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  9. Panasonic MTM86628 User manual

Panasonic MTM86628 User manual

Multi Chip Discrete
Publication date: November 2008 SJF00111AED 1
This product complies with the RoHS Directive (EU 2002/95/EC).
MTM86628
Silicon P-channel MOS FET (FET)
Silicon epitaxial planar type (SBD)
For DC-DC converter
For switching circuits
Overview
MTM86628 is the composite MOS FET (P-channel MOS FET and Schottky
Barrier Diode) that is highly suitable for DC-DC converter and other switching
circuits.
Features
Built-in schottky barrier diode: VR= 15 V, IF= 700 mA
Low on-resistance: Ron = 300 mW(VGS = –4.0 V)
Low short-circuit input capacitance (Common source): Ciss = 80 pF
Small surface mounting halogen-free package: WSSMini6-F1 (1.6 mm ×1.6
mm ×0.5 mm)
Absolute Maximum Ratings Ta= 25°C
Parameter Symbol Rating Unit
FET
Drain-source surrender voltage VDSS –20 V
Gate-source surrender voltage VGSS ±12 V
Drain current ID–1.0 A
Peak drain current *1IDP –4.0 A
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Total power dissipation
PD1 *2540 mW
PD2 *3150 mW
SBD
Reverse voltage VR15 V
Forward current (Average) IF(AV) 700 mA
Junction temperature Tj125 °C
Storage temperature Tstg –55 to +125 °C
Note) *1: t = 10 µs, Duty Cycle < 1%
*2: Glass epoxy board: 25.4 mm × 25.4 mm ×0.8 mm
Copper foil of the drain portion should have a area of 300 mm2or more
*3: Stand-alone (without the board)
Package
Code
WSSMini6-F1
Pin Name
1: Gate 4: Cathode
2: Source 5: Drain
3: Anode 6: Drain
Marking Symbol: PL
Internal Connection
1
(G) 2
(S) 3
(A)
(K)
4
(D)
5
(D)
6
MTM86628
2SJF00111AED
This product complies with the RoHS Directive (EU 2002/95/EC).
Electrical Characteristics Ta= 25°C±3°C
FET
Parameter Symbol Conditions Min Typ Max Unit
Drain-source surrender voltage VDSS ID= –1.0 mA, VGS = 0 –20 V
Drain-source cutoff current IDSS VDS = –20 V, VGS = 0 –1.0 µA
Gate-source cutoff current IGSS VGS = ±10 V, VDS = 0 ±10 µA
Gate threshold voltage VTH ID= –1.0 mA, VDS = –10 V – 0.45 –1.0 –1.5 V
Drain-source ON resistance RDS(on)
ID= – 0.5 A, VGS = –4.0 V 300 420 mW
ID= – 0.5 A, VGS = –2.5 V 420 560
Forward transfer admittance YfsID= – 0.5 A, VDS = –10 V 1.0 2.0 S
Short-circuit input capacitance (Common source)
Ciss
VDS = –10 V, VGS = 0, f = 1 MHz
80 pF
Short-circuit output capacitance (Common source)
Coss 12 pF
Reverse transfer capacitance (Common source)
Crss 12 pF
Turn-on delay time *td(on)
VDD = –15 V, VGS = –4.0 V, ID= – 0.5 A
12 ns
Rise time *tr6 ns
Turn-off delay time *td(off) 17 ns
Fall time *tf10 ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: ton , toff measurement circuit
VDD =−15 V
PW=10 µs
Duty Cycle ≤1% ID=−0.5 A
RL=30 Ω
VOUT
VIN
D
G
S
VIN
50 Ω
td(on) td(off)
0 V
−4 V VIN
VOUT
10%
90%
90%
10%
trtf
SBD
Parameter Symbol Conditions Min Typ Max Unit
Forward voltage VF
IF= 500 mA 0.42 V
IF= 700 mA 0.45 V
Reverse current IR
VR= 6 V 90 µA
VR= 15 V 250 µA
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
MTM86628
SJF00111AED 4
This product complies with the RoHS Directive (EU 2002/95/EC).
PDTaIDVDS RDS(on) VGS
RDS(on) IDCXVDS
040 80 160120
0
400
200
600
MTM86628_ PD-Ta
Total power dissipation PD(mW)
Ambient temperature Ta(°C)
0−0.2 −0.4 −1.0−0.6 −0.8
0
−0.02
− 0.04
−0.06
−0.08
−0.10
MTM86628_ ID-VDS
Drain current ID(A)
Drain-source voltage VDS (V)
−1.4 V
−1.2 V
VGS =−1.6 V
0−2−10−8−6−4
0.1
0.2
0.3
0.4
0.5
MTM86628_ RDS(on)-VGS
Drain-source ON resistance RDS(on) (Ω)
Gate-source voltage VGS (V)
ID=−0.5 A
−0.1 −1.0
0
0.1
0.2
0.3
0.4
0.5
MTM86628_ RDS(on)-ID
Drain-source ON resistance RDS(on) (Ω)
Drain current ID(A)
VGS =2.5 V
4.0 V
−50 −15 −20−10
0
20
40
60
120
100
80
MTM86628_ CX-VDS
Drain-source voltage VDS (V)
Short-circuit input capacitance (Common source)
Ciss ,
Short-circuit output capacitance (Common source)
Coss ,
Reverse transfer capacitance (Common source) Crss (pF)
Ciss
Coss
Crss
Characteristics charts of FET
Characteristics charts of SBD
IFVFIRVRCt VR
0 0.2 0.60.4
103
1
10
102
MTM86628_IF-VF
Forward current IF(mA)
Forward voltage VF(V)
Ta= 75°C
−25°C
25°C
0 9 1263 15
10−1
1
10
103
102
104
MTM86628_IR-VR
Reverse current IR(µA)
Reverse voltage VR(V)
Ta= 75°C
−25°C
25°C
0 2010 155
0
40
20
60
80
100
MTM86628_Ct-VR
Terminal capacitance Ct(pF)
Reverse voltage VR(V)
MTM86628
4SJF00111AED
This product complies with the RoHS Directive (EU 2002/95/EC).
WSSMini6-F1 Unit: mm
+0.05
−0.02
1.60 ±0.05
1.00 ±0.05
(0.50) (0.50)
1.60 ±0.05
(0.10)
1.40 ±0.05
0.50 ±0.05
0.20
+0.05
−0.03
0.13
6 5 4
1 2 3
0 to 0.02
5°
5°
(0.15)
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20080805

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