Panasonic HL-G1 A-C5 Series User manual

Compact Laser Displacement Sensor
HL-G1 Series
User's Manual
WUME-HLG1-6
2013.12 panasonic.net/id/pidsx/global

Introduction
Thank you for purchasing the HL-G1-series Compact Laser Displacement Sensor.
Read this manual carefully and be sure you understand the information provided
before attempting to install and operate the product so that the product will fully
demonstrate its superior performance. Refer to the website of Panasonic Industrial
Devices SUNX Co., Ltd. (http://panasonic.net/id/pidsx/global) for the latest
information on the product as well as the latest version of the manual.
Note
1. The illustrations of the product in the manual may differ from the actual design of the
product.
2. The contents of this user's manual may change without notice for possible improvements
in the future.
3. All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system, or transmitted, in any form, or by any means, mechanical, electronic,
photocopying, recording, or otherwise, without the prior written permission of Panasonic
Industrial Devices SUNX Co., Ltd.
4. The utmost attention has been paid to the creation of this manual. Should you find any
errors, omissions or inaccuracies, contact the nearest office of Panasonic Industrial
Devices SUNX Co., Ltd.
5. Panasonic Industrial Devices SUNX Co., Ltd. shall be in no case responsible for any
consequences resulting from your operation of the product.
Conventions
The following conventions are used to indicate and classify precautions in this manual.
Always heed the information provided with them.
Indicates information that, if not heeded, is likely to result in
loss of life or serious injury.
Indicates information that, if not heeded, could result in
relatively serious or minor injury, damage to the product, or
faulty operation.
Explains matters that should be observed or mistakes that
the user is apt to make.
Explains items that should be kept in mind, relevant
information in detail, and references.
Explains useful operating conditions and technical tips
(know-how).

Introduction
1
About this Manual
Chapter
1
Chapter
2
Chapter
3
Chapter
4
Chapter
5
Chapter
6
1
2
3
4
5
6
Introduction provides precautions on the safe and
correct use of this system. Be sure to read the
precautions provided in this section.
Introduction
仕様
I/O Terminal Block
Before Use
Chapter 1 provides information on the configuration,
installation, and connection of the system (including the
sensor head and Setting and monitoring software
HL-G1SMI.
Chapter 2 provides information on the I/O lines o
f
the sensor head.
センサヘッドの仕様を記載しています。
第7章
Functions Chapter 3 provides information on the functions o
f
the system.
Chapter 4 provides information on RS-422 and
RS-485 communications control.
Communications
Control Chapter 5 provides information on the
troubleshooting of the system.
Troubleshooting
Specifications Chapter 6 provides the specifications of the senso
r
head.

Introduction
2
Table of Contents
About this Manual·······························1
Table of Contents ·······························2
Safety Precautions·····························4
WARNING········································4
Caution············································4
Correct Handling ·······························5
Installation Environment·······················5
Operating Environment························5
Ambient Temperature, Humidity, and
Illuminance············································5
Power Supply Voltage·······························6
Environment ···········································6
Protective Structure ····························6
Warm-up Time···································7
Countermeasures against Noise············7
Power Supply····································8
Applicable Power Supply···························8
Power Supply Sequence for Sensor Head ····8
Instantaneous Power Failure·················8
Applicable Standards / Regulations ········9
CE Compliant Conditions ··························9
Contact ｆｏｒ ＣＥ·····································9
Laser Product Handling ····················10
JIS/IEC/GB····································· 10
Laser Diode Sensor ·······························10
Precautions ··········································10
Warning label········································10
FDA ···············································11
Export to US········································· 11
FDA Standards······································12
Maintenance and Inspection··············14
Maintenance Instructions·························14
Inspection ············································14
1Before Use···························1-1
1-1 System Configuration··················1-2
1-1-1 System Configuration ················ 1-2
1-1-2 List of System Components &
Accessories ··································· 1-3
Sensor Head Accessories·······················1-3
Extension Cable for Sensor Head
(Optional for High-function Type Only) ·····1-4
Setting and Monitoring Software
HL-G1SMI (Optional for High-function
Type Only) ·········································1-4
Compact Console (Optional for High-function
Type Only)···········································1-5
1-2 Part Names and Functions ···········1-6
1-3 Installation Method······················1-7
Extension Cable ···································1-7
Mounting Direction of Sensor Head ··········1-8
1-4 Measurement of transparent objects
·················································1-12
2I/O Terminal Block··················2-1
2-1 Functions andArrangements of I/O Terminal
Block ·············································2-2
2-2 I/O Circuit··································2-4
NPN Type ···········································2-4
PNP Type············································2-5
2-3 Analog Output Circuit ··················2-6
2-4 Timing Chart······························2-7
2-5 Conditions WhenOutput Data Become Unfixed
···················································2-9
3Functions·····························3-1
3-1 Classification of Functions············3-2
3-2 Function List & Initial Values ·········3-2
3-3 Operation of Each Function··········3-5
3-3-1 Basic Operation························3-5
Panel Configuration·······························3-5
Basic Operation····································3-6
Screen Transition in Setting Mode············3-9
3-3-2 Memory Change······················3-11
3-3-3 Sensing Setting······················ 3-13
Sampling Cycle·································· 3-13
Shutter Time······································ 3-14
Light Intensity Monitor·························· 3-15
3-3-4 Data Processing Settings·········· 3-16
Average Times··································· 3-16
Analysis Mode···································· 3-17
Span ················································ 3-19
Offset··············································· 3-20
Zero-set OFF····································· 3-21
3-3-5 Output Settings ······················ 3-22
Judgment Output Selection··················· 3-22
Displacement Judgment······················· 3-24
Judgment Output OFF Delay ················ 3-25
Measurement Value Display on Panel····· 3-27
3-3-6 Analog Settings······················ 3-28
Analog Output Selection······················· 3-28
Analog Scaling··································· 3-29

Introduction
3
3-3-7 Alarm Settings························ 3-31
Analog Output at Alarm ························ 3-31
Digital Output at Alarm························· 3-32
Alarm Delay Times······························ 3-33
3-3-8 COM Settings························· 3-34
Terminating Resistor Selection ·············· 3-34
Sensor No.········································ 3-35
Baud Rate········································· 3-36
Connection Mode ······························· 3-37
Sending Delay Time···························· 3-38
3-3-9 System Settings······················ 3-39
Timing Mode······································ 3-39
Laser Control····································· 3-40
Eco Mode ········································· 3-41
View Version······································ 3-42
3-3-10 Other System Settings············ 3-43
Initialize············································ 3-43
Save················································ 3-44
3-3-11 Measurement Control with
External Input ······························· 3-45
Timing·············································· 3-45
Zero Set ··········································· 3-45
Reset··············································· 3-46
3-3-12 Buffering Settings (High-function
type only)····································· 3-47
Data Buffering Operation······················ 3-48
Buffering Mode··································· 3-49
Buffering Rate···································· 3-50
Accumulated Amount··························· 3-50
Trigger Points ···································· 3-51
Trigger Delay····································· 3-51
Trigger Conditions······························· 3-52
Buffering Operation····························· 3-53
Status Readout ·································· 3-53
Last Data Point ·································· 3-53
Binary Readout of Buffering Data··········· 3-54
4Communications Control·········4-1
4-1 Communications Specifications·····4-2
Specifications·······································4-2
Pin Arrangement···································4-2
Connecting Example with External Device·4-3
Communications Protocol·······················4-5
Communications Condition Changes ········4-5
4-2 Type and Format of Commands ····4-6
4-2-1 Commands······························4-6
Data Transmission/Reception··················4-6
4-2-2 Command Formats····················4-8
Error Response·································· 4-15
BCC················································· 4-17
4-3 Command List ·························4-18
Basic Settings···································· 4-18
Data Processing Settings ····················· 4-18
Output Settings ·································· 4-19
Analog Settings·································· 4-20
Alarm Settings···································· 4-20
System Settings ································· 4-21
Read Commands ······························· 4-22
Buffering Commands··························· 4-22
4-4 Setting Address List ··················4-24
■Command Formats(MEWTOCOL)········ 4-25
■Error Response································ 4-25
■Sensing Settings ······························ 4-26
Data Processing Settings ····················· 4-26
Output Settings ·································· 4-27
Analog Settings·································· 4-27
Alarm Settings···································· 4-28
System Settings ································· 4-28
■Data Readout ·································· 4-28
■Buffering settings······························ 4-29
■Setting for Programmable Display (GT
Series) ············································ 4-30
5Troubleshooting·····················5-1
5-1 Corrective Actions······················ 5-2
5-2 Initialization ······························ 5-6
6Specifications························6-1
6-1 Sensor Head Specifications········· 6-2
6-2 Dimensions ······························ 6-7
Sensor Head ·······································6-7
6-3 Characteristics ·························6-12
Beam Diameter·································· 6-12
Mutual Interference Area ······················ 6-14
Output Characteristics························· 6-17
Revision history ···································· 6-19

Introduction
4
Safety Precautions
This product is used to detect objects, and does not incorporate control functions
for the purpose of maintaining safety including the prevention of accidents.
Do not use this product as a human sensor to protect human bodies.
Use products that conform to the laws, regulations, and international standards,
such as OSHA, ANSI, and IEC standards, for applications protecting human
bodies.
In order to ensure the correct use of the product, read this user manual carefully
before use.
WARNING
●Incorporate safety measures, such as a double safety mechanism, into the
system if the use of the system is likely to result in injury or serious
consequential loss.
●Do not use the system in combustion gas atmospheres. Otherwise, the
system may result in explosion.
●This product was developed and manufactured for use in industrial
environments.
Caution
●Always observe the specifications including the ratings and ambient
conditions.
Otherwise, the system may result in overheating or generate smoke.
●Do not disassemble or modify the system. Otherwise, an electric shock may
be received or the system may generate smoke.
●Do not touch the wires when the system is energized. Otherwise, an electric
shock may be received.

Introduction
5
Correct Handling
Pay attention to the following items when installing and using the system.
Installation Environment
Do not install the system in the following places.
• Places where the ambient temperature, humidity, or the illumination level of the
light receiving surface is in excess of the operating environmental conditions.
(Refer to “Operating Environment”.)
• Places that causes dew condensation as a result of radical temperature changes.
• Places with corrosive gas or flammable gas.
• Places with excessive dust, iron powder, or salt.
• Places where organic solvents, such as benzine, paint thinner, and alcohol, and
strong alkaline substances, such as ammonia and sodium hydroxide are likely to
adhere to the system.
• Places with strong vibration and shock.
• Places exposed to direct sunlight.
• Places where water, oil, or chemicals are sprayed.
• Places where a heavy load is imposed on the sensor head.
Operating Environment
Ambient Temperature, Humidity, and Illuminance
Ambient temperature
• Use the system within the range of the specifications ( refer to Chapter 6
“Specifications”).
Sensor head: -10°C to 45°C
• Keep the following storage temperature range in the case of storing the sensor
head.
Sensor head: -20°C to 60°C
• The life of the semiconductor laser depends on the operating ambient temperature.
Take appropriate measures, such as the use of a cooling fan, to drop the ambient
temperature of the sensor head as much as possible if the sensor head is used
close to heat radiating objects.
• The sensor head radiates heat as well. Therefore, be sure to install the sensor head
in places with as good thermal conductivity as possible. Mount the sensor head to
an aluminum or steel plate with a minimum surface area of 200 cm2if the

Introduction
6
ambient temperature is 40°C or higher.
In the case of installing two or more sensor heads in parallel, mount each sensor
head to an aluminum or steel plate with a minimum surface area of 200 cm2and
make sure that the ambient temperature does not exceed 40°C.
Ambient humidity
• Use the system within a relative humidity (RH) range of 35% to 85%.
Do not use the system in places that may cause dew condensation as a result of
radical temperature changes.
Ambient illuminance of light receiving surface
Make sure that the illumination level of the light receiving surface does not exceed
3,000 lx under incandescent light.
Power Supply Voltage
Be sure to supply a rated voltage of 21.6 to 26.4 VDC.
Environment
• The internal circuit may be damaged if an external surge voltage (single-polarity,
full-wave voltage) in excess of 500 V ± 1.2 x 50 μs is imposed. Insert a surge
absorber between power input terminals if the external surge voltage is likely to
exceed 500 V.
• Always keep the emitter and receiver of the sensor head clean. Make sure that the
emitter and receiver are free of substances that refract light, such as water, oil, or
fingerprints, or surface water, or matters that block light, such as dust and dirt.
Clean the emitter and receiver with a soft lint-free cloth or lens cleaning paper.
• Check that the receiver will not receive direct ambient light the same as the laser
light in wavelength, such as sunlight. Mount an appropriate object, such as a light
shield plate, to the sensor head if high accuracy is especially required.
• Do not use the system in places with flammable or corrosive gas or excessive
dust, places where water is sprayed, places exposed to direct sunlight, or places
with strong vibration or shock.
Protective Structure
• The sensor head is of penetration-resistant type, but the connector is not of dust-,
water-, or corrosion-proof construction. Therefore, Do not use the product
underwater or in the rain. Pay attention to the operating environment.

Introduction
7
Warm-up Time
In order to ensure the performance of the system, allow a warm-up time of at least
30 minutes after the system is turned ON.
Countermeasures against Noise
• Install the system separated as much as possible from noise generating sources,
such as high-tension lines, high-voltage equipment, power lines, power
equipment, machines generating high-voltage ON/OFF surges, welding machines,
and inverter motors.
• Install the system separated as much as possible from radio equipment incorporating
transmission circuitry, such as amateur radio transmitters.
・Do not touch the connector parts when the system is energized. Keep in mind that
the internal circuit may be damaged if an excessive level of static electricity is
imposed on the connector parts.
• Separate the sensor cable from other wires at least 100 mm, and make sure that
the sensor cable is not in parallel with them. Separate the sensor cable from
high-voltage and power circuit lines. Shield the sensor cable with grounded
conduits if it is unavoidable to lay the sensor cable together with high-voltage or
power circuit lines.
• Separate the I/O signal lines at least 100 mm away from power lines and power
supply lines. All signal lines should be connected as short as possible.
• The analog output of the system is adversely influenced by heavy noise in the
power supply. In that case, use a noise filter or noise-cut transformer.
• It is recommended to use shield cables for I/O signal wires and connect the
shields to the frame ground (FG) for countermeasures against noise.
• The analog output is easily affected by external noise. Use the shield cable and
lay it as short as possible.
• Ground the FG at a resistance not exceeding 100 independently. The FG may
be adversely affected if the ground is shared with other equipment.

Introduction
8
Power Supply
Applicable Power Supply
• Select a power supply with a maximum ripple of 0.5 V (peak to peak) and a minimum
current capacity of 0.5 A.
• Be sure to ground the FG terminal in order to prevent an adverse influence of
high-frequency noise if a commercially available switching regulator is used for the
power supply.
• A transformer may be connected to the power supply on the condition that the
transformer is of isolation type. The product or the power supply may be damaged if
an auto transformer is used.
• In order to protect the system from abnormally high voltages from the power supply
line, be sure to use an isolated power supply with a built-in protective circuit.
• In the case of using a power supply that does not incorporate a protective circuit, be
sure to connect the power supply to the system through a protective element, such as a
fuse.
Power Supply Sequence for Sensor Head
• Arrange a power supply sequence so that the sensor head will be turned ON
earlier than the I/O power supply.
• Arrange a power supply sequence so that the I/O power supply will be turned ON
earlier than the sensor head.
• Do not turn ON the sensor head again within 10 seconds after the sensor head is
turned OFF.
• The system will be ready to operate approximately 40 to 50 seconds after the
system is turned ON, depending on the contents of settings. No outputs are
determined during startup. Do not output anything during the period.
• An analog voltage of 11 V and an analog current of approximately 21.6 mA will
be output until the system becomes ready to operate.
• Do not turn OFF the system while system settings are being saved. In the worst
case, the sensor head system may be damaged and fail to restart.
Instantaneous Power Failure
If an instantaneous power failure occurs, the system will operate continuously or
go to the initial power-on state, depending on the duration of the power failure. Do
not use the system in environments where instantaneous power failures occur.

Introduction
9
Applicable Standards / Regulations
 CE Compliant Conditions
Make sure that the length of signal and power lines connected to the product is less
than 30 m.
Attach a ferrite core to the head cable as shown below.
Recommended ferrite core: SEIWA ELECTRIC MFG. Co., Ltd.E04SR200935AB
or equivalent one
 Contact ｆｏｒ ＣＥ
Panasonic Marketing Europe GmbH Panasonic Testing Center
Winsbergring 15, 22525 Hamburg,Germany
30mm以下
30 mm max.

Introduction
10
Laser Product Handling
JIS/IEC/GB
Laser Diode Sensor
The laser is classified in accordance with JIS (JIS C 6802: 2005), IEC (IEC
60825-1: 2007) and GB (GB 7247.1: 2012) standards.
Model No. HL-G1□□-A-C5
HL-G1□□-S-J
HL-G1□□A-RA-C5
HL-G1□□A-RS-J
Wavelength 655 nm 655 nm
Max. output 1 mW 0.39 mW
Class 2 1
Precautions
1) Be careful not to stare at the laser beam directly or the reflected light of the
mirror surface.
2) Install the sensor so the laser beam will be located higher or lower than eye level
in order not to watch the beam directly while the system is in operation.
3) Contact the nearest office of Panasonic Industrial Devices SUNX Co., Ltd. if the
system breaks down. The product is not provided with a function to stop laser
beam radiation automatically when the sensor head is disassembled. Do not
disassemble the sensor head, or otherwise you may be exposed to the laser beam.
4) Do not use the system in methods other than that specified in this manual.
You may be exposed to hazardous laser radiation if the system is
controlled or adjusted in procedures not specified in this manual.
5) Read the descriptions of the warning label carefully before use.
The warning label (English) is affixed to the side of the sensor head. Warning
labels in Japanese, Korean, and Chinese are enclosed. Use them as needed.

Introduction
11
Warning label
●Diffuse reflection type
In English In Japanese
In Chinese In Korean
<Label position>
●Specular reflection type
<Label position>

Introduction
12
FDA
Export to US
The laser product mounted on equipment and exported to the United States is
subjected to the regulation of the Food and Drug Administration (FDA). In order to
prevent the users’ injury caused by laser products, the FDA specifies PART 1040
(Performance Standards for Light-Emitting Products). The FDA classifies laser
products according to the degree of risk and provides safety measures for
respective classes. ( refer to “FDA Standards”.)
●Certification and Identification Label
<Label position>

Introduction
13
FDA Standards
Class*1
Requirements
I IIa II IIIa IIIb IV
Performance (all laser products)
Protective housing [1040.10(f)(1)]
Safety interlock [1040.10 (f) (2)]
Location of controls [1040.10(f)(7)]
Viewing optics [1040.10(f)(8)]
Scanning safeguard [1040.10(f)(9)]
R*2
R*3,4
N/A
R
R
R*2
R*3,4
R
R
R
R*2
R*3,4
R
R
R
R*2
R*3,4
R
R
R
R*2
R*3,4
R
R
R
R*2
R*3,4
R
R
R
Performance (laser system)
Remote interlock connector [1040.10(f)(3)]
Key control [1040.10(f)(4)]
Emission indicator [1040.10(f)(5)]
Beam attenuator [1040.10(f)(6)]
Manual reset mechanism [1040.10(f)(10)]
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
R
R
N/A
N/A
N/A
R
R
N/A
R
R
R*10
R
N/A
R
R
R*10
R
R*13
Performance (specific-purpose products)
Medical [1040.11(a)]
Surveying, leveling, alignment [1040.11(b)]
Demonstration [1040.11(c)]
S
S
S
S
S
S
S
S
S
S*8
S
S
S*8
NP
S*11
S*8
NP
S*11
Labeling (all laser products)
Certification/identification [1010.2,3]
Protective housings [1040.10(g)(6),(7)]
Aperture [1040.10(g)(4)]
Class warning [1040.10(g)(1),(2),(3)]
R
D
N/A
N/A
R
R*5
N/A
R*6
R
R*5
R
R*7
R
R*5
R
R*9
R
R*5
R
R*12
R
R*5
R
R*12
Information (all laser products)
User information [1040.10(h)(1)]
Product literature [1040.10(h)(2)(i)]
Service information [1040.10(h)(2)(ii)]
R
N/A
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
: Required
N/A: Not applicable
S: Requirements: Same as for other products of that Class.
NP: Not permitted
D: Depends on level of inner radiation

Introduction
14
*1 Class is based on the maximum level of laser exposure duringoperation.
*2 Required wherever and whenever such human access to laser radiation
levels that exceed the limits of Class I is not necessary for the product to
perform its intended function.
*3 Required at the protective housing which is designed to be removed or
displaced during operation or maintenance, if removal or displacement of the
protective housing could permit human access to laser or collateral radiation.
*4 The requirements for interlock differ depending on the class of inner
radiation.
*5 The contents of label differ depending on the level and wavelength of laser
radiation inside the protective housing.
*6 Warning statement label
*7 CAUTION logotype
*8 The method to measure the level of laser radiation to human body is
required.
*9 CAUTION if 2.5mWcm-2 or less, DANGER if greater than 2.5mWcm-2.
*10 Time difference is needed between instruction and emission.
*11 Exception should be provided for demonstration of laser products or light
shows using laser of Class IIIb or IV.
*12 DANGER logotype
*13 Required on and after August 20, 1986.

Introduction
15
Maintenance and Inspection
Maintenance Instructions
• Be sure to turn OFF the system to stop laser emission before cleaning the system.
• Molded resin is used in some parts of the system. Do not use organic solvents
such as paint thinner or benzine to wipe the dirt on the system.
• Do not wipe the glass portion of the laser aperture too strongly. Scratches on the
glass may cause measurement errors.
(1) Cleaning Emitter and Receiver on Front Side of Sensor Head
• Always keep the emitter and receiver of the sensor head clean. Make sure that the
emitter and receiver are free of substances that refract light, such as water, oil, or
fingerprints, or surface water, or matters that block light, such as dust and dirt.
Inspect the surfaces regularly and always keep them clean.
• Blow away large particles of dust, if any, using a camera lens blower.
• To remove small particles of dust or fingerprints, use soft lens cleaning cloth or
lens cleaning paper and lightly wipe them out.
• Use cloth moistened with a small amount of alcohol to wipe out tough dirt
carefully.
Inspection
Inspect the system regularly to maintain the performance of the system and make it
possible to use the system under optimum conditions.
●Major Inspection Items
• Check that no I/O terminal connections are loose or disconnected.
• Check that the glass surface on the laser aperture is free of dust, dirt or
fingerprints.
• Check that the power supply voltage is within the rated range (21.6 to 26.4
VDC).
• Check that the operating ambient temperature during use is within the
specification range (a sensor head temperature range of -10°C to 45°C).
• Check that operating ambient humidity (RH) is within a range of 35% to 85%.

Introduction
16

1-1
1
1
Before Use
This Chapter provides information on the configuration,
installation, and connection of the system (including the sensor
head and Setting and Monitoring Software HL-G1SMI).
1-1 System Configuration········· 1-2
1-1-1 System Configuration ·········· 1-2
1-1-2 List of System Components &
Accessories ······················ 1-3
1-2 Part Names and Functions ···· 1-6
1-3 Installation Method ··········· 1-7

Chapter 1 Before Use
1-2
1
1-1 System Configuration
1-1-1 System Configuration
The system configuration and equipment connecting cables are shown below.
USB-RS-422/485 converter
Recommended: SI-35USB (LINEEYE made) or GT02 series or GT12 series
(Panasonic Industrial Devices SUNX made)
The user may use a different converter at the user's own discretion.
Dedicated software (to be downloaded from the website of Panasonic
Industrial Devices SUNX) is required if the GT02 or GT12 series is used
as a converter.
RS-485 wiring
can reach up to
16 units.
Sensor head
(Standard type)
Sensor head
(High-function
type)
Unilateral extension
cable connector
(2 m, 5 m, 10 m, and 20 m)
USB-RS-422/485 converter
PC Setting and Monitoring
Software HL-G1SMI
USB cable
RS-422/485
Analog signal processing equipment
(A/D board and digital panel)
I /O control devices
(PLC etc.)
Analog output
Each I/O
System Configuration Example with SettingTools (HL-G1SMI) Used
RS-422/485 communications
control equipment
RS-422/485 board
USB-RS-422/485 converter
Dedicated compact console
and others