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  9. Panasonic Schottky Barrier Diodes MA24D70 User manual

Panasonic Schottky Barrier Diodes MA24D70 User manual

Schottky Barrier Diodes (SBD)
Publication date: July 2008 SKH00225AED 1
This product complies with the RoHS Directive (EU 2002/95/EC).
MA24D70
Silicon epitaxial planar type
For rectification
Overview
MA24D70 is optimal for general circuit supplies.
Features
Forward current (Average) IF(AV) = 5.0 A rectification is possible5.0 A rectification is possible5.0 A rectification is possible
Low forward voltage VFand good rectification efficiency
Absolute Maximum Ratings Ta= 25°C
Parameter Symbol Rating Unit
Reverse voltage VR35 V
Maximum peak reverse voltage VRM 35 V
Forward current (Average) *1IF(AV) 5.0 A
Non-repetitive peak forward surge current
*2IFSM 60 A
Junction temperature Tj150 °C
Storage temperature Tstg -40 to +150 °C
Note) *1: Lead temperature: Tl = 80°C, DC wave on
*2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
Electrical Characteristics Ta= 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Forward voltage VF
IF= 3.0 A 0.43 0.48 V
IF= 5.0 A 0.49 0.55
Reverse current IRVR= 35 V 0.3 mA
Terminal capacitance CtVR= 10 V, f = 1 MHz 110 pF
Reverse recovery time *1trr
IF= IR= 100 mA, Irr = 10 mA,
RL= 100 W32 ns
Thermal resistance (j-a) Rth(j-a)
Mounted on an alumina PC board *260
°C/W
Mounted on a glass epoxy PC board *3220
Thermal resistance (j-l) Rth(j-l) 10 °C/W
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current
from the operating equipment.
3. *1: trr measurement circuit
Bias Application Unit (N-50BU)
90%
Pulse Generator
(PG-10N)
Rs= 50 Ω
Wave Form Analyzer
(SAS-8130)
Ri= 50 Ω
tp= 2 µs
tr= 0.35 ns
δ = 0.05
IF= IR= 100 mA
RL= 100 Ω
10%
Input Pulse Output Pulse
Irr = 10 mA
trtp
trr
VR
IF
t
t
A
*2: Mounted on an alumina PC board (Board: 50 mm ×50 mm ×0.8 mm, Soldering land:1.4 mm ×2.1 mm)
*3: Mounted on an alumina PC board (Board: 50 mm ×20 mm ×1.0 mm, Soldering land: 2.0 mm ×2.0 mm + 20 mm ×0.8 mm)
Package
Code
TMinP2-F1
Pin Name
1: Anode
2: Cathode
Marking Symbol: 5M
MA24D70
2SKH00225AED
This product complies with the RoHS Directive (EU 2002/95/EC).
PR(AV) VRPF(AV) IF(AV) Rth t
10−3
10−2
0 0.2 0.4 0.6
10−1
104
103
102
10
1
MA24D70_ IF-VF
Forward current IF(mA)
Forward voltage VF(V)
Ta= 150°C
125°C
25°C
75°C
−20°C
0 10 20 30 40
10−4
10−3
10−2
10−1
10
1
102
Reverse voltage VR(V)
Reverse current IR(mA)
MA24D70_IR-VR
Ta= 150°C
75°C
125°C
25°C
−20°C
0
100
200
300
400
500
0 10 40
MA24D70_Ct-VR
Ta= 25°C
f= 1 MHz
Reverse voltage VR(V)
Terminal capacitance Ct(pF)
0
2
4
6
8
0 10 20 30 40
MA24D70_ PR(AV)-VR
Reverse voltage VR(V)
Reverse power dissipation (Average) PR(AV) (mW)
0.5
0.8
0.9
DC
IF
tp
T
0
0.8
1.6
2.4
0 2 4 6 8
MA24D70_PF(AV)-IF(AV)
Forward current (Average) IF(AV) (A)
Forward power dissipation (Average) PF(AV) (W)
DC
0.5
0.2
0.1
IF
tp
T
10−3110−1
10−210 102103
MA24D70_Rth-t
Time t (s)
Thermal resistance Rth (°C/W)
10−1
10
1
103
102
Alumina board
:
50 mm ×50 mm, t = 0.8 mm,
land
1.4 mm ×2.1 mm
Glass epoxy board
:
50 mm ×20 mm, t = 1 mm,
land
2.0 mm ×2.0 mm + 2.0 mm ×0.8 mm
0
2
4
0 40
160120
80
Ambient temperature Ta(°C)
Forward current (Average) IF(AV) (A)
tp/ T
DC
0.5
0.2
0.1
MA24D70_IF(AV)-Ta
tp
T
IF
Tj= 150°C
VR= 20 V
Mounted on an alumina PC board
Copper foil: 2.0 mm ×2.0 mm
IF(AV) Ta
IFVFIRVRCtVR
MA24D70
SKH00225AED 3
This product complies with the RoHS Directive (EU 2002/95/EC).
TMiniP2-F1 Unit: mm
2.40 ±0.10 0.15 ±0.05
1.75 ±0.05
3.80 ±0.050.45 ±0.05
4.70 ±0.10
2
1
0 to 0.40
0to0.03
0.9max.
5°
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.

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