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Panasonic 2SA2079 User manual

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Transistors
Publication date : December 2004 SJC00326AED 1
2SA2079
Silicon PNP epitaxial planar type
For general amplification
Complementary to 2SC5848
 Features
 High forward current transfer ratio hFE
 Suitable for high-density mounting and douwsizing of the equipment for
ultraminiature leadless package
Package: 0.6 mm × 1.0 mm (hight 0.39 mm)
 Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO –45 V
Collector-emitter voltage (Base open) VCEO –45 V
Emitter-base voltage (Collector open) VEBO –7V
Collector current IC–100 mA
Peak collector current ICP –200 mA
Collector power dissipation PC100 mW
Junction temperature Tj125 °C
Storage temperature Tstg –55 to +125 °C
 Electrical Characteristics Ta = 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0–45 V
Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0–45 V
Emitter-base voltage (Collector open) VEBO IE = –10 µA, IC = 0–7V
Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0– 0.1µA
Collector-emitter cut-off current (Base open)
ICEO VCE = –10 V, IB = 0–100 µA
Forward current transfer ratio hFE VCE = –10 V, IC = –2 mA 180 390 
Collector-emitter saturation voltage VCE(sat) IC = –100 mA, IB = –10 mA – 0.2– 0.5V
Transition frequency fTVCB = –10 V, IE = 1 mA, f = 200 MHz 80 MHz
Collector output capacitance
(Common base, input open circuited) Cob VCB = –10 V, IE = 0, f = 1 MHz 2.2pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Unit: mm
1: Base
2: Emitter
3: Collector ML3-N2 Package
0.60±0.05
1.00±0.05
2
1
3
0.39+0.01
−0.03
0.25±0.05 0.25±0.05
0.50±0.05
0.65±0.01
0.15±0.05
2
1
0.35±0.01
0.05±0.03
0.05±0.03
3
Marking Symbol : 3D
This product complies with the RoHS Directive (EU 2002/95/EC).
2SA2079
2 SJC00326AED
PC  Ta IC  VCE IC  IB
IB  VBE IC  VBE VCE(sat)  IC
020 40 60 80 100 120 140
0
20
40
60
80
100
120
2SA2162_ PC-Ta
Collector power dissipation PC (mW)
Ambient temperature Ta (°C)
Collector current IC (mA)
Collector-emitter voltage VCE (V)
0
−10
−20
−30
−40
−50
−60
0−2−4−6−8−10 −12
Ta = −300 µA
−250 µA
−200 µA
−150 µA
−100 µA
−50 µA
2SA2079_IC-VCE
Ta = 25°C
Base current IB (mA)
Collector current IC (mA)
2SA2079_IC-IB
0− 0.2 − 0.4 − 0.6 − 0.8 −1.0 −1.2
0
−140
−120
−100
−80
−60
−40
−20
VCE = −10 V
Ta = 25°C
Base-emitter voltage VBE (V)
Base current IB (mA)
2SA2079_IB-VBE
0− 0.8− 0.2 − 0.4 − 0.6
0
−1.0
−2.0
−2.5
−3.0
−3.5
− 0.5
−1.5
VCE = −10 V
Ta = 25°C
Base-emitter voltage VBE (V)
Collector current IC (mA)
2SA2079_IC-VBE
0− 0.4
− 0.2 −1.0 −1.2
− 0.8
− 0.6
−20
−40
−60
−80
−100
−120
0
Ta = 75°C
25°C
−25°C
VCE = −10 V
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC (mA)
Ta = 75°C
25°C
−25°C
2SA2079_VCE(sat)-IC
−1−10 −100
− 0.01
− 0.1
−1
IC / IB = 10 V
hFE  IC Cob  VCB
Forward current transfer ratio hFE
Collector current IC (mA)
2SA2079_hFE-IC
−1−10 −100
−1000
0
300
250
200
150
100
50
Ta = 75°C
25°C
−25°C
VCE = −10 V
Collector-base voltage VCB (V)
Collector output capacitance
(Common base, input open circuited) Cob (pF)
−8−16 −24 −32 −40
0
10
1
2SA2079_Cob-VCB
f = 1 MHz
Ta = 25°C
This product complies with the RoHS Directive (EU 2002/95/EC).
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.