LG InTouch Lady User manual
Service Manual Model : LG-C320
Internal Use Only
Service Manual
LG-C320
Date: October, 2010 / Issue 1.0
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 Product Name.................................................................................. 9
2.2 Supporting Standard .................................................................... 9
2.3 Main Parts : GSM Solution........................................................... 9
2.4 HW Features....................................................................................10
2.5 SW Features ....................................................................................12
2.6 HW SPEC. .........................................................................................14
2.7 C320 Figures...................................................................................15
3. TECHNICAL BRIEF.............................................................16
3.1 General Description.....................................................................16
3.2 Power management....................................................................28
3.3 SUB SYSTEM....................................................................................32
3.4 General Description (RF Part) ..................................................40
3.5 GSM MODE......................................................................................41
3.6 OFF-CHIP RF COMPONENTS ....................................................44
3.7 OFF-CHIP COMPONENTS ..........................................................46
4. TROUBLE SHOOTING .......................................................50
4.1 Power ON Troubleshooting......................................................50
4.2 Charger Troubleshooting..........................................................52
4.3 USB Troubleshooting..................................................................54
4.4 USIM Detect Troubleshooting.................................................56
4.5 Camera Troubleshooting...........................................................58
4.6 Main side view LED Troubleshooting...................................60
4.7 Slide Key side view LED Troubleshooting...........................61
4.8 LCD Troubleshooting..................................................................63
4.9 Vibrator Troubleshooting..........................................................65
4.10 Receiver Path ...............................................................................67
4.11 Headset path ...............................................................................70
4.12 Speaker/Speaker Phone path...............................................73
4.13 Main microphone ......................................................................78
4.14 Headset microphone................................................................80
4.15 RF Component............................................................................82
4.16 RF Path............................................................................................83
4.17 Trouble Shooting of GSM Part ..............................................84
4.18 Checking Bluetooth Block......................................................91
4.19 Checking FM Radio Block.......................................................96
5. DOWNLOAD......................................................................99
6. BLOCK DIAGRAM........................................................... 112
7. CIRCUIT DIAGRAM ........................................................ 123
8. BGA Pin Map.................................................................. 137
9. PCB LAYOUT................................................................... 143
10. RF CALIBRATION ......................................................... 149
10.1 Usage of Tachyon for RF Calibration and Test ............. 149
11. TEST ALONE ................................................................. 152
11.1 Phone Test Mode..................................................................... 152
12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157
11.1 EXPLODED VIEW...................................................................... 157
11.2 Replacement Parts.................................................................. 159
11.3 Accessory ................................................................................... 175
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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
Introduction
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common carrier telecommunication service of facilities accessed through or connected
to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
G
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following
information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ 6/140
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ 7/140
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
3
2.1 Product Name
C320 : EGSM/GSM850/DCS/PCS
(GPRS Class 12 / EDGE Class 12)
2.2 Supporting Standard
Item Feature Comment
Supporting Standard EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit : Class 1, 2, 3, C-E
Frequency Range EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX : 824 – 849 MHz
GSM850 RX : 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
DCS1800 RX : 1805 – 1880 MHz
PCS1900 TX : 1850 – 1910 MHz
PCS1900 RX : 1930 – 1990 MHz
Application Standard WAP 2.0, JAVA 2.0
2.3 Main Parts : GSM Solution
Item Part Name Comment
Digital Baseband ESC6270 : Qualcomm
Analog Baseband ESC6270 : Qualcomm
RF Chip ESC6270 : Qualcomm
Phase 2+(include AMR)
SIM Toolkit : Class 1, 2, 3, C-E
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2. PERFORMANCE
4
2.4 HW Features
Item Feature Comment
Form Factor Slide type
1) Capacity
Standard : Li-Ion, 900 mAh
Battery
2) Packing Type : Soft Pack
Size Standard : 91 x 63 x 15.9 mm
Weight 115.6g With Battery
Volume TBD
PCB Stag type, 10 Layers , 0.8t
Stand by time Up to 300 hrs @ Paging Period 5
Charging time Up to 3 hrs @
Talk time 2G Up to 3.4hr @ Tx=Max(2G)
RX sensitivity EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm
GSM/
GPRS
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE GSM 900 : 27 dBm
GSM 850 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (GSM850)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
SIM card type Plug-In SIM
3V /1.8V
Display 2.4”TFT QVGA landscape
Built-in Camera 2M FF SOC Camera
Status Indicator Yes
Keypad
ANT Main : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory NAND Flash : 2Gbit
SDRAM : 1Gbit
Speech coding FR, EFR, HR,AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
BlueTooth V2.1 + EDR
MIDI(for Buzzer
Function)
SW Decoded 64Poly
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Copyright © 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
5
Music Player MP3/AAC/AAC+/WMA
Video Player PEG4, H.263,H.264 30fps@QVGA
WMV 15fps@QCIF
Camcorder MPEG4, 15fps@QVGA
Voice Recording Yes
Speaker Phone mode
Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory)
Yes
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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
6
2.5 SW Features
Item Feature Comment
RSSI 0 ~ 7 Levels
Battery Charging 0 ~ 3 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 20 Level
Time / Date Display Yes
Multi-Language Yes English / Chinese Trad. / Chinese Simp.
/ Thai / Korean / Malay / Indonesian /
Vietnamese
Quick Access Mode Dialing / Contact / Menu /
Message / Camera
PC Sync Yes PC suite 4
Speed Dial Yes Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book Name + 5 Numbers + 1 Memo + 2
e-mail + 3 Group Select + Picture +
Ringtone + Anniversary day
1000 + SIM
Last Dial Number Yes Total Call DB Max 100
LDN (SIM) N/A
Last Received
Number
Yes Total Call DB Max 100
LDN (SIM) N/A
Last Missed Number Yes Total Call DB Max 100
LDN (SIM) N/A
Search by Number
/ Name
Name and Number
Group Yes 30
Fixed Dial Number Yes
Service Dial Number No
Own Number Yes Read only
(add/edit/delete are not supported)
Voice Memo Yes Support voice recorder
Call Reminder Yes
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS) Yes (1000+SIM) EMS : Release4
(Except Text align)
SMS Over GPRS Yes
EMS Melody / Picture
Send / Receive / Save
Yes
(Receive only)
MMS MPEG4
Send / Receive / Save
Yes
Long Message MAX 1000 Characters SMS 7pages
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Copyright © 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
7
Cell Broadcast Yes
Download Over the WAP
Game Yes
Calendar Yes
Memo Yes 100
World Clock Yes
Unit Convert Yes
Stop Watch Yes
Wall Paper Yes
WAP Browser Over WAP 2.0 Obigo
Download Melody /
Wallpaper
Yes Over WAP
SIM Lock Yes Operator Dependent
SIM Toolkit Yes R99
MMS Yes Obigo +LG MMS Client
EONS No
CPHS Yes V4.2
ENS No
Camera Yes 2M FF
JAVA Yes CLDC V1.1 / MIDP V2.1
Download Over WAP
Voice Dial No
IrDa No
Bluetooth Yes BT 2.1+EDR
HFP/HSP/A2DP&AVRCP
/OPP/BPP/PBAP/SPP/
FM radio Yes
GPRS Yes Class 12
EDGE Yes Class 12
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad Yes
TTY No
AMR Yes
SyncML No
IM Yes JAVA midlet (neustar)
Email Yes
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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
8
2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to less
than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the edge
of the transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech
channels
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
TGSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
- 15 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
9
2.7 C320 Figures
- 16 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
2. Base Band Technical Description
3.1 General Description
QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1
Figure 3.1 QSC6270(3G disable) Base band block
- 17 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.1 Processor
The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two
DSP processors. Each processor is part of a functional subsystem:
The micro subsystem includes the ARM926EJ-S microprocessor.
The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).
The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).
Figure 3.1.1 Processors and bus architecture
- 18 -
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3. TECHNICAL BRIEF
3.1.2 Memory support (and LCD interface)
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile
DDR SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This
interface supports the high-bandwidth, high-density, and low-latency requirements of the QSC’s
advanced on-chip capabilities such as the ARM9 processor, highperformance graphics, and video
applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and
asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or
broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst
AAD NOR flash to enable a NOR/DDR SDRAM memory configuration because the simultaneous mode
(NOR, SDRAM) is not supported on the EBI1 bus.
The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst
techniques of four or eight 32-bit words when the memory region is declared to be
cacheable/bufferable. To take advantage of this QSC higher performance feature, data from
memories must satisfy the requirements for these burst accesses.
Figure 3.1.2.1 The memory control blocks of C320
QSC6270
NAND Flash
(1Gbit)
SDRAM
512Mbit)
NAND_DATA[ 0: 15]
NAND__CS__N
NAND_LB_N
NAND_UB_N
NAND_OE_N
NAND_WE_N
NAND_BSY_N
NAND_WP_N
_CE
ALE
CLE
_RE
_WE
RY_BY
_WP
IO[1: 16]
DDR_A[0:13]
DDR_M_CLK_N
DDR_CKE[0]_
DDR_CS[0]_N_
DDR_RAS_N
DDR_CAS_N
DDR_WE_N_ _
DDR_DQM[0:1]_
DDR_D[0:15]
CLK
CKE
_CS
_RAS
_CAS
_WED
DQM
ADDR
DQ
EBI1 EBI2
(3G disable)
USIM
(SIM PLUS)
SIM_CLK
_ _
SIM_DATA
MUSIM_DM
MUSIM_DP
SIM_RST_N
External
Memory
( MICRO SD)
MSD_D[0:3]
MSD_CMD
MSD_CLK
3.1.2 Memory support (and LCD interface)
The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR
SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports
the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities such
as the ARM9 processor, highperformance graphics, and video applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous
SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only).
In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM memory
configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.
The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst
techniques of four or eight 32-bit words when the memory region is declared to be cacheable/bufferable. To take
advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these
burst accesses.
- 19 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
QSC6270
(3G disable)
QVGA Main
LCD
(2.4", 320x240)
EBI2_DATA[15:0]
LCD_ADS
LCD_CS_N
EBI2_WE_N
LCD_RST
LDO_LCD_2.8V
WLED_PWR
LCD_IF(2:1)
LDO_LCD_1.8V
Figure 3.1.2.2 The LCD interfaces of C320
- 20 -
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3. TECHNICAL BRIEF
3.1.3 Connectivity
QSC6270 has connectivity features as below
– USB-OTG; USB LS, FS, and HS (2.0 compliant)
– I2C compatible for peripheral controls (1.8 V)
– UART: up to 4 Mbps
– Bluetooth 2.0 support via external SoC
– WLAN via external device (SDIO)
– NFC via external module (I2C)
– FM radio via external module (I2C)
– USIM, SIM, and USB-UICC support; 1.8 and 3 V
– Keypad interface
– SPI (master only) for peripheral support
– Two secure digital controllers — WLAN and secure digital (SD) cards
Figure 3.1.3 The connectivity of BL20
QSC6270
- 21 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
Figure 3.1.4 GPIOs of C320
3.1.4 GPIOs
QSC6270 (3G disable has 78 configurable I/O pins
UART_BT_SEL
MUIC_INT_N
CHG_EN_N
BT_WAKEUP_HOST
CHG_STS_N
HALL_SENS_DET
MUIC_AUD_FM_I2C_SCL
MUIC_AUD_FM_I2C_SDA
BL_LCD_CAM_LDO_I2C_SCL
HS_JACK_DET
WLAN_BT_REG_ON
WLAN_CLK
LCD_IF_MODE[0]
BL_LCD_CAM_LDO_I2C_SDA
WLAN_RST_N
BL_LCD_CAM_LDO_EN
BT_RST_N
WLAN_CMD
LCD_RST_N
WLAN_SDIO[3]
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
BT_PWR_ON
MUSIM_DM
MUSIM_DP
Low : UART Comm
High : BT UART
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