Nokia RH-53 User manual

Nokia Customer Care
RH-53/54
ISSUE 1 09/2004 Copyright © 2004 Nokia Corporation. All Rights Reserved.
8-System Module

RH-53/54
Nokia Customer Care 8-System Module
2 COMPANY CONFIDENTIAL ISSUE 1 09/2004
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Table of Contents
Page No
Abbreviations ...................................................................................................... 6
Introduction ......................................................................................................... 9
Technical Summary ........................................................................................... 9
List of Features................................................................................................ 10
Technical Specifications .................................................................................. 12
Modes of Operation ......................................................................................... 12
No supply ....................................................................................................... 12
Power off ........................................................................................................ 12
Acting dead .................................................................................................... 13
Active ............................................................................................................. 13
Sleep mode .................................................................................................... 13
Charging ........................................................................................................ 13
Regulators........................................................................................................ 14
DC Characteristics........................................................................................... 15
Supply Voltage Ranges ................................................................................. 15
Regulators Voltage Ranges ........................................................................... 16
Interconnection Diagram.................................................................................. 17
External Signals and Connections................................................................... 17
Battery connector ........................................................................................... 17
Baseband - RF interface ................................................................................ 18
Internal Signals and Connections.................................................................... 18
Audio .............................................................................................................. 18
Speaker (Ringer & Earpiece) ......................................................................... 19
Hinge flex connection ..................................................................................... 19
Baseband board clocks.................................................................................... 21
Functional Description ..................................................................................... 22
Audio External ................................................................................................ 22
Headset Detection ......................................................................................... 22
PnPHF Detection ........................................................................................... 23
Audio Internal................................................................................................... 23
Earpiece/Ringer ............................................................................................. 23
Microphone .................................................................................................... 24
Vibra................................................................................................................. 25
Introduction .................................................................................................... 25
Acoustic design .............................................................................................. 25
Batteries........................................................................................................... 25
Keyboard.......................................................................................................... 26
Display & Keyboard Backlight.......................................................................... 27
LCD Backlight ................................................................................................ 27
Keyboard light effects .................................................................................... 27
LCD.................................................................................................................. 28

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Memory Module............................................................................................... 28
Fold detection-switch....................................................................................... 28
SIM Interface.................................................................................................... 28
SIM -reader .................................................................................................... 29
SIM switch and card detection ....................................................................... 29
Assembly ........................................................................................................... 31
Flex.................................................................................................................. 31
Security.............................................................................................................. 32
Test Interfaces................................................................................................... 33
Connections to Baseband................................................................................ 33
FBUS Interface ................................................................................................ 34
Test points ....................................................................................................... 34
RF Functional Descriptions ............................................................................. 36
RF block diagram............................................................................................. 36
Frequency synthesizers................................................................................... 36
VCXO ............................................................................................................. 36
VCO ............................................................................................................... 36
PLL Synthesizer, Functional Description ....................................................... 37
Receiver........................................................................................................... 37
AGC ............................................................................................................... 38
Transmitter....................................................................................................... 38
Dual band FEM .............................................................................................. 38
Power control scheme ................................................................................... 38
List of Figures
Page No
Fig 1 RH-53/54 bb block diagram ......................................................................... 9
Fig 2 IPower distribution diagram.......................................................................... 17
Fig 3 Flex con. pin out........................................................................................... 20
Fig 4 External audio interface ............................................................................... 22
Fig 5 Earpiece/ringer interface.............................................................................. 24
Fig 6 Microphone interface.................................................................................... 25
Fig 7 BL-4C battery............................................................................................... 26
Fig 8 Keyboard PWB layout.................................................................................. 26
Fig 9 UEM, UPP and SIM interface....................................................................... 28
Fig 10 Upper block B-cover SIM-slide slot............................................................ 29
Fig 11 SIM draw and switch.................................................................................. 30
Fig 12 Test pattern............................................................................................... 33
Fig 13 RF block diagram....................................................................................... 36
Fig 14 Simplified BB, either I or Q channel........................................................... 37
Fig 15 Power loop................................................................................................. 38

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Abbreviations
Abbr. Description
ADC Analog Digital Connector
ASIC Application Specific Integrated Circuit
ATR Answer To Reset
BB Baseband
BL-4C Battery type.
BSI Battery Size Indicator
Cbus Control bus (internal phone interface between UPP-UEM)
CTSI Clock Timing Sleep and Interrupt
Dbus DSP controlled bus (Internal phone interface between UPP-UEM)
DC Direct Current
DCT4.0 Digital Core Technology, generation 4.0
DSP Digital Signal Processor
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
Fbus Fast Bus, asynchronous message bus connected to DSP (communications
bus)
FPC Flexible printed circuit
GENIO General Purpose Input/Output
GPRS General Packed Radio Services
HW Hardware
IF Interface
IMEI International Mobile Equipment Identity
LCD Liquid Crystal Display
LDO Low Drop Out
LED Light Emitting Diode
Li-Ion Lithium Ion battery
Lion Battery program, Salo - Finland
LN Lotus Notes

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MALT Medium And Loud Transducer
Mbus Asynchronous message bus connected to MCU (phone control interface).
Slow message bus for control data.
MCU Micro Controller Unit
NO_SUPPLY UEM state where UEM has no supply what so ever
NTC Negative temperature Coefficient, temperature sensitive resistor used as a
temperature sensor.
PA Power Amplifier (RF)
PDM Pulse Density Modulation
Penny HDA11, Phone program (1100)m Copenhagen-Denmark
Phoenix SW tool of DCT4.x
Pippi Hdb12, Phone program (3510), Copenhagen-Denmark
PLL Phase locked loop
PnPHF Plug and Play Handsfree
PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators
PWB Printed Wired Board
PWR_OFF UEM state where phone is off
PWRONX Signal from power on key.
R&D Research and development
RESET UEM state where regulators are enabled
RTC UEM internal Real Time Clock
SIM Subscriber Identification Module
SLEEP UEM power saving state controlled by UPP
SPR Standard Product Requirements
SRAM Static RAM
SW Software
TB To Be Defined
TI Texas Instruments, American company
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VBAT Main battery voltage

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VCHAR Charger input voltage
VCHARDET Charger detection threshold level
VMSTR+,
VMSTR Master Reset threshold level

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Introduction
This document specifies the baseband module for the RH-53/54 platform program. The base-
band module includes the baseband engine chipset, the UI components and the acoustical
parts for the transceiver.
RH-53/54 is a hand-portable dualband GSM/GPRS 900/1800MHz fold-phone, having the
DCT4 generation baseband (UEM/UPP) and RF (MJOELNER) circuitry. The RH-53 platform
also supports a GSM 850/1900 US variant called RH-54. RH-53 platform is based on common
baseband engine 4.0.
■ Technical Summary
The baseband module contains 2 main ASICs named the UEM and UPP. The module further-
more contains a Combo Flash IC of 64Mbit flash and 16Mbit RAM.
Figure 1:RH-53/54 bb block diagram
Interface

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The UEM suppliesboth the baseband module as well as the RF module with a series of voltage
regulators. Both the RF and baseband modules are supplied with regulated voltages of 2.78 V
and 1.8V. UEM includes 6 linear LDO (low drop-out) regulators for baseband and 7 regulators
for RF. The UEM is furthermore supplying the baseband SIM interface with a programmable
voltage of either 1.8 V or 3.0 V. The core of the UPP is supplied with a programmable voltage
of 1.0 V, 1.3 V, 1.5 V or 1.8 V.
UPP operates from a 26MHz clock, coming from the RF ASIC MJOELNER, the 26 MHz clock
is internally divided by two, to the nominal system clock of 13MHz. DSP and MCU contain
phase locked loop (PLL) clock multipliers, which can multiply the system frequency by factors
from 0.25 to 31.
The UEM contains a real-time clock, sliced from the 32768 Hz crystal oscillators. The 32768
Hz clock is fed to the UPP as a sleep clock.
The communication between the UEM and the UPP is done via the bi-directional serial busses
CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1 MHz set
by SW. The DBUS is controlled by the DSP and operates at a speed of 13 MHz. Both proces-
sors are located in the UPP.
The UEM ASIC handles the interface between the baseband and the RF section.UEM pro-
vides A/D and D/A conversion of the in-phase, quadrature receive/transmit signal paths and
also A/D and D/A conversions of received and transmitted audio signals to and from the user
interface. The UEM supplies the analog signals to RF section according to the UPP DSP digital
control. RF ASIC MJOELNER is controlled through UPP RFBUS serial interface. There are
also separate signals for PDM coded audio. Digital speech processing is handled by the DSP
inside UPP ASIC.
UEM is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and
the analog parts are running from the analog supply 2.78V also VBAT is directly used by some
blocks.
The baseband supports both internal and external microphone inputs and speaker outputs.
RH-53/54 has two external serial control interfaces: FBUS and MBUS. These busses can be
accessed through production test pattern as described in section 8.
RH-53/54 transceiver modules are implemented on 8 layers and the surface are with selective
Ni/Au OSP.
■ List of Features
RH-53 platform common features:
• Jack UI style 20 keys (with 4 ways scroll) ESD-proof layout, multiple keypress.
• Battery BL-4C
•UEMK
• UPP8Mv2.6/2.10 Lead Free
• Combo Flash 8MByte flash memory and 2MByte PSRAM (64Mbit+16Mbit)
• Power key integrated in keypad (common with End key)
• Internal vibra
• Colour display (colures 4096, resolution: 130 columns x 130 rows, technology:
CSTN)

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 11
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• Polyphonic ringing tones
• 2 white LED’s for LCD Backlight.
• 2 white LEDs for key mat & 3 blue LED’s for Light-effect in key mat.
•JAVA
•MMS
•GPRS

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Technical Specifications
■ Modes of Operation
RH-53/54 baseband engine has six different ‘normal’ operating modes:
•Νo supply
• Power off
•Αcting dead
•Active
•Sleep
• Charging
No supply
In this mode the phone has no supply voltage.
The phone enters this mode if the battery is disconnected, or the battery voltage drops below
VMSTR- (1.8V~2.0V)
The phone exits ‘No supply’ mode, into hardware ‘Reset’ mode (not described here), after a
20ms delay, if the battery voltage rises above VMSTR+ (2.0~2.2V). This will occur either by re-
placing the battery with a new battery (VBAT>VMSTR+), or by connectinga charger and charging
the battery above VMSTR+.
The phone exits ‘Reset’ mode into ‘Active’/Acting dead’ mode when the battery voltage rises
above VCOFF+ (3.0~3.2V) within the watchdog time period, and subsequently stays above
VCOFF- (2.7~2.9V) for a minimum of 240.5ms. If the battery voltage has not risen beyond
VCOFF+ before the internal watchdog elapses the phone is forced into ‘Power off’ mode instead.
Power off
In this mode the phone is powered off, but has a supply voltage.
The phone enters ‘Power off’ mode from all other modes, except ‘No supply’, if internal watch-
dog elapses. VRTC regulator is active (enabled), and supplied from the main battery (the RTC
status depends on whether RTC was enabled or not when entering ‘Power off’ mode).
The phone exits ‘Power off’ mode, into hardware ‘Reset’ mode (not described here), after a
20ms delay, if either of the following conditions are met:
• Power on button detected (PwrOffX).
• Charger connection detected (VCharDet)(VCharIn>VCHDET+ (1.9~2.1V)).
• RTC alarm detected (RTC_ALARM).
The phone exits ‘Reset’ mode into ‘Active’/Acting dead’ mode when the battery voltage rises
above VCOFF+, and stays above VCOFF- for a minimum of 240.5ms.

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Acting dead
This mode is just a sub mode of normal ‘Active’ mode, where everything, except for VSIM and
the RF parts, is powered up. This mode is only used for when the phone is in ‘Power off’ or ‘No
supply’ mode and a charger is connected. To the user, the phone acts as if it was switched off.
A battery-charging alert is given and/or a battery charging indication on the display is shown,
toacknowledgetheuserthatthebatteryisbeingcharged.The softwaredifferentiation between
‘Acting dead’ and ‘Active’ is based on whether or not a power on button was initially detected
(PwrOffX).
The phone exits from ‘Power off’ or ‘No supply’ mode, into hardware ‘Reset’ mode (not de-
scribed here), after a 20ms delay, if a charger connection is detected (VCharD-
et)(VCharIn>VCHDET+).
The phone then enters ‘Acting dead’ mode, after a 100ms delay, if the battery voltage rises
above VCOFF+ (sub mode of normal ‘Active’).
The phone exits ‘Acting dead’, into ‘Active’ mode, if the power on button is detected (PwrOffX).
Active
In the active mode the phone is in normal operation, scanning for channels, listening to a base
station, transmitting and processing information. There are several sub-states in the active
mode depending on if the phone is in burst reception, burst transmission, if DSP is working, if
the phone is folded or unfolded etc.
In active mode the RF regulators are controlled by SW writing into UEMK’s registers wanted
settings: VR1B must be kept disabled. VR2 can be enabledor forced into low quiescent current
mode. VR3 is always enabled in active mode. VR4 -VR7 can be enabled, disabled or forced
into low quiescent current mode.
Sleep mode
The phone enters ‘Sleep’ mode when the UPP goes into standby mode and forces the UEM
into sleep mode by pulling SleepX low.
The UEM puts VCORE, VIO and VFLASH1 into sleep mode and disables VANA and all of the
RF regulators except VR2, VSIM is also put into sleep mode if supported by the SIM card. The
main oscillator (26MHz) is also shut down and the 32 kHz sleep clock oscillator is used as ref-
erence clock for the baseband.
The phone exits sleep mode when SleepX is set high by the UPP, or by expiration of a sleep
clock counter in the UEM or by some external interrupt, generated by a charger connection,
key press, headset connection etc.
Charging
Charging can be performed in parallel with any other operating mode. The charging will be con-
trolled by hardware until the phone enters either ‘Sleep’, ‘Acting dead’ or ‘Active’ mode. Here-
after it will be controlled by software.

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A BSI resistor inside the battery pack indicates the battery type/size. The resistor value corre-
sponds to a specific battery capacity and technology.
The battery voltage, temperature, size and current are measured by the UEM, and controlled
by the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEM controls the charging current deliv-
ered from the charger to the battery. The battery voltage rise is limited by turning the UEM
switch off when the battery voltage has reached VBATLim (programmable charging cut-off lim-
its 3.6V / 5.0V / 5.25V). Charge current is monitored by measuring the voltage drop across a
0.22 ohm resistor.
■ Regulators
Overview of the regulator state in ‘Active’, ‘Acting dead’ and ‘Sleep’ mode is shown in table 1.
Table 1: Overview
Regulator Active Acting dead Sleep
VFLASH1 Enabled Enabled Sleep mode
VFLASH2 Disabled (Not used) Disabled (Not used) Disabled (Not used)
VANA Enabled Enabled Disabled
VIO Enabled Enabled Sleep mode
VCORE Enabled Enabled Sleep mode
VSIM Enabled (voltage control-
led by software) Disabled Enabled/Sleep mode (depending on SIM
card)
VR1A Enabled Enabled Disabled
VR1B Disabled (Not used) Disabled (Not used) Disabled (Not used)
VR2 Enabled (voltage control-
led by software) Enabled (voltage control- led by software) Enabled (voltage con- trolled by software)
VR3 Enabled Disabled Disabled
VR4 Disabled Disabled Disabled
VR5 Enabled Disabled Disabled
VR6 Enabled Disabled Disabled
VR7 Enabled Disabled Disabled
Regulator Active Acting dead Sleep
IPA1-2 Disabled (not used) Disabled (not used) Disabled (not used)

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 15
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■ DC Characteristics
Supply Voltage Ranges
Table 2: Supply voltage ranges
Following voltages are assumed as normal and extreme voltages for used battery:
Table 3: Battery voltages
1 TA will test with the nominal voltage at an 85% range (0.85 x 3.7V = 3.145V); therefore the
nominal voltage has been set to 3.8V. ADC settings in the SW might shutdown the phone
above the min value. During fast charging of an empty battery, the max voltage might exceed
this value. Voltages between 4.20 and 4.60 might appear for a short while.
Signal Rating
Battery Voltage 0 ... 4.39V (VBAT)
Flashing Voltage 0 … 5.15V
Charger Input Voltage -0.3 ... 9.2VRMS (16,9 Vpeak)
Source Min Nom Max Note
VBAT 3.21V 3.80V 4.39V 1
Vcoff+ 3.0V 3.1 3.2 HW off to on
Vcoff- 2.7V 2.8V 2.9V HW on to off
Vmstr+ 2.0V 2.1V 2.2V HW off to on
Vmstr- 1.8V 1.9V 2.0V HW on to off
Sw shutdown - 3.1V - In Call

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Regulators Voltage Ranges
Table 4: Regulators voltage ranges
Table 5: RF regulators
Source Min Nom Max Note
VANA 2.70V 2.78V 2.86V Imax = 80mA
VFLASH1 2.70V 2.78V 2.86V Imax = 70mA
Isleep = 4mA
VFLASH2 2.70V 2.78V 2.86V Not used
VSIM 1.745V 2.91V 1.8V 3.0V 1.855V 3.09V Imax = 25mA
Isleep =
0.5mA
VIO 1.72V 1.8V 1.88V Imax =150mA
Isleep =
0.5mA
VCORE Higher
range 1.000V1.140V 1.235V1.425V
1.710V
1.053V 1.2V 1.3V
1.5V 1.8V 1.106V 1.260V 1.365V 1.575V
1.890V
Imax=200mA
ISleep =
0.2mA Used
voltages:
(c035)=1.5V
(c027) = 1.3V
Source Min Nom Max Note
VR1A 4.6V 4.75V 4.9V Imax = 10mA
VR1B 4.6V 4.75V 4.9V Not used
VR2 2.70V 2.78V 2.86V Imax=100mA
VR3 2.70V 2.78V 2.86V Imax = 20mA
VR4 2.70V 2.78V 2.86V Not used
VR5 2.70V 2.78V 2.86V Imax = 50mA
VR6 2.70V 2.78V 2.86V Imax = 50mA
VR7 2.70V 2.78V 2.86V Imax = 45mA

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 17
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■ Interconnection Diagram
Figure 2:IPower distribution diagram
■ External Signals and Connections
Battery connector
As a difference to previous NMP Battery Interfaces, BTEMP has been removed and battery
temperature is estimated by measurement in Transceiver PWB with a separate NTC resistor.
Thus the Battery Interface has only 3 contacts. BSI ranges has been altered and Battery Inter-
face will not support NiMh batteries.
Table 6: Battey connetor
Name Description Test usage
VBAT Battery voltage terminal. Battery calibration.
GND Battery ground terminal.
BSI Battery size identification. Flash and local mode forcing.
System Connecto
r
Battery CHACON
RF Regulators
Baseband
Regulators
6
VR2-7
VR1A
VIO
VSIM
VCORE
VANA
VFLASH1
RTC
PA Supply
SIM
UPP
LCD
FLASH
Baseband UEM
Boomer
VBAT
LED
Driver
LED+

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Baseband - RF interface
The interface between the baseband and the RF can be divided into three categories:
- The digital interface from the UPP to the RF ASIC (Mjoelner). The serial digital interface is
used to control the operation of the different blocks in the RF ASICs.
- The analogue interface between UEM andthe RF. The analogue interface consists of RX and
TXconvertersignals.The power amplifiercontrolsignalTXCandtheAFCsignalcomes as well
from the UEM.
- Reference clock interface between Mjoelner and UPP, which supplies the 26Mhz system
clock for the UPP.
■ Internal Signals and Connections
The tables below describe internal signals. The signal names can be found on the schematic
for the PWB.
Audio
Table 7: Internal microphone
Table 8: Internal speaker (Differential output EARP & EARN)
Signal Min No
mMax Conditi on Note
MIC1P (Differential input P) - 5mV - TBD
MIC1N (Differential input N) - 5mV - TBD
MICB1 (Microphone Bias) 2.0
V2.1 V2.25 V DC
External loading of MICB1 - - 600uA DC
Signal Min No
mMax Units Note
Output voltage swing 4.0 - - Vpp Differential output
Load Resistance (EARP to
EARN)25,5 27, 228,9 W 2*10Ù 5% + 7,2Ù±10%
Load Capacitance (EARP to
EARN) - - 50 nF

ISSUE 1 09/2004 COMPANY CONFIDENTIAL 19
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Speaker (Ringer & Earpiece)
Table 9: Connections between UPP and Boomer
Table 10: Connections between UEM/Battery and Boomer
Hinge flex connection
Connection between main engine (lower block) and upper is done by hinge flex via 30 pins
board to board connector. Hinge flex includes Earpiece/Ringer, Display, SIM, LCD led and Vi-
bra signals.
Table 11: Hinge flex signals
Signal From To Parameter Min. Max. Unit Notes
Shutdown
(Only
Ringer)
UPP
GENIO[14
]
Boomer
Shut-
down (pin
5)
Vih Vil 1.2 - - 0.4 V V Boomer
Shutdown
treshold
levels
Signal
name From To Paramete rMin. Max. Unit Notes
XAU-
DIO[1] Fil-
tered
signal
Differential
between HF and
HFCM. No direct
connection
between UEM
and Boomer
Boome
rOutput Swing - 80mV Vpp Long-term consump-
tion
VBAT Battery Boome
r (pin 6) Supply 3.2 4.39 V Lower limit is SW cut-
off
Pin Signal Comments
1,2,3,4 GND
5 LCD_CSL Display Serial Clock
6 LCD_CSX Display Chip Select
7,8,9 GND
10 Vibra PWM signal
11 Vbat For Vibra
12,13,14,15 GND
16 SIMCARD_Det Detection of SIM Card
17 VSIM 3.0V/1.8V for SIM
18 SIM_RST SIM Reset
19 SIM_IO SIM Data
20 SIM_CLK SIM Clock

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Figure 3:Flex con. pin out
Pin Signal Comments
21 GND
22 EARP For MALT
23 EARN For MALT
24 GND
25 VDD "Vflash1" 2.78 V for Display
26 LED- Return from LEDs
27 LED+ Pos supply for LEDs
28 VDDI "Vio" 1.80 V for Display
29 LCD_RESETX Display Reset
30 LCD_SI Display Serial Data
Pin 30 Pin 1