LG GS107 User manual

Service Manual Model : GS107
Internal Use Only
Service Manual
GS107
Date: February, 2010 / Issue 1.0

- 3 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION.................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE..................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF............................................16
3.1 Digital Main Processor................................................................16
3.2 Power Management....................................................................20
3.3 FEM with integrated Power Amplifier Module.................32
3.4 Crystal(26 MHz, X102).................................................................34
3.5 RF Subsystem of PMB8810 (U101).........................................34
3.6 MEMORY(K5N3217ATA-AT80, U102 ) ...................................38
3.7 SIM Card Interface........................................................................40
3.8 LCD Interface..................................................................................41
3.9 Battery Charger Interface..........................................................43
3.10 Keypad Interface........................................................................44
3.11 Audio Front-End.........................................................................46
3.12 KEY BACLKLIGHT LED Interface............................................52
3.13 Vibrator Interface .......................................................................53
4. TROUBLE SHOOTING ......................................55
4.1 RF Component...............................................................................55
4.2 RX Trouble .......................................................................................56
4.3 TX Trouble........................................................................................60
4.4 Power On Trouble.........................................................................64
4.5 Charging Trouble..........................................................................67
4.6 Vibrator Trouble.............................................................................69
4.7 LCD Trouble.....................................................................................71
4.8 Speaker Trouble ............................................................................75
4.9 Earphone Trouble.........................................................................78
4.10 Microphone Trouble.................................................................81
4.11 SIM Card Interface Trouble.....................................................83
4.12 KEY backlight Trouble ..............................................................85
4.13 FM Radio Trouble .......................................................................87
5. DOWNLOAD.....................................................89
5.1 S/W Download...............................................................................89
5.2 Download program user guide..............................................90
5.3 Multi-Download Program Setting (Model-Base).............91
6. BLOCK DIAGRAM.............................................93
7. CIRCUIT DIAGRAM ..........................................95
8. BGA Pin Map....................................................99
9. PCB LAYOUT...................................................101
10.ENGINEERING MODE...................................103
11. AUTO CALIBRATION....................................104
11.1 Overview .................................................................................... 104
11.2 Configuration of HotKimchi ............................................... 104
11.3 Description of Basic File ....................................................... 105
11.4 Procedure................................................................................... 106
11.5 AGC............................................................................................... 109
11.6 APC ............................................................................................... 109
11.7 ADC............................................................................................... 109
11.8 Target Power ............................................................................. 109
12. EXPLODED VIEW & REPLACEMENT
PART LIST ....................................................111
12.1 EXPLODED VIEW...................................................................... 111
12.2 Replacement Parts.................................................................. 113
12.3 Accessory ................................................................................... 125

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 5 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
[VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent unauthorized
use. The manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to
it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
\VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION

- 7 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
]VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

- 8 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
^VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

- 9 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
8/140 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
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- 10 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
`VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
2. SYSTEM SPECIFICATION
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI 32 poly
Item Feature Comment
Camera Not Support
FM Radio 87~108MHz supported

- 11 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
XWVX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
2.2 Technical Specification
Item Description Specification
1 Frequency Band
EGSM
TX: 880 ~ 915MHz
RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
GSM850/EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB
2. SYSTEM SPECIFICATION

- 12 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
XXVX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification
2. SYSTEM SPECIFICATION

- 13 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
XYVX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 13·4 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2·3 dB
DCS/PCS
2. SYSTEM SPECIFICATION

- 14 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
13/140 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
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- 15 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
14/140 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
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

- 16 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
X\VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 110 Hardware Block Diagram
3. TECHNICAL BRIEF
X\VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 110 Hardware Block Diagram
3. TECHNICAL BRIEF
X\VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 110 Hardware Block Diagram
3. TECHNICAL BRIEF

- 17 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
X]VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
3.1.1 General
Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– WFWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.1.3 Baseband
• High performance fixed-point TEAKlite DSP
• C166S-V2 high performance microcontroller with a 16KB Instruction Cache and a Data cache Buffer.
• FM Stereo Radio Receiver with RDS
• There are several Interfaces:
– I2S interface for DAI connections (for Tape Approval) and external Audio component
connection.
– High Speed SSC Interface for connection of companion chips (like Serial SD Cards)
– High Speed SSC Interface dedicated to Display control
– USIM Interface with support of Protocol T=1 and Dual USIM support.
– Keypad Interface (6x4 or 5x5 keys)
– External Memory Controller (EBU) for external RAM/NOR FLASH/Busrt Flash/NAND
Flash/Serial Flash
(SPI/SQI) and Parallel Display connection
– Asynchronous serial interface.
– Asynchronous serial interface for WLAN/BT/GPS control (incl. IrDA support capability) .
– JTAG Interface, OCDS, Multi-Core Debug and Real Time Trace facilities.
– Black & white and 128x160 - 16bit color displays are supported
– PWM source to drive vibrator
– Keypad and display backlight supported.
– HASH Unit support for hashing.

- 18 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
X^VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
Crystal Oscillator
• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic
Mixed Signal and Power Management Unit
• Embedded stepdown converter (1.8V)
• DC/DC boost for voltages up to 15 V for driving White or Blue LEDs
• 8-ȳloud speaker driver (700 mW)
• 16-ȳearpiece driver
• 32-ȳheadset driver
• Measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient temperature)
• Accessory Detection
• PCB ID detection as part of measurement interface.
• Differential microphone input
• System start up circuitry
• Charger circuitry for NiCd, NiMh and LiIon cells with integrated Control Current/Voltage Charging.
• Integrated regulators for direct connection to battery.
C166S-V2 Buses
The C166S-V2 is connected to four buses:
1. IMB (Internal Program) bus (64b - 0 cycle instruction bus))
2. DPMI (Data-Program) Bus (16b - 0 cycle data bus)
3. X-Bus (16b - 3 cycle peripheral bus)
4. PD-Bus (16b 0 cycle peripheral bus)
Bus Interconnections
The interconnection between the X-Bus and the TEAKlite Bus uses:
• Multicore Synchronization
• Shared Memory.

- 19 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
X_VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
3.1.4 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 ɆV EMF
– Support for US & EU bands
– Stereo recording
3.1.5 Display
• Type
– 128*128, QQVGA, 65k color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap fonts)

- 20 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
X`VX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated in the
integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard
phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 110
3. TECHNICAL BRIEF
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8 V supply rail. This voltage rail is used to supply main parts of the
system, like the digital core of the chip (via LDO LCORE), parts of the mixed signal macro, parts of the RF
macro and the external memory if a 1.8V memory is used.

- 21 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
YWVX[W ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ
3. TECHNICAL BRIEF
Linear voltage Regulators (low dropout) LDOs
The LDOs are used to generate the supply for the different supply domains not directly supplied out of the
DC/DC converter.
LCORE
The LCORE LDO provides the VCORE supply used for most of the digital parts of the chip
LPMU
The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC,
sense amplifier etc.
LAUX
The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the
phone application, e.g. for the display or Camera.
LSIM
The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM
cards.
Other LDOs
The RF module has implemented several LDO’s for different RF Power domain.
The mixed signal module has some LDO’s for the audio driver and microphone supply.