Nexcom NDiS B560-Q User manual

NEXCOM International Co., Ltd.
NEXCOM International Co., Ltd.
Published February 2024 www.nexcom.com
Intelligent Platform & Services Business Unit
Visual Edge Compter
NDiS B560-Q
User Manual

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. ii NDiS B560-Q User Manual
Content
Contents
Preface
Copyright ............................................................................................. iv
Disclaimer.............................................................................................. iv
Acknowledgements ............................................................................... iv
Regulatory Compliance Statements........................................................ iv
Declaration of Conformity...................................................................... iv
RoHS Compliance ................................................................................... v
Warranty and RMA ................................................................................ vi
Safety Information ................................................................................viii
Installation Recommendations...............................................................viii
Safety Precautions.................................................................................. ix
Technical Support and Assistance............................................................ x
Conventions Used in this Manual............................................................ x
Global Service Contact Information........................................................ xi
Package Contents.................................................................................xiii
Ordering Information ............................................................................xiv
Chapter 1: Product Introduction
Overview ................................................................................................1
Key Features ...........................................................................................1
Physical Features .....................................................................................2
Front Panel ..........................................................................................2
Rear Panel ...........................................................................................2
Hardware Specifications..........................................................................3
Mechanical Dimensions...........................................................................5
Chapter 2: Jumpers and Connectors
Before You Begin ....................................................................................6
Precautions ............................................................................................6
Locations of the Jumpers and Connectors for NDiB B560-Q ....................7
NDiB B560-Q.......................................................................................7
Top View .............................................................................................7
Bottom View .......................................................................................8
Jumper Settings ......................................................................................9
Jumper and DIP Switch Settings ............................................................10
CMOS Clear Selection....................................................................10
AT/ATX Mode Selection..................................................................10
Connector Pin Definitions .....................................................................11
External I/O Interfaces - Front Panel ...................................................11
Power Button.................................................................................11
Power/HDD LED Connector............................................................11
COM 1 Port ..................................................................................12
COM 2 Port ..................................................................................12
COM 3 Port ..................................................................................13
COM 4 Port ..................................................................................13
Connector location: COM4 ............................................................13
USB3.1 Ports..................................................................................14
Reset Connector ............................................................................14
External I/O Interfaces - Rear Panel.....................................................15
USB 3.1 Ports.................................................................................15
USB3.1 Ports..................................................................................15
DC In Connector............................................................................16

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Content
HDMI1 Connector..........................................................................16
HDMI2 Connector..........................................................................17
HDMI3 Connector..........................................................................17
LAN1 I219 Connector ....................................................................18
LAN2 I226 Connector ....................................................................18
Mic In (Pink) Connector..................................................................19
Audio Connector ...........................................................................19
Internal Connectors...........................................................................20
Port 80 Connector .........................................................................20
Fan1 Connector .............................................................................20
Fan2 Connector .............................................................................21
GPIO Connector.............................................................................21
SATA Connector.............................................................................22
SPEK Pin Header Connector ...........................................................22
Reset/PUT Connector .....................................................................23
DC In for NTK-B560-PW Connector................................................23
USB2.0 Pin Header Connector........................................................24
USB2.0 Pin Header Connector........................................................24
SMABUS Pin Header.......................................................................25
RI Connector..................................................................................25
Battery Connector..........................................................................26
CON1 Connector ...........................................................................26
SIM Card Connector ......................................................................27
NGFF Key E Connector...................................................................28
NGFF Key M Connector..................................................................29
NGFF Key B Connector...................................................................30
Block Diagram ......................................................................................31
Chapter 3: System Setup
Removing the Chassis Cover ................................................................32
Installing a CPU.....................................................................................34
Installing a SO-DIMM (DIMM2) .............................................................37
Installing a SO-DIMM (DIMM1) .............................................................38
Installing a HDD....................................................................................39
Installing a M.2 Storage Module ..........................................................41
(M-key 2280)........................................................................................41
Installing a M.2 WiFi Module ...............................................................43
(E-key 2230) ........................................................................................43
Assembling The Top Cover To The Chassis.............................................45
Installing a M.2 LTE/5G module ............................................................47
(B-key 3042/3052) and SIM card...........................................................47
Chapter 4: BIOS Setup
About BIOS Setup.................................................................................50
When to Configure the BIOS.................................................................50
Default Configuration...........................................................................51
Entering Setup......................................................................................51
Legends................................................................................................51
BIOS Setup Utility..................................................................................53
Main .................................................................................................53
Advanced..........................................................................................54
Chipset..............................................................................................69
PCH-IO Configuration........................................................................71
SATA And RST Configuration.............................................................71
HD Audio Configuration....................................................................72
EDID Mode Control ...........................................................................73
Security .............................................................................................73
Boot..................................................................................................74
Save & Exit ........................................................................................75

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. iv NDiS B560-Q User Manual
Preface
PrefaCe
Copyright
This publication, including all photographs, illustrations and software, is
protected under international copyright laws, with all rights reserved. No
part of this manual may be reproduced, copied, translated or transmitted in
any form or by any means without the prior written consent from NEXCOM
International Co., Ltd.
Disclaimer
The information in this document is subject to change without prior notice and
does not represent commitment from NEXCOM International Co., Ltd. However,
users may update their knowledge of any product in use by constantly checking
its manual posted on our website: http://www.nexcom.com. NEXCOM shall
not be liable for direct, indirect, special, incidental, or consequential damages
arising out of the use of any product, nor for any infringements upon the rights
of third parties, which may result from such use. Any implied warranties of
merchantability or fitness for any particular purpose is also disclaimed.
Acknowledgements
NDiS B560-Q is a trademark of NEXCOM International Co., Ltd. All other
product names mentioned herein are registered trademarks of their
respective owners.
Regulatory Compliance Statements
This section provides the FCC compliance statement for Class B devices and
describes how to keep the system CE compliant.
Declaration of Conformity
FCC
This equipment has been tested and verified to comply with the limits for
a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference
to radio communications. Operation of this equipment in a residential area
(domestic environment) is likely to cause harmful interference, in which
case the user will be required to correct the interference (take adequate
measures) at their own expense.
CE
The product(s) described in this manual complies with all applicable
European Union (CE) directives if it has a CE marking. For computer systems
to remain CE compliant, only CE-compliant parts may be used. Maintaining
CE compliance also requires proper cable and cabling techniques.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. vNDiS B560-Q User Manual
Preface
RoHS Compliance
NEXCOM RoHS Environmental Policy and Status
Update
NEXCOM is a global citizen for building the digital
infrastructure. We are committed to providing green
products and services, which are compliant with
European Union RoHS (Restriction on Use of Hazardous Substance in
Electronic Equipment) directive 2011/65/EU, to be your trusted green
partner and to protect our environment.
RoHS restricts the use of Lead (Pb) < 0.1% or 1,000ppm, Mercury (Hg) < 0.1%
or 1,000ppm, Cadmium (Cd) < 0.01% or 100ppm, Hexavalent Chromium
(Cr6+) < 0.1% or 1,000ppm, Polybrominated biphenyls (PBB) < 0.1% or
1,000ppm, and Polybrominated diphenyl Ethers (PBDE) < 0.1% or 1,000ppm.
In order to meet the RoHS compliant directives, NEXCOM has established
an engineering and manufacturing task force to implement the introduction
of green products. The task force will ensure that we follow the standard
NEXCOM development procedure and that all the new RoHS components
and new manufacturing processes maintain the highest industry quality
levels for which NEXCOM are renowned.
The model selection criteria will be based on market demand. Vendors and
suppliers will ensure that all designed components will be RoHS compliant.
How to recognize NEXCOM RoHS Products?
For existing products where there are non-RoHS and RoHS versions, the
suffix “(LF)” will be added to the compliant product name.
All new product models launched after January 2013 will be RoHS compliant.
They will use the usual NEXCOM naming convention.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. vi NDiS B560-Q User Manual
Preface
Warranty and RMA
NEXCOM Warranty Period
NEXCOM manufactures products that are new or equivalent to new in
accordance with industry standard. NEXCOM warrants that products will be
free from defect in material and workmanship for 2 years, beginning on the
date of invoice by NEXCOM.
NEXCOM Return Merchandise Authorization (RMA)
▪Customers shall enclose the “NEXCOM RMA Service Form” with the
returned packages.
▪Customers must collect all the information about the problems
encountered and note anything abnormal or, print out any on-screen
messages, and describe the problems on the “NEXCOM RMA Service
Form” for the RMA number apply process.
▪Customers can send back the faulty products with or without accessories
(manuals, cable, etc.) and any components from the card, such as CPU
and RAM. If the components were suspected as part of the problems,
please note clearly which components are included. Otherwise, NEXCOM
is not responsible for the devices/parts.
▪Customers are responsible for the safe packaging of defective products,
making sure it is durable enough to be resistant against further damage
and deterioration during transportation. In case of damages occurred
during transportation, the repair is treated as “Out of Warranty.”
▪Any products returned by NEXCOM to other locations besides the
customers’ site will bear an extra charge and will be billed to the customer.
Repair Service Charges for Out-of-Warranty Products
NEXCOM will charge for out-of-warranty products in two categories, one is
basic diagnostic fee and another is component (product) fee.
System Level
▪Component fee: NEXCOM will only charge for main components such as
SMD chip, BGA chip, etc. Passive components will be repaired for free,
ex: resistor, capacitor.
▪Items will be replaced with NEXCOM products if the original one cannot
be repaired. Ex: motherboard, power supply, etc.
▪Replace with 3rd party products if needed.
▪If RMA goods can not be repaired, NEXCOM will return it to the customer
without any charge.
Board Level
▪Component fee: NEXCOM will only charge for main components, such
as SMD chip, BGA chip, etc. Passive components will be repaired for free,
ex: resistors, capacitors.
▪If RMA goods can not be repaired, NEXCOM will return it to the customer
without any charge.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. vii NDiS B560-Q User Manual
Preface
Warnings
Read and adhere to all warnings, cautions, and notices in this guide and
the documentation supplied with the chassis, power supply, and accessory
modules. If the instructions for the chassis and power supply are inconsistent
with these instructions or the instructions for accessory modules, contact
the supplier to find out how you can ensure that your computer meets
safety and regulatory requirements.
Cautions
Electrostatic discharge (ESD) can damage system components. Do the
described procedures only at an ESD workstation. If no such station is
available, you can provide some ESD protection by wearing an antistatic
wrist strap and attaching it to a metal part of the computer chassis.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. viii NDiS B560-Q User Manual
Preface
Installation Recommendations
Ensure you have a stable, clean working environment. Dust and dirt can get
into components and cause a malfunction. Use containers to keep small
components separated.
Adequate lighting and proper tools can prevent you from accidentally
damaging the internal components. Most of the procedures that follow
require only a few simple tools, including the following:
▪A Philips screwdriver
▪A flat-tipped screwdriver
▪A grounding strap
▪An anti-static pad
Using your fingers can disconnect most of the connections. It is recommended
that you do not use needle-nose pliers to disconnect connections as these
can damage the soft metal or plastic parts of the connectors.
Safety Information
Before installing and using the device, note the following precautions:
▪Read all instructions carefully.
▪Do not place the unit on an unstable surface, cart, or stand.
▪Follow all warnings and cautions in this manual.
▪When replacing parts, ensure that your service technician uses parts
specified by the manufacturer.
▪Avoid using the system near water, in direct sunlight, or near a heating
device.
▪The load of the system unit does not solely rely for support from the
rackmounts located on the sides. Firm support from the bottom is highly
necessary in order to provide balance stability.
▪The computer is provided with a battery-powered real-time clock circuit.
There is a danger of explosion if battery is incorrectly replaced. Replace
only with the same or equivalent type recommended by the manufacturer.
Discard used batteries according to the manufacturer’s instructions.
▪The instructions shall require connection of the equipment protective
earthing conductor to the installation protective earthing conductor (for
example, by means of a power cord connected to a socket-outlet with
earthing connection).

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. ix NDiS B560-Q User Manual
Preface
Safety Precautions
1. Read these safety instructions carefully.
2. Keep this User Manual for later reference.
3. Disconnect this equipment from any AC outlet before cleaning. Use a
damp cloth. Do not use liquid or spray detergents for cleaning.
4. For plug-in equipment, the power outlet socket must be located near the
equipment and must be easily accessible.
5. Keep this equipment away from humidity.
6. Put this equipment on a stable surface during installation. Dropping it or
letting it fall may cause damage.
7. The openings on the enclosure are for air convection to protect the
equipment from overheating. DO NOT COVER THE OPENINGS.
8. Make sure the voltage of the power source is correct before connecting
the equipment to the power outlet.
9. Place the power cord in a way so that people will not step on it. Do not
place anything on top of the power cord. Use a power cord that has been
approved for use with the product and that it matches the voltage and
current marked on the product’s electrical range label. The voltage and
current rating of the cord must be greater than the voltage and current
rating marked on the product.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the
power source to avoid damage by transient overvoltage.
12. Never pour any liquid into an opening. This may cause fire or electrical
shock.
13. This equipment is not suitable for use in locations where children are
likely to be present.
14. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
15. If one of the following situations arises, get the equipment checked by
service personnel:
a. The power cord or plug is damaged.
b.Liquid has penetrated into the equipment.
c. The equipment has been exposed to moisture.
d.The equipment does not work well, or you cannot get it to work
according to the user’s manual.
e. The equipment has been dropped and damaged.
f. The equipment has obvious signs of breakage.
16. Do not place heavy objects on the equipment.
17. The unit uses a three-wire ground cable which is equipped with a third
pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If your outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.
18. ATTENTION: Risque d’explosion si la batterie est remplacée par un type
incorrect. Mettre au rebus les batteries usagées selon les instructions.
CAUTION: Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
19. This product is intended to be supplied by a Listed (Certificate) power
adapter, output rated 12Vdc, 8A or 8.33A minimum, Tma 40 degree
C minimum and altitude 2000m. If further assistance is needed, please
contact NEXCOM for further information.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. xNDiS B560-Q User Manual
Preface
Technical Support and Assistance
1. For the most updated information of NEXCOM products, visit NEXCOM’s
website at www.nexcom.com.
2. For technical issues that require contacting our technical support team or
sales representative, please have the following information ready before
calling:
– Product name and serial number
– Detailed information of the peripheral devices
– Detailed information of the installed software (operating system,
version, application software, etc.)
– A complete description of the problem
– The exact wordings of the error messages
Warning!
1. Handling the unit: carry the unit with both hands and handle it with care.
2. Maintenance: to keep the unit clean, use only approved cleaning products
or clean with a dry cloth.
3. CompactFlash: Turn off the unit’s power before inserting or removing a
CompactFlash storage card.
Conventions Used in this Manual
Warning:
Information about certain situations, which if not observed,
can cause personal injury. This will prevent injury to yourself
when performing a task.
CAUTION!
CAUTION!CAUTION! Caution:
Information to avoid damaging components or losing data.
Note:
Provides additional information to complete a task easily.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. xi NDiS B560-Q User Manual
Preface
Global Service Contact Information
Headquarters
NEXCOM International Co., Ltd.
9F, No. 920, Chung-Cheng Rd.,
Zhonghe District, New Taipei City, 23586,
Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
www.nexcom.com
Asia
Taiwan
NexAIoT Headquarters
Industry 4.0 and Cloud Services
12F, No.922, Zhongzheng Rd.,
Zhonghe District, New Taipei City,
23586, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexaiot.com
NexAIoT Co., Ltd.
Taichung Office
16F, No.250, Sec. 2, Chongde Rd.,
Beitun District,
Taichung City, 406, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexaiot.com
NexCOBOT Taiwan Co., Ltd.
13F, No.916, Chung-Cheng Rd.,
Zhonghe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcobot.com
GreenBase Technology Corp.
13F, No.922, Chung-Cheng Rd.,
Zhonghe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.com.tw
EMBUX Technology Co., Ltd.
13F, No.916, Chung-Cheng Rd.,
Zhonghe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.com.tw
TMR Technology Corp.
13F, No.916, Chung-Cheng Rd.,
Zhonghe District,
New Taipei City, 23586, Taiwan, R.O.C.
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.com.tw
China
NEXSEC Incorporated
5F, No.4, No.7 Fengxian Middle Rd.,
(Beike Industrial Park), Haidian District,
Beijing, 100094, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexsec.cn
NEXCOM Shanghai
No.4, 16 Building,
Shanghai OMNI Tech & Science Park
No. 1699, Douhui Rd.,
Shanghai, 201108, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.cn

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. xii NDiS B560-Q User Manual
Preface
NEXGOL Chongqing
1st Building No.999,
Star Boulevard, Yongchuan Dist,
Chongqing City, 402160, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.cn
Beijing NexGemo Technology Co.,Ltd.
Room 205, No.1, Fazhan Rd.,
Beijing International Information Industry Base,
Changping District,
Beijing, 102206, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexgemo.com
Japan
NEXCOM Japan
9F, Tamachi Hara Bldg.,
4-11-5, Shiba Minato-ku,
Tokyo, 108-0014, Japan
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom-jp.com
China
NEXSEC Incorporated
201, Floor 2, Unit 2, Building 15, Yard 3,
Gaolizhang Road, Haidian District,
Beijing, 100094, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexsec.cn
NEXCOM Shanghai
Room 406-407, Building C, No 154, Lane 953,
Jianchuan Road, Minhang District,
Shanghai, 201108, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.cn
NEXCOM Surveillance Technology Corp.
Floor 8, Building B3, Xiufeng Industrial Zone,
GanKeng Community, Buji Street,
LongGang District,
ShenZhen, 518112, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcom.cn
America
USA
NEXCOM USA
46665 Fremont Blvd.,
Fremont CA 94538, USA
Tel: [phone]
Fax: [phone]
Email: [email protected]
www.nexcomusa.com

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. xiii NDiS B560-Q User Manual
Preface
Package Contents
Before continuing, verify that the NDiS B560-Q package that you received is
complete. Your package should have all the items listed in the following table.
Item Part Number Name Qty
1 10W00B56007X0 NDiS B560-Q System 1
2
5060200531X00 Thermal Pad E-LIN 50x25x1.0mm K=4.2W/mk PK404 (for M.2) 1
5060200579X00 Thermal Pad E-LIN 50x25x2mm K=4.2 W/mk PK404+9448 (for M.2) 1
5060200307X00 Thermal Pad For NDiS B426 Heat Sink E-LIN 60x20x1mm S3S (for memory) 1
3
5061711906X00 SSD BRACKET FOR NDiS B560S VER:A YUNGCHAN 2
50311F0326X00 Flat Head Screw Long Fei:F3x5 Nylok Ni+Heat Treatment (for HDD Bracket) 4
5040430536X00 M.2 EXTEND NUT BRACKET FOR aROK5510 VER:A NACTEK 1
50311F0100X00 (H)Round Head Screw w/Spring+Flat Washer Long Fei:P3x6L P3x6 iso/SW6x0.5 NI (for Wall Mount Bracket) 8
50311F0215X00 (H)I HEAD SCREW LONG FEI:I3x5ISO+NYLOK NIGP 1
4 5040430540X00 Wall Mount Bracket for NDiS B560 Series VER:A SHYUNG SHUHN 37.05x190x6.6mm SGCC Nickel Plated 2
5 5090000001X00 THERMAL GREASE FOR NDiS B561 VER:A T-GLOBAL:TG-S808 1
6 7400096009X00 POWER ADAPTER FSP:FSP096-AHAN3(9NA0961442) 1

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. xiv NDiS B560-Q User Manual
Preface
Ordering Information
The following information below provides ordering information for NDiS B560-Q.
NDiS B560-Q (P/N: 10W00B56007X0)
- 9th and 8th generation Intel®Core™ processor (up to 35W) fanless system
- Intel®PCH Q370 chipset

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Chapter 1: Product Introduction
ChaPter 1: ProduCt IntroduCtIon
Key Features
▪Support 8th and 9th Generation Intel®Core™ i7/i5/i3 LGA socket type
embedded processor, up to 35W
▪Intel®PCH Q370
▪Intel®integrated UHD 630 graphic engine
▪Support 3 independent 4K@ 60Hz display output
▪Support 1 x 2.5” SATA HDD Space
▪HDMI 2.0 x3, USB 3.0 x6, GbE LAN x2, COM x4, Line-out x1, Mic-in x1
▪Support M.2 Key B/E/M
▪Fanless design
▪Support a wide temperature range of -20 to 60°C
Overview
Powered by the 9th and 8th generation Intel®Core™ processor series and
Intel®300 Series chipset integrated graphics controller, the NDiS B560-Q
fanless embedded player can handle powerful multimedia content. In
addition, the NDiS B560-Q can be operated in an extended operating
temperature range between -20 to 60°C, with three 4K2K independent
display output and rich connectives including Wi-Fi and 4G, 5G support.
The NDiS B560-Q can fully satisfy customer’s expectation and therefore, be
used in both indoor and outdoor applications such as DOOH, hospitality,
brand promotion, digital menu board, outdoor bus station and even smart
stadium.

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. 2NDiS B560-Q User Manual
Chapter 1: Product Introduction
Physical Features
Front Panel Rear Panel
12V
DC in
HDMI1 HDMI3
HDMI2
Power
Button
USB 3.0
LAN LAN
COM1 Power
LED
COM4
HDD
LED
Reset Mic-In Line-out
USB 3.0
COM3 COM2

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Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪8th and 9th generation Intel®Core™ i7/i5/i3 LGA socket type processor,
up to 35W
– Core™ i7-9700TE, 8 Core, 1.8GHz, 12M Cache
– Core™ i5-9500TE, 6 Core, 2.2GHz, 9M Cache
– Core™ i3-9100TE, 4 Core, 2.2GHz, 6M Cache
– Core™ i7-8700T, 6 Core, 2.4GHz, 12M Cache
– Core™ i5-8500T, 6 Core, 2.1GHz, 9M Cache
– Core™ i3-8100T, 4 Core, 3.1GHz, 6M Cache
Chipset
▪Intel®PCH Q370
▪Intel®UHD graphics 630 series
Main Memory
▪2x 260-pin SO-DIMM sockets, supports DDR4 2666MHz non-ECC,
un-buffered memory up to 32GB (single socket max. 16GB)
I/O Interface-Front
▪1x Power status LED
▪1x HDD status LED
▪1x Power button with LED
▪1x Reset switch
▪2x USB 3.0
▪4x DB9 for COM1~COM4
– COM1: RS232/422/485
– COM2~4: RS232
▪2 x Antenna hole
I/O Interface-Rear
▪+12V DC-in
▪3x HDMI 2.0
▪4x USB3.0
▪1 x Intel®I219-LM GbE LAN port
▪1 x Intel®I226-IT 2.5G Ethernet LAN port
▪1x Mic-in/ 1x Line-out
▪2x Antenna hole
I/O Interface-Internal
▪8CH GPIO support 4x GPO and 4x GPI
▪Onboard TPM 2.0 (by request)
▪Support iAMT
Storage
▪1 x SATA 2.5” HDD/SSD storage space
▪1x M.2 2280 (SATA, PCIe x4)/2242 (by request) Key M socket
Expansion
▪1x M.2 2230 Key E (PCIe x2), support optional Wi-Fi modules
▪1x M.2 3042/3052 Key B (SATA, USB 3.0), support optional 3G, 4G or
5G modules
▪1x SIM slot
Dimensions
▪238 mm (W) x 192 mm (D) x 67.29 mm(H) (9.4” x 7.6” x 2.6”)

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. 4NDiS B560-Q User Manual
Chapter 1: Product Introduction
Power Supply
▪1x External 96W AC/ DC power adapter
Input: 100~240VAC
Output: DC+12VDC
Environment
▪Operating temperature: -20°C to 60°C ambient with 0.7m/s air flow
▪Storage temperature: -20°C to 80°C
▪Humidity: 10 to 90% (non-condensing)
Certification
▪CE Approval (EN55032/55035)
▪FCC Class A (Part 15B)
Operating System
▪Windows 10/11/Linux
Package Information
▪1 pc/carton
▪G.W: 5kgs
▪Dimension: 420 x 275 x 127mm

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. 5NDiS B560-Q User Manual
Chapter 1: Product Introduction
Mechanical Dimensions
192.00
238.00
67.30

Copyright © 2024 NEXCOM International Co., Ltd. All Rights Reserved. 6NDiS B560-Q User Manual
Chapter 2: Jumpers and Connectors
ChaPter 2: JumPers and ConneCtors
This chapter describes how to set the jumpers and connectors on the
NDiS B560-Q motherboard.
Before You Begin
▪Ensure you have a stable, clean working environment. Dust and dirt can
get into components and cause a malfunction. Use containers to keep
small components separated.
▪Adequate lighting and proper tools can prevent you from accidentally
damaging the internal components. Most of the procedures that follow
require only a few simple tools, including the following:
– A Philips screwdriver
– A flat-tipped screwdriver
– A set of jewelers screwdrivers
– A grounding strap
– An anti-static pad
▪Using your fingers can disconnect most of the connections. It is
recommended that you do not use needle-nosed pliers to disconnect
connections as these can damage the soft metal or plastic parts of the
connectors.
▪Before working on internal components, make sure that the power is off.
Ground yourself before touching any internal components, by touching
a metal object. Static electricity can damage many of the electronic
components. Humid environments tend to have less static electricity than
dry environments. A grounding strap is warranted whenever danger of
static electricity exists.
Precautions
Computer components and electronic circuit boards can be damaged by
discharges of static electricity. Working on computers that are still connected
to a power supply can be extremely dangerous.
Follow the guidelines below to avoid damage to your computer or yourself:
▪Always disconnect the unit from the power outlet whenever you are
working inside the case.
▪If possible, wear a grounded wrist strap when you are working inside the
computer case. Alternatively, discharge any static electricity by touching
the bare metal chassis of the unit case, or the bare metal body of any
other grounded appliance.
▪Hold electronic circuit boards by the edges only. Do not touch the
components on the board unless it is necessary to do so. Don’t flex or
stress the circuit board.
▪Leave all components inside the static-proof packaging that they shipped
with until they are ready for installation.
▪Use correct screws and do not over tighten screws.