Panasonic KX-TG6071BXM User manual

© 2007 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
ORDER NO. KM40704321CE
Telephone Equipment
KX-TG6071BXM
KX-TGA601BXM
5.8 GHz Digital Cordless Answering
System
Metallic Gray Version
(for Asia, Middle Near East and Other areas)

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KX-TG6071BXM/KX-TGA601BXM

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KX-TG6071BXM/KX-TGA601BXM
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning-------------------------------------------------------------- 4
2.1. Battery Caution -------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
3 Specifications ----------------------------------------------------- 5
4 Technical Descriptions ----------------------------------------- 6
4.1. FHSS Description ----------------------------------------- 6
4.2. Explanation of Link Data Communication ----------- 9
4.3. Block Diagram (Base Unit_Main)---------------------10
4.4. Block Diagram (Base Unit_RF Part)----------------- 11
4.5. Circuit Operation (Base Unit)--------------------------12
4.6. Block Diagram (Handset)-------------------------------20
4.7. Block Diagram (Handset_RF Part)-------------------21
4.8. Circuit Operation (Handset)----------------------------22
4.9. Circuit Operation (RF Part) ----------------------------26
4.10. Signal Route -----------------------------------------------29
5 Location of Controls and Components ------------------31
5.1. Controls -----------------------------------------------------31
5.2. Display ------------------------------------------------------31
6 Installation Instructions---------------------------------------32
6.1. Setting Up the Base Unit -------------------------------32
6.2. Battery Installation/Replacement ---------------------32
6.3. Battery Charge --------------------------------------------33
7 Operation Instructions ----------------------------------------34
7.1. Programmable Settings---------------------------------34
7.2. Dial Lock----------------------------------------------------36
7.3. Error Messages -------------------------------------------37
7.4. Troubleshooting-------------------------------------------38
8 Test Mode ----------------------------------------------------------41
8.1. Adjustment and Test Mode Flow Chart -------------41
9 Service Mode -----------------------------------------------------51
9.1. How to Clear User Setting -----------------------------51
10 Troubleshooting Guide----------------------------------------53
10.1. Troubleshooting Flowchart -----------------------------53
10.2. How to Replace the Flat Package IC----------------66
10.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------68
11 Disassembly and Assembly Instructions ---------------70
11.1. Disassembly Instructions -------------------------------70
11.2. How to Replace the Handset LCD -------------------73
11.3. Antenna Soldering Work--------------------------------75
12 Measurements and Adjustments---------------------------76
12.1. Things to Do after Replacing IC or X'tal ------------76
12.2. Base Unit Reference Drawing-------------------------77
12.3. Handset Reference Drawing --------------------------78
12.4. Frequency Table ------------------------------------------79
13 Schematic Diagram---------------------------------------------80
13.1. For Schematic Diagram---------------------------------80
13.2. Schematic Diagram (Base Unit_Main) --------------82
13.3. Schematic Diagram (Base Unit_RF Part) ----------84
13.4. Schematic Diagram (Base Unit_Operation) -------86
13.5. Schematic Diagram (Handset_Main)----------------88
13.6. Schematic Diagram (Handset_RF Part) ------------90
14 Printed Circuit Board ------------------------------------------93
14.1. Circuit Board (Base Unit_Main)-----------------------93
14.2. Circuit Board (Base Unit_RF Part)-------------------95
14.3. Circuit Board (Base Unit_Operation) ----------------97
14.4. Circuit Board (Base Unit_Antenna)------------------ 99
14.5. Circuit Board (Handset_Main) -----------------------101
14.6. Circuit Board (Handset_RF Part) -------------------103
15 Appendix Information of Schematic Diagram--------104
15.1. CPU Data (Base Unit) ---------------------------------104
15.2. CPU Data (Handset) -----------------------------------105
15.3. Explanation of IC Terminals (RF Part) -------------106
15.4. Terminal Guide of the ICs, Transistors and
Diodes -----------------------------------------------------108
16 Exploded View and Replacement Parts List----------109
16.1. Cabinet and Electrical Parts (Base Unit)----------109
16.2. Cabinet and Electrical Parts (Handset)------------110
16.3. Accessories and Packing Materials ---------------- 111
16.4. Replacement Parts List--------------------------------112

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KX-TG6071BXM/KX-TGA601BXM
1 Safety Precautions
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temper-
ature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).

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KX-TG6071BXM/KX-TGA601BXM
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer's specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
3 Specifications

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KX-TG6071BXM/KX-TGA601BXM
4 Technical Descriptions
4.1. FHSS Description
4.1.1. Frequency
The frequency range of 5.76 GHz-5.84 GHz is used. Transmitting and receiving channel between base unit and handset is same
frequency. Refer to Frequency Table (P.79).
4.1.2. FHSS (Frequency Hopping Spread Spectrum)
This telephone is using an IC chip which has similar specification to WDCT (World Digital Cordless Telephone) and is the tele-
phone system that can use multiple portable unit simultaneously. The explanation of this system is mentioned below. This sys-
tem uses a Time Division Multiple Access/Time Division Duplex (TDMA/TDD) scheme:
transmitting and receiving frequencies of the base unit and handset are shared in the same frequency. The construction of RX/
TX frequency data is shown below. It consists of 4 slots from the base unit to the handset, and 4 slots from the handset to the
base unit, total 8 slots in 10 ms. By this slot system, simultaneous air link and communication between 4 handsets and the base
unit can be realized. One communication between handset and the base unit is done by one slot from the base unit to handset,
and another slot from handset to the base unit.
DSS makes spectrum spread by multiplying carrier signal by PN code. The purpose to make spectrum spread is to reduce
power density per time and per band. On the other hand, FHSS makes spectrum spread by changing channel every 10 ms
according to Hopping table. Also the purpose to make spectrum spread is to reduce power density per time and per band.

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KX-TG6071BXM/KX-TGA601BXM
4.1.2.1. TDD Frame Format
Sync Field (72 bit): Preamble 56 bit + SyncWord 16 bit
Base unit (handset) adjusts the timing of reception so that reception of base unit (handset) can correspond to transmission of
handset (base unit).
It is necessary for sync-field that handset gets synchronization.
A - field (64 bit): Each kinds of DATA: ch data, line condition, etc.
B - field (320 bit + 80 bit): Sound data + parity
Z - field (4 bit): Parity Check
4.1.2.2. TDMA system
This system is the cycles of 10 ms, and has four duplex paths,
so it is possible to perform four duplex communications simultaneously.
In 1 slot 1.25 ms, the 10 ms of voice data is transmitted.
Each slot makes every frame frequency hop. (100 hops/sec.)
Although each slot (UpLink3 and UpLink4) uses different frequency, UpLink3 and DownLink3 use the same frequency.
•2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
The hopping pattern of a 3000 hops (30 seconds) cycle.
Dummy Bearer
The base unit sends Dummy-data to the all stand-by state handsets.
The handsets receive that data for keeping synchronization and monitoring request from the base unit.
Dummy Bearer doesn't contain B-field (sound) data.

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KX-TG6071BXM/KX-TGA601BXM
4.1.3. Signal Flowchart in the Whole System
Reception
CN101 of the base unit is connected to the TEL line, and signal is input through the bridge diode D101. While talking, the relay
(Q141) is turned ON and amplified at the Q171, then led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with
FHSS to TXDATA. The TXDATA signal goes into IC701 of RF PART, and is modulated to 5.8 GHz. The RF signal is amplified by
the power amplifier (IC801) and fed to Antennas.
As for the handset, RF signal from the RX antenna is amplified by LNA (IC801). The amplified signal is down-converted to IF
signal in IC701. The IF signal passing through internal filter is demodulated into RXDATA, then goes into DSP (IC501). The DSP
performs TDD/TDMA and ADPCM decoding to convert the RXDATA into the voice signal, then it is output to the speaker.
Transmission
The voice signal entering from the handset microphone is led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with
FHSS to TXDATA. The TXDATA signal goes into IC701 of RF PART, and is modulated to 5.8 GHz. The RF signal is amplified by
the power amplifier (IC801) and fed to Antenna.
As for the base unit, RF signal from the Antennas is amplified by LNA (IC801). The amplified signal is down-converted to IF sig-
nal in IC701. The IF signal passing through internal filter is demodulated into RXDATA, then goes into DSP (IC501). The DSP
performs TDD/TDMA and ADPCM decoding to convert the RXDATA into the voice signal. The voice signal is amplified at the TX
amplifier (Q161), then output to the TEL line CN101 through the relay (Q141) and bridge (D101).

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KX-TG6071BXM/KX-TGA601BXM
4.2. Explanation of Link Data Communication
4.2.1. Calling
4.2.2. To Terminate Communication
4.2.3. Ringing

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KX-TG6071BXM/KX-TGA601BXM
4.3. Block Diagram (Base Unit_Main)
KX-TG6071 BLOCK DIAGRAM (Base Unit_Main)
Operational P.C. Board
D101
CHARGE_CONTACT
+
-
MIC
X501
13.824 MHz
ANT2ANT1
CN101
TEL JACK
Tip Ring
CN301
DC JACK
DC+ DC-
RLY
SIDE TONE CIRCUIT
Q161
Q141
BELL DETECT
RLY
BELL
Q111
LIN
LOUT
RF_PART
CID IN CID IN
IC501
DSP
4.0 V
CONVERTOR
MIN
INUSE DETECT 2
INUSE DETECT 1
RECEIVE AMP
DCIN 1 DCIN 2
IC331
RESET
POWER_DOWN
VCCIN
VCC
VCCA
VCCPA
INT_1
CHARGE_DET
V_RF
INT_1 5
VCC
ANSWER_LED
SP_LED
IC601
FLASH MEMORY
KEYS
IC300, Q300
R151,R152 R131,R133
Q171
BCLK RADIO_EN TX_EN RX_EN SLOT_CTRL SYN_DATA SYN_CLK TXDATA
V_RF(VPA)
SI,SO,CS,
IN USE_LED
MSG_LED
KEY1 6
KEYA E
SPOUTP
SPOUTN
RXDATA
MIP
SYN_EN SYN_OUT RF_RESET
3.3 V
REGULATOR with RESET
CLK,RST
AC_DOWN
AC DOWN
Q361, Q362
CHARGE DETECT
R371 R372
SP

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KX-TG6071BXM/KX-TGA601BXM
4.4. Block Diagram (Base Unit_RF Part)
TXDATA
ANT1
ANT2
RXDATA
5.8 GHz Power Amp., LNA and Antenna Switc Circuit
3.0 V
REGULATOR
IC761
PLL
delta-sigma Modulator
IC701
Doubler
2x
Control Logic
&
Modem
A/D
PAEN ANTSEL_A ANTSEL_B LNA_EN RXGAIN
VCC_PLLA
VCC_VCO
VCC_PLLD
VCC_PA
VCC_FE
VCC_IF
VCC_DIG
RADIO_EN
KX-TG6071 BLOCK DIAGRAM (Base Unit_RF Part)
SLOT_CTRL SYN_DATA SYN_CLK SYN_EN SYN_OUT BCLK
DSP
IC501
V_RF
V_PA
IC801
FL711 FL721 IF = 432 kHz
FL811
FL821

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KX-TG6071BXM/KX-TGA601BXM
4.5. Circuit Operation (Base Unit)
General Description:
(DSP, Flash Memory) is a digital speech/signal processing system that implements all the functions of speech compression,
record and playback, and memory management required in a digital telephone answering machine.
The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that func-
tions as follows.
4.5.1. DSP (Digital Speech/Signal Processing: IC501)
•Voice Message Recording/Play back
The DSP system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
•DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
•Synthesized Voice (Pre-recorded message)
The DSP implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
•Caller ID demodulation
The DSP implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
•Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from handset is transmitted to the Tele-
phone line, etc. They are determined by the signal path route operation of voice signal.
•Block Interface Circuit
RF part, LED, Key scan, Speaker, Microphone, Telephone line.
4.5.2. Flash Memory (IC601)
Following information data is stored.
•Voice signal
ex: Pre-recorded Greeting message, Incoming message
•Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse

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KX-TG6071BXM/KX-TGA601BXM
4.5.3. Power Supply Circuit
Function:
The power supply voltage from AC adaptor is converted to the desired voltage of each block.
Circuit Operation:
• Q300 and IC300: 4.0 V DCDC Converter
• IC331: 3.3 V Regulator

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KX-TG6071BXM/KX-TGA601BXM
4.5.3.1. Charge Circuit
The voltage from the AC adaptor is supplied to the charge circuits.

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KX-TG6071BXM/KX-TGA601BXM
4.5.4. Reset Circuit
Function:
This circuit is used to initialize the microcomputer when it incorporates an AC adaptor.
Circuit Operation:
When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC331 and power is supplied to the DSP.
The set starts to operate when VCC goes up to 3.0 V or more in the circuit voltage diagram.
Note:
(*1) The initializing time of the DSP chip is 28 ms under normal conditions.

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KX-TG6071BXM/KX-TGA601BXM
4.5.5. Telephone Line Interface
Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T →L101 →R111 →C111 →Q111 →DSP pin 58 [BELL]
When the CPU (DSP) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T →L101 →D101 →Q141 →Q161 →R163 →D101 →L102 →P101 →R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 59 of DSP turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of DSP.

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KX-TG6071BXM/KX-TGA601BXM
4.5.6. Auto Disconnect Circuit
Function:
This circuit is used to detect the fact that another telephone connected to the same line is OFF-HOOK while the unit is in a
receiving status or OGM transmitting status.
Circuit Operation:
The voltage of pin 90 of IC501 is monitored. If a parallel-connected telephone is put into OFF HOOK status, the presence/
absence of a parallel connection is determined when the voltage changes by 0.2 V or more. When the set detects the parallel-
connected telephone is OFF HOOK status, the line is disconnected.
You can enable or disable the Auto Disconnect function.
See Check Record (P.55)

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KX-TG6071BXM/KX-TGA601BXM
4.5.7. Parallel Connection Detect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone con-
nected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 86 of IC501. There is no parallel connection if the voltage is
1.65 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 90 of IC501; the presence/absence of a parallel connection is determined when
the voltage changes by 0.2 V or more.

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KX-TG6071BXM/KX-TGA601BXM
4.5.8. Calling Line Identification (Caller ID)
Function:
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used.
The Caller-ID data from exchange is supplied to the telephone using either method of FSK or DTMF. The method is chosen
according to the exchange of telephone office. This unit is available to receive the data with both methods and displays the
received data on LCD.
•FSK (Frequency Shift Keying) format
•DTMF format
It is the method to send the telephone number of calling party with DTMF to the telephone. DTMF is sent before the first bell sig-
nal.
The data is sent in turn; first the start code, secondly the telephone number of calling party, lastly end code.
The DTMF is chosen from A (1633 Hz and 697 Hz), B (1633 Hz and 770 Hz), C (1633 Hz and 852 Hz) and D (1633 Hz and
941 Hz) as the start code and end code according to the exchange.

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KX-TG6071BXM/KX-TGA601BXM
4.6. Block Diagram (Handset)
V_PA
V_RF
3.0 V
IC521
IC371
IC501
IC381
IC541
MIP
MIN
LOUTO (SP)
LCD BACKLIGHT
HSSPOUT
ANT_LIGHT
LINO (HS_MIC)
HEADSET_DET
SPOUTP
SPOUTN
CI
CI
VCCPA
VCCA
VCC
PDN
DSP
RESET
CHG_CTL
CHG_DET
RADIO_EN
CON_EN
SYN_LE2
SYN_OUT
SYN_DATA
SYN_CLK
SYN_LE1
RX_GAIN
RX_EN
TX_EN
SHCTRL
RF_RESET
RSSI
WP, CLK, DATA
KEYSTOROBE_A~F
KEYIN_1~5
Q531
CHARGE
DETECT
CHARGE Q361 D361
Q521
Q362, Q363
CHARGE
CONTROL
RESET
POWER DOWN
IC561
DC/DC
CONVERTER
REGULATOR
MIC
SP
Headset Jack
CN431
Q431
LED561
HEADSET
DETECT
Monitor SP
3.3 V
REGULATOR
LCD KEYS
RF part
ANT
X501
13.824 MHz
EEPROM
BATTERY
PA_CONT
TX_DATA
RX_DATA
OSC_IN
Q561
Q555
LCD
BACK
LIGHT
KEY_BACKLIGHT
Q562
LED551-554
(KEY)
(ANT)
KKX-TGA601 BLOCK DIAGRAM (HANDSET)