Mitsubishi Electric MELSEC L series User manual

Transition from MELSEC-AnS/QnAS
(Small Type) Series to L Series Handbook
(Intelligent Function Modules)
Feb. 2016 Edition

A- 1
SAFETY PRECAUTIONS
(Read these precautions before using this product.)
Before using this product, please read this handbook and the relevant manuals introduced in this handbook
carefully and pay full attention to safety to handle the product correctly.
In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".
Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to
serious consequences.
Observe the precautions of both levels because they are important for personal and system safety.
WARNING
CAUTION
Indicates that incorrect handling may cause hazardous conditions,
resulting in death or severe injury.
Indicates that incorrect handling may cause hazardous conditions,
resulting in minor or moderate injury or property damage.

A- 2
[Design Precautions]
WARNING
●Configure safety circuits external to the programmable controller to ensure that the entire system
operates safely even when a fault occurs in the external power supply or the programmable
controller. Failure to do so may result in an accident due to an incorrect output or malfunction.
(1) Emergency stop circuits, protection circuits, and protective interlock circuits for conflicting
operations (such as forward/reverse rotations or upper/lower limit positioning) must be
configured external to the programmable controller.
(2) Machine OPR (Original Point Return) of the positioning function is controlled by two kinds of
data: an OPR direction and an OPR speed. Deceleration starts when the near-point watchdog
signal turns on. If an incorrect OPR direction is set, motion control may continue without
deceleration. To prevent machine damage caused by this, configure an interlock circuit external
to the programmable controller.
(3) When the CPU module detects an error during control by the positioning function, the motion
slows down and stops.
(4) When the programmable controller detects an abnormal condition, it stops the operation and all
outputs are:
• Turned off if the overcurrent or overvoltage protection of the power supply module is activated.
• Held or turned off according to the parameter setting if the self-diagnostic function of the CPU
module detects an error such as a watchdog timer error.
Also, all outputs may be turned on if an error occurs in a part, such as an I/O control part, where
the CPU module cannot detect any error. To ensure safety operation in such a case, provide a
safety mechanism or a fail-safe circuit external to the programmable controller. For a fail-safe
circuit example, refer to the MELSEC-L CPU Module User's Manual (Hardware Design,
Maintenance and Inspection).
(5) Outputs may remain on or off due to a failure of a component such as a transistor in an output
circuit. Configure an external circuit for monitoring output signals that could cause a serious
accident.
●In an output circuit, when a load current exceeding the rated current or an overcurrent caused by a
load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an
external safety circuit, such as a fuse.
●Configure a circuit so that the programmable controller is turned on first and then the external power
supply. If the external power supply is turned on first, an accident may occur due to an incorrect
output or malfunction.
●Configure a circuit so that the external power supply is turned off first and then the programmable
controller. If the programmable controller is turned off first, an accident may occur due to an incorrect
output or malfunction.
●For the operating status of each station after a communication failure, refer to relevant manuals for
each network. Incorrect output or malfunction due to a communication failure may result in an
accident.

A- 3
[Design Precautions]
WARNING
●When changing data from a peripheral device connected to the CPU module to the running
programmable controller, configure an interlock circuit in the program to ensure that the entire
system will always operate safely. For other forms of control (such as program modification or
operating status change) of a running programmable controller, read the relevant manuals carefully
and ensure that the operation is safe before proceeding. Especially, when a remote programmable
controller is controlled by an external device, immediate action cannot be taken if a problem occurs
in the programmable controller due to a communication failure. To prevent this, configure an
interlock circuit in the program, and determine corrective actions to be taken between the external
device and CPU module in case of a communication failure.
●An absolute position restoration by the positioning function may turn off the servo-on signal (servo
off) for approximately 20ms, and the motor may run unexpectedly. If this causes a problem, provide
an electromagnetic brake to lock the motor during absolute position restoration.

A- 4
[Design Precautions]
[Installation Precautions]
[Wiring Precautions]
CAUTION
●Do not install the control lines or communication cables together with the main circuit lines or power
cables. Keep a distance of 100mm or more between them. Failure to do so may result in malfunction
due to noise.
●During control of an inductive load such as a lamp, heater, or solenoid valve, a large current
(approximately ten times greater than normal) may flow when the output is turned from off to on.
Therefore, use a module that has a sufficient current rating.
●After the CPU module is powered on or is reset, the time taken to enter the RUN status varies
depending on the system configuration, parameter settings, and/or program size. Design circuits so
that the entire system will always operate safely, regardless of the time.
WARNING
●Shut off the external power supply (all phases) used in the system before mounting or removing a
module. Failure to do so may result in electric shock or cause the module to fail or malfunction.
CAUTION
●Use the programmable controller in an environment that meets the general specifications in the
MELSEC-L CPU Module User's Manual (Hardware Design, Maintenance and Inspection). Failure to
do so may result in electric shock, fire, malfunction, or damage to or deterioration of the product.
●To interconnect modules, engage the respective connectors and securely lock the module joint
levers. Incorrect interconnection may cause malfunction, failure, or drop of the module.
●Do not directly touch any conductive parts and electronic components of the module. Doing so can
cause malfunction or failure of the module.
●Securely connect an extension cable to the connectors of a branch module and an extension
module. After connections, check that the cable is inserted completely. Poor contact may cause
malfunction.
●When using an SD memory card, fully insert it into the SD memory card slot. Check that it is inserted
completely. Poor contact may cause malfunction.
●Do not directly touch any conductive parts and electronic components of the module or SD memory
card. Doing so can cause malfunction or failure of the module.
WARNING
●Shut off the external power supply (all phases) used in the system before wiring. Failure to do so
may result in electric shock or cause the module to fail or malfunction.
●After installation and wiring, attach the included terminal cover to the module before turning it on for
operation. Failure to do so may result in electric shock.

A- 5
[Wiring Precautions]
CAUTION
●Individually ground the FG and LG terminals of the programmable controller with a ground
resistance of 100or less. Failure to do so may result in electric shock or malfunction.
●Use applicable solderless terminals and tighten them within the specified torque range. If any spade
solderless terminal is used, it may be disconnected when a terminal block screw comes loose,
resulting in failure.
●Check the rated voltage and terminal layout before wiring to the module, and connect the cables
correctly. Connecting a power supply with a different voltage rating or incorrect wiring may cause a
fire or failure.
●Connectors for external devices must be crimped or pressed with the tool specified by the
manufacturer, or must be correctly soldered. Incomplete connections may cause short circuit, fire, or
malfunction.
●Securely connect the connector to the module.
●Do not install the control lines or communication cables together with the main circuit lines or power
cables. Keep a distance of 100mm or more between them. Failure to do so may result in malfunction
due to noise.
●Place the cables in a duct or clamp them. If not, dangling cable may swing or inadvertently be pulled,
resulting in damage to the module or cables or malfunction due to poor contact.
●Check the interface type and correctly connect the cable. Incorrect wiring (connecting the cable to an
incorrect interface) may cause failure of the module and external device.
●Tighten the terminal block screws within the specified torque range. Undertightening can cause short
circuit, fire, or malfunction. Overtightening can damage the screw and/or module, resulting in drop,
short circuit, fire, or malfunction.
●When disconnecting the cable from the module, do not pull the cable by the cable part. For the cable
with connector, hold the connector part of the cable. For the cable connected to the terminal block,
loosen the terminal screw. Pulling the cable connected to the module may result in malfunction or
damage to the module or cable.
●Prevent foreign matter such as dust or wire chips from entering the module. Such foreign matter can
cause a fire, failure, or malfunction.
●A protective film is attached to the top of the module to prevent foreign matter, such as wire chips,
from entering the module during wiring. Do not remove the film during wiring. Remove it for heat
dissipation before system operation.
●To use the high-speed counter function, ground the shield cable on the encoder side (relay box) with
a ground resistance of 100or less. Failure to do so may cause malfunction.
●Mitsubishi programmable controllers must be installed in control panels. Connect the main power
supply to the power supply module in the control panel through a relay terminal block.
Wiring and replacement of a power supply module must be performed by qualified maintenance
personnel with knowledge of protection against electric shock. For wiring methods, refer to the
MELSEC-L CPU Module User's Manual (Hardware Design, Maintenance and Inspection).

A- 6
[Startup and Maintenance Precautions]
WARNING
●Do not touch any terminal while power is on. Doing so will cause electric shock or malfunction.
●Correctly connect the battery connector. Do not charge, disassemble, heat, short-circuit, solder, or
throw the battery into the fire. Also, do not expose it to liquid or strong shock.
Doing so will cause the battery to produce heat, explode, ignite, or leak, resulting in injury and fire.
●Shut off the external power supply (all phases) used in the system before cleaning the module or
retightening the terminal block screws or the connector screws. Failure to do so may result in electric
shock.
CAUTION
●Before performing online operations (especially, program modification, forced output, and operating
status change) for the running CPU module from the peripheral device connected, read relevant
manuals carefully and ensure the safety. Improper operation may damage machines or cause
accidents.
●Do not disassemble or modify the modules. Doing so may cause failure, malfunction, injury, or a fire.
●Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone
System) more than 25cm away in all directions from the programmable controller. Failure to do so
may cause malfunction.
●Shut off the external power supply (all phases) used in the system before mounting or removing a
module. Failure to do so may cause the module to fail or malfunction.
●Tighten the terminal block screws and the connector screws within the specified torque range.
Undertightening can cause drop of the component or wire, short circuit, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
●After the first use of the product (module, display unit, and terminal block), the number of
connections/disconnections is limited to 50 times (in accordance with IEC 61131-2). Exceeding the
limit may cause malfunction.
●After the first use of the SD memory card, the number of insertions/removals is limited to 500 times.
Exceeding the limit may cause malfunction.
●Do not drop or apply shock to the battery to be installed in the module. Doing so may damage the
battery, causing the battery fluid to leak inside the battery. If the battery is dropped or any shock is
applied to it, dispose of it without using.
●Before handling the module, touch a conducting object such as a grounded metal to discharge the
static electricity from the human body. Failure to do so may cause the module to fail or malfunction.
●Before testing the operation by the positioning function, set a low speed value for the speed limit
parameter so that the operation can be stopped immediately upon occurrence of a hazardous
condition.

A- 7
[Disposal Precautions]
[Transportation Precautions]
CAUTION
●When disposing of this product, treat it as industrial waste. When disposing of batteries, separate
them from other wastes according to the local regulations. For details on battery regulations in EU
member states, refer to the MELSEC-L CPU Module User's Manual (Hardware Design, Maintenance
and Inspection).
CAUTION
●When transporting lithium batteries, follow the transportation regulations. For details on the regulated
models, refer to the MELSEC-L CPU Module User's Manual (Hardware Design, Maintenance and
Inspection).

A- 8
CONDITIONS OF USE FOR THE PRODUCT
(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;
i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major
or serious accident; and
ii) where the backup and fail-safe function are systematically or automatically provided outside of
the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general
industries.
MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT
LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT,
WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR
LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR
USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS,
OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY
MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT.
("Prohibited Application")
Prohibited Applications include, but not limited to, the use of the PRODUCT in;
• Nuclear Power Plants and any other power plants operated by Power companies, and/or any
other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.
• Railway companies or Public service purposes, and/or any other cases in which establishment of
a special quality assurance system is required by the Purchaser or End User.
• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as
Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation,
Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or
Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a
significant risk of injury to the public or property.
Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the
PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT
is limited only for the specific applications agreed to by Mitsubishi and provided further that no
special quality assurance or fail-safe, redundant or other safety features which exceed the general
specifications of the PRODUCTs are required. For details, please contact the Mitsubishi
representative in your region.

A- 9
REVISIONS
* The handbook number is given on the bottom left of the back cover.
Japanese Handbook Version L08255-D
© 2012 MITSUBISHI ELECTRIC CORPORATION
Print Date * Handbook Number Revision
Oct. 2012 L(NA)08259ENG-A First edition
Dec. 2013 L(NA)08259ENG-B Addition of LCPU models
Addition of the L series analog input/output module and review of alternative
models
L02SCPU, L02SCPU-P, L06CPU, L06CPU-P, L26CPU, L26CPU-P,
LH42C4NT1P, L60AD2DA2
Insert Chapter 4 and modify the Chapter 5 or later
Sep. 2015 L(NA)08259ENG-C
L60ADVL8, L60ADIL8, LD75P1, LD75P2, LD75D1, LD75D2
Section 2.4
SAFETY PRECAUTIONS, Section 2.1, 3.1, 6.1, Chapter 7
Feb. 2016 L(NA)08259ENG-D
Cover, WARRANTY
This handbook confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses.
Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may
occur as a result of using the contents noted in this handbook.
Model addition
Addition
Model addition
Addition
Partial correction
Partial correction

A- 10
SAFETY PRECAUTIONS ................................................................................................................................A - 1
CONDITIONS OF USE FOR THE PRODUCT .................................................................................................A - 8
REVISIONS ......................................................................................................................................................A - 9
GENERIC TERMS AND ABBREVIATIONS ...................................................................................................A - 14
CHAPTER 1 INTRODUCTION 1 - 1 to 1 - 2
1.1 Advantages of Transition to L Series ............................................................................................... 1 - 1
1.2 Precautions for Transition ................................................................................................................ 1 - 1
CHAPTER 2 ANALOG INPUT MODULE REPLACEMENT 2 - 1 to 2 - 35
2.1 List of Analog Input Module Alternative Models for Replacement ................................................... 2 - 1
2.2 A1S64AD ......................................................................................................................................... 2 - 2
2.2.1 Performance specifications comparison ................................................................................... 2 - 2
2.2.2 Functional comparison .............................................................................................................. 2 - 6
2.2.3 I/O signal comparison ............................................................................................................... 2 - 8
2.2.4 Buffer memory address comparison ......................................................................................... 2 - 9
2.3 A1S68AD (replacement with the L60AD4) .................................................................................... 2 - 16
2.3.1 Performance specifications comparison ................................................................................. 2 - 16
2.3.2 Functional comparison ............................................................................................................ 2 - 18
2.3.3 I/O signal comparison ............................................................................................................. 2 - 20
2.3.4 Buffer memory address comparison ....................................................................................... 2 - 21
2.4 A1S68AD (replacement with the L60ADVL8 or L60ADIL8) ........................................................... 2 - 28
2.4.1 Performance specifications comparison ................................................................................. 2 - 28
2.4.2 Functional comparison ............................................................................................................ 2 - 30
2.4.3 I/O signal comparison ............................................................................................................. 2 - 31
2.4.4 Buffer memory address comparison ....................................................................................... 2 - 32
CHAPTER 3 ANALOG OUTPUT MODULE REPLACEMENT 3 - 1 to 3 - 26
3.1 List of Analog Output Module Alternative Models for Replacement ................................................. 3 - 1
3.2 A1S62DA ......................................................................................................................................... 3 - 3
3.2.1 Performance specifications comparison ................................................................................... 3 - 3
3.2.2 Functional comparison .............................................................................................................. 3 - 7
3.2.3 I/O signal comparison ............................................................................................................... 3 - 8
3.2.4 Buffer memory address comparison ......................................................................................... 3 - 9
3.3 A1S68DAI ...................................................................................................................................... 3 - 11
3.3.1 Performance specifications comparison ................................................................................. 3 - 11
3.3.2 Functional comparison ............................................................................................................ 3 - 15
3.3.3 I/O signal comparison ............................................................................................................. 3 - 16
3.3.4 Buffer memory address comparison ....................................................................................... 3 - 17
3.4 A1S68DAV ..................................................................................................................................... 3 - 19
CONTENTS

A- 11
3.4.1 Performance specifications comparison ................................................................................. 3 - 19
3.4.2 Functional comparison ........................................................................................................... 3 - 23
3.4.3 I/O signal comparison ............................................................................................................. 3 - 24
3.4.4 Buffer memory address comparison ....................................................................................... 3 - 25
CHAPTER 4 ANALOG I/O MODULE REPLACEMENT 4 - 1 to 4 - 36
4.1 List of Analog I/O Module Alternative Models for Replacement ...................................................... 4 - 1
4.2 A1S63ADA ....................................................................................................................................... 4 - 3
4.2.1 Performance specifications comparison ................................................................................... 4 - 3
4.2.2 Functional comparison ............................................................................................................. 4 - 9
4.2.3 I/O signal comparison ............................................................................................................. 4 - 11
4.2.4 Buffer memory address comparison ....................................................................................... 4 - 12
4.3 A1S66ADA ..................................................................................................................................... 4 - 21
4.3.1 Performance specifications comparison ................................................................................. 4 - 21
4.3.2 Functional comparison ........................................................................................................... 4 - 25
4.3.3 I/O signal comparison ............................................................................................................. 4 - 27
4.3.4 Buffer memory address comparison ....................................................................................... 4 - 29
CHAPTER 5 HEATING-COOLING TEMPERATURE CONTROL MODULE/
TEMPERATURE CONTROL MODULE REPLACEMENT 5 - 1 to 5 - 65
5.1 List of Heating-cooling Temperature Control Module/Temperature Control Module Alternative Models
for Replacement .............................................................................................................................. 5 - 1
5.2 Performance Specifications Comparison ......................................................................................... 5 - 3
5.2.1 A1S64TCTRT(BW) (thermocouple connection) ....................................................................... 5 - 3
5.2.2 A1S64TCTRT(BW) (platinum resistance thermometer connection) ......................................... 5 - 7
5.2.3 A1S64TCTT(BW)-S1 .............................................................................................................. 5 - 11
5.2.4 A1S64TCRT(BW)-S1 ............................................................................................................. 5 - 17
5.2.5 A1S62TCTT(BW)-S2 .............................................................................................................. 5 - 21
5.2.6 A1S62TCRT(BW)-S2 ............................................................................................................. 5 - 27
5.3 Functional Comparison .................................................................................................................. 5 - 33
5.4 I/O Signal Comparison ................................................................................................................... 5 - 35
5.4.1 A1S64TCTRT(BW) and L series modules (standard control) ................................................ 5 - 35
5.4.2 A1S64TCTRT(BW) and L series modules (heating-cooling control) ...................................... 5 - 37
5.4.3 A1S64TCTT(BW)-S1/A1S64TCRT(BW)-S1 and L series modules ....................................... 5 - 39
5.4.4 A1S62TCTT(BW)-S2/A1S62TCRT(BW)-S2 and L series modules ....................................... 5 - 41
5.5 Buffer Memory Address Comparison ............................................................................................. 5 - 43
5.5.1 A1S64TCTRT(BW) and L series modules (standard control) ............................................... 5 - 43
5.5.2 A1S64TCTRT(BW) and L series modules (heating-cooling control) ..................................... 5 - 49
5.5.3 A1S64TCTT(BW)-S1/A1S64TCRT(BW)-S1 and L series modules ....................................... 5 - 55
5.5.4 A1S62TCTT(BW)-S2/A1S62TCRT(BW)-S2 and L series modules ...................................... 5 - 61
CHAPTER 6 HIGH-SPEED COUNTER MODULE REPLACEMENT 6 - 1 to 6 - 24
6.1 List of High-Speed Counter Module Alternative Models for Replacement ....................................... 6 - 1
6.2 A1SD61 ........................................................................................................................................... 6 - 6
6.2.1 Performance specifications comparison ................................................................................... 6 - 6

A- 12
6.2.2 Functional comparison ............................................................................................................ 6 - 10
6.2.3 I/O signal comparison ............................................................................................................. 6 - 11
6.2.4 Buffer memory address comparison ....................................................................................... 6 - 12
6.3 A1SD62(E/D/D-S1) ....................................................................................................................... 6 - 13
6.3.1 Performance specifications comparison ................................................................................. 6 - 13
6.3.2 Functional comparison ............................................................................................................ 6 - 21
6.3.3 I/O signal comparison ............................................................................................................. 6 - 22
6.3.4 Buffer memory address comparison ....................................................................................... 6 - 24
CHAPTER 7 POSITIONING MODULE REPLACEMENT 7 - 1 to 7 - 18
7.1 List of Positioning Module Alternative Models for Replacement ...................................................... 7 - 1
7.2 A1SD75P1-S3/P2-S3/P3-S3 ........................................................................................................... 7 - 3
7.2.1 Performance specifications comparison ................................................................................... 7 - 3
7.2.2 Functional comparison .............................................................................................................. 7 - 7
7.2.3 I/O signal comparison ............................................................................................................. 7 - 10
7.2.4 Buffer memory address comparison ....................................................................................... 7 - 11
7.2.5 External interface specifications comparison .......................................................................... 7 - 18
CHAPTER 8 REPLACEMENT OF OTHER MODULES 8 - 1 to 8 - 2
8.1 Replacement of Other Modules ....................................................................................................... 8 - 1
CHAPTER 9 EXTERNAL DIMENSIONS 9 - 1 to 9 - 2
9.1 External Dimensions ........................................................................................................................ 9 - 1
APPENDICES App - 1 to App - 8
Appendix 1 Spare Parts Storage ..........................................................................................................App - 1
Appendix 2 Relevant Manuals ..............................................................................................................App - 2
Appendix 2.1 Replacement handbooks ............................................................................................App - 2
Appendix 2.2 AnS series manuals ....................................................................................................App - 3
Appendix 2.3 L series manuals ........................................................................................................App - 4
Appendix 2.4 Programming tool manuals .........................................................................................App - 4
Appendix 3 How to Change Resolution After Analog I/O Module is Replaced .....................................App - 5
Appendix 3.1 Resolution ...................................................................................................................App - 5
Appendix 3.2 Using the scaling function of an analog I/O module ...................................................App - 5
Appendix 3.3 Adding the scaling operation function to sequence program ......................................App - 6

A- 13
●For the products shown in handbooks for transition, catalogues, and transition examples, refer to the
manuals for the relevant products and check the detailed specifications, precautions for use, and
restrictions before replacement.
For the products manufactured by Mitsubishi Electric Engineering Co., Ltd., Mitsubishi Electric
System & Service Co., Ltd., and other companies, refer to the catalogue for each product and check
the detailed specifications, precautions for use, and restrictions before use.
The manuals and catalogues for our products, products manufactured by Mitsubishi Electric
Engineering Co., Ltd., and Mitsubishi Electric System & Service Co., Ltd. are shown in Appendix of
each handbook for transition.
●Details of models certified by each standard are available at the following Mitsubishi Electric FA site:
http://www.mitsubishielectric.com/fa/worldwide/index.html
●Products shown in this handbook are subject to change without notice.

A- 14
GENERIC TERMS AND ABBREVIATIONS
Unless otherwise specified, this handbook uses the following generic terms and abbreviations.
Generic term/abbreviation Description
Series
A series The abbreviation for large types of Mitsubishi MELSEC-A series programmable
controllers
AnS series The abbreviation for compact types of Mitsubishi MELSEC-A series programmable
controllers
A/AnS series A generic term for A series and AnS series
QnA series The abbreviation for large types of Mitsubishi MELSEC-QnA series programmable
controllers
QnAS series The abbreviation for compact types of Mitsubishi MELSEC-QnA series programmable
controllers
QnA/QnAS series A generic term for QnA series and QnAS series
A/AnS/QnA/QnAS series A generic term for A series, AnS series, QnA series, and QnAS series
Q series The abbreviation for Mitsubishi MELSEC-Q series programmable controllers
L series The abbreviation for Mitsubishi MELSEC-L series programmable controllers
CPU module type
CPU module A generic term for A series, AnS series, QnA series, QnAS series, Q series, and L
series CPU modules
Basic model QCPU A generic term for the Q00JCPU, Q00CPU, and Q01CPU
High Performance model QCPU A generic term for the Q02CPU, Q02HCPU, Q06HCPU, Q12HCPU, and Q25HCPU
Process CPU A generic term for the Q02PHCPU, Q06PHCPU, Q12PHCPU, and Q25PHCPU
Redundant CPU A generic term for the Q12PRHCPU and Q25PRHCPU
Universal model QCPU
A generic term for the Q00U(J)CPU, Q01UCPU, Q02UCPU, Q03UD(E)CPU,
Q03UDVCPU, Q04UD(E)HCPU, Q04UDVCPU, Q04UDPVCPU, Q06UD(E)HCPU,
Q06UDVCPU, Q06UDPVCPU, Q10UD(E)HCPU, Q13UD(E)HCPU, Q13UDVCPU,
Q13UDPVCPU, Q20UD(E)HCPU, Q26UD(E)HCPU, Q26UDVCPU, Q26UDPVCPU,
Q50UDEHCPU, and Q100UDEHCPU
CPU module model
ACPU A generic term for MELSEC-A series CPU modules
AnSCPU A generic term for MELSEC-AnS series CPU modules
AnNCPU
A generic term for the A1NCPU, A1NCPUP21/R21, A1NCPUP21-S3, A2NCPU,
A2NCPU-S1, A2NCPUP21/R21, A2NCPUP21/R21-S1, A2NCPUP21-S3(S4),
A3NCPU, A3NCPUP21/R21, and A3NCPUP21-S3
AnACPU A generic term for the A2ACPU, A2ACPU-S1, A3ACPU, A2ACPUP21/R21,
A2ACPUP21/R21-S1, and A3ACPUP21/R21
AnUCPU A generic term for the A2UCPU, A2UCPU-S1, A3UCPU, and A4UCPU
AnUS(H)CPU A generic term for the A2USCPU, A2USCPU-S1, A2USHCPU-S1
A/AnSCPU A generic term for MELSEC-A series and MELSEC-AnS series CPU modules
AnN/AnACPU A generic term for the AnNCPU and AnACPU
AnN/AnA/AnSCPU A generic term for the AnNCPU, AnACPU, and AnSCPU
QnACPU A generic term for MELSEC-QnA series CPU modules
QnASCPU A generic term for MELSEC-QnAS series CPU modules
QnA/QnASCPU A generic term for MELSEC-QnA series and MELSEC-QnAS series CPU modules
A/AnS/QnA/QnASCPU A generic term for A series, AnS series, QnA series, and QnAS series CPU modules
QCPU A generic term for MELSEC-Q series CPU modules
LCPU A generic term for MELSEC-L series CPU modules

1INTRODUCTION
1- 1
(1) When replacing the AnS/QnAS series with the L series, be sure to read the manuals of each L
series module and confirm the functions, specifications, and how to use before using the L
series.
(2) After the AnS/QnAS series is replaced with the L series, be sure to verify the operation of the
entire system before the start of operations.
1
1 INTRODUCTION
1.1 Advantages of Transition to L Series
Advantage 1) Advanced performance of equipments (shortened takt time)
In addition to the processing performance improvement for L series CPU, the processing
speed for L series intelligent function module is also increased, so that the equipment
capability to improve is possible.
Advantage 2) Baseless, flexible composition
The L series does not require a main base unit and can be installed in a minimum space
without restrictions of the base unit size.
Even when a module is added, the number of modules is not constrained by the number of
base slots, therefore the system cost such as addition of an extension base unit can be
suppressed.
Advantage 3) Improved operating efficiency for programming and monitoring
The intelligent function module operation of GX Works2 can be used on the L series
intelligent function module.
Though using the intelligent function module operation of GX Works2 is not required, the
use enables the following and can reduce sequence programs.
• Initial setting is possible without a program.
• The auto refresh setting allows to read/write buffer memory data of intelligent function
module automatically from/to the CPU device memory.
• Checking of the setting status or operating status of intelligent function module is
simplified.
1.2 Precautions for Transition

1INTRODUCTION
1- 2
Memo

2ANALOG INPUT MODULE REPLACEMENT
2- 1
Point
The upgrade tool (conversion adapter) manufactured by Mitsubishi Electric Engineering Co., Ltd.
enables to connect the existing wiring that was connected to the A1S64AD to L series modules without
change.
*1 For details on the conversion adapter or LG69, refer to the Transition from MELSEC-AnS/QnAS (Small Type) Series to L
Series Handbook (Fundamentals)
2
2 ANALOG INPUT MODULE
REPLACEMENT
2.1 List of Analog Input Module Alternative Models for Replacement
AnS/QnAS series Transition to L series
Product Model Model Remarks (Restrictions)
Analog input module
A1S64AD L60AD4
1) External wiring: Cable size is changed.
2) Number of slots: Not changed
3) Program: The number of occupied I/O points, I/O
signals, and buffer memory addresses are changed.
4) Performance specifications: Not changed
5) Functional specifications: Not changed
A1S68AD
L60AD4
1) External wiring: Cable size is changed.
2) Number of slots: Changed (Two modules are
required.)
3) Program: The number of occupied I/O points, I/O
signals, and buffer memory addresses are changed.
4) Performance specifications: Four channels per
module
5) Functional specifications: Not changed
L60ADVL8
(voltage)
1) External wiring: Cable size is changed.
2) Number of slots: Not changed
3) Program: The number of occupied I/O points, I/O
signals, resolution, and buffer memory addresses
are changed.
4) Performance specifications: Input signals are
changed (V or I input only).
5) Functional specifications: Not changed
L60ADIL8
(current)
Product Existing module model Alternative module model Conversion adapter model*1 Space module LG69*1
Analog input module A1S64AD L60AD4 ERNT-ASLT64AD Available

2ANALOG INPUT MODULE REPLACEMENT
2- 2
2.2.1 Performance specifications comparison
*1 I/O characteristics and maximum resolutions of the A1S64AD are shown below.
2.2 A1S64AD
Item A1S64AD
Analog input Voltage -10 to 0 to +10VDC (Input resistance value: 1M)
Current -20 to 0 to +20mA (Input resistance value: 250)
Digital output
16-bit signed binary
When 1/4000 is set: -4096 to +4095
When 1/8000 is set: -8192 to +8191
When 1/12000 is set: -12288 to +12287
I/O characteristics
*1
Resolution
Overall accuracy
(Accuracy in respect to maximum
digital output value)
±1%
When 1/4000 is set: ±40
When 1/8000 is set: ±80
When 1/12000 is set: ±120
Item Specifications
I/O characteristics
Analog input Digital output value (when gain 5V/20mA, offset 0V/0mA)
1/4000 1/8000 1/12000
+10V
+5V or +20mA
0V or 0mA
-5V or -20mA
-10V
+4000
+2000
0
-2000
-4000
+8000
+4000
0
-4000
-8000
+12000
+6000
0
-6000
-12000
Resolution
1/4000 1/8000 1/12000
Voltage input
Current input
2.5mV
10µA
1.25mV
5µA
0.83mV
3.33µA