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1. Introduction ..................................... 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. General Performance...................... 9
2.1 Product Name ......................................... 9
2.2 Supporting Standard............................... 9
2.3 Main Parts............................................... 9
2.4 H/W Features........................................ 10
2.5 S/W Features ........................................ 12
3. H/W Circuit Description................ 14
3.1. General Description ............................. 14
3.2. Receiver Part ....................................... 14
3.3. Transmitter Part ................................... 17
3.4. Digital Baseband (DBB) Processor...... 21
3.5. Analog Baseband (ABB) Processor..... 26
4. TROUBLE SHOOTING .................. 45
4.1. Main Components Placement.............. 45
4.2. FPCB Components Placement ............ 46
4.3. Baseband Components ....................... 46
4.4 Main Components (Description) ........... 47
4.5. Power On Trouble................................ 48
4.6. Charging Trouble ................................. 49
4.7. LCD Display Trouble............................ 51
4.8. Receiver Trouble.................................. 53
4.9. Microphone Trouble ............................. 57
4.10. Vibrator Trouble ................................. 59
4.11. Keypad Backlight Trouble.................. 60
4.12 FOLDER Open/Close Trouble ............ 62
4.13. SIM Detect Trouble ............................ 64
4.14. Earphone Trouble .............................. 66
5. DOWNLOAD .................................. 85
5.1. Download Setup................................... 85
5.2. Download Procedure ........................... 86
6. SERVICE AND CALIBRATION...... 93
6.1. Service S/W ......................................... 93
6.2. Calibration............................................ 96
7. BLOCK DIAGRAM ....................... 100
8. CIRCUIT DIAGRAM ..................... 103
9. PCB LAYOUT ............................... 107
10. ENGINEERING MODE ............... 109
11. STANDALONE TEST ................. 110
11.1 Setting Method.................................. 110
Table of Contents