M-system R3-ND1 User manual

5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 1 / 6
INSTRUCTION MANUAL
DeviceNet INTERFACE MODULE
(for 16-point analog signals) MODEL R3-ND1
BEFORE USE ....
Thank you for choosing M-System. Before use, please check
contents of the package you received as outlined below.
If you have any problems or questions with the product,
please contact M-System’s Sales Office or representatives.
■PACKAGE INCLUDES:
Network interface module ............................................... (1)
■MODEL NO.
Confirm that the model number described on the product is
exactly what you ordered.
■INSTRUCTION MANUAL
This manual describes necessary points of caution when
you use this product, including installation, connection and
basic maintenance procedures.
■EDS FILE
EDS files are downloadable at M-System’s web site:
http://www.m-system.co.jp
POINTS OF CAUTION
■CONFORMITY WITH EU DIRECTIVES
• The equipment must be mounted inside the instrument
panel of a metal enclosure.
• The actual installation environments such as panel con-
figurations, connected devices and connected wires may
affect the protection level of this unit when it is integrat-
ed in a panel system. The user may have to review the CE
requirements in regard to the whole system and employ
additional protective measures to ensure CE conformity.
■HOT INSERTION/REMOVAL OF MODULES
• It is possible to replace the module with the power is sup-
plied. Be sure to replace it when the module is not com-
municating with a host, as it is possible to affect the sys-
tem. However, replacing multiple modules at once may
greatly change line voltage levels. We recommend that
you replace them one by one.
■POWER INPUT RATINGS
• Operational range & power consumption: Check the pow-
er rating for the unit on the specification label.
Rating 100 – 120V AC: 85 – 132V, 47 – 66 Hz, approx. 20VA
Rating 200 – 240V AC: 170 – 264V, 47 – 66 Hz, approx. 20VA
Rating 24V DC: 24V ±10%, approx. 12W
■ENVIRONMENT
• Indoor use
• When heavy dust or metal particles are present in the
air, install the unit inside proper housing with sufficient
ventilation.
• Do not install the unit where it is subjected to continuous
vibration. Do not subject the unit to physical impact.
• Environmental temperature must be within -10 to +55°C
(14 to 131°F) with relative humidity within 30 to 90% RH
in order to ensure adequate life span and operation.
■WIRING
• Do not install cables close to noise sources (relay drive
cable, high frequency line, etc.).
• Do not bind these cables together with those in which
noises are present. Do not install them in the same duct.
■AND ....
• The unit is designed to function as soon as power is sup-
plied, however, a warm up for 10 minutes is required for
satisfying complete performance described in the data
sheet.
INSTALLATION
Use the Installation Base Model R3-BS, or Model R3-BSW
for free I/O address capability.
Before mounting the Network Interface Module onto the
Base, be sure to configure the module as explained below.
■DATA ALLOCATION
The setting determines the data area size assigned to each
I/O module mounted on the base.
The data sent/received via DeviceNet is mapped according
to this setting.
See “COMPONENT IDENTIFICATION”.
■NODE ADDRESS & BAUD RATE
See “COMPONENT IDENTIFICATION”.
■NETWORK SLOTS ON THE BASE
I/O 1 I/O 2 I/O n
With Model R3-BS base, mount the I/O Modules from the
left end (I/O 1) to the right in order that the Network Mod-
ule assigns data areas from I/O 1.
Network Module(s) and Power Module are mounted basi-
cally at the right end though technically they could be
mounted in any position.
With Model R3-BSW base, there is no limitation in mount-
ing positions as I/O address can be assigned freely to each
module using rotary switches equipped on the base.

R3-ND1
5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 2 / 6
COMPONENT IDENTIFICATION
MS Indicator LED
NS Indicator LED
SW2
ON
8
7
6
5
4
3
2
1
SW3
ON
4
3
2
1
ON
8
7
6
5
4
3
2
1
SW1
1
2
3
4
5
6
Configuration Jack
7
8
6
5
4
3
2
1
ON
Baud Rate
Setting
Node
Address
Setting
NA0
NA1
NA2
NA3
NA4
NA5
DR0
DR1
Node Address & Baud Rate
■FRONT VIEW ■SIDE VIEW
Euro Type
Connector Terminal
DIP SW
■NODE ADDRESS & BAUD RATE DIP SW
• Node Address: 1 – 6 (NA0 – NA5)
1 (NA0) 2 (NA1) 3 (NA2) 4 (NA3) 5 (NA4) 6 (NA5)
202122232425
A node address is defined in 6-digit binary code. 1 – 6 (NA0
to NA5) correspond to the least to most significant digits.
DIP SW NODE
ADDRESS
6
NA5
5
NA4
4
NA3
3
NA2
2
NA1
1
NA0
000000 0
000001 1
000010 2
000011 3
:::::: :
111100 60
111101 61
111110 62
111111 63
0 = OFF, 1 = ON
• Baud Rate: 7, 8 (DR0, DR1)
BAUD RATE 7 (DR0) 8 (DR1)
125 kbps OFF (*) OFF (*)
250 kbps ON OFF
500 kbps OFF ON
N/A ON ON
(*) Factory setting
■INDICATORS
The following table defines the LED states of the MS, and
NS indicators.
LED S TAT E TO INDICATE
MS
Green Operating in a normal condition
Flashing Green Standby (needs commissioning)
Red Critical failure
Flashing Red Minor failure
OFF No power supplied
NS
Green Link on-line and connections in the
established state
Flashing Green Link on-line but no connections in
the established state
Red Critical link failure
Flashing Red Minor link failure
OFF No power supplied
■SIDE DIP SW
(*) Factory setting
• Data Allocation: SW1, SW2
Data Allocation Type* must be assigned to each I/O module
position to specify how many data areas (four types) are to
be occupied by each.
Two bits from SW1 and SW2 are assigned to each posi-
tion, and data areas can be specified from the module No. 1
through 8. Setting for No. 9 and later modules is identical
to No. 8.
SW ASSIGNMENT MODULE NO.
SW1-1 SW1-2 1
SW1-3 SW1-4 2
SW1-5 SW1-6 3
SW1-7 SW1-8 4
SW2-1 SW2-2 5
SW2-3 SW2-4 6
SW2-5 SW2-6 7
SW2-7 SW2-8 8
SW SETTTING DATA ALLOCATION
OFF OFF 1
ON OFF 4
OFF ON 8
ON ON 16
* Refer to the specifications of the related series for the Data
Allocation Type of I/O modules.
• Dual Communication: SW3-1
When two network modules are mounted, one must be
‘Main’ (OFF) network and the other must be ‘Sub’ (ON)
network. For single communication, the network module
must always be set to ‘Main’ (OFF).
SW DUAL COMMUNICATION
MAIN (*) SUB
SW3-1 OFF ON
• Input Error Data: SW3-2
Hold: When the communication from an input module is lost
due to the input module error, the network module holds the
signal and stands by until the communication recovers.
Set to ‘0’: When the communication from an input module
is lost due to the input module error, the network module
outputs ‘0.’
SW INPUT ERROR DATA
HOLD (*) SET ‘0’
SW3-2 OFF ON
Note: Be sure to set unused SW3-3 and 3-4 to OFF.

R3-ND1
5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 3 / 6
■CONFIGURABLE ITEMS
PC Configurator Software (model: R3CON) configures the
following:
• Communication failure detection time
• I/O modules scaling
(Refer to PC Configurator Software Users Manual (model:
R3CON) for details)
TERMINAL CONNECTIONS
Connect the unit as in the diagram below.
■DIMENSIONS mm (inch)
1
2
3
4
5
6
130 (5.12)
27.5 (1.08) 109 (4.29) POSITIONING
GUIDE
TERMINAL
COVER
6–M3
SCREW
6.2
(.24)
■CONNECTION DIAGRAM
Note: In order to improve EMC performance, bond the FG ter-
minal to ground.
Caution: FG terminal is NOT a protective conductor terminal.
INTERNAL
POWER
INTERNAL
BUS
CONFIGURATION JACK JACK
BUS CONNECTOR
* Not provided with ‘No Power Supply’ type module.
1
4
RUN +
RUN –
RUN CONTACT OUTPUT
2
3
6
U (+)
V (–)
FG
POWER INPUT
*
V+
CAN_H
Drain
CAN_L
V–
To Other
DeviceNet
Devices
WIRING INSTRUCTIONS
■M3 SCREW TERMINAL (power input, RUN contact output)
Torque: 0.5 N·m
■SOLDERLESS TERMINAL mm (inch)
Refer to the drawing below for recommended ring tongue
terminal size. Spade tongue type is also applicable. Solder-
less terminals with insulation sleeve do not fit.
Applicable wire size: 0.75 to 1.25 mm2(AWG19 – 16)
Recommended manufacturer: Japan Solderless Terminal
MFG.Co.Ltd, Nichifu Co.,ltd
3.2 (.13) dia.
4 min.
(.16)
12 (.47) max.
6 max.
(.24)
3 (.12) max.
■EURO TYPE CONNECTOR TERMINAL (DiviceNet)
Wire size: 0.2 – 2.5 mm2(AWG24-12)
Stripped length: 7 mm

R3-ND1
5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 4 / 6
TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module specifies each I/O module’s data allocation (occupied data area).
For example, when the data areas are assigned as shown below:
Module 1 4
Module 2 4
Module 3 4
Module 4 1
Module 5 1
Module 6 1
Module 7 1
Then the I/O data are assigned as in the figures below:
■OUTPUT DATA
The figure below shows the allocation of the data sent from
the network module to the master.
0 15
+0
+2
+4
+6
+8
+10
+12
+14
+16
+18
Module 1
Module 2
Module 3
Module 4
Module 5
Module 6
Module 7
Module Status
Error Status
Data Error Status
Begin
Address
■INPUT DATA
The figure below shows the allocation of the data sent from
the master to the network module.
0 15
+0
+2
+4
+6
+8
+10
+12
+14
Module 1
Module 2
Module 3
Module 4
Module 5
Module 6
Module 7
Begin
Address
Module Status, Error Status and Data Error Status are assigned to +16, +17 and +18 respectively.
Each module can handle either input or output data. Input and output cannot be mixed in one module.
Input data from the master device is transferred to the module’s output data area. The master device can read from the
output data area the data it has set.
• Module Status indicates whether individual I/O module are mounted or not. The bit corresponding to the mounted slots
turns to “1,” and the unmounted slots to “0.”
• Error Status indicates error status for each module as described below. The bit corresponding to such modules turns to “1.”
R3-TSx, R3-RSx, R3-US4: Input burnout
R3-DA16A: Power input in error or disconnected
R3-YSx: Output current error (e.g. load unconnected)
• Data Error Status indicates overrange (R3-US4: out of -10% to +110%; the other types: out of -15% to +115%) status for each
module. The bit corresponding to such modules turns to “1.”

R3-ND1
5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 5 / 6
MODULE STATUS, ERROR STATUS, DATA ERROR STATUS
Shows each module’s availability and error status.
0 15
Module 1
Module 2
Module 3
:
Module 16
I/O DATA DESCRIPTIONS
The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.
■ANALOG DATA (models: R3-SV4, YV4, DS4, YS4 and US4, etc.)
16-bit binary data.
Basically, 0 to 100% of the selected I/O range is converted into 0 to 10000 (binary). Negative percentage is represented in 2’s
complements.
0 15
■TEMPERATURE DATA (models: R3-RS4, TS4 and US4, etc.)
16-bit binary data.
With °C temperature unit, raw data is multiplied by 10. For example, 25.5°C is converted into 255.
With °F temperature unit, the integer section of raw data is directly converted into the data. For example, 135.4°F is con-
verted into 135.
Minus temperature is converted into negative values, represented in 2’s complements.
0 15
■ACCUMULATED COUNT DATA (32-bit data, models: R3-PA2, PA4A, WT1, WT4, etc.)
32-bit binary data is used for accumulated counts and encoder positions.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
0 15
+0
Lower 16 bits
0 15
+1
Higher 16 bits
■BCD DATA (32-bit data, models: R3-BA32A, BC32A, etc.)
32-bit binary data is used for BCD.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
0 15
+0
Lower 16 bits
0 15
+1
Higher 16 bits
■DISCRETE DATA (models: R3-DA16 and DC16, etc.)
0 15
Input 1 (Output 1)
Input 2 (Output 2)
Input 3 (Output 3)
: :
Input 16 (Output 16)
0 : OFF
1 : ON

R3-ND1
5-2-55, Minamitsumori, Nishinari-ku, Osaka 557-0063 JAPAN
Phone: [phone] Fax: [phone] E-mail: [e-mail]
EM-8353 Rev.11 P. 6 / 6
EDS
$ DeviceNet Electronic Data Sheet
$ Author:H. Iijima
[File] DescText = “This is for R3_ND1”;
CreateDate = 02-07-2004;
CreateTime = 19:52:41;
ModDate = 12-15-2004;
ModTime = 19:30:30;
Revision = 0.2;
[Device] VendCode = 184;
VendName = “M*System Co.,Ltd.”;
ProdType = 0;
ProdTypeStr = “Generic Device”;
ProdCode = 25;
MajRev = 1;
MinRev = 1;
ProdName = “R3_ND1”;
Catalog = “N/A”;
[IO_Info] Default = 0x0001;
PollInfo = 0x0001,1,1;
Input1 = 38,0,0x0001,
“Input data”,6,
“20 04 24 65 30 03”,””;
Output1 = 32,0,0x0001,
“Output data”,6,
“20 04 24 64 30 03”,””;
[ParamClass]
[Params]
[EnumPar]
[Groups]