Panasonic KX-TG1032SK User manual

© Panasonic System Networks Co., Ltd. 2010
Unauthorized copying and distribution is a violation
of law.
ORDER NO. KM41003051CE
F13
Telephone Equipment
Model No. KX-TG1032SK
KX-TGA101S
Expandable Digital Cordless Answering
System
S: Silver Version
(for U. S. A.)

2
KX-TG1032SK/KX-TGA101S

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KX-TG1032SK/KX-TGA101S
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precaution ------------------------------------------------ 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit)--------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------16
6 Installation Instructions ---------------------------------------16
7 Operation Instructions-----------------------------------------16
8 Service Mode -----------------------------------------------------17
8.1. Engineering Mode ----------------------------------------17
8.2. Copying Phonebook Items when Repairing -------21
8.3. How to Clear User Setting------------------------------23
9 Troubleshooting Guide ----------------------------------------24
9.1. Troubleshooting Flowchart -----------------------------24
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------37
9.3. Troubleshooting by Symptom (Handset) -----------37
10 Disassembly and Assembly Instructions ---------------38
10.1. Disassembly Instructions -------------------------------38
10.2. How to Replace the Handset LCD -------------------43
10.3. How and Where to fix the spacer---------------------44
11 Measurements and Adjustments---------------------------46
11.1. Equipment Required -------------------------------------46
11.2. The Setting Method of JIG (Base Unit) -------------46
11.3. Adjustment Standard (Base Unit)---------------------48
11.4. Adjustment Standard (Charger Unit)-----------------50
11.5. The Setting Method of JIG (Handset) ---------------51
11.6. Adjustment Standard (Handset) ----------------------53
11.7. Things to Do after Replacing IC or X'tal ------------54
11.8. How to Check the Handset Speaker or
Receiver ----------------------------------------------------55
11.9. Frequency Table (MHz) ---------------------------------55
12 Miscellaneous ----------------------------------------------------56
12.1. How to Replace the Flat Package IC----------------56
12.2. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------58
12.3. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------60
13 Schematic Diagram ---------------------------------------------61
13.1. For Schematic Diagram---------------------------------61
13.2. Schematic Diagram (Base Unit_Main) --------------62
13.3. Schematic Diagram (Base Unit_Operation) -------64
13.4. Schematic Diagram (Handset) ------------------------66
13.5. Schematic Diagram (Charger Unit) ------------------68
14 Printed Circuit Board-------------------------------------------69
14.1. Circuit Board (Base Unit_Main)-----------------------69
14.2. Circuit Board (Base Unit_Operation) ----------------71
14.3. Circuit Board (Handset) ---------------------------------73
14.4. Circuit Board (Charger Unit) ---------------------------75
15 Exploded View and Replacement Parts List ----------- 76
15.1. Cabinet and Electric Parts (Base Unit) ------------- 76
15.2. Cabinet and Electric Parts (Handset) --------------- 77
15.3. Cabinet and Electric Parts (Charger Unit) --------- 78
15.4. Accessories------------------------------------------------ 79
15.5. Replacement Part List ---------------------------------- 80

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KX-TG1032SK/KX-TGA101S
1 Safety Precaution
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).

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KX-TG1032SK/KX-TGA101S
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

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KX-TG1032SK/KX-TGA101S
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
•Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
•Analog telephone connection: Telephone Line
•Optional headset: KX-TCA60, KX-TCA86, KX-TCA92,KX-TCA93, KX-TCA94

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KX-TG1032SK/KX-TGA101S
4 Technical Descriptions
4.1. Block Diagram (Base Unit)
Analog
Front
End
T
o TEL_LINE
A B
CN1
Bridge
Rect D3
D3
Hook Switch
Q3,Q4 Audio
Bell/Caller ID
Interface
CPU
59 54
61
52 60 56 55
BELL
HOOK
Off-Hook Line Voltage 64 ADCO
D/A A/D
ADPCM
Codec Filter
DSP
Speech Decoding Speech Encoding
BMC
Burst Decoding
Burst Encoding
RF
Interface
18 19
TXDA
RXDA
15
21
20
22
RSSI SYCL SYDA SYEN
ANT1 ANT2
RF Module
18
16
2
31
8
21
14
13 12
12
13
XTAL
X1
10.368 MHz
EEPROM
SCL
SDA
6
5
To AC Adaptor
CN2
Limit
Resistor
CHARGE CONTACT
VUNREG
3.3V
Reg. IC1
2.5V
Reg. Q9
1.8V
Reg. Q8
3.3V 2.5V
1.8V
BBIC
IC5
FLASH
MEMORY
(TAM)
TAM Companion IC
RESET
CS
CS
3 4 2 1 8
SCK
SI SO
9
39 40 38 36 37 62
10 11 23 12
IC9
IC8
IC7
IC10
KX-TG1032 BLOCK DIAGRAM (BASE UNIT)

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KX-TG1032SK/KX-TGA101S
4.2. Circuit Operation (Base Unit)
4.2.1. Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC7
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
• RF Module: IC10
- PLL Oscillator
-Detector
- Compress/Expander
- First Mixer
- Amplifier for transmission and reception
• EEPROM: IC5
- Temporary operating parameters (for RF, etc.)
• FLASH MEMORY: IC9
- Voice Prompt (TAM) D/L Area
- ICM/OGM/MEMO Recording Area
• TAM Companion: IC8
- Voice data compression and decompression
- Speaker Amp
-LEDDriver
• Additionally,
- Power Supply Circuit (+3.3 V, +2.5 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit

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KX-TG1032SK/KX-TGA101S
4.2.2. Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown in
Fig.101. The power supply is as follows;
• DECT BBIC (IC7):
CN2 (+6.5 V) →IC1 →Q9 →IC7
CN2 (+6.5 V) →IC1 →Q8 →IC7
• RF Module (IC10):
CN2 (+6.5 V) →IC1 →Q9 →IC10 (PLL)
CN2 (+6.5 V) →IC1 →Q10 →IC10 (Power AMP)
• EEPROM (IC5):
CN2 (+6.5 V) →IC1 →Q9 →IC5
• FLASH MEMORY (IC9):
CN2 (+6.5 V) →IC1 →IC9
• TAM Companion (IC8):
CN2 (+6.5 V) →IC1 →Q9 →IC8
CN2 (+6.5 V) →IC1 →Q8 →IC8
• Charge Contact (TP16):
CN2 (+6.5 V) →R55, R56 →TP16
<Fig.101>

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KX-TG1032SK/KX-TGA101S
4.2.3. Telephone Line Interface
<Function>
• Bell signal detection
• Clip signal detection
• ON/OFF hook circuit
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred as
follows;
•A→C4 →R6 →R33 →IC7 Pin 60 (CID INp)
•B→C3 →R4 →R35 →IC7 Pin 52 (CID INn)
ON/OFF hook circuit:
In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is conse-
quently in an on-hook condition.
When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing an
off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.
•A →D3 →Q3 →Q5 →R21 →R22 →D3 →B [OFF HOOK]
4.2.4. Transmitter/Receiver
• Audio Circuits and DTMF tone signal circuits.
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to Signal Route (P.14).
4.2.4.1. Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC10) through DECT BBIC (IC7) as shown in Block Dia-
gram (Base Unit) (P.7)
The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC10, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from
antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
4.2.4.2. Receiver Block
The signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC10 as shown in Block
Diagram (Base Unit) (P.7).
In IC10, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, and goes to IC7 as GAP (Generic
Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the
frame information and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned
back into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

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KX-TG1032SK/KX-TGA101S
4.3. Block Diagram (Handset)
CHARGE
CIRCUIT
Q4,Q5,Q9
R7
CHARGE
CONTACTS
CHARGE(+)
CHARGE(-)
CHARGE
CHARGE DETECT
EEPROM SCL
SDA
SWITCHED
SUPPLY
Q1
Q1
BATTERY
TERMINAL
D7
VBAT1
DC/DC-SWITCH
J1
J2
2.5V
Q3
1.8V
Q2
4.0V 2.5V
1.8V
LCD
RS
RESET
CS
SI
SCL
CPU
Analog
Front
End
D/A
A/D
30
32
66
67
72
62
52
45
44
58
56
59
60
6
9
10
77
ADPCM
Codec
Filter
DSP
Speech
Decoding
Speech
Encoding
BMC
Burst
Decoding
Burst
Encoding
RF
Interface
RF
Module
IC4
23
22
RXDA
TXDA
19
26
25
24
RSSI
SYDA
SYEN
SYCL
16
17
XTAL
X1
10.368
MHz
BATTERY
61
ON SWITCH
KEYPAD
ROWS
COLUMNS
1,12,40,76
27,28,34,35,36,74
BBIC
IC1
IC3
11
LCD-BACK LIGHT
Ringer LED
7
46
KX-TGA101 BLOCK DIAGRAM (HANDSET)
SPEAKER
RECEIVER
MIC
CN4
Headset
1
2
3
4
5

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KX-TG1032SK/KX-TGA101S
4.4. Circuit Operation (Handset)
4.4.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.11).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD)
• RF Module: IC4
- PLL Oscillator
-Detector
- Compress/Expander
- Amplifier for transmission and reception
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.4.2. Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) →F1, L1, D1 →Q2 (1.8 V), Q3 (2.5 V), Q1 (3.3 V)
The Reset signal generates IC1 (53 pin) and 1.8 V.
4.4.3. Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) →R55, R56 →CHARGE+(Base) →CHARGE+(Handset) →Q4 →D7→F1 →BATTERY+... Battery...
BATTERY- →R45 →GND →CHARGE-(Handset)→CHARGE-(Base) →GND →DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q5 of Handset.
Refer to Fig.101 in Power Supply Circuit (P.9).
4.4.4. Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.4.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

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KX-TG1032SK/KX-TGA101S
4.5. Circuit Operation (Charger Unit)
4.5.1. Power Supply Circuit
The power supply is as shown.

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KX-TG1032SK/KX-TGA101S
4.6. Signal Route

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KX-TG1032SK/KX-TGA101S

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KX-TG1032SK/KX-TGA101S
5 Location of Controls and Components
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
7 Operation Instructions
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

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KX-TG1032SK/KX-TGA101S
8 Service Mode
8.1. Engineering Mode
8.1.1. Base Unit

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KX-TG1032SK/KX-TGA101S
Frequently Used Items (Base Unit)
ex.)
Note:
(*1) Refer to Registering a Handset (P.34)
(*2) When you enter the address or New Data, please refer to the table below.
Items Address Default Data New Data Remarks
Frequency 00 01 75 - - Use these items in a READ-ONLY mode to
confirm the contents. Careless rewriting may
cause serious damage to the computer system.
ID 00 10~00 14 Given value - -
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5

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KX-TG1032SK/KX-TGA101S
8.1.2. Handset

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KX-TG1032SK/KX-TGA101S
Frequently Used Items (Handset)
ex.)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
Items Address Default Data New Data Possible Adjusted
Value MAX (hex)
Possible Adjusted
Value MIN (hex)
Remarks
Battery Low 00 04 25 - - -
(*2)
Frequency 00 01 75 - - -
ID 00 10~00 14 Given value - - -
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5