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  9. Panasonic 2SD0602A User manual

Panasonic 2SD0602A User manual

Transistors
Publication date: October 2008 SJC00191DED 1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD0602A
Silicon NPN epitaxial planar type
For general amplification
Complementary to 2SB0710A
Features
Low collector-emitter saturation voltage VCE(sat)
Mini type package, allowing downsizing of the equipment and automatic
insertion through the tape packing.
Absolute Maximum Ratings Ta= 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 60 V
Collector-emitter voltage (Base open) VCEO 50 V
Emitter-base voltage (Collector open) VEBO 5 V
Collector current IC500 mA
Peak collector current ICP 1 A
Collector power dissipation PC200 mW
Junction temperature Tj150 °C
Storage temperature Tstg –55 to +150 °C
Electrical Characteristics Ta= 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC= 10 mA, IE= 0 60 V
Collector-emitter voltage (Base open) VCEO IC= 10 mA, IB= 0 50 V
Emitter-base voltage (Collector open) VEBO IE= 10 mA, IC= 0 5 V
Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE= 0 0.1 mA
Forward current transfer ratio *1hFE1 *2VCE = 10 V, IC= 150 mA 85 340 
hFE2 VCE = 10 V, IC= 500 mA 40 
Collector-emitter saturation voltage *1VCE(sat) IC= 300 mA, IB= 30 mA 0.35 0.60 V
Transition frequency fTVCB = 10 V, IE= -50 mA, f = 200 MHz 200 MHz
Collector output capacitance
(Common base, input open circuited) Cob VCB = 10 V, IE= 0, f = 1 MHz 6 15 pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank Q R S No-rank
hFE1 85 to 170 120 to 240 170 to 340 85 to 340
Marking symbol XQ XR XS X
Product of no-rank is not classified and have no indication for rank.
Package
Code
Mini3-G1
Pin Name
1: Base
2: Emitter
3: Collector
Marking Symbol: X
2SD0602A
2SJC00191DED
This product complies with the RoHS Directive (EU 2002/95/EC).
040 80 120 160
0
80
160
240
2SD0602_ PC-Ta
Collector power dissipation PC(mW)
Ambient temperature Ta(°C)
2SD0602_ IC-VCE
Collector current IC(mA)
Collector-emitter voltage VCE (V)
16 208 124
00
800
600
200
500
700
400
100
300
IB=10 mA
9 mA
8 mA
1 mA
2 mA
3 mA
4 mA
5 mA
6 mA
7 mA
Ta=25°C
084
0
200
600
800
400
2SD0602_ IC-IB
Collector current IC(mA)
Base current IB(mA)
VCE =10 V
Ta =25°C
2SD0602_ VCE(sat)-IC
Collector-emitter saturation voltage VCE(sat) (V)
Collector current IC(mA)
10−1 1 10
10−2
10−1
102
10
1
10−2
IC / IB =10
Ta =75°C
−25°C
25°C
2SD0602_ VBE(sat)-IC
Base-emitter saturation voltage VBE(sat) (V)
Collector current IC(mA)
10−210−11 10
10−2
10−1
102
10
1
IC / IB =10
Ta =−25°C
25°C
75°C
2SD0602_ hFE-IC
Forward current transfer ratio hFE
Collector current IC(mA)
0
300
250
200
150
100
50
Ta =75°C
25°C
−25°C
1 10
VCE =10 V
10−210−1
2SD0602_ fT-IE
Transition frequency fT(MHz)
Emitter current IE(mA)
−1−10 −100
0
240
200
160
120
80
40
VCB =10 V
Ta =25°C
2SD0602_ Cob-VCB
Collector-base voltage VCB (V)
0
12
10
8
6
4
2
110 102
IE =0
f=1 MHz
Ta =25°C
Collector output capacitance
(Common base, input open circuited) Cob (pF)
110 103
102
0
40
80
120
2SD0602_ VCER-RBE
Base-emitter resistance RBE (kΩ)
IC =2 mA
Ta =25°C
Collector-emitter voltage
(Resistor between B and E) VCER (V)
PCTaICVCE ICIB
VCE(sat) ICVBE(sat) IChFE IC
fTIECob VCB VCER RBE
2SD0602A
SJC00191DED 3
This product complies with the RoHS Directive (EU 2002/95/EC).
Mini3-G1 Unit: mm
(0.95)
(0.95)
1.9 ±0.1
0.40
1.50
2.8
2.90
3
2
1
5°
0.4 ±0.2
0.16
10°
1.1
1.1
0 to 0.1 (0.65)
+0.10
−0.05
+0.25
−0.05
+0.2
−0.3
+0.20
−0.05
+0.2
−0.1
+0.3
−0.1
+0.10
−0.05
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20080805

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