . . 27
System boa d connecto s . . . . . . . . . 28
P ocesso and memo y expansion t ay
connecto s . . . . . . . . . . . . . . . 30
Powe backplane connecto s. . . . . . . . 31
2.5-inch 8-bay d ive backplane connecto s . . 32
PCIe ise ca d connecto s. . . . . . . . . 34
4U PCIe ise cage connecto s . . . . . . . 36
Switches, jumpe s, and buttons . . . . . . . . 38
System boa d LEDs . . . . . . . . . . . . . 40
P ocesso and memo y expansion t ay
LEDs . . . . . . . . . . . . . . . . . 41
Pa ts list. . . . . . . . . . . . . . . . . . 42
Powe co ds . . . . . . . . . . . . . . 46
Chapter 3 Internal cable routing 47
Cable outing fo 2.5-inch d ives . . . . . . . . 47
Connecting cables to the p ocesso and
memo y expansion t ay . . . . . . . . . . 50
Connecting cables to the NVMe switch
ca ds . . . . . . . . . . . . . . . . . 52
SAS/SATA backplane combinations . . . . . 55
One-NVMe-backplane combinations. . . . . 68
Two-NVMe-backplane combinations. . . . . 70
Th ee-NVMe-backplane combinations . . . . 73
One-AnyBay-backplane combinations . . . . 78
Two-AnyBay-backplane combinations . . . . 103
Th ee-AnyBay-backplane combinations . . . 125
Chapter 4 Hardware replacement
procedures 137
Installation Guidelines . . . . . . . . . . . . 137
Safety inspection checklist. . . . . . . . . 138
System eliability guidelines . . . . . . . . 139
Wo king inside the se ve with the powe
on . . . . . . . . . . . . . . . . . . 139
Handling static-sensitive devices . . . . . . 140
Replace components in the se ve . . . . . . . 140
2.5-inch hot-swap d ive and backplane
eplacement . . . . . . . . . . . . . . 140
CMOS batte y (CR2032) eplacement . . . . 148
Fan and fan cage eplacement . . . . . . . 153
F ont VGA assembly eplacement . . . . . . 160
Heat sink To x T30 nut eplacement . . . . . 168
Int usion switch eplacement . . . . . . . . 171
LCD diagnostics panel eplacement . . . . . 173
Memo y module eplacement . . . . . . . 178
OCP Ethe net adapte eplacement . . . . . 184
PCIe ise assembly and adapte
eplacement . . . . . . . . . . . . . . 186
Powe backplane eplacement . . . . . . . 194
Powe supply unit eplacement . . . . . . . 199
P ocesso and heat sink eplacement . . . . 206
P ocesso and memo y expansion t ay
eplacement . . . . . . . . . . . . . . 219
System boa d ai baffle eplacement . . . . . 226
System boa d eplacement (t ained technician
only) . . . . . . . . . . . . . . . . . 228
Top cove eplacement . . . . . . . . . . 240
USB f ont panel module eplacement . . . . 244
Replace components in the PCIe expansion
t ay . . . . . . . . . . . . . . . . . . . 249
4U PCIe expansion t ay eplacement. . . . . 249
4U PCIe ise cage eplacement. . . . . . . 255
4U PCIe ise powe cable assembly
eplacement . . . . . . . . . . . . . . 260
7mm d ive and d ive cage eplacement . . . . 263
Chassis ai baffle eplacement . . . . . . . 270
Flash powe module eplacement . . . . . . 272
M.2 d ive and backplane eplacement . . . . 275
Complete the pa ts eplacement . . . . . . . . 282
Chapter 5 Problem
determination 285
Event logs . . . . . . . . . . . . . . . . . 285
Light path diagnostics . . . . . . . . . . . . 287
Powe supply LEDs . . . . . . . . . . . 289
© Copy ight Lenovo 2020, 2022 i

System boa d LEDs . . . . . . . . . . . 291
Gene al p oblem dete mination p ocedu es . . . . 293
Resolving suspected powe p oblems . . . . 294
Resolving suspected Ethe net cont olle
p oblems . . . . . . . . . . . . . . . 294
T oubleshooting by symptom . . . . . . . . . 295
Ha d disk d ive p oblems . . . . . . . . . 295
Fan p oblems . . . . . . . . . . . . . . 297
Inte mittent p oblems. . . . . . . . . . . 298
Keyboa d, mouse, KVM switch o USB-device
p oblems . . . . . . . . . . . . . . . 299
Memo y p oblems . . . . . . . . . . . . 300
Monito and video p oblems . . . . . . . . 304
Netwo k p oblems . . . . . . . . . . . . 305
Obse vable p oblems. . . . . . . . . . . 306
Optional-device p oblems . . . . . . . . . 309
Powe on and powe off p oblems . . . . . . 311
P ocesso p oblems . . . . . . . . . . . 312
Se ial-device p oblems . . . . . . . . . . 313
Softwa e p oblems. . . . . . . . . . . . 313
Appendix A Hardware disassembling for
recycle 315
Disassemble the se ve fo chassis ecycle . . . . 315
Appendix B Getting help and
technical assistance 317
Befo e you call . . . . . . . . . . . . . . . 317
Collecting se vice data . . . . . . . . . . . . 318
Contacting Suppo t . . . . . . . . . . . . . 319
Appendix C Notices 321
T adema ks . . . . . . . . . . . . . . . . 322
Impo tant notes . . . . . . . . . . . . . . . 322
Telecommunication egulato y statement. . . . . 322
Elect onic emission notices . . . . . . . . . . 323
Taiwan Region BSMI RoHS decla ation. . . . 323
Taiwan Region impo t and expo t contact
info mation . . . . . . . . . . . . . . . . 323
Index 325
ii ThinkSystem SR860 V2 Maintenance Manual

Safety
Befo e installing this p oduct, ead the Safety Info mation.
Antes de instala este p oduto, leia as Info mações de Segu ança.
Læs sikke hedsfo sk ifte ne, fø du installe e dette p odukt.
Lees voo dat u dit p oduct installee t ee st de veiligheidsvoo sch iften.
Ennen kuin asennat tämän tuotteen, lue tu vaohjeet kohdasta Safety Info mation.
Avant d'installe ce p oduit, lisez les consignes de sécu ité.
Vo de Installation dieses P odukts die Siche heitshinweise lesen.
P ima di installa e questo p odotto, legge e le Info mazioni sulla Sicu ezza.
Les sikke hetsinfo masjonen (Safety Info mation) fø du installe e dette p oduktet.
Antes de instala este p oduto, leia as Info mações sob e Segu ança.
© Copy ight Lenovo 2020, 2022 iii

Antes de instala este p oducto, lea la info mación de segu idad.
Läs säke hetsinfo mationen innan du installe a den hä p odukten.
Safety inspection checklist
Use the info mation in this section to identify potentially unsafe conditions with you se ve . As each machine
was designed and built, equi ed safety items we e installed to p otect use s and se vice technicians f om
inju y.
Notes:
1. The p oduct is not suitable fo use at visual display wo kplaces acco ding to §2 of the Wo kplace
Regulations.
2. The set-up of the se ve is made in the se ve oom only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location
Important: Elect ical g ounding of the se ve is equi ed fo ope ato safety and co ect system function.
P ope g ounding of the elect ical outlet can be ve ified by a ce tified elect ician.
Use the following checklist to ve ify that the e a e no potentially unsafe conditions:
1. Make su e that the powe is off and the powe co d is disconnected.
2. Check the powe co d.
• Make su e that the thi d-wi e g ound connecto is in good condition. Use a mete to measu e thi d-
wi e g ound continuity fo 0.1 ohm o less between the exte nal g ound pin and the f ame g ound.
• Make su e that the powe co d is the co ect type.
To view the powe co ds that a e available fo the se ve :
a. Go to:
iv ThinkSystem SR860 V2 Maintenance Manual

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model o Configure to order.
c. Ente the machine type and model fo you se ve to display the configu ato page.
d. Click Power ➙ Power Cables to see all line co ds.
• Make su e that the insulation is not f ayed o wo n.
3. Check fo any obvious non-Lenovo alte ations. Use good judgment as to the safety of any non-Lenovo
alte ations.
4. Check inside the se ve fo any obvious unsafe conditions, such as metal filings, contamination, wate o
othe liquid, o signs of fi e o smoke damage.
5. Check fo wo n, f ayed, o pinched cables.
6. Make su e that the powe -supply cove fastene s (sc ews o ivets) have not been emoved o tampe ed
with.
© Copy ight Lenovo 2020, 2022 v

vi ThinkSystem SR860 V2 Maintenance Manual

Chapter 1 Introduction
The ThinkSystem SR860 V2 is a 4U ack se ve designed fo high-volume netwo k t ansaction p ocessing.
This high-pe fo mance, multi-co e se ve is ideally suited fo netwo king envi onments that equi e supe io
p ocesso pe fo mance, input/output (I/O) flexibility, and high manageability.
Figure 1. ThinkSystem SR860 V2
The se ve comes with a limited wa anty. Fo details about the wa anty, see:
https://suppo t.lenovo.com/us/en/solutions/ht503310
Fo details about you specific wa anty, see:
http://datacente suppo t.lenovo.com/wa antylookup
In addition, the system se vice label on the top cove of the se ve p ovides a QR code fo mobile access to
se vice info mation. You can scan the QR code with a mobile device fo quick access to additional
info mation including pa ts installation, eplacement, and e o codes.
Following illust ation is the QR code: https://suppo t.lenovo.com/p/se ve s/s 860v2
Figure 2. QR code
© Copy ight Lenovo 2020, 2022 1

Specifications
The following info mation is a summa y of the featu es and specifications of the se ve . Depending on the
model, some featu es might not be available, o some specifications might not apply.
Table 1. S ecifications, Ty e 7Z59 and 7Z60
Specification Description
Dimension 4U se ve
• Height: 175 mm (6.9 inches)
• Width:
– With ack handles: 482 mm (19.0 inches)
– Without ack handles: 434.4 mm (17.1 inches)
• Depth: 835.9 mm (32.9 inches)
Note: The depth is measu ed with ack handles installed.
Weight (depending on the
configu ation)
62 kg (136.7 lb) in maximum
P ocesso (depending on
model)
Suppo ts multi-co e Intel Xeon p ocesso s, with integ ated memo y cont olle and Intel
Mesh UPI (Ult a Path Inte connect) topology.
• Two p ocesso sockets (expandable up to fou ) with minimal equi ement of two
installed on the system boa d.
• Designed fo LGA 4189 sockets
• Scalable up to 28 co es
• Suppo ts 6 UPI links at 10.4 GT/s
Memo y See “Memo y module installation ules and o de ” in Setu Guide fo detailed
info mation about memo y configu ation and setup.
• Capacity
– Minimum: 16 GB
– Maximum:
– RDIMM: 3 TB
– 3DS-RDIMM: 6 TB
• Memo y module types:
– Double-data- ate 4 (T uDDR4) e o co ecting code (ECC) 3200 MT/s egiste ed
DIMM (RDIMM) o 3DS RDIMM
– Pe sistent Memo y (PMEM)
• Capacity (depending on the model):
– RDIMM: 16 GB, 32 GB, and 64 GB
– 3DS-RDIMM: 128 GB, 256 GB
– PMEM: 128 GB, 256 GB, and 512 GB
Note: PMEMs can be mixed with DRAM DIMMs. See “PMEM ules” in Setu
Guide fo mo e info mation.
• Slots: 24 two-way inte leaved slots (expandable to 48)
Fo a list of suppo ted memo y modules, see https://se ve p oven.lenovo.com/.
Sto age expansion • Fo ty-eight 2.5-inch d ive bays:
– Bay 0 to 23 suppo t SAS/SATA/NVMe d ives.
– Bay 24 to 47 suppo t SAS/SATA d ives.
Notes: When the following components a e installed in the system, bay 24 to 47
a e disabled, and the maximal suppo ted d ive quantity is 24.
– PMEMs
– DRAM DIMMs with 64 GB o la ge capacity
– P ocesso s with 250 o mo e watts
• Two 7mm/M.2 d ive bays suppo t SAS/SATA/NVMe d ives.
2ThinkSystem SR860 V2 Maintenance Manual

Table 1. S ecifications, Ty e 7Z59 and 7Z60 (continued)
Expansion slots Up to seventeen slots:
• Slot 1 to 4 (4U PCIe ise cage):
– PCI Exp ess 3.0 x8 (Slot 1, 2, 3, 4) o
– PCI Exp ess 3.0 x16 (Slot 2, 4)
• Slot 5 to 7 (PCIe ise ca d):
– PCI Exp ess 3.0 x16 (Slot 5, 6, 7) o
– PCI Exp ess 3.0 x8 (Slot 5, 6)
• Slot 8 (OCP 3.0 Ethe net adapte )
• Slot 9 to 12 (4U PCIe ise cage):
– PCI Exp ess 3.0 x8 (Slot 9, 10, 11, 12) o
– PCI Exp ess 3.0 x16 (Slot 10, 12)
• Slot 13: PCI Exp ess 3.0 x16
• Slot 14: PCI Exp ess 3.0 x8
• Slot 15: PCI Exp ess 3.0 x8
• Slot 16 to 17: 7mm/M.2 d ive bays
Integ ated functions • Lenovo XCla ity Cont olle (XCC), which p ovides se vice p ocesso cont ol and
monito ing functions, video cont olle , and emote keyboa d, video, mouse, and
emote d ive capabilities.
• One system-management RJ-45 connecto on the ea to connect to a systems-
management netwo k. This connecto is dedicated to the Lenovo XCla ity Cont olle
functions and uns at 1 GB speed.
• Fou unive sal se ial bus (USB) po ts:
– Two on the f ont of the se ve :
– One USB 2.0 with Lenovo XCla ity Cont olle management
– One USB 3.1
– Two USB 3.1 on the ea of the se ve
• One se ial po t
RAID adapte
(depending on model)
The following options with suppo t fo RAID levels 0, 1, and 10 a e available fo this
se ve with up to fou flash powe modules:
• ThinkSystem 430-8i SAS/SATA 12Gb HBA
• ThinkSystem 430-16i SAS/SATA 12Gb HBA
• ThinkSystem 430-8e SAS/SATA 12Gb HBA
• ThinkSystem 430-16e SAS/SATA 12Gb HBA
• ThinkSystem RAID 530-8i PCIe 12Gb Adapte
• ThinkSystem RAID 530-16i PCIe 12Gb Adapte
• ThinkSystem RAID 930-8i 2GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 930-16i 4GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 930-8e 4GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapte
• ThinkSystem RAID 940-8i 8GB Flash PCIe Gen4 12Gb Adapte
• ThinkSystem RAID 940-16i 4GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 940-16i 8GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 940-32i 8GB Flash PCIe 12Gb Adapte
• x16 PCIe 1610-8P adapte
• ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Adapte
• ThinkSystem RAID 5350-8i Flash PCIe 12Gb Adapte
• ThinkSystem 4350-16i SAS/SATA 12Gb HBA
• ThinkSystem 4350-8i SAS/SATA 12Gb HBA
Netwo k OCP Ethe net adapte with 1G/10G base-T and 10G/25G/50G SPF+
Fans • Eight (60 mm x 38 mm / 60 mm x 56 mm) inte nal single/dual oto system fans (N+1
edundancy) :
– Slot 1, 3, 4, 6: single-fan single/dual- oto module
– Slot 2, 5: dual-fan single/dual- oto module
• Fou fans fo 4U PCIe ise cages (Two fans fo each unit)
Chapte 1.Int oduction 3

Table 1. S ecifications, Ty e 7Z59 and 7Z60 (continued)
Ope ating System Suppo ted and ce tified ope ating systems:
• Mic osoft Windows Se ve
• VMwa e ESXi
• Red Hat Ente p ise Linux
• SUSE Linux Ente p ise Se ve
Refe ences:
• Complete list of available ope ating systems: https://lenovop ess.lenovo.com/osig.
• OS deployment inst uctions: See “Deploy the ope ating system” in Setu Guide..
Elect ical input This se ve suppo ts up to fou units of CFF V4 powe supplies. Following is the list of
suppo ted types:
• 750-watt Platinum, input powe 115 Vac / 230 Vac / 240 VDC
• 750-watt Titanium, input powe 230 Vac / 240 VDC
Note: When only two units of 750-watt Titanium powe supply a e installed, 240 VDC
is not suppo ted.
• 1100-watt Platinum, input powe 115 Vac / 230 Vac / 240 VDC
• 1100-watt Titanium, input powe 230 Vac / 240 VDC
• 1800-watt Platinum, input powe 230 Vac / 240 VDC
• 1800-watt Titanium, input powe 230 Vac / 240 VDC
• 2600-watt Titanium, input powe 230 Vac / 240 VDC
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland
ONLY
• Power supply with 240 V dc input cannot support hot-plugging power cord
function Before removing the power supply with dc input, please turn off server
or disconnect dc power sources at the breaker panel or by turning off the power
source Then, remove the power cord
Minimal configu ation fo
debugging
• Two p ocesso s in p ocesso socket 1 and 2
• Two DRAM DIMMs in slot 8 and 20
• One powe supply
• One d ive with RAID adapte and backplane (If OS is needed fo debugging)
• Eight system fans:
– Uppe ow: fan 2 and fan 5
– Lowe ow: fan 1 to 6
4ThinkSystem SR860 V2 Maintenance Manual

Table 1. S ecifications, Ty e 7Z59 and 7Z60 (continued)
Acoustical noise emissions The se ve has the following acoustic noise emissions decla ation:
• Sound powe level (LWAd)
– Idling:
– Typical: 6.1 Bel
– Sto age ich: 6.8 Bel
– GPU: 7.4 Bel
– Ope ating:
– Typical: 7.0 Bel
– Sto age ich: 7.5 Bel
– GPU: 8.2 Bel
• Sound p essu e level (LpAm):
– Idling:
– Typical: 47 dBA
– Sto age ich: 53 dBA
– GPU: 60 dBA
– Ope ating:
– Typical: 55 dBA
– Sto age: 61 dBA
– GPU: 67 dBA
Notes:
• These sound levels we e measu ed in cont olled acoustical envi onments acco ding
to p ocedu es specified by ISO7779 and a e epo ted in acco dance with ISO 9296.
• The decla ed acoustic sound levels a e based on the specified configu ations, which
may change slightly depending on configu ation/conditions.
– Typical configu ation: fou 165W p ocesso s, twenty-fou 64 GB DIMMs, twenty-
fou SAS ha d disk d ives, 930-8i, Intel X710 10 GB 2 po t, fou 1100-watt powe
supply units
– Sto age ich configu ation: fou 205W p ocesso s, fo ty-eight 64 GB DIMMs, fo ty-
eight SAS ha d disk d ives, 940-16i, Intel X710 10 GB 2 po t, fou 1100-watt powe
supply units
– GPU configu ation: fou 205W p ocesso s, fo ty-eight 64 GB DIMMs, fo ty-eight
SAS ha d disk d ives, 940-16i, Intel X710 10 GB 2 po t, eight Nvidia Tesla T4, fou
1800-watt powe supply units
• The decla ed acoustic noise levels may inc ease g eatly, if high-powe components
a e installed such as high-powe NICs, high-powe p ocesso s and GPUs.
• Gove nment egulations (such as those p esc ibed by OSHA o Eu opean Community
Di ectives) may gove n noise level exposu e in the wo kplace and may apply to you
and you se ve installation. The actual sound p essu e levels in you installation
depend upon a va iety of facto s, including the numbe of acks in the installation; the
size, mate ials, and configu ation of the oom; the noise levels f om othe equipment;
the oom ambient tempe atu e, and employee's location in elation to the equipment.
Fu the , compliance with such gove nment egulations depends on a va iety of
additional facto s, including the du ation of employees' exposu e and whethe
employees wea hea ing p otection. Lenovo ecommends that you consult with
qualified expe ts in this field to dete mine whethe you a e in compliance with the
applicable egulations.
Chapte 1.Int oduction 5

Table 1. S ecifications, Ty e 7Z59 and 7Z60 (continued)
Ambient tempe atu e
management
Adjust ambient tempe atu e when specific components a e installed:
• Keep ambient tempe atu e to 35°C o lowe when one o mo e of the following
components a e installed.
– P ocesso s with 165 to 205 watts
– DRAM DIMMs with capacity la ge than 64 GB
• Keep ambient tempe atu e to 35°C o lowe when the following components a e
installed in the same unit.
– P ocesso s with 205 to 250 watts
– 24 d ives
• Keep oom tempe atu e to 30°C o lowe when one o mo e of the following
components a e installed.
– P ocesso s with 205 o mo e watts
– Nvidia V100S
– Nvidia T4
– PMEMs
Envi onment ThinkSystem SR860 V2 complies with ASHRAE Class A2 specifications. Depending on
the ha dwa e configu ation, some models comply with ASHRAE Class A3 and Class A4
specifications. System pe fo mance may be impacted when ope ating tempe atu e is
outside AHSARE A2 specification.
• Ai tempe atu e:
– Ope ating
– ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 300 m (984 ft) inc ease in altitude
above 900 m (2,953 ft).
– ASHARE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 175 m (574 ft) inc ease in altitude
above 900 m (2,953 ft).
– ASHARE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
tempe atu e dec eases by 1°C fo eve y 125 m (410 ft) inc ease in altitude
above 900 m (2,953 ft).
– Se ve off: 5°C to 45°C (41°F to 113°F)
– Shipment/sto age: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
– Ope ating
– ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
– Shipment/sto age: 8% to 90%
• Pa ticulate contamination
Attention: Ai bo ne pa ticulates and eactive gases acting alone o in combination
with othe envi onmental facto s such as humidity o tempe atu e might pose a isk to
the se ve . Fo info mation about the limits fo pa ticulates and gases, see
“Pa ticulate contamination” on page 6.
Note: The se ve is designed fo standa d data cente envi onment and ecommended
to be placed in indust ial data cente .
Particulate contamination
Attention: Ai bo ne pa ticulates (including metal flakes o pa ticles) and eactive gases acting alone o in
combination with othe envi onmental facto s such as humidity o tempe atu e might pose a isk to the
device that is desc ibed in this document.
6ThinkSystem SR860 V2 Maintenance Manual

Risks that a e posed by the p esence of excessive pa ticulate levels o concent ations of ha mful gases
include damage that might cause the device to malfunction o cease functioning altogethe . This
specification sets fo th limits fo pa ticulates and gases that a e intended to avoid such damage. The limits
must not be viewed o used as definitive limits, because nume ous othe facto s, such as tempe atu e o
moistu e content of the ai , can influence the impact of pa ticulates o envi onmental co osives and gaseous
contaminant t ansfe . In the absence of specific limits that a e set fo th in this document, you must
implement p actices that maintain pa ticulate and gas levels that a e consistent with the p otection of human
health and safety. If Lenovo dete mines that the levels of pa ticulates o gases in you envi onment have
caused damage to the device, Lenovo may condition p ovision of epai o eplacement of devices o pa ts
on implementation of app op iate emedial measu es to mitigate such envi onmental contamination.
Implementation of such emedial measu es is a custome esponsibility.
Table 2. Limits for articulates and gases
Contaminant Limits
Reactive gases Seve ity level G1 as pe ANSI/ISA 71.04-19851:
• The coppe eactivity level shall be less than 200 Angst oms pe month (Å/month ≈ 0.0035 μg/
cm2-hou weight gain).2
• The silve eactivity level shall be less than 200 Angst oms pe month (Å/month ≈ 0.0035 μg/
cm2-hou weight gain).3
• The eactive monito ing of gaseous co osivity must be conducted app oximately 5 cm (2 in.) in
f ont of the ack on the ai inlet side at one-qua te and th ee-qua te f ame height off the floo
o whe e the ai velocity is much highe .
Ai bo ne
pa ticulates Data cente s must meet the cleanliness level of ISO 14644-1 class 8.
Fo data cente s without ai side economize , the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filt ation methods:
• The oom ai might be continuously filte ed with MERV 8 filte s.
• Ai ente ing a data cente might be filte ed with MERV 11 o p efe ably MERV 13 filte s.
Fo data cente s with ai side economize s, the choice of filte s to achieve ISO class 8 cleanliness
depends on the specific conditions p esent at that data cente .
• The deliquescent elative humidity of the pa ticulate contamination should be mo e than 60%
RH.4
• Data cente s must be f ee of zinc whiske s.5
1 ANSI/ISA-71.04-1985. Environmental conditions for rocess measurement and control systems: Airborne
contaminants. Inst ument Society of Ame ica, Resea ch T iangle Pa k, No th Ca olina, U.S.A.
2 The de ivation of the equivalence between the ate of coppe co osion g owth in the thickness of the co osion
p oduct in Å/month and the ate of weight gain assumes that Cu2S and Cu2O g ow in equal p opo tions.
3 The de ivation of the equivalence between the ate of silve co osion g owth in the thickness of the co osion
p oduct in Å/month and the ate of weight gain assumes that Ag2S is the only co osion p oduct.
4 The deliquescent elative humidity of pa ticulate contamination is the elative humidity at which the dust abso bs
enough wate to become wet and p omote ionic conduction.
5 Su face deb is is andomly collected f om 10 a eas of the data cente on a 1.5 cm diamete disk of sticky
elect ically conductive tape on a metal stub. If examination of the sticky tape in a scanning elect on mic oscope
eveals no zinc whiske s, the data cente is conside ed f ee of zinc whiske s.
Firmware updates
Seve al options a e available to update the fi mwa e fo the se ve .
Chapte 1.Int oduction 7

You can use the tools listed he e to update the most cu ent fi mwa e fo you se ve and the devices that a e
installed in the se ve .
• Best p actices elated to updating fi mwa e is available at the following site:
– http://lenovop ess.com/LP0656
• The latest fi mwa e can be found at the following site:
– http://datacente suppo t.lenovo.com/p oducts/se ve s/thinksystem/s 860v2/downloads
• You can subsc ibe to p oduct notification to stay up to date on fi mwa e updates:
– https://datacente suppo t.lenovo.com/tw/en/solutions/ht509500
UpdateXpress System Packs (UXSPs)
Lenovo typically eleases fi mwa e in bundles called UpdateXp ess System Packs (UXSPs). To ensu e that all
of the fi mwa e updates a e compatible, you should update all fi mwa e at the same time. If you a e updating
fi mwa e fo both the Lenovo XCla ity Cont olle and UEFI, update the fi mwa e fo Lenovo XCla ity Cont olle
fi st.
Update method terminology
• In-band update. The installation o update is pe fo med using a tool o application within an ope ating
system that is executing on the se ve ’s co e CPU.
• Out-of-band update. The installation o update is pe fo med by the Lenovo XCla ity Cont olle collecting
the update and then di ecting the update to the ta get subsystem o device. Out-of-band updates have no
dependency on an ope ating system executing on the co e CPU. Howeve , most out-of-band ope ations
do equi e the se ve to be in the S0 (Wo king) powe state.
• On-Target update The installation o update is initiated f om an installed ope ating system executing on
the ta get se ve itself.
• Off-Target update The installation o update is initiated f om a computing device inte acting di ectly with
the se ve ’s Lenovo XCla ity Cont olle .
• UpdateXpress System Packs (UXSPs). UXSPs a e bundled updates designed and tested to p ovide the
inte dependent level of functionality, pe fo mance, and compatibility. UXSPs a e se ve machine-type
specific and a e built (with fi mwa e and device d ive updates) to suppo t specific Windows Se ve , Red
Hat Ente p ise Linux (RHEL) and SUSE Linux Ente p ise Se ve (SLES) ope ating system dist ibutions.
Machine-type-specific fi mwa e-only UXSPs a e also available.
Firmware updating tools
See the following table to dete mine the best Lenovo tool to use fo installing and setting up the fi mwa e:
Tool Update
Methods
Supported
Core
System
Firmware
Updates
I/O Devices
Firmware
Updates
Graphical
user
interface
Command
line
interface
Supports
UXSPs
Lenovo XClarity
Provisioning Manager
(LXPM)
In-band2
On-Ta get
√ √
Lenovo XClarity
Controller
(XCC)
Out-of-band
Off-Ta get
√Selected I/O
devices
√
8ThinkSystem SR860 V2 Maintenance Manual

Tool Update
Methods
Supported
Core
System
Firmware
Updates
I/O Devices
Firmware
Updates
Graphical
user
interface
Command
line
interface
Supports
UXSPs
Lenovo XClarity
Essentials OneCLI
(OneCLI)
In-band
Out-of-band
On-Ta get
Off-Ta get
√All I/O
devices
√ √
Lenovo XClarity
Essentials
UpdateXpress
(LXCE)
In-band
Out-of-band
On-Ta get
Off-Ta get
√All I/O
devices
√ √
Lenovo XClarity
Essentials Bootable
Media Creator
(BoMC)
In-band
Out-of-band
Off-Ta get
√All I/O
devices
√
(BoMC
application)
√
(BoMC
application)
√
Lenovo XClarity
Administrator
(LXCA)
In-band1
Out-of-
band2
Off-Ta get
√All I/O
devices
√ √
Lenovo XClarity
Integrator (LXCI) for
VMware vCenter
Out-of-band
Off-Ta get
√Selected I/O
devices
√
Lenovo XClarity
Integrator (LXCI) for
Microsoft Windows
Admin Center
In-band
Out-of-band
On-Ta get
Off-Ta get
√All I/O
devices
√ √
Lenovo XClarity
Integrator (LXCI) for
Microsoft System
Center Configuration
Manager
In-band
On-Ta get
√All I/O
devices
√ √
Notes:
1. Fo I/O fi mwa e updates.
2. Fo BMC and UEFI fi mwa e updates.
• Lenovo XClarity Provisioning Manager
F om Lenovo XCla ity P ovisioning Manage , you can update the Lenovo XCla ity Cont olle fi mwa e, the
UEFI fi mwa e, and the Lenovo XCla ity P ovisioning Manage softwa e.
Chapte 1.Int oduction 9

Note: By default, the Lenovo XCla ity P ovisioning Manage G aphical Use Inte face is displayed when
you sta t the se ve and p ess the key specified in the on-sc een inst uctions. If you have changed that
default to be the text-based system setup, you can b ing up the G aphical Use Inte face f om the text-
based system setup inte face.
Fo additional info mation about using Lenovo XCla ity P ovisioning Manage to update fi mwa e, see:
“Fi mwa e Update” section in the LXPM documentation compatible with you se ve at https://
pubs.lenovo.com/lxpm-ove view/
Important: Lenovo XCla ity P ovisioning Manage (LXPM) suppo ted ve sion va ies by p oduct. All
ve sions of Lenovo XCla ity P ovisioning Manage a e efe ed to as Lenovo XCla ity P ovisioning Manage
and LXPM in this document, unless specified othe wise. To see the LXPM ve sion suppo ted by you
se ve , go to https://pubs.lenovo.com/lxpm-ove view/.
• Lenovo XClarity Controller
If you need to install a specific update, you can use the Lenovo XCla ity Cont olle inte face fo a specific
se ve .
Notes:
– To pe fo m an in-band update th ough Windows o Linux, the ope ating system d ive must be installed
and the Ethe net-ove -USB (sometimes called LAN ove USB) inte face must be enabled.
Fo additional info mation about configu ing Ethe net ove USB, see:
“Configu ing Ethe net ove USB” section in the XCC documentation ve sion compatible with you
se ve at https://pubs.lenovo.com/lxcc-ove view/
– If you update fi mwa e th ough the Lenovo XCla ity Cont olle , make su e that you have downloaded
and installed the latest device d ive s fo the ope ating system that is unning on the se ve .
Fo additional info mation about using Lenovo XCla ity Cont olle to update fi mwa e, see:
“Updating Se ve Fi mwa e” section in the XCC documentation compatible with you se ve at https://
pubs.lenovo.com/lxcc-ove view/
Important: Lenovo XCla ity Cont olle (XCC) suppo ted ve sion va ies by p oduct. All ve sions of Lenovo
XCla ity Cont olle a e efe ed to as Lenovo XCla ity Cont olle and XCC in this document, unless
specified othe wise. To see the XCC ve sion suppo ted by you se ve , go to https://pubs.lenovo.com/lxcc-
ove view/.
• Lenovo XClarity Essentials OneCLI
Lenovo XCla ity Essentials OneCLI is a collection of command line applications that can be used to
manage Lenovo se ve s. Its update application can be used to update fi mwa e and device d ive s fo
you se ve s. The update can be pe fo med within the host ope ating system of the se ve (in-band) o
emotely th ough the BMC of the se ve (out-of-band).
Fo additional info mation about using Lenovo XCla ity Essentials OneCLI to update fi mwa e, see:
https://pubs.lenovo.com/lxce-onecli/onecli_c_update
• Lenovo XClarity Essentials UpdateXpress
Lenovo XCla ity Essentials UpdateXp ess p ovides most of OneCLI update functions th ough a g aphical
use inte face (GUI). It can be used to acqui e and deploy UpdateXp ess System Pack (UXSP) update
packages and individual updates. UpdateXp ess System Packs contain fi mwa e and device d ive
updates fo Mic osoft Windows and fo Linux.
You can obtain Lenovo XCla ity Essentials UpdateXp ess f om the following location:
https://datacente suppo t.lenovo.com/solutions/lnvo-xp ess
10 ThinkSystem SR860 V2 Maintenance Manual

• Lenovo XClarity Essentials Bootable Media Creator
You can use Lenovo XCla ity Essentials Bootable Media C eato to c eate bootable media that is suitable
fo fi mwa e updates, VPD updates, invento y and FFDC collection, advanced system configu ation, FoD
Keys management, secu e e ase, RAID configu ation, and diagnostics on suppo ted se ve s.
You can obtain Lenovo XCla ity Essentials BoMC f om the following location:
https://datacente suppo t.lenovo.com/solutions/lnvo-bomc
• Lenovo XClarity Administrator
If you a e managing multiple se ve s using the Lenovo XCla ity Administ ato , you can update fi mwa e fo
all managed se ve s th ough that inte face. Fi mwa e management is simplified by assigning fi mwa e-
compliance policies to managed endpoints. When you c eate and assign a compliance policy to managed
endpoints, Lenovo XCla ity Administ ato monito s changes to the invento y fo those endpoints and flags
any endpoints that a e out of compliance.
Fo additional info mation about using Lenovo XCla ity Administ ato to update fi mwa e, see:
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.lxca.doc/update_fw.html
• Lenovo XClarity Integrator offerings
Lenovo XCla ity Integ ato offe ings can integ ate management featu es of Lenovo XCla ity Administ ato
and you se ve with softwa e used in a ce tain deployment inf ast uctu e, such as VMwa e vCente ,
Mic osoft Admin Cente , o Mic osoft System Cente .
Fo additional info mation about using Lenovo XCla ity Integ ato to update fi mwa e, see:
https://pubs.lenovo.com/lxci-ove view/
Tech Tips
Lenovo continually updates the suppo t website with the latest tips and techniques that you can use to solve
issues that you se ve might encounte . These Tech Tips (also called etain tips o se vice bulletins) p ovide
p ocedu es to wo k a ound issues o solve p oblems elated to the ope ation of you se ve .
To find the Tech Tips available fo you se ve :
1. Go to http://datacente suppo t.lenovo.com and navigate to the suppo t page fo you se ve .
2. Click on How To’s f om the navigation pane.
3. Click Article Type ➙ Solution f om the d op-down menu.
Follow the on-sc een inst uctions to choose the catego y fo the p oblem that you a e having.
Security advisories
Lenovo is committed to developing p oducts and se vices that adhe e to the highest secu ity standa ds in
o de to p otect ou custome s and thei data. When potential vulne abilities a e epo ted, it is the
esponsibility of the Lenovo P oduct Secu ity Incident Response Team (PSIRT) to investigate and p ovide
info mation to ou custome s so they may put mitigation plans in place as we wo k towa d p oviding
solutions.
The list of cu ent adviso ies is available at the following site:
https://datacente suppo t.lenovo.com/p oduct_secu ity/home
Chapte 1.Int oduction 11

Power on the server
Afte the se ve pe fo ms a sho t self-test (powe status LED flashes quickly) when connected to input powe ,
it ente s a standby state (powe status LED flashes once pe second).
The se ve can be tu ned on (powe LED on) in any of the following ways:
• You can p ess the powe button.
• The se ve can esta t automatically afte a powe inte uption.
• The se ve can espond to emote powe -on equests sent to the Lenovo XCla ity Cont olle .
Fo info mation about powe ing off the se ve , see “Powe off the se ve ” on page 12.
Power off the server
The se ve emains in a standby state when it is connected to a powe sou ce, allowing the Lenovo XCla ity
Cont olle to espond to emote powe -on equests. To emove all powe f om the se ve (powe status LED
off), you must disconnect all powe cables.
To place the se ve in a standby state (powe status LED flashes once pe second):
Note: The Lenovo XCla ity Cont olle can place the se ve in a standby state as an automatic esponse to a
c itical system failu e.
• Sta t an o de ly shutdown using the ope ating system (if suppo ted by you ope ating system).
• P ess the powe button to sta t an o de ly shutdown (if suppo ted by you ope ating system).
• P ess and hold the powe button fo mo e than 4 seconds to fo ce a shutdown.
When in a standby state, the se ve can espond to emote powe -on equests sent to the Lenovo XCla ity
Cont olle . Fo info mation about powe ing on the se ve , see “Powe on the se ve ” on page 12.
12 ThinkSystem SR860 V2 Maintenance Manual