Panasonic PAN1326C Owner's manual

PAN1326C
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 1.0
Wireless Modules



PAN1326C Bluetooth Module
Product Specification Rev. 1.0 Page 2
Overview
Panasonic’s new PAN1326C is a Host Controlled
Interface (HCI) Bluetooth RF module that brings
Texas Instrument’s seventh generation Bluetooth
core integrated circuit, the CC2564C, to an easy-to-
use module format. The PAN1326C is Bluetooth-4.2-
compliant and it offers best-in-class RF performance
with about twice the range of other Bluetooth Low
Energy solutions. Panasonic’s tiny footprint
technology has produced a module of only 85.5
mm². The module is designed to accommodate
PCBs pad pitch of 1.3 mm and as few as two layers
for easy implementation and manufacturing. The
module has been designed to be 100 % pin-
compatible with previous generations of Texas
Instruments-based Bluetooth HCI modules.
Features
•Bluetooth-4.2-compliant up to the HCI layer
•Best-in-class Bluetooth RF performance (Tx, Rx
sensitivity, blocking)
•Dimensions: 9.0 mm x 9.5 mm x 1.8 mm
•Based upon TI’s CC2564C
•Interfaces: UART, GPIO, PCM
Characteristics
•Bluetooth 4.2
•Receiver sensitivity -93 dBm
•Output power 11.5 dBm
•Power supply 1.7 to 4.8 V
•Power consumption Tx 40 mA
•Power consumption Rx 20 mA
•Sleep mode 135 µA
•Operating temperature range -45 ºC to +85 ºC
Block Diagram
Chip
Antenna
Texas Instruments
CC256x
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN132x
Bluetooth 4.2 Module
Crystal
26 MHz

PAN1326C Bluetooth Module
Product Specification Rev. 1.0 Page 3
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
reserves the right to make changes as required at any time without notification. Please consult the most
recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.

PAN1326C Bluetooth Module
Product Specification Rev. 1.0 Page 4
Table of Contents
1About This Document.........................................................................................................................5
1.1 Purpose and Audience ..............................................................................................................5
1.2 Revision History.........................................................................................................................5
1.3 Use of Symbols .........................................................................................................................5
1.4 Related Documents...................................................................................................................5
2Overview..............................................................................................................................................6
2.1 Block Diagram...........................................................................................................................7
2.2 Pin Configuration.......................................................................................................................8
2.3 Device Power Supply...............................................................................................................11
2.4 Clock Inputs.............................................................................................................................13
2.5 Bluetooth Features ..................................................................................................................13
2.6 Interfaces.................................................................................................................................14
3Detailed Description.........................................................................................................................19
3.1 Dimensions..............................................................................................................................19
3.2 Footprint ..................................................................................................................................21
3.3 Packaging................................................................................................................................23
3.4 Case Marking ..........................................................................................................................27
4Specification .....................................................................................................................................28
4.1 Default Test Conditions ...........................................................................................................28
4.2 Absolute Maximum Ratings.....................................................................................................28
4.3 Recommended Operating Conditions......................................................................................29
4.4 Current Consumption...............................................................................................................29
4.5 nSHUTD Requirements...........................................................................................................30
4.6 External Digital Slow Clock Requirements..............................................................................30
4.7 Bluetooth .................................................................................................................................30
4.8 Reliability Tests .......................................................................................................................33
4.9 Recommended Soldering Profile.............................................................................................34
5Cautions ............................................................................................................................................35
5.1 Design Notes...........................................................................................................................35
5.2 Installation Notes.....................................................................................................................35
5.3 Usage Condition Notes............................................................................................................36
5.4 Storage Notes..........................................................................................................................36
5.5 Safety Cautions .......................................................................................................................36
5.6 Other Cautions ........................................................................................................................37
5.7 Life Support Policy...................................................................................................................37
6Appendix ...........................................................................................................................................38
6.1 Ordering Information................................................................................................................38
6.2 Contact Details........................................................................................................................39

PAN1326C Bluetooth Module
1 About This Document
Product Specification Rev. 1.0 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1326C module. It is intended for hardware design,
application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to
as “the PAN1326C” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
November 2017
1st version.
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 6.2.2 Product Information.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 6
2 Overview
Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that
brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to
an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers best-in-
class RF performance with about twice the range of other Bluetooth Low Energy solutions.
Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is
designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy
implementation and manufacturing. The module has been designed to be 100 % pin-compatible
with previous generations of Texas Instruments-based Bluetooth HCI modules.
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
Further information on the variants and versions 6.1 Ordering Information.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 7
2.1 Block Diagram
Note: The Slow Clock 32.768 kHz is mandatory, otherwise the module does not start
up, refer to Chapter 2.4 for additional information.
Note: The IO are 1.8V driven and might need external level shifter and LDO. The
MLDO_OUT PIN can not be used as reference due to RF internal connection.
The total capacity will not exceed 2.8uF and the total inductance will not exceed 0nH.
There are no voltage multiplying or voltage boosting circuits.
Texas Instruments
CC256x
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN131x
Bluetooth 4.2 Module
Crystal
26 MHz
RF-Pad
Chip
Antenna
Texas Instruments
CC256x
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN132x
Bluetooth 4.2 Module
Crystal
26 MHz

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 8
2.2 Pin Configuration
Pin Assignment PAN1316C
Top View
PIN Assignment PAN1326C
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Top View
9,00 mm
6,50 mm
20
23
1
24
19
18 12
7
Pad = 24 x 0.60mm x 0.60mm
Module Height 1.8 mm
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
9.00 0,55
1.80
9.50
0,60
20
23
1
24
19
18 12
7
A
C
B
D

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 9
Pin Functions
No
Pin Name
Pull at
Reset
Def.
Dir. 1
I/O Type 2
Description
1
GND
Connect to Ground
2
TX_DBG
PU
O
2 mA
Logger output
3
HCI_CTS
PU
I
8 mA
HCI UART clear-to-send.
4
HCI_RTS
PU
O
8 mA
HCI UART request-to-send.
5
HCI_RX
PU
I
8 mA
HCI UART data receive
6
HCI_TX
PU
O
8 mA
HCI UART data transmit
7
AUD_FSYNC
PD
IO
4 mA
PCM frame synch. (NC if not used) Fail Safe3
8
SLOW_CLK_IN
I
32.768-kHz clock in Fail Safe
9
NC
IO
Not connected
10
MLDO_OUT
O
Main LDO output (1.8 V nom.)
11
CL1.5_LDO_IN
I
PA LDO input
12
GND
Connect to Ground
13
RF
IO
Bluetooth RF IO
14
GND
Connect to Ground
15
MLDO_IN
I
Main LDO input
16
nSHUTD
PD
I
Shutdown input (active low).
17
AUD_OUT
PD
O
4 mA
PCM data output. (NC if not used) Fail Safe
18
AUD_IN
PD
I
4 mA
PCM data input. (NC if not used) Fail Safe
19
AUD_CLK
PD
IO
HY, 4 mA
PCM clock. (NC if not used) Fail Safe
20
GND
Connect to Ground
21
NC
EEPROM I²C SDA (Internal)
22
VDD_IO
PI
I/O power supply 1.8 V Nom
23
NC
EEPROM I²C SCL (Internal)
24
NC
IO
Not connected
A
GND
Connect to Ground
B
GND
Connect to Ground
C
GND
Connect to Ground
D
GND
Connect to Ground
1
I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
2
I/O Type: Digital I/O cells. HY = input hysteresis, current = typ. output current
3
No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 10
For RF conducted measurements either use the PAN1323ETU or de-solder the antenna and
solder an antenna connector to the hot pin.
Pin Description
Pin Name
No
ESD 4
(V)
Pull at
Reset
Def.
Dir. 5
I/O Type 6
Description of Options
Bluetooth IO SIGNALS
HCI_RX
5
750
PU
I
8 mA
HCI UART data receive
HCI_TX
6
750
PU
O
8 mA
HCI UART data transmit
HCI_RTS
4
750
PU
O
8 mA
HCI UART request-to-send.
HCI_CTS
3
750
PU
I
8 mA
HCI UART clear-to-send.
AUD_FYSNC
7
500
PD
IO
4 mA
PCM frame synch (NC if not used) Fail safe
AUD_CLK
19
500
PD
IO
HY, 4 mS
PCM clock (NC if not used) Fail safe
AUD_IN
18
500
PD
I
4 mA
PCM data input (NC if not used) Fail safe
AUD_OUT
17
500
PD
O
4 mA
PCM data output (NC if not used) Fail safe
TX_DBG
2
1000
PU
O
2 mA
Logger output
OPTION: nTX_DBG –logger out (low = 1)
CLOCK SIGNALS
SLOW_CLK_IN
8
1000
I
32.768-kHz clock in Fail safe
Bluetooth ANALOG SIGNALS
RF
13
1000
IO
Bluetooth RF IO (not connected with antenna)
nSHUTD
16
1000
PD
I
Shutdown input (active low).
Bluetooth POWER AND GND SIGNALS
VDD_IO
22
1000
PI
I/O power supply 1.8 V Nom
MLDO_IN
15
1000
I
Main LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
MLDO_OUT
10
1000
O
Main LDO output (1.8 V nom.) Can not be used as 1.8V supply
due to internal connection to the RF part.
CL1.5_LDO_IN
11
1000
I
PA LDO input
Connect directly to battery or to a pre-regulated 1.8-V supply
GND
1
P
Connect to Ground
GND
12
P
Connect to Ground
GND
14
P
Connect to Ground
GND
20
P
Connect to Ground
EEPROM IO SIGNALS (EEPROM is optional in PAN13x product line)
NC
23
1000
PU/PD
I
HY, 4mA
EEPROM I²C SCL (Internal)
NC
21
1000
PU/PD
IO
HY, 4mA
EEPROM I²C IRQ (Internal)
Remark:
HCI_CTS is an input signal to the CC2564C device:
•When HCI_CTS is low, then CC2564C is allowed to send data to Host device.
•When HCI_CTS is high, then CC2564C is not allowed to send data to Host device.
4
ESD: Human Body Model (HBM). JEDEC 22-A114
5
I = input; O = output; IO = bidirectional; P = power; PU = pulled up; PD = pulled down
6
I/O Type: Digital I/O cells. HY = input hysteresis, current = typ output current

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 11
2.3 Device Power Supply
The PAN13x6C Bluetooth radio solution is intended to work in devices with a limited power
budget such as cellular phones, headsets, hand-held PC’s and other battery-operated devices.
One of the main differentiators of the PAN13x6C is its power management –its ability to draw
as little current as possible.
The PAN13x6C device requires two kinds of power sources:
1. Main power supply for the Bluetooth - VDD_IN = VBAT
2. Power source for the 1.8 V I/O ring - VDD_IO
The PAN13x6C includes several on-chip voltage regulators for increased noise immunity. The
PAN13x6C can be connected either directly to the battery or to an external 1.8-V DC to DC
converter.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 12
There are three ways to supply power:
1. Full-VBAT system (Maximum RF output power, but not optimum system power):
2. Full-DC2DC system (Lower RF output power, but optimum system power):
3. Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but
requires routing of VBAT):

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 13
2.4 Clock Inputs
The slow clock is always supplied from an external source. It is connected to the
SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0-1.8 V.
The slow clock's frequency accuracy must be 32.768 kHz
(according to the Bluetooth specification).
The Slow Clock 32.768 kHz is mandatory to start the internal controller; otherwise the module
does not start up.
2.5 Bluetooth Features
•Bluetooth-4.2-compliant up to the HCI layer
•Up to seven active devices
•Scatternet: up to three piconets simultaneously, one as master and two as slaves
•Up to two Synchronous Connection Oriented (SCO) links on the same piconet
•Support for All Voice Air-Coding - Continuously Variable Slope Delta (CVSD), A-law, µ-law,
modified Subband Coding (mSBC), and transparent (uncoded)
•Assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host
processing and power
•Support of multiple Bluetooth profiles with enhanced QoS
•Multiple sniff instances tightly coupled to achieve minimum power consumption
•Independent buffering for Low Energy allows large numbers of multiple connections without
affecting BR or EDR performance
•Built-in coexistence and prioritization handling for BR, EDR, and Low Energy
•Capabilities of link layer topology Scatternet - can act concurrently as peripheral and central
•Network support for up to 10 devices
•Time line optimization algorithms to achieve maximum channel utilization

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 14
2.6 Interfaces
2.6.1 Host Controller Interface (HCI)
The CC2564C incorporates one UART module dedicated to the host controller interface (HCI)
transport layer. The HCI interface transports commands, events, ACL, and synchronous data
between the Bluetooth device and its host using HCI data packets.
The UART module supports H4 (4-wires) protocol with maximum baud rate of 4 Mbps for all fast
clock frequencies.
After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The
baud rate can thereafter be changed with a vendor specific command. The CC2564C responds
with a Command Complete Event (still at 115.2 kbps), after which the baud rate change takes
place. HCI hardware includes the following features:
•Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
•Transmitter underflow detection
•CTS/RTS hardware flow control
The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between the host
and the CC2564C is byte-wise by hardware.
Flow control is obtained by the following:
When the UART RX buffer of the CC2564C passes the “flow control” threshold, it will set the
UART_RTS signal high to stop transmission from the host.
When the UART_CTS signal is set high, the CC2564C will stop its transmission on the
interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will
finish transmitting the byte and stop the transmission.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 15
2.6.2 Audio/Voice CODEC Interface
The codec interface is a fully-dedicated programmable serial port that provides the logic to
interface to several kinds of PCM or I2S codec’s. PAN13x6C supports all voice coding schemes
required by Bluetooth specification –Log PCM (A-Law or μ-Law) and Linear (CVSD). In
addition, module also supports transparent scheme:
•Two voice channels
•Master / slave modes
•µ-Law, A-Law, Linear, Transparent coding schemes
•Long and short frames
•Different data sizes, order, and positions.
•High rate PCM interface for EDR
•Enlarged interface options to support a wider variety of codecs
•PCM bus sharing
2.6.2.1 PCM Hardware Interface
The PCM interface is one implementation of the codec interface. It contains the following four
lines:
•Clock –configurable direction (input or output)
•Frame Sync –configurable direction (input or output)
•Data In –Input
•Data Out –Output/3-state
The Bluetooth device can be either the master of the interface where it generates the clock and
the frame-sync signals, or slave where it receives these two signals. The PCM interface is fully
configured by a vendor specific command.
For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above 12
MHz, the maximum data burst size is 32 bits. For master mode, the CC2564C can generate any
clock frequency between 64 kHz and 6 MHz.
When the I2S bus is used in an application, Panasonic recommends adding a low pass filter
(series resistor and capacitor to GND) to the bus for better noise suppression. Connecting the
host μController/DSP directly with the module’s I2S interface is not recommended.
The suggested low pass filter component values are:
470 pF
120 Ω
2.6.2.2 Data Format
The data format is fully configurable:
•The data length can be from 8 to 320 bits, in 1-bit increments, when working with two
channels, or up to 640 bits when using 1 channel. The Data length can be set
independently for each channel.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 16
•The data position within a frame is also configurable in with 1 clock (bit) resolution and can
be set independently (relative to the edge of the Frame Sync signal) for each channel.
•The Data_In and Data_Out bit order can be configured independently. For example;
Data_In can start with the MSB while Data_Out starts with LSB. Each channel is separately
configurable. The inverse bit order (that is, LSB first) is supported only for sample sizes up
to 24 bits.
•It is not necessary for the data in and data out size to be the same length.
•The Data_Out line is configured to ‘high-Z’ output between data words. Data_Out can also
be set for permanent high-Z, irrespective of data out. This allows the CC2564C to be a bus
slave in a multi-slave PCM environment. At power up, Data Out is configured as high-Z.
2.6.2.3 Frame Idle Period
The codec interface has the capability for frame idle periods, where the PCM clock can “take a
break” and become ‘0’ at the end of the PCM frame, after all data has been transferred.
The CC2564C supports frame idle periods both as master and slave of the PCM bus.
When CC2564C is the master of the interface, the frame idle period is configurable. There are
two configurable parameters:
•Clk_Idle_Start –Indicates the number of PCM clock cycles from the beginning of the frame
until the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock will become
‘0’.
•Clk_Idle_End –Indicates the time from the beginning of the frame till the end of the idle
period. This time is given in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
For example, for PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start = 60,
Clk_Idle_End = 90.
Between each two frame syncs there are 70 clock cycles (instead of 100). The clock idle period
starts 60 clock cycles after the beginning of the frame, and lasts 90 –60 = 30 clock cycles. This
means that the idle period ends 100 –90 = 10 clock cycles before the end of the frame. The
data transmission must end prior to the beginning of the idle period.

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 17
2.6.2.4 Clock-Edge Operation
The codec interface of the CC2564C can work on the rising or the falling edge of the clock. It
also has the ability to sample the frame sync and the data at inversed polarity.
This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM
bus. The frame sync signal is updated (by the codec) on the falling clock edge and therefore
shall be sampled (by the CC2564C) on the next rising clock. The data from the codec is
sampled (by the CC2564C) on the clock falling edge.
2.6.2.5 Two-Channel PCM Bus Example
In below figure, a 2-channel PCM bus is shown where the two channels have different word
sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer)
2.6.2.6 Audio Encoding
The CC2564C codec interface can use one of four audio-coding patterns:
•A-Law (8-bit)
•µ-Law (8-bit)
•Linear (8- or 16-bit)

PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.0 Page 18
2.6.2.7 Improved Algorithm For Lost Packets
The CC2564C features an improved algorithm for improving voice quality when received voice
data packets are lost. There are two options:
•Repeat the last sample –possible only for sample sizes up to 24 bits. For sample sizes >24
bits, the last byte is repeated.
•Repeat a configurable sample of 8 to 24 bits (depends on the real sample size), in order to
simulate silence (or anything else) in the PCM bus. The configured sample will be written in
a specific register for each channel.
The choice between those two options is configurable separately for each channel.
2.6.2.8 Bluetooth/PCM Clock Mismatch Handling
In Bluetooth RX, the CC2564C receives RF voice packets and writes these to the codec I/F. If
the CC2564C receives data faster than the codec I/F output allows, an overflow will occur. In
this case, the Bluetooth has two possible behaviour modes: ‘allow overflow’ and ‘don’t allow
overflow’.
•If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any data
not yet sent to the codec.
•If overflow is not allowed, RF voice packets received when buffer is full will be discarded.
2.6.2.9 Bluetooth Inter-IC Sound (I2S)
The CC2564C can be configured as an Inter-IC Sound (I2S) serial interface to an I2S codec
device. In this mode, the CC2564C audio codec interface is configured as a bi-directional, full-
duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio
data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40
serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length.
Do not connect the microcontroller/DSP directly to the module’s PCM interface, a simple RC low
pass filter is recommended to improve noise suppression.

PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.0 Page 19
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
3.1.1 PAN1316C Module Drawing
No.
Item
Dimension
Tolerance
Remark
1
Width
6.50
0.30
2
Length
9.00
0.30
3
Height
1.80
0.20
With case

PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.0 Page 20
3.1.2 PAN1326C Module Drawing
No.
Item
Dimension
Tolerance
Remark
1
Width
9.50
0.30
2
Length
9.00
0.30
3
Height
1.80
0.20
With case