Panasonic TY-FB9FDD User manual

1 Safety Precautions 2
1.1. General Guidelines 2
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 3
3 About lead free solder (PbF) 4
4 Replacement 5
5 Connection 6
6 Circuit Board Layout 7
6.1. HDD-Board 7
7 Block and Schematic Diagram 9
©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TY-FB9FDD
7.1. Schematic Diagram Notes 9
7.2. HDD-Board Block Diagram 10
7.3. HDD-Board (1 of 2) Schematic Diagram 11
7.4. HDD-Board (2 of 2) Schematic Diagram 12
8 Replacement Parts List 13
8.1. Replacement Parts List Notes 13
8.2. Electrical Replacement Parts List 14
8.3. Mechanical Replacement Parts List 16
8.4. Parts Location (1) 17
8.5. Parts Location (2) 18
DVI-D Terminal Board for PF Series
Specifications
Terminals Video Input DVI-D 24 Pin × 1
compliance with DVI Revision 1.0
A
udio Input Stereo mini jack (M3) × 1
0.5Vrms
Content Protection Compatible with HDCP 1.1
CONTENTS
Page Page
ORDER NO. ITD0608047CE
B34 Canada: D10

1 Safety Precautions
1.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MWand 5.2MW.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
2
TY-FB9FDD

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
3
TY-FB9FDD

3 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
4
TY-FB9FDD

4 Replacement
5
TY-FB9FDD

5 Connection
6
TY-FB9FDD

6 Circuit Board Layout
6.1. HDD-Board
ABCDEFGH I
1
2
3
4
5
6
HDD-BOARD (FOIL SIDE)
TXNHD10YQT
TY-FB9FDD
HDD-BOARD TXNHD10YQT TY-FB9FDD HDD-BOARD TXNHD10YQT
R226
R227
R228
FL021
JK501
C101
C102
C103
Q100
C104
Q101
C105
C108
C110
C112 C113 C114 C115
H1
R101
R102
R103
R104 R105
IC104
IC105
C143
C144
R125
R126
C924 D902
C928
D904
R901
R904
R134
R135
R137
C930
R139
C931
TP001
TP002
C932
TP003
TP004
C934
TP005
IC906
TP006
TP007
R141
R912
R142
R913
R914
R915
R145 R146 R149
C946
C947
R150
R924
R925 R926 R927
R157
R928
R158
C951
R929
R930
R931
R932
R933
R934
R173
R175
JK001
R178
R179
R180
R181
R182
R183
R184
R185
R186
FL907
C205 C214
C215
C216
C217
R001
R201
D011
R202
R203
R204
R205
R206
R207 R208
R209
IC201
R210 R211
D021
R212
D022
R213
D023
D024
R021
D025
R022
CR NO.3
1
TNPA4052
HDD
PbF
B1
B2
A1
A2
A40
A39
B39
B40
13
4
5
1
45
8
1
45
8
16
24
17
9
1
8
1
32
33
64
65
96
97
128
ORDER NO.
Parts Location
HDD-BOARD
IC3104 C-3
IC3105 C-3
IC3201 D-2
IC3906 C-2
TP3001 E-5
TP3002 B-3
TP3003 B-2
TP3004 B-3
TP3005 B-4
TP3006 B-5
TP3007 B-5
Q3100 D-3
Q3101 D-3
ICIC
TRANSISTOR
TP
TY-FB9FDD
7

ABCDEFGH I
1
2
3
4
5
6
HDD-BOARD (COMPONENT SIDE)
TXNHD10YQT
TY-FB9FDD
HDD-BOARD TXNHD10YQT TY-FB9FDD HDD-BOARD TXNHD10YQT
R224
R225
R229
L901
L551
L552
L553
JK501
C106
C107 C109
C111
C116
C117 C118
C501
Q501
H0
H1
C511
Q511
R108
R109
C901
IC101
C902
IC102
C903
IC103
C904
C905
R110 R111 R112 R113
R114 R115
R116
R117 R118
C141
R119
C911
R501
C912
R502
C142
C913
R503R504
C915
R505
R506 R507
R120R121
R122R123
R124
C921
R511
C922
R512
C923
R513R514
C925
D901
R515
C926
R516
C927
D903
R517
D905
C929
R131
R902
R132
R903
R133
R905 R906
R136
R907
R138
IC901
IC902
IC903
C933
IC904
IC905
S501
R911
C551
C552
R143
R144
R916
R147
R148
C941
C942
C943
C944
C945
S511
C948
C949
R921
R151
R922
R152
R923
R153 R154 R155 R156
C950
C952
C953
C954
C955
C956
C957
C958
R160
C959
R161 R162 R163 R164
R935
R165 R166 R167
C960
R168
R169
JK001
R187
R188
FL901
FL902
FL903
FL904
FL905
FL906
FL908
JS501
JS502
JS503
C201 C202
C203
C204
C206
C207
C208
C209
C210
C211
C212 C213
C021
D001
D002
D003D004 D005D006
D007
D008
D009
IC001
D010
R214
R215
R216
R217
R023
R218
R024
R219
R025 R026
R220 R221 R222 R223
CR NO.3
HDD
TNPA4052
1
PbF
SEE REVERSE FOR ORDER NO.
A1
A2
B1
B2
A39
A40
B39
B40
125
26
50
51
75
76
100
1
45
8
1
8
9
16
1
4
5 81
4
5 8
1
4
5
8
1
5
1
9
17
8
16
24
1
4
5
8
1
9
Parts Location
HDD-BOARD
IC3001 B-4
IC3101 C-5
IC3102 B-5
IC3103 D-3
IC3901 A-3
IC3902 A-2
IC3903 D-2
IC3904 D-3
IC3905 D-4
Q3501 C-4
Q3511 D-4
ICIC
TRANSISTOR
TY-FB9FDD
8

7 Block and Schematic Diagram
7.1. Schematic Diagram Notes
TY-FB9FDD
9

7.2. HDD-Board Block Diagram
RX2+
RX1+
RX0+
RX2-
RX1-
RX0-
81
85
93
86
94
80
90
91
+5V
+9V
LAN15V
+3.3V
STB+5V
JK3001
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
55
54
56
53
51
49
50
52
106
3
59
60
62
65
63
64
61
66
31
30
34
35
32
37
33
36
23
26
24
25
22
21
20
27
70 697374 7177 7275
11 14 151310 1612 17
40
41
99 8
4748 4446
92
76
96
77
75
74
99
104
121
122
5
9
20
14
120
19
119
55
54
56
53
51
57
58
52
227 43
60
59
52
51
59
58
60
54
57
52
53
56
55
51
123 124 126 127 128
11011
98 97 86 83 79 78
30 34 63
JK3501
-
-
+
-
TMDS
+
-
INTERFACE
PANEL
AND
+
DVI I/F RECEIVER
LATCH
SYNCHRONIZATION
DATA RECOVERY
DECODER
IC3101
+
DDC+5V
B14
TX9+
SLOT SCL
TX5+
TX8-
SLOT5V
B25
B9
S2DETECT
SLOT1
B12
A10
B40
A5
B8
LAN+15V
TX2-
STB5V
TX6+
TX6-
B15
TX8+
SLOT9V
A2
A22
SLOT3.3V
A19
A26
B21
SLOT3.3V
B19
A21
TX1-
B3
A4
TX4+
DS11
B24
TX1+
TX7+
TX0-
A17
TX0+
A15
B11
TX3+
A13
B6
TX3-
SLOT5V
A12
TXC+
B17
AUDIO IN L
A40
SLOT9V
A3
A9
TXC-
B2
A14
TX4-
LAN+15V
TX2+
TX9-
TX5-
A8
B36
TX7-
A7
A28
B5
AUDIO IN R
DVI IN
SCL
SDA5
6
SCL0
SDA0 3
2SCL17
EEPROM
IC3001
6SDA1
IIC BUS REPEATER
IC3902
3
6
5
2
7
B2
B1 A1
A2
/OE2
LEVEL SHIFT
IC3102
(3.3V <-> 5V)
SCL_HDCP
SDA_HDCP
LATCH
LATCH
PLL
8
5
B1
3B2
(3.3V <-> 5V)
6
VCC
IC3105
2A1
A2
LEVEL SHIFT
SCL_EQ
SDA_EQ
8 VCC
+5V
B23
SRQ
+5V
15
14
7
11
16 VCC 6
SDA1
SCL1 P6
P3
P2
LEVEL SHIFT
IC3103
(3.3V <-> 5V)
ODD_G7
ODD_G6
ODD_G5
ODD_G4
ODD_G3
ODD_G0
ODD_G2
ODD_G1
ODD_B7
ODD_B2
ODD_B3
ODD_B0
ODD_B4
ODD_B1
ODD_B6
ODD_B5
ODD_R7 ODD_R2 ODD_R3 ODD_R0 ODD_R4 ODD_R1 ODD_R6 ODD_R5
HSYNC VSYNC
DE
ODCK
+3.3V
EVEN_B5
EVEN_B6
EVEN_B0
EVEN_B3
EVEN_B4
EVEN_B7
EVEN_B2
EVEN_B1
EVEN_B6 EVEN_B0 EVEN_B5 EVEN_B2 EVEN_B7 EVEN_B4 EVEN_B3 EVEN_B1
EVEN_G6
EVEN_G0
EVEN_G5
EVEN_G2
EVEN_G7
EVEN_G4
EVEN_G3
EVEN_G1
TXEC6 TXEC5
TCLKIN
TXEC4
SCDT PRESET
1
35
7
TXOA+
TXOB-
TXOC-
TXOD+
TXOD-
TXOB+
TXOE+
TXOE-
TXOC+
TXOA-
TCLKOUT-
TCLKOUT+
TXEB-
TXED+
TXED-
TXEB+
TXEA-
TXEC-
TXEE-
TXEC+
TXEA+
TXEE+
8
TXOD2
TXOD3
TXOB0
TXOB5
TXOA0
TXOD1
TXOA5
TXOD0
TXED1
TXEA5
TXED0
TXEA0
TXEA4
TXED2
TXEB0
TXED3
TXEA6
TXED4 TXED5 TXEC0 TXEC1 TXEC2 TXEC3 TXEB6 TXEB5
TXOB6 TXOB5 TXOC3 TXOC0 TXOD5 TXOD4
TXC-
TX5+
TX7+
TX8-
TX0-
TX0+
TX4-
TX3+
TX6+
TX6-
TX9-
TX3-
TX5-
TX7-
TX1-
TXC+
TX8+
TX4+
TX1+
TX9+
TX2+
TX2-
ODCK
DE
HSYNC VSYNC
DE
ODCK
VSYNC HSYNC
LVDS TX
IC3201
1
2
4
5
7
6
8
9
TXC-
TX5+
TX7+
TX8-
TX0-
TX0+
TX2-
TX4-
TX3+
TX6+
TX6-
TX2+
TX9-
TX3-
TX5-
TX7-
TX1-
TXC+
TX8+
TX4+
TX1+
TX9+
PWDDNB MODE0 RESRVD
ODD_R0-R7
ODD_G0-G7
ODD_B0-B7
EVEN_R0-R7
EVEN_G0-G7
EVEN_B0-B7
+3.3V
A23
SRQ
WP
VCC 8
7
Q3100,Q3101
R
L
DVI AUDIO IN
Q3511
Q3501
AUDIO_R
AUDIO_L
AUDIO_L
AUDIO_R
TMDS_RX2-
TMDS_RX2+
TMDS_RX1+
TMDS_RX1-
TMDS_RX0+
TMDS_RX0-
TMDS_RXC+
TMDS_RXC-
DVI_SDA
DVI_SCL
C_SCL
C_SDA
SLOT_SCL
SLOT_SDA
LVDS_PD
PRESET
SYNC_DET
BUFFER
IC3906
H0
C_SDA
C_SCL
SLOT_SDA
SLOT_SCL
DVI_SCL
DVI_SDA
STB 5V
SRQ
DVI_SCL
DVI_SDA
SCL
SDA
WP(CONFIG)
WP(EDID)
STB+5V
LVDS_PD
FHD:H
FHD:H
+5V
SLOT SDA
STB+5V
SCL
SDA5
6
EEPROM
7
IC3001
8
WP
VCC
DVI_SDA
DVI_SCL
TY-FB9FDD
HDD-Board Block Diagram TY-FB9FDD HDD-Board Block Diagram
TY-FB9FDD
10