Panasonic PAN301 Series Quick setup guide

Wireless Connectivity
PAN301x
Bluetooth®Low Energy Module
Module Integration Guide
Rev. 1.0

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 2 of 30
Overview
The PAN301x is a Bluetooth 5 Low Energy (LE)
module based on ST’s BlueNRG-2 Bluetooth low
energy single mode system-on-chip.
Features
•Surface mount type (SMT) dimensions
−PAN3011/PAN3012: 25 mm x 14 mm x 3 mm
−PAN3013: 31 mm x 14 mm x 3 mm
•PAN3011 and PAN3012 have same form factor
and pinning
•ARM®Cortex®-M0 microcontroller
•Embedded 256 kB flash memory and 24 kB
internal RAM
•Interfaces: I2C, UART, PDM, GPIO, ADC, SWD
•Internal chip antenna
Characteristics
•Typical sensitivity: -88 dBm
•Typical max. output power: 8 dBm
•Typical current consumption: 16 mA in Tx and
9 mA in Rx mode
•Typical current consumption in sleep-mode:
10 µA
•Voltage range
−PAN3011/PAN3012: 1.7 V to 3.6 V
−PAN3013: 2.6 V to 3.5 V
•Temperature range
−PAN3011/PAN3012: -40 °C to 85 °C
−PAN3013: -20 °C to 85 °C
Sensor Application
•PAN3011
−LSM6DSO: 3D accelerometer and
3D gyroscope
−LIS2MDL: magnetometer
−MP34DT05-A: digital microphone
•PAN3012
−HTS221: humidity and temperature
−LPS22HH: pressure sensor
−MP34DT05-A: digital microphone
•PAN3013
−VL53L1X: time of flight sensor (ToF)
−LSM6DSO: 3D accelerometer and
3D gyroscope
−LIS2MDL: magnetometer
Block Diagram
Chip
Antenna
Reset


IoT-SB
BluetoothâLow Energy (LE) Sensor Module

UART
I²C
ADC
SWD
Power Supply
GPIOs
PDM
Sensor C
Sensor A
Sensor B Bluetooth LE SoC
BlueNRG-2
Crystal
32 MHz
Crystal
32.768 kHz
PAN301x

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 3 of 30
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Module Integration Guide before initiating or
completing a design.
© Panasonic Industrial Devices Europe GmbH 2021.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Module Integration Guide does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Module Integration Guide and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
•The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
•Deviation or lapse in function of the Engineering Sample,
•Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
The information contained herein is presented only as guidance for Product use. No responsibility is
assumed by Panasonic for any infringement of patents or any other intellectual property rights of third
parties that may result from the use of Product. No license to any intellectual property right is granted by
this document, whether express or implied, by estoppel or otherwise.
Description of hardware, software, and other information in this document is only intended to illustrate the
functionality of the referred Panasonic product. It should not be construed as guaranteeing specific
functionality of the product as described or suitable for a particular application.
Any provided (source) code shall not be used or incorporated into any products or systems whose
manufacture, use or sale is prohibited under any applicable laws or regulations.
Any outlined or referenced (source) code within this document is provided on an “as is” basis without any
right to technical support or updates and without warranty of any kind on a free of charge basis according
to § 516 German Civil Law (BGB) including without limitation, any warranties or conditions of title, non
infringement, merchantability, or fitness for a particular purpose. Customer acknowledges that (source)
code may bear defects and errors.

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 4 of 30
The third-party tools mentioned in this document are offered by independent third-party providers who are
solely responsible for these products. Panasonic has no responsibility whatsoever for the performance,
product descriptions, specifications, referenced content, or any and all claims or representations of these
third-party providers. Panasonic makes no warranty whatsoever, neither express nor implied, with respect
to the goods, the referenced contents, or any and all claims or representations of the third-party providers.
To the maximum extent allowable by Law Panasonic assumes no liability whatsoever including without
limitation, indirect, consequential, special, or incidental damages or loss, including without limitation loss of
profits, loss of opportunities, business interruption, and loss of data.

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 5 of 30
Table of Contents
1About This Document......................................................................................................................... 6
1.1 Purpose and Audience................................................................................................................6
1.2 Revision History..........................................................................................................................6
1.3 Use of Symbols...........................................................................................................................6
1.4 Related Documents ....................................................................................................................7
2Overview.............................................................................................................................................. 8
3PAN301x Module................................................................................................................................. 9
3.1 Block Diagrams...........................................................................................................................9
3.2 Footprints..................................................................................................................................10
3.3 Placement.................................................................................................................................11
4Reference Design.............................................................................................................................. 13
4.1 Block Diagram...........................................................................................................................13
4.2 Schematic.................................................................................................................................14
4.3 Building Blocks..........................................................................................................................15
4.4 Breakout Pins............................................................................................................................16
4.5 Configuration Settings...............................................................................................................17
4.6 PCB Layout...............................................................................................................................18
5Software: STEVAL-BCN002V1B Development Kit......................................................................... 19
6Regulatory and Certification Information....................................................................................... 20
6.1 General Certification Information..............................................................................................20
6.2 Federal Communications Commission (FCC) for US...............................................................20
6.3 Innovation, Science, and Economic Development (ISED) for Canada.....................................23
6.4 European Conformity According to RED (2014/53/EU)............................................................27
6.5 Bluetooth...................................................................................................................................28
7Restricted Use................................................................................................................................... 29
7.1 Life Support Policy....................................................................................................................29
7.2 Restricted End Use...................................................................................................................29
8Contact Details.................................................................................................................................. 30
8.1 Contact Us................................................................................................................................30
8.2 Product Information...................................................................................................................30

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 6 of 30
1 About This Document
1.1 Purpose and Audience
This Module Integration Guide is intended to support the easy integration of the PAN301x into a
product and to ensure the compliance with regulatory requirements.
This guide gives an overview about the hardware design requirements by providing a reference
design, which is the evaluation board of the PAN301x. It describes how to use the PAN301x on
the evaluation board with the software packages and tools provided by ST. In addition, it
explains how to start up the evaluation board, get all the needed software sources, execute
example code and build own implementations.
It is intended for hardware design, application, and Original Equipment Manufacturers (OEM)
engineers.
The product is referred to as “the PAN301x”or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
2021-04-28
First version
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
Tip
Indicates useful information designed to facilitate working with the module and
software.
[chapter number]
[chapter title]
Cross Reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
✓
Requirement
Indicates a requirement that must be met before the corresponding tasks can be
completed.
➔
Result
Indicates the result of a task or the result of a series of tasks.

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PAN301x Bluetooth Module 1 About This Document
Module Integration Guide Rev. 1.0 Page 7 of 30
Symbol
Description
This font
GUI Text
Indicates fixed terms and text of the graphical user interface.
Example:
Click Save.
Menu > Menu item
Path
Indicates a path, e.g. to access a dialog.
Example:
In the menu, select File > Setup page.
This font
File Names, Messages, User Input
Indicates file names or messages and information displayed on the screen or to
be selected or entered by the user.
Examples:
pan1760.c contains the actual module initialization.
The message Failed to save your data is displayed.
Enter the value Product 123.
Key
Key
Indicates a key on the keyboard, e.g. F10.
1.4 Related Documents
For related documents please refer to the Panasonic website 8.2 Product Information.

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PAN301x Bluetooth Module 2 Overview
Module Integration Guide Rev. 1.0 Page 8 of 30
2 Overview
Creating IoT Solution Modules like the PAN3011, PAN3012, and PAN3013, that clearly
contribute to cutting down time-to-market in development processes in these rather fast paced
times of innovation and automatization has been the clear priority for Panasonic Industry. Being
based on and inspired by the ST BlueTile (STEVAL-BCN002V1B) multi-sensor development kit,
customers are now able to test and evaluate their ideas easily and bring new IoT products
appropriately fast and at a reduced BOM to the markets.
The IoT Solution Module features ST’s latest BlueNRG Bluetooth LE 5 system-on-chip (SoC)
paired with inertial, environmental, audio, and magnetic sensors. The onboard sensors enable
the cost-effective delivery of a broad range of compact and valuable IoT applications for smart
factory, smart home, and smart life scenarios.
The combination of different sensors in an efficient low-power design with Bluetooth
communications enables OEM customers to dramatically slash time-to-market and reduce
design expense and complexity using certified modules.
For related documents please refer to 8.2 Product Information.

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PAN301x Bluetooth Module 3 PAN301x Module
Module Integration Guide Rev. 1.0 Page 9 of 30
3 PAN301x Module
3.1 Block Diagrams
PAN3011
PAN3012
PAN3013
Chip
Antenna
Reset


IoT-SB
BluetoothâLow Energy (LE) Sensor Module

UART
I²C
ADC
SWD
2.6 V to 3.5 V
GPIOs
Accelerometer/
Gyroscope
LSM6DSO
Magnetometer
LIS2MDL Bluetooth LE SoC
BlueNRG-2
Crystal
32 MHz
Crystal
32.768 kHz
Time of Flight Sensor
VL53L1X
PAN3013

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PAN301x Bluetooth Module 3 PAN301x Module
Module Integration Guide Rev. 1.0 Page 10 of 30
3.2 Footprints
The dimensions are in millimeters.
The outer dimensions have a tolerance of ±0.3 mm.
PAN3011/PAN3012 Top View
PAN3013 Top View
1.50
2.50
14.00
25.00
0.25
0.25
1
24 13
11
2.00
1.50
2.50
14.00
31.00
0.25
0.25
1
24 13
12
2.00