Philips CDI 220/31 User manual

Compact disc interactive player CDI
220/2012s1a11a1139
lintil:liractive
Media CD-I
/20/25/39 are PAL players
/31/37 are NTSC players
CONTENTS
Detailled table of contents
2 Product information
3 Service information
4 Mechanical drawings
5 Descriptions of Service Software
6 Electrical drawings
7 Diagnostics, measurements and adjustments
8 Partslist
These sets are equiped with Compact Disc Mechanism type
CDM9; service code 4822
691 30275. This COM is also used
in CDl205 and CDl910
@)
Avattaessa ja suojalukitus ohitettaessa olet alttiina
nakymattomalle lasersateilylle. Ala katso siiteeseen.
CD
Osynlig laserstralning nar denna del iir oppnad och sparren ar
urkopplad. Betakta
ej stralen.
@)
Usynlig laserstraling ved abning nar sikkerhedsafbrydere er
une af funktion. Undga udsaettelse for straling.
Safety regulations require that the set be restored
to its original condition
and that parts which are identical with those specified
be used.
iMtifiiii
CLASS 1
LASER PRODUCT
31Zl:1100l4l(l
Published by PS1192 Service & Support Interactive Media Systems Printed in The Netherlands ©Copyright reserved Subject to modification 4822 725 24182
PHILIPS
PCS67 628

1 DETAILLED TABLE OF CONTENTS
SECTION CONTENTS SECTION CONTENTS
1 DETAILLED TABLE OF CONTENTS 5 SERVICE SOFTWARE 7 DIAGNOSTICS
l5.1
The FTDDisplay/Keyboard test
7.1
Troubleshooting and Repair
2 PRODUCT INFORMATION
5.1.1
Test sequence 7.1.2
Troubleshooting and Service the MMC parts
2.1
Technical specification 5.2 The
low level MMC test
7.1.3 Servo part and
Audio Section
2.2 Connections and
controls
5.2.1
Tools Troubleshooting
5.2.2 Test sequence 7.1.4 Video Section Troubleshooting
3 SERVICE INFORMATION 5.2.3 Low level test implementation 7.2 Measurements and
adjustments
3.1
Safety instructions
5.2.4 How
to start up the low level test
7.2.1
Power supply section
3.2 Servicing
of SMDs (Surface Mounted 5.2.5 PCB
low level test
7.2.2 Servo section
Devices) 5.2.6 Terminal
low level test 7.2.2.1 Laser
current
3.2.1
General cautions on handling and storage 5.2.7
Error codes 7.2.2.2 Focus signal
3.2.2 Removal of SMDs 5.2.8 Release number,
position and checksum 7.2.2.3 Starting signal
3.2.2.1 Caution on removal storage 7.2.2.4 Motor
control signals
3.2.3 Attachment
of SMDs 5.2.9 How is the checksum calculated 7.2.2.5 Radial
error circuit signals
3.2.3.1
Caution on attachment
5.3
The service shell
7.2.2.6
Clock signal µP IC7475
3.3 Handling ESD sensetive
components 5.3.1 Starting the service shell
7.2.2.7 Decoder
signals
3.3.1
Personal safety 5.3.2 Layout info
7.2.3
Audio section
3.3.2 Storage and
transport 5.3.3 Subject dependent information 7.2.3.1 Slave
processor data
3.3.3 Testing
or handling 7.2.3.2 1
2S signals
3.3.4 Mounting ESD sensetive
components
6 ELECTRICAL DRAWINGS 7.2.3.3 Xin clock signal
3.3.5 Soldering
6.1 Block diagram 7.2.3.4 DEEMP signal
3.3.6 Electrostatic charges 6.2 Wiring diagram 7.2.3.5 KIii signal
3.3.7 Transients
(switchon phenomena)
6.2.1 Alphabetical list of abbreviations 7.2.3.6 Performance
check
3.3.8 Working environment
6.3 Power
supply panel 7.2.4 Video section
3.3.9 Replacement
of the Flat Pack ICs
6.3.1 PCB Layouts 7.2.4.1 Check
and adjustmentof the subcarrier
3.4 Codenumbers
for standardized resistors 6.3.2
Circuit diagram 7.2.4.2 SW control signal
3.5 Service
tools
6.3.3 List
of electrical parts 7.2.4.3 Check
of RGB input signals
3.5.1
Service PCB 6.4 Control & Display panel 7.2.5 Multi media
controller section
3.5.1.1
Circuit diagram
6.4.1 PCB layouts 7.2.5.1 Supply voltages
3.5.1.2 Layout 6.4.2 Circuit diagram 7.2.5.2
Clock signals
3.5.1.3 Parts
list
6.5 Headphone panel 7.2.5.3 1
2S interface
3.5.2
List of accessories and Service tools
6.5.1 PCB layouts
7.2.5.4 Reset
circuitry
3.5.2.1 Partslist for Rollercontroller 6.5.2 Circuit diagram 7.2.5.5 Main µP 68070
3.6 The Monoboard central repair procedure 6.6 Monoboard panel 7.2.5.6
Low Level test
6.6.1 Up part
circuit diagram
4 MECHANICAL DRAWINGS 6.6.2 Gluelogic, CDIC, DSP part
circuit diagram 8 PARTSLIST
4.1
Service position
6.6.3 Digital video part circuit diagram
8.1
Partslist of the cabinet
4.2 Exploded
view of cabinet 6.6.4 PCB layout
8.2
Partslist of the trayloader
4.3
Exploded view of loader 6.6.5 F.M.V. interface panel circuit diagram and 8.3 Partslist
of the display and powersupply
PCB layout panel
6.6.6 Servo part
circuit digram
8.4 Partslist
of the Monoboard
6.6.7 Analog
audio part circuit diagram 8.5 Partslist
of accessories and servicetools
6.6.8 Analog video part circuit diagram
6.6.9 PCB layout
PCS67 629

2 PRODUCT INFORMATION
2.1 TECHNICAL SPECIFICATION
System • Systeme • Sistema • Systeem • System • Sistema •
Sistema
CD-Interactive
CD-lnteractif
Output• Sortie• Salida• Uitgang • Ausgang • Uscita • Saidas •
Salidas
video 1 Vpp (75 Ohm load, sync neg) RCA pin jack
1 Vc-c (charge 75 Ohm. sync neg) Prise cinch
Usable discs • Disques utiliables • Discos utilizables • Discos S-video
y-output 1 Vpp (75 Ohms)
Utiliable • Te gebruiken discs • Verwendbare discs • Dischi usabili
CD-I CO-I
CD-DA CD-Audio
PHOTO-CD Photo CD
CD-I READY CO-/ READY
CD BRIDGE CO-I BRIDGE
CD+GRAPHICS CD+GRAPH/CS
Power requirement • Alimentation • Alimentacion • Alimentaci6n
Voedingsspanning • NetzanschluB • Alimentazione
Europe: 220-230 V/50 Hz USA: 120 V/60 Hz
UK: 240 V/50
Hz Japan: 100 V/50,60 Hz
Power consumption • Consommation • Consume de corriente
Opgenomen vermogen • Leistungsaufname • Consumo
di corrente •
Consomo de Corriente
35 W with. 22 W without extension (22ER9141)
35 W avec. 22 W sans extension (22ER9141)
Operating temperature • Temperature de tonctionnement
Temperatura de operacion • Bedrijfstemperatuur
Betriebstemperatur • Temperature di tonzionamento • Temperature
de funcionamiento
41 °F(5°C) to 95°F{35°C)
5°C a35°C
Relative humidity • Humidite relative • Humedad relative
Relatieve vochtigheid • Relative Feuchtigkeit • Umidita relative •
Humedad relative
5% to 95% (no condensation)
5% a 95% (sans condensation)
Weight • Poids • Peso • Gewicht • Gewicht • Peso • Peso
5,2 kg
Dimensions (w x h x d) • Dimensions (I x h x p)
Dimensiones
(ax ax p) • Afmetingen (bx h x d)
Abmessungen
(Bx H x T) • Dimensioni (I x h x p) • Dimensiones
(anch. x alt. x prof.)
420 mm x 90 mm x 286 mm
16.55" X3.55" X 11.25""
Input • Entree • Entrada • lngang • Eingang • lngresso • Entradas
remote in 2 Vpp at 2.2 kOhm cinch socket
Prise cinch 2 Vc-c a 2.2 kOhm
input (2 ports) 8-pin mini-DIN
(2 entrees) mini DIN 8 broches
pin
Broche
1
2
3
4
5
6
7
8
signal
Signal
nc
rxd
txd
nc
ground / Masse
els
rts
+5V (200
mA maxi.}
Note: Pointing device speed of 96D0 baud is supported
1/0
EIS
1/E
O/S
II E
O/S
Remarque· V1tesse de transmission jusqu· a9600 baud. • Nota Se adm1te un drsposilivo de
puntero de 9600 baudios de velocidad. • Opmerk1ng. Voor de aanwljsapparaten is een snel-
heid van 9600 baud mogehik. • Hinweis. Die Geschwmd,gkert der Ze,gevorrichrung van 9600
baud wird unters/Otzt • Nata.· Toliera la velocira dell'accessono d1 comando d1 9600 baud. •
Nola: Velocidad dot
d1spos1t,vo de apunta admir1da: 9600 baudios.
c-output 300 mVpp (75 Ohms)
S-video 4-pin miniDIN
Sortie Y 1 Vc-c (75 Ohm}
Sortie C
300 mVc-c (75 Ohm)
mini DIN 4 broche S-video
pin
Broche
1
2
3
4
signal
Signal
ground y I Masse Y
ground c / Masse C
y / y
CIC
AV/Euroconnector
Per/television AN
Headphones
Prise Gasque
Audio
pin
Broche
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
signal
Signal
audio R / audio R (droite)
nc / non connecte
audio L / audio L (gauche)
audio ground/ masse audio
blue ground/ masse bleu
nc / non connecte
blue/ bleu
slow switching (0= TV 1=AV/Euroconnector)
commutation lente
(0= TV 1=Peritelevision All;)
green ground / masse vert
nc / non connecte
green/ vert
nc / non connecte
red ground / masse rouge
nc / non connecte
red/ rouge
fast switching (RGB/CVBS)
commutation rapide (RVBICVBS)
CVBS ground / masse CVBS (PAL)
fast switching (ground)
commutation rapide (masse)
CVBS/RGB sync/ CVBSIRVB sync.
nc / non connecte
shield / blindage
Input impedance 32 Ohm to 2 kOhm output power
30 mW at 1kHz, 32 Ohm stereo socket 3.5 mm
impedance entree 32 Ohm a2 kOhm puissance sortie
30 mW a 1kHz. 32 Ohm stereo, prise Jack 3.5 mm
2 Vrms
2 channel individual RCA pin cinch sockets
2 Ve11
2 prises cinch (une par canal)
Designs and specihcations are subJect lo change without notice
La conception et les spf§dficar1ons de ~e produft sont sujel a modif1cat1ons sans ~vis pr0ala~
Qfe. • Los d,seiios y las especif1cacrones estan sujefos a cambios sin prev,o aviso. •
Anderungen von Austahrung und technfsche D~ton vorbetraften • Jdisegnf e fe speci!iche tec-
mche sono soggette a modif1che senza preavviso • As especificar;Oes desc1tas estao sujeftas
a a!lreai;:ao sem aviso
prev10. • Et diseffo y las especificaciones estas sujetos a cambios sin
previo 8v1s0
2.2 CONNECTIONS AND CONTROLS
23 22
13 1,i 1, rn n
1!!! 21 2(i ::to
(9)
(8)
TT
PCS 67 630

3.1 SAFETY INSTRUCTIONS
Safety regulations demand that the set be restored to
its original condition and
that components identical
with the original types be used.
Safety components are marked by the symbol A.
-ESD ,,.
~
All IC's and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are connected
with the same potential as the
mass of the set via a
wrist
wrap with resistance.
Keep components and tools also at this potential.
For detailed information see "Handling ESD-sensitive
components".
- A set to be repaired should always be connected to
the mains via a suitable isolating transformer.
-never replace any modules
or any other parts while
the set is switched on.
-Use plastic instead
of metal alignment tools. This in
order to prelude short-circuit or to prevent a specific
circuit form being rendered unstable.
3.2 SERVICING OF SMDs (Surface Mounted Devices)
3.2.1 General cautions
on handling and storage
a. Oxidation on the SMDs terminals results in poor
soldering. Do not handle SMDs with bare hand.
b. Avoid for storage places that are sensitive to
oxidation such as places with
sulfur or chlorine gas,
direct sunlight, high temperatures
or a high degree of
humidity.
As a result the capacitance or resistance value of the
SMDs may be affected.
c. Rough handling of circuit boards containing SMDs
may cause damage to the
components as well as the
circuit boards. Circuit boards containing
SMDs should
never be bent
or flexed. Different circuit board
materials expand and contract at different rates when
heated
or cooled and the components and/or solder
connections may be damaged due
to the stress.
Never rub
or scrape chip components as this may
cause the value
of the component to change. Similary,
do not slide the circuit board across any surface.
3.2.2 Removal of SMDs
a. Heat the solder (for 2-3 seconds) at each terminal of
the chip. Small components can, by means of litz wire
and a limited horizontal force, be removed with the
soldering iron. They can also be removed with a
solder sucker (see Fig. 1
a) or
b. While holding the SMD with a pair of tweezers take it
off gently using th soldering
iron's heat applied to
each terminal (see Fig. 1 b).
c. Remove the excess solder on the solder lands by
means
of litz wire or a solder sucker (see Fig. 1 c).
3.2.2.1 Caution on removal:
a. When handling the soldering iron, use suitable
pressure and
be careful.
b. When removing the chip, do not use undue force with
the pair
of tweezers.
c. The soldering iron to be used (approx. 30 W), must
preferably
be provided with a thermal control
(soldering temperature about 225
to 250°C).
d The chip, once removed,
must never be used again.
PCS 67 631
DISMOUNTING
SOLDERING
IRON ~
e g WELLER
SOLDER TIP PT-H7
SOLDERING
OR
IRON~
SOLDER WICK \\
4822 3;;-, 40042 ~
e g A PAIR OF TWEEZERS
HEAT~. t HEAT IN:
,., ,,., ,,
SOLDERING IRON
SOLDE'R WICK,;:~ CLEANING
Fig. 1
3.2.3 Attachment of SMDs
t,J 757 Ali
C
a. Locate the SMD on the solder lands by means of
tweezers and solder the component at one side.
Ensure
that the component is positioned well on the
solder lands (see Fig. 2a).
b. Next complete te soldering of the terminals of the
component (see Fig. 2b).
MOUNTING
SOLDER
•• Q 5 · 05 mm
SOLDERING'\ PRESSURE
IRON 'I.., \ •
• :b:===:o
'
SOLDERING TIME
3 S!:-C s.~de
SOLDf::R
.• 0 !> -0 8 rnm
O 768 An
Fig. 2
EXAMPLES
@x(@0$,
8
SOLDERING
~'
43 7-69 An
Fig. 3
3.2.3.1 Caution
on attachment:
a. When soldering the SMD terminals, do not touch them
directly with the soldering iron. The soldering
must be
as quick as possible; care
must be taken to avoid
damage
to the terminals and the body itself.
b. Keep the SMD's body in contact with the printed
board when soldering.
c. The soldering iron to be used (approx. 30 W) must
preferably be provided with a thermal control
(soldering temperature
about 225 to 250°C).
d. Soldering should
not be done outside the solder land.
e. Soldering flux (of rosin) may be used but should not
be acidic.
f. After soldering, let the SMD cool down gradually at
room temperature.
g. The quantity
of solder must be proportional with the
size
of the solder land. If the quantity is too great, the
SMD might
crack or the solder lands might be torn
loose from the printed board (see Fig. 3).
3.3 HANDLING ESD-SENSITIVE COMPONENTS
3.3.1 Personal safety
The testing, handling and replacing of ESD-sensitve
components requires special attention for personal
safety. A person dealing with ESD-sensitive
components should, normally speaking, be connected
via a resistance to the same potential as the chassis
of the set to protect him against direct contact with
the supply voltage.
This resistance is often applied
in the connection lead
of wrist wraps. If necessary, make use of an isolating
transformer.
3.3.2 Storage and transport
Transport and store the circuits and PCBs in their
original packages.
As an alternative to the original package one may use
a conductive material
or special IC package which
short-circuits all the pins
of the component with one
another.
Always discharge the package before opening
it
3.3.3 Testing or handling
Work on a conductive surface when testing loose
circuits and components
or when transferring
components and circuits from one package to
another.
Use a conductive wrist
wrap with lead to make an
electrical connection between the conductive surface
and yourself via a resistance
in the connection lead of
the wrist wrap.
Connect equipment and tools also with this conductive
surface.
Do not connect any signals to inputs as long as the
power supply of the set to be tested is off.
All the inputs that are not used should be connected
either
to ground or to the supply voltage. When
testing, do not use any freon sprays for under-cooling
of sensitive components.
3.3.4 Mounting ESD-sensitive components
Mount ESD-sens1tive components only after all other
components have been mounted.
Make sure that the components themselves, the metal
parts
of the PCB, mounting equipment and mounting
operator are at the same potential level as the chassis
of the set.
If it is impossible to ground the PCB, the mounting
operator should pick the PCB up before bringing it
into contact with the components
to be replaced.
Conductive sheet
Special attention should be paid in regions having a
dry atmosphere and when the floor
is covered with a
nylon carpet or such.
Bit
3.3.5 Soldering
Soldering iron tips, also those of low-voltage soldering
stations, should be
kept at the same potential as the
components and the PCB.
It is better to use solder-removing braid than solder
suckers.
3.3.6 Electrostatic charges
One should stick to the precautionary measures also
after the ESD-sensitive
components have been
mounted on the PCB. Until the sub-PCBs have been
incorporated into a complete system on which the
correct supply voltages are connected, the PCB
is
nothing more than an extension of the conductors of
the components on this PCB. To prevent electrostatic
discharges from passing
to the components via the
terminals, we recommend
that you apply conductive
clips
or conductive tape on the terminals of the PCB.
3.3.7 Transients (switch-on phenomena)
To prevent permanent damages as a result of
switch-on phenomena. no ESD-sensitive components,
or PCBs populated with these components, should be
inserted
in or removed from test-sockets or systems
with the
supply voltage on.
Prevent switching peeks on the mains as a
consequence
of switching electric equipment, relay
and
DC lines on and off.
3.3.8 Working environment
The work bench for the service technician should look
like the
one shown in the figure.
3.3.9 Replacement of the Flat Pack IC's
For replacing a component see Fig. 6 Dismounting
and Mounting. Also a
number of precautions and
examples is given.
When replacing a flat pack, rosin flux applied to the
device leads will ensur-e a
good soldered joint.
Since rosin flux, when
not properly heated by the
soldering process,
is sticky, it will attract dust which
will result
in component degeneration over a period of
time.
The removal
of excess flux with a cleaner will not
solve this problem because the flux is then even
spread over a greater area by the cleaner. Drying of
the flux can
be accomplished by blowing the area with
a common hair dryer for 1
or 2 minutes at a distance
of approx. 10 centimeters.
I•
Safety isolating transformer
Wrist wrap

TOOLS
TO
BE
USED
ANTISTATIC
MAT
MAGNIFYING
GLASS
CUTTING
THE
LEADS
HAIR
DRYER
______
.,_
_
...
METAL
BRUSH
DISMOUNTING
CLEANING
THE
TRACKS
WRONG
TRA
C
KS
WILL
BE
DAMA
G
ED
ALIGNING
THE
LEADS
RIGHT
WRONG
WRONG
4822 390 50025
w
FLUX
J°LU
J'
B
4822
321
40042
•
DESOLDER
BRAID
,.,,,,.,
..
00
,
5-0
,8
MM
FIXING
IC
AT
THE
CORNERS
\
RIGHT
MOUNTING
DRYING
SOLDERING
IRON
WELLER
TCP
50
-
--
~
'--
--
-
SOLDER
TIP
WELLER
PT-CC7
4822 310 50081
KNIFE
APPL
YING
FLUX
SPEED
1
CM
IN
5 SEC.
SOLDERING
WRONG
WRONG
PCS 67
632

CODENUMBERS FOR
STANDARDIZED
RESISTORS
Unless otherwise specified,
all
defective resistors
in
the
circuits of the set can
be
replaced by standardizes types,
mentioned
in
this chapter.
VR25, VR37 high-ohmic/high
-voltage
resistors
woe iDrnax
I
L1
max
i
L2
max
I
d
VR25 2,5 6,5 7,5 0,6
type
Dma.,,,
Li
max
l2~max
d
Vfl37
I 3.7 I 9.0
I
100
I
0.7
Range VR25 : 100
KQ
to 22 MQ
Range VR37 : 100
KQ
to 33 MQ
Composition ofthe service number
for
the VR25 and VR37
Main subgroup: 4822 053 20
...
and 4822 053
21
...
The codenumber above is completed by inserting the
first two figures (resistance code) followed by the
multiplier.
4 for R = 100K to 910
Kn
5 for A = 1M to
9.1
Mn
6
for R = or
>
10M
Example's:
The serv.nbr. for a VR25 resistor
of
100
Kn
is 4822 053 20104
The serv.nbr. for a VR37 resistor
of
33
Mil
is 4822 053 21336
PR01, PR02 and PR03
power
metal
film resistors
-¢1Dma:><
L
1
L2m,:1x
,pd
2.5 6.5
8,0
0.6
~
II II
L--L2~~
1
o
l
l
00
====<1~~11
u--~:t==h=:
=
-Lz~J
01
0
Llma,; L2max
tfxJ
e-----+-----t
5.2
16.7 17.9
0.6
Rated dissipation at T(amb) = 70 degrees :
PR01
=
1 Watt,
PR02 = 2
Watt,
PR03 =
3Watt
Composition
of
the service number
for
the PR01, PR02
and PR03
Main subgroup: 4822 053 10... ; 4822 053
11
...
and 4822
053 12...
PCS 67 633
The codenumber above is completed by inserting the
first
two
figures (resistance code)followed by the
multiplier.
8forR=
1
to9,1n
9
for
R=
1
o
to
91
n
1 for
R=
100 to 910 n
2 for
R=
1
to
9,
1
Kn
3 for
R=
10 to
91
Kn
4forR=
100
to910Kn
5 for
R=
or
>
1
Mn
Example:
The serv.nbr.
of
a
PR01
resistor
of
47 n
is: 4822 053 10479
The serv.nbr.
of
a PR03 resistor
of
1
MO
is: 4822 053 12105
NFR25
fusible resistors
A
Dma~_
Lma)(
.a,
+a2
2.5
6.5
0.6
.;;
1
Composition
of
the service number
for
the NFR25
Main subgroup: 4822 052 10...
The codenumber above is completed by inserting the
first two figures (resistance code)followed by the
multiplier.
8 for
R=
9
for
A=
1 for
R=
2 for
R=
3 for A=
Example:
1 to 9,1
n
10 to
91
n
100
to910n
1
to9,1
Kn
1
o
to
91
Kn
The service number
of
a resistor
of
47 n
is:
4822 052 10479
NFR25H fusible resistors
A
r'--1
___
'•-1~
~p
0d
I
2,5 6,5 0,6
,;:
1
Composition of the service number for the NFR25H
Main subgroup: 4822 052 11...
· The codenumber above is completed by inserting the
first two figures (resistance code)followed by the
multiplier.
8
for
A=
9 for
A=
1 for
R=
2
for
A=
3 for
A=
Example:
1
to9,1
n
1
o
to
91
n
100
to910!1
1 to 9,1
Kn
10
to91
Kn
The service number
of
a resistor of 47 n
is: 4822 052 11479

3.4 CODENUMBERS FOR STANDARDIZED RESISTORS
Unless otherwise specified, all defective resistors in the
circuits of the set can
be replaced by standardizes types,
mentioned
in this chapter.
VR25, VR37 high-ohmic/high -voltage resistors
-1 -L1--1 I
V-,...--'7j.._!
=====!! 'll:=====;;00
i-L2- 00
L1 max
L2 rria;-; I d
6,5
),,$
0,6
,yµe
Dma:< Lt max L2m,n.:
rj
VR37
I 3.7
9.0 10.0 0.7
Range VR25 : 100 KQ to 22 MQ
Range
VR37 : 100 KQ to 33 /AQ ·
Composition
of the service number for the VR25 and VR37
Main subgroup: 4822 053
20 ... and 4822 053 21 ...
The codenumber above is completed by inserting the
first two figures (resistance code) followed by the
multiplier.
4 for R = 100K to 910
Kn
5 for R = 1M to 9.1 Mn
6 for R = or > 1 OM
Example's:
The serv.nbr. for a VR25 resistor
of 100 Kn
is 4822 053 20104
The serv.nbr. for a VR37 resistor
of 33 MQ
is 4822 053 21336
PR01, PR02 and PR03 power metal film resistors
i- ~Dma, L1 I L2max , ¢d
,.5 s.5 1 s.o I o.6
l""-L'~i
I ! •
'~' I __ 1J+--~
i 3.9
Rated dissipation at T(amb) = 70 degrees :
PR01 = 1 Watt, PR02 = 2 Watt, PR03 = 3Watt
Composition of the service number
for the PR01, PR02
and PR03
Main subgroup: 4822 053 10
... ; 4822 053 11 ... and 4822
053 12
...
The codenumber above is completed by inserting the
first
two figures (resistance code)followed by the
multiplier.
8 for R= 1 to
9, 1 n
9 for R= 10 to
91 n
1 for R= 100 to 910 n
2
for R= 1 to 9,1 Kn
3 for R= 10 to 91 KQ
4
for R= 100 to 910 KQ
5
for R= or > 1 Mn
Example:
The serv.nbr.
of a PR01 resistor of 47 Q
is: 4822 053 10479
The serv.nbr.
of a PR03 resistor of 1 Mn
is: 4822 053 121 05
NFR25 fusible resistors A
a~-1-
o,
I
0d
~D
Dmax Lmax d
ai -.f. a2
2.5
6,5
0,6 <;1
Composition of the service number for the NFR25
Main subgroup: 4822 052 10
...
The codenumber above is completed by inserting the
first two figures (resistance code)followed by the
multiplier.
8 for R=
9 tor R=
1
for R=
2
for R=
3 for R=
Example:
1
to9,1 n
10
to 91 n
100 to 910 n
1
to 9,1 Kn
10 to 91 Kn
The service number of a resistor of 47 n
is: 4822 052 10479
NFR25H fusible resistors A
i+--'7
··-1~
~"
•• j
Dmax. Lmax.. a1 + a2
2,5 6,5 0,6 <; 1
Composition of the service number for the NFR25H
Main subgroup: 4822 052
11 ...
The codenumber above is completed by inserting the
first two figures (resistance code)followed by the
multiplier.
8 for
R=
9 for R=
1 for R=
2 for R=
3 for R=
Example:
1
to9,1 n
10
to91 n
100
to910Q
1 to 9,1 Kn
10 to 91 KQ
The service number
of a resistor of 47 n
is: 4822
052 11479
RC-01, RC-11 AND RC-21 chip resistors
-0,45± 0.25
~ protecuve ooat
1,6
±0.15
/
AH dimensions in mm
/
--- 2.0±.0,15 ---
All d1mensmns in mm
,__ __ i.S±,0.10 ---
Absolute max. dissipation :
A~J "' 0.25 t. 0.15 for style T
or 0.40 .! 0 20 for style 2
RC-01 : 0,25 W, RC-11 : 0, 10 W, RC-21 :0,062 W.
Range: RC-01 0 Q TO 10 MQ
RC-11 0 Q TO tO MQ
RC-21 0 Q TO 6,8 MQ
Composition
of the service number for the RC-01,RC-11
and RC-21
Main subgroup: 4822 051 10, .. , 4822 051 20 ... and
4822
051 30 ...
The codenumber above is completed by inserting the
first two figures (resistance code) followed by the
multiplier.
8 for
R= o to 9.1 n
9 for
R= 1o to 91 n
1 for
R= 100 to 910 n
2 for
R= 1 to 9.1 Kn
3 for R= 10 to 91 Kn
4 for R= 100 to 910 KQ
5 for R= 1 to 9.1 MQ
6 for R= or > 1O MQ
Example's:
The serv.nbr. for a
RC-01 resistor of
o n is 4822 051 10008
The serv.nbr. for a
RC-11 resistor of
on is 4822 051 20008
The serv.nbr. for a
RC-21 resistor of
on is 4822 051 30008
The serv.nbr. for a
RC-01 resistor of
10 n is 4822 051 10109
The serv.nbr. for a
RC-11 resistor of
10 n is 4822 051 20109
The serv.nbr. for a
RC-21 resistor of
10 n is 4822 051 30109
MRS16T metal film resistors with low-inductance
--u-·
~ ! fd
~ !
·~ L2-' 00
L2 max
3,7 0,5 -0,04
Composition of the service number for the MRS16T
Main subgroup: 4822 050 1
.. ,.
The codenumber above is completed by inserting the
first three figures (resistance code)followed
by the
multiplier.
8
for R= 4,99 to 9,76 n
9
for R= 10 to 97,6 n
1 for R= 100 to 976 n
2 for R= 1 to 9,76 KQ
3
for R= 1o to 97,6 Kn
4 for R= 100 to 976 KQ
5 for R=
or > 1 MQ
Example:
The service number
of a resistor of 487 n is:
4822 050
14871
MRS25 metal film resistors (0,5%)
Composition of the service number for the MRS25
Main subgroup: 4822 050 2....
The codenumber above is completed by inserting the
first three figures (resistance code)followed by the
multiplier.
8 for R= 1 to
9, 76 n
9 for R= 10 to 97,6 n
1 for R= 100 to 976 n
2 for R= 1 to 9,76
Kn
3 for R= 10 to 97,6 KQ
4 for
R= 100 to 976 KQ
5 for
R= 1 to 9,76 Mn
6 for R= or > 10 MQ
Example: _
The service number
of a resistor of 976 n is:
4822 050 29761
PCS 61851

3.5 SERVICE TOOLS
3.5.1 Service PCB
3.5.1.1 Circuit diagram
im
F 1
lm
B 6
lm
F 1
1m
n
!~'
F 6
mi
H
6
im
F 1
im
£
1
mi
[ 1
S1
n
S1
5I
G
1 B 6 D1 oo!
G
1
H
4 D1
G
6 D 4
S1
S1
1
001
B 1 1
00
)
£
4
)001
B 1
iii
£
1 B I
jOll
G
1 !
!6l
D
8
60
04
G
6
l!il
11
S1
G 8
S1
D
8
1101
t
I
100
4
E
6 )
001
D1 F 1
01
0
B
6 0
14
H
1
£
1
6001
f
1
I
6
S1
F 8
S1
C 8
,-------------------------
•
IV I
I
10
01
1001
_ .t. I
16n
I
J)u/
16V
I
g
~ w_
____
+_
lv
-
8
Sl
I
~s
I
,---
--
--
---
------------
--
------
--_;;,;,:.
--
7
S1
+IV +IV
~
~
~
~
~
~
IU:StT
IRQ
1006
)
lu
/1
6V
I NC
VPP
6008
BZXISC.V9
PA1
PA.)
PU
+
IV
PAI
PA6
PA
)
?£ST
g
~
~Joo
+I
V
~
m
~
~ l o1
+IV
~
NO
~
~ l
o1
,c
NC NC
MSM
mi
A
D!Sl
8 9
10
+IV
1000
40
6801C
4
VDD
OSCl
OSC1
PD
l
'!00/
PD6
SS
/
POI
SCK/
PD4
l<'.lSl
/
PD)
H!S0/ P
D1
TOO
/
P
D!
P!JI
/
PD
O
PC
O
PC!
PC1
PCJ
PC4
PCI
PC6
PC
l
V
SS
TCAP
10
NC
NC
11
11
BBBB
1 1 l 4 6 1
+5V +5V
DE!
CLK
DATA
)9
)8
31
NC
+IV
~
0
CTJW!
.
RtSONATOR
+IV
+5V
+5
V
+5V
NC NC NC
~O)l
01A
D!S1
8 9
10
•
IV
SC
NC
11 11
BBBB
1 1 l 4 6 1
t5V
+5V
D
E1
CLK
DATA
•
IV
I
·~i
~6S1
J
1s1
NC
L
4
S1
I
I
SC
LI
SI
L
_________________________
_J
PCS67711
3.
5.1
.2 Layout
G4
OB
K
0004
coos
I
ROOS
I
0007
ROOS
l0
01
!
R012
JQQi
I!
R007
C004c:=J
C ! R003
·I
E5c=)x2
01
I
,,
I
j
....
~
~
~
~'
IO
OO
K
DOOi
...
0
0
a:
Ill
~
-,
~~l
a-B---=
,~
K
0008
I
Bi
TEST
~ ~ ~
YES
GI
LJ
G3
I
RO
OI
I
II
ROOS
I
l002
R011
R009
ROIO
jswo21
NO
G2
3.5
.
1.3
Parts
list
ITEM
DESCRIPTION CODENUMBER
1000 Tact
switch
4822 276 10974
1001 Tact
switch
4822 276 10974
1002 Tact
switch
4822 276 10974
1201
Ceram
.
resonator
4822 242 72527
2001 33 µF/16V 4822 124 20688
2002 56 nF 4822
121
41154
2003
47
pF
4822 122 31072
2004 47 pF 4822 122 31072
2005 100 µF/25V 4822 124 20701
2006 µF/63V 4822 124 20722
3001 4,7
Q
4822 052 10478
3002 22
KQ
4822 050 22203
3003 220
KQ
4822 050 22204
3004 10
KQ
4822 050 21003
3005 100
Q
4822 050 21001
3006 22
KQ
4822 050 22203
3007 4,7
KQ
4822 050 24702
3008 10
KQ
4822 050 21003
3009 22
KQ
4822 050 22203
3010 22
KQ
4822 050 22203
3011 22
KQ
4822 050 22203
3012 22
KQ
4822 050 22203
3013 22
KQ
4822 050 22203
014 22
Kn
4822 050 22203
3015 22
KQ
4822 050 22203
3016 22
KQ
4822 050 22203
3017 100
Q
4822 050 21003
6001 1
N4148
4822 130 30621
6002 BC558B 4822 130 44197
6003 BC548B 4822 130 40937
6004 1
N1448
4822 130 30621
6005 BZX55 C4V7 4822 130 34174
6006 BAT85 4822 130 31983
6007 1N1448 4822 130 30621
7000 MC68HC705C4 4822 900 10272
7001
MSM
4202A 4822 130 90474
7002
MSM
4202A 4822 130 90474
S1
min
iDIN
8p
ins
(m
ale) 4822 267 31289
Plug 8 a
min
i DIN (Fe
ma
le) 4822 264 50262

3.5.2 LIST OF ACCESSORIES AND SERVICE
TOOLS
Item Codenumber Description
1 4822 395 50145
TORX
SCREW
DRIVER SET
2 4822 214 52007 LOW-LEVEL-
TEST
PANEL
ASSY
3 4822
321
61677 CABLE FOR
TEST
PANEL
4 4822 264 50263 PLUG FOR STARTUP
OF
SER-
VICESHELL
ON
PORT2 (BU 2)
5 4822
397
30096 AUDIO TESTDISC SET
6 4822 397 30155 TESTDISC WITH CONTINOUS
1KHz SIGNAL 70 MIN.
7 4822 397 30184 AUDIO SIGNALS DISC
8 4822
701
11922
SKEW
DISC 0,6
9 4822
701
11923 EXCENTRICITY DISC
150
I
10 4822
691
30293 ROLLER CONTROLLER
11
4822 691 30298 TRACKER BALL
12 4822
691
30299 JOY STICK
13 4822
691
30297 MOUSE
3.5.2.1 PARTSLIST FOR ROLLERCONTROLLER
Item Codenumber Description
1 4822 321 61841 CABLE ASSY
2 4822
413
90093
BALL
3 4822
276
13359 SWITCH
4 4822
410
62427 KEYTOP-LEFT
4 4822 410 62428 KEYTOP-RIGHT
5 4822
492
42645 SPRING
3.6 THE MONOBOARD CENTRAL REPAIR
PROCEDURE
In case of a defect on the Multi Media Controller (see Block-
diagram) part, the complete panel must be sent
back
to
PCS for repair.
Below a brief description
is
given, a more detailed proce-
dure is available at P.C.S Logistics Management, systems
and Procedure Office.
CODENUMBER Monoboard:
Version
/20
/25
/31
/37
/39
Codenumber
4822
214
52065
4822
214
52068
4822 214 52069
4822 214 52056
4822
214
52066
•
NSO
or
Customer: send telex
or
on-line MSH system info
to PCS customer relations officer with indicated num-
ber(s) and service 12NC
tor
a repair reference number.
• PCS: send telex
or
MSH info with repair reference num-
ber
and
return invoice price. Also the same number(s)
of
new/repaired items are sent with invoice.
• NSO
or
customer: send defective item(s) to
PCS
at SOM1
by standard address label with repair reference number
and
return invoice to PCS -price center.
• Remark: the difference between the invoice price and
return invoice price gives the 'repair price' for the
NSO
• PCS: send cJefective item
to
factory and stock.
• Experience has learned that the status
of
the particular
products and packaging needs your local attention. Prod-
uct~ will be returned in case
of
unacceptable conditions.
REPAIR PROCEDURE CONDITIONS :
* HANDLE WITH
CARE
IN
AN
ESD PROTETECTED
ENVIRONMENT.
* Defective items must be sent back to PHILPS CON-
SUMER SERVICE for repair forwarded byAddress
sticker.
• Put the address stickerproperly
on
a free area
of
the
box.
* Boards must not be reworked
or
damaged.
• Re-use original package order new package in case
of
damages.
• Remove additional stickers
and
labeling if re-using the
original box. Service codenumber on sticker must be
equal to codenumber
on
repairable item.
I
I!
Ifthe above conditions are notfulfilled, then boards
are
not accepted and the return price will not be credited
!
!l
PCS67 634

4 MECHANICAL DRAWINGS AND PARTS LIST
4.1
SERVICE POSITIONS
PCS67635
HAS.CDl220

4.2 EXPLODED VIEW OF THE CABINET
FRONT
ffi
4
SCREWS
HEADPHONE
DISPLAY
PANEL
fil
2
SCREWS
ffi
POWER
KNOB
POWERSWI
TCH
£
2
SCREWS
FRAME
PANEL
6
SCREWS
FRONT
'--~--414
COVER
ffi
7 SCREWS
CDM9
LOADER
£
4
SCREWs
MONO
PANEL
~
120,
6 SCREl'S
/25/31
/37,
I O SCREl\6
LOADER
SUPPORT
i
I
FMV-BOX
6
SCREWS
POWER SUPPLY FMV-EXPANSION
&
3
SCREWS ffi
2
SCREWS
TEXTPLATE
ffi
3
SCREWS
__-
HEADPHONE DISPLAY
PANEL
1002
~ANEL
1002
-~¼D
i
L
--,
185
screws:
metal:
M2,5
x 6
if
not
otherwise
indicated
plastic:
3M x
10
MAI
NS
INLET
BU-I
FRAME
M3X6
WASHER
COVER
FMV-BOX
1002
-~WERSWITCf-
1002
FMV-EXPANS
ION
PANEL
HAS CDl220
PCS67636

4.3 EXPLODED VIEW OF LOADER
@f-------------------~
© ~~
0 I ~
~f-------------flNt
41 ]----------------------
• I I ------------------{
@0-----------------------------<
-----------------110
B
B
6),------------------------------l@
---------------------------10
0
+
PCS67637

5 SERVICE SOFTWARE
In the set there are 3 different testsoftware available:
1. FTD-display/keyboard test
2. Low Level test
3. Service Shell
5.1
THE FTD-DISPLAY/KEYBOARD TEST
Scope
This testfeature includes following tests:
• FTD filament test
• Player keyboard test
• NVDS signal test
(The NVDS signal is to switch on/off to the FMV mode)
5.1.1
Test sequence
-To startup this test press the
'PAUSE'
button on the front
of the player while switching on
the
power. After
approximately 5 seconds a
'O'
will appear on the FTD.
Now
the test software is activated.
-First test, the keyboard test.
Now
all front keys should be
pressed one
by
one in a proper sequence. Every time the
correct key is pressed, the counter on the FTD will
increment by one.
The correct sequence is :
1. EJECT
2. PREVIOUS
TRACK
3.PLAY
4. NEXT
TRACK
5.
PAUSE
6.
STOP
After this, if
any
key is pressed then the FTD test will
startup.
In
this test also
the
remote control player-control-
keys can be used.
Second test,
the FTD/NVDS test.
By
using any key
(remote or on the front
of
the player) except the 'PLAY'
will toggle all FTD filaments
on
and off. Simultaneously
the NVDS signal, which is an internal signal will be
toggled. This can be noticed by looking to the TV
or
monitor screen, the picture on
the
screen will dissapear at
the toggling
of
NVDS.
-To continue and go to the normal mode just press
'PLAY'.
Now
the player shell will be started and the player can be
operated normally again.
5.2 THE LOW LEVEL MMC TEST
Scope
This test is standard implemented in the boot software of
CD-ATOS.
It
doesn't need a lot of hardware to run. When
debugging
or
servicing an MMC panel this test ls very
useful. The Low Level test in Menu driven.
General
This test is developed for service
and
low
level hardware
debugging purposes only.
It
is meant to be used with the
service pcb
as
described in
TOOLS
(please refer
to
section
3.5 SERVICE TOOLS).
The
test executed wlth
the
service
pcb is called the
"pcb low level test".
The
test executed with
the
VT100
terminal
is
called the
"terminal low level test"
.Since this service pcb display has
just 8 digits, only the most important information will
be
displayed to the user.
For
the
VT100
terminal this is nevera
problem. This test consists out of the following items:
• Display header and release number.
• VSC init
• ROM
• NVRAM
• DRAM
• CDIC
• SLAVE processor (68HC05)
• Clock Calibration (only for Terminal
Low
Level test)
• ATTEX (only for Terminal Low Level test)
• X-bus
5.2.1
Tools
In
this test the service pcb acts
as
some kind of a 'micro ter-
minal'. This means that the service pcb is able
to
display
some alphabetical
and
numerical characters.
Some
charac-
ters because it uses 7-segmentdisplays
The
three keys available are :
TEST
; test all display leds.
Yes ; Send
an
ASCII 'Y'.
No
; Send an ASCII 'N'.
The communication parameters are fixed at :
9600 baud
8 data bits
1 stopbit
no parity
The
microcontroller is programmed with software available
at IMS CDI software group.
The
circuit diagram is
on
section 3.5.1.1
5.2.2 Testsquence
Table 1 below shows all
the
steps ofthe testprogram and
what kind of tests are performed.
Table below shows all
the
steps
of
the testprogram and
what kind of tests are performed.
STEP ACTION/TEST PERFORMED
0
2
3
4
5
6
7
8
Exit Low Level
test
Writing
to
a default RAM address
ROM parity check
NVRAM test
DRAM test
CDIC test
Slave processor test
Clock Calibration
ATTEX
test
9 X-bus
test
PCS
67638

5.2.3 Low level test implementation
The low level test (short: lltest) is implemented in the boot
part of the CD-ATOS software. The whole test occupies
about 15k of ROM memory and is written
in
assembler. The
test runs without the use of any external RAM. It only uses
internal CPU registers. As communication channel the
68070's UART is used. Before starting the normal player
boot the following sequence is executed :
1.
Initialize the 68070's UART : 9600 baud
1 startbit
2.
Clearthe RXD buffer.
3.
Wait 5
ms.
4.
Read the RXD buffer.
8 databits
1
stopbit
no parity
no handshake
!
If
the character receved was a space ($20) the start
the terminal lltest.
If the character received was an ACK ($06) the start
the pcb Iltest.
5.
Else start the normal playerboot.
The UART is connected to
1/0
port 2
5.2.4 Howto start up the low level test
With service pcb
To startup the pcb low level testsoftware the next
sequence should be followed:
-Switch off the player.
-Connect service pcb to port 2 atthe rear of the player.
-Switch
on
the player.
-The service pcb display should now show 'CDI
Rlxx'.
(with xx the release number)
-The pcb lltest is now ready to go.
With VT100 terminal
To
startup the terminal low level testsoftware one should
follow the next sequence:
-Switch offthe player.
-Connect the terminal to the 68070's UARTof the player.
-Switch on the player while pressing the SPACE-bar ofthe
terminal.
-The terminal should now show the title of the terminal
lltest.
5.2.5 PCB low level test
If the service pcb
is
connected to port 2 the pcb low level
test is executed after power on.
In
table 1 a survey is given
for all tests executed.
Display lltest release number:
When this lltest is entered, first the release number of the
pcb lltest will be displayed.
Example:
CDI
Rlxx
( RL stands for RELEASE, xx stands for release
x.x).
PCS
67639
The lltest is now waiting for an action from the user.
The usershould now press either the'Y' or 'N' button to
continue the test.
STEP0:
VDSC
STEP 0A0B : VDSC channel 1&2 registers
display:
OA0B
In
this step some registers of the VDSC Channel 1
&2
are
initialized.
STEP1:
ROM
In
this step the contents of the ROM is checked.
Following tests are done on the ROM :
1.
Display ID byte and release number of this ROM.
(test
A)
format 'IDxxRLyy'
3.
Check if the parity of the ROM
is
OK.
(test C)
STEP
1:
ROM
STEP
1A:
ID AND RELEASE NUMBER DISPLAY
display: 1A IDxxRLyy
·
In
this step the release number of this ROM is displayed for
a moment.
(ID stands for IDentification, xx is the id number.
RL
stands for RELEASE, yy stands for y.y)
STEP1C:CHECKSUM
display: 1C
In thls step the checksum of this ROM is calculated as
described in "how is the checksum calculated". If the
checksum is not ok
an
error will be displayed.
display: 1C Er05
STEP
5 :
NVRAM
The nvram test is a non destructive test. This means that
the original nvram contents is restored again.
Address range : Full nvram address range
display: 5
The following actions take place in the nvram test:
1.
read byte from nvram and save it
in
a register
2.
write a pattern (from ROM) to nvram
3.
read byte from nvram and compare with pattern
4.
if byte read is ok then continue with action 5 else
give error message and stop testing

If error,
display: 5 Er09
5.
write inverted pattern to nvram
6.
read byte from nvram
and
compare with pattern
7.
if
byte
read
is
ok
then restore original byte
else give error message and stop testing
If
error,
display: 5 Er10
8.
repeat this for every possible nvram address.
STEP 6-8 : DRAM
The dram test is always a destructive test. The test is
performed for
both
ram
chip1
and chip2 as one large
memory followed by a test for each bank separately.
On
the displays following, the 'x' is a memory counter. The
counter is incremented every 256k.
So
for the full range it
counts from 1
to
4.
STEP 6A : TEST THE FULL DRAM MEMORY
The following actions take place
in
this test:
1.
fill the memory with the long word address as data.
display: 6AFx
2.
read
the memory contents and compare with the
address.
display: 6ARx
3.
if
the
long word read is
ok
then continue
else give error message and stop testing.
If
error,
display: 6ArxEr11
STEP 6B : TEST THE FULL DRAM MEMORY WITH
INVERTED DATA
The following actions take place
in
this test:
1.
fill the memory with the inverted long word address
as data.
display: 6BFx
2.
read the memory contents and compare with the
inverted address.
display: 6BRx
3.
if
the long word read is
ok
then continue
else give error message and stop testing.
If error,
display: 6BrxEr12
STEP
7A:
TEST DRAM CHIP1
The following actions take place
in
this test:
1. fill the memory with the long word address
as
data.
display: 7AFx
2.
read the memory contents and compare with the
address.
display: 7ARx
3.
if the long word read is ok then continue
else give error message and stop testing.
If
error,
display: 7ARxEr13
STEP
7B:
TEST DRAM CHIP1 WITH INVERTED DATA
The following actions take place
in
this test:
1.
fill
the
memory with the inverted long word address
as data.
display: 7BFx
2.
read the memory contents and compare with the
inverted address.
display: 7BRx
3.
if
the long word read
is
ok then continue
else give error message and stop testing.
If
error,
display: 7BRxEr14
STEP BA: TEST DRAM CHIP2
The following actions take place
in
this test:
1.
fill the memory with the long word address as data.
display: 8AFx
2.
read the memory contents
and
compare with the
address.
display: 8ARx
3.
if the long word read is ok then continue
else give error message and stop testing.
If
error,
display: 8ARxEr15
PCS
67
640

STEP
BB:
TEST DRAM CHIP2 WITH INVERTED DATA
The following actions take place
in
this
test
1.
fill the memory
with
the inverted long word address
as data.
display: 8BFx
2.
read the memory contents and compare with the
inverted address.
display: 8BRx
3.
if the long word read is ok then continue
else give error message and stop testing.
If error,
display: BBRxEr16
STEP9:
CDIC
This test only checks part ofthe CDIC ram, mainly because
it is possible that during the test the CDIC destroys part of
the
ram
contents.
address range : CDIC base address + $1400 to CDIC base
address+ $3C7F.
cdic register2 : CDIC base address + $3FFA register2
contents after reset: $C7FE
STEP
9A:
CDIC RAM TEST WITH ADDRESS
AS
DATA
display: 9A
The following actions take place
in
the
core
RAM test:
1.
Fill the memory with long word address as data.
2.
Read and compare the data with the address.
3.
If the long word read is ok then continue
else give an error and stop testing.
If
error,
display: 9A Er17
STEP 9B : CDIC RAM TEST WITH INVERTED ADDRESS
AS DATA
display:
9B
The following actions take place in the CDIC RAM test:
1.
Fill the memory with inverted long word address as
data.
2.
Read and compare the data with the inverted
address.
3.
If
the long word read is ok then continue
else give an error and stop testing.
If error,
display: 9A Er18
STEP 9C : CDIC REGISTER 2 TEST
display: 9C
PCS 67
641
The following actions take place
in
the CDIC REGISTER
test
1.
Read register 2 and compare with fixed pattern.
Register 2 has a defined pattern after reset.
2.
If the register is ok then continue with next step else
give
an
error and stop testing.
If
error,
display: 9C Er19
STEP 10 SLAVE processor (68HC05)
This test checks the communication with the slave
processor.
Additionally it displays the slave and cd processor release
numbers.
If
the communication with the cd processor via
SPI
does not function, the cd release number will give a 0.0.
Address range : Slave base address + 6
STEP 1
0A:
WRITE REQUEST BYTE TO THE SLAVE
display: 1
0A
In
this step a
$FO
(request) is written to the slave.
STEP
10B:
READ ACKNOWLEDGE FROM THE SLAVE
display: 1
OB
In
this step the following actions take place:
1.
wait about 2 sec to give the slave the time to
acknowledge.
2.
read the acknowledge.
3.
if the acknowledge is
$FO
then continue
else give an error and stop testing.
if error,
display: 1
OB
Er20
STEP
10C:
READ AND DISPLAY SLAVE RELEASE
NUMBER
display: 1
OC
RLxx
For a moment the slave release number is displayed
STEP 1
OD
: READ AND DISPLAY CD RELEASE NUMBER
display: 1
OD
RLxx
Wait until a key is pressed.
Read the next byte: this is a dummy read.
STEP
11
: X•BUS TEST
This test checks the Xbus communication from DSP
to
servo processor. First it writes a transparent command into
the CIDIC memory. The servo processor receives it
by
the X
bus
and
returns the command via the
SPI
bus to the slave
processor. The given command is then returned
by
the
slave
to
the testsoftware.

STEP
11
A : XBUS TRANSPARENT COMMAND
TO
CIDIC
display :
11
A
In
this step atransparent Xbus test command is written to
CIDIC. CIDIC will transferthis command to the servo proces-
sorvia the Xbus.
STEP
11
B:
READ ACKNOWLEDGE FROM THE SLAVE
display :
11
B
In
this step the following actions take
place:
1.
Wait about2 sec
to
give the slave the time to
acknowledge.
2. If the acknowledge is
$A4
$7
A
$38
$1
C then
continue
else give
an
error and stop testing.
If error,
display :
11
b
Er21
STEP DESCRIPTION
Oa
Ob
1a
1c
5
6af
6ar
6bf
6br
7af
7ar
?bf
7br
Bat
Bar
Bbf
Bbr
9a
9b
9c
10a
10b
10c
10d
11a
11b
VDSC channel 1 initialization
VDSC channel 2 initialization
ROM identification release number
ROM checksum check
NVRAM
test with rom data as data
DRAM fill chip1 &chip2 with address as data
DRAM read and compare data
DRAM fill chip1&chip2 with inverted add. as data
DRAM read and compare data
DRAM fill chip1 with address as data
DRAM read and compare
DRAM fill chip1 with inverted address as data
DRAM read and compare data
DRAM
fill
chip2 with address as data
DRAM read and compare
DRAM fill chip2 with inverted address as data
DRAM read and compare data
CDIC RAM test with address as data
CDIC RAM test with inverted address as data
CDIC register test
SLAVE test :write request to slave
SLAVE test :read echo from slave
SLAVE test :read SLAVE release number from slave
SLAVE test :read CD release number from slave
Xbus test write command to CIDIC
Xbus test read response from servo in Slave µP
Table 1 : PCB
LL
TEST steps overview
.5.2.6 TERMINAL LOW LEVEL TEST
Ifa VT100 orcompatible terminal is connected
to
the
6B070's UART
of
the COi player one is able to execute the
terminal low level test. Due
to
the fact that almost every test
is self explanatory only the major steps are described
below. In this test it is possible to skip every major step.
Display lltest headerand release number
In this step the VDSC is initialized in the same way as in the
pcb lltest.
ITEM
O: EXIT LOW LEVEL TEST
Selecting this item will end the lltest and continue with the
boot. After the boot the player shell is started up.
ITEM 1 : Writing to a default RAM address
This test writes the powers of2 to a ( word ) address. The
result is read again and will be displayed. The address can
be selected by the user ( only word adresses
).
Pressing
'ESC' stops the test.
If one trys to write to unused space in the memory map, the
program will NOT generate an error message and the
system will hang up.
ITEM
2:
ROM parity check
Forthe ROM the following information is displayed and
checked:
-Display the identification code for this ROM (ROM ID)
-Display the release numberof this ROM
-Display the checksum
of
this ROM. The upper word ofthe
checksum displayed
is
always '0000'. If the checksum is
not ok then a specific errorwill be displayed. This error
is
the same as in the pcb low level test.
ITEM 3 : NVRAM test
For the NVRAM test three different tests can be selected:
-The first is a non destructive nvram test as in the pcb low
level test.
-The second test is a destructive nvram test with ROM
data as test data.
-The third test is also a destructive test with the address as
data.
-The third test has also some hidden functions. Pressing :
w:
writes continu the address as data to the nvram.
r:
reads continu the complete nvram ( no display
).
d : displays the contents of
421
succeeding ram
locations. The start address is given
by
the user.
ESC stops these functions.
Remark : The error message is different from the pcb lltest.
See error table for more information.
PCS67642

ITEM4:
DRAM
The dram test is always a destructive test. The test is per-
formed for both ram CHIP! and CHIP2 as
one
large mem-
ory followed
by
a test for each bank separately.
The following actions take place in the
dram
test
1.
fill the memory with the long word address as data.
2.
read the memory contents and compare with the
address.
3.
if the long word read is ok then continue else give
error message and stop testing.
4.
write the inverted long word address
as
data to
memory.
5.
read the memory contents and compare with the
inverted address.
6.
if the long word read is
ok
then continue else give
error message and stop testing.
This test
has
also some hidden functions. Pressing :
w : writes continu the long address
as
data to the
dram.
r:
reads continu the dram (no display).
d : displays the contents of
421
succeeding ram
locations. The start address is given by the user.
ESC stops these functions.
Remark :
The
error message is different from the pcb lltest.
See
error table for more information.
ITEM
5:
CDIC
The cdic test consists out of three main parts:
1.
test cdic ram with long word address
as
pattern
2.
test cdic ram with inverted long word address as
pattern
3.
display cdic register and compare
Jf
in
one
of these
tests an erroroccurs the test will be stopped and
the error displayed.
ITEM
6:
SLAVE processor (68HC05)
This Illes! for the slave performs following actions:
1.
Write
$FO
to the slave processor.
2. Read byte from same address, the slave should
respond with
$FO.
3.
If data is not
$FO
then stop testing and display error
code else continue with next action.
4.
Read the next byte: this byte is the release number
of
the
slave processor firmware.
Display the release number.
If
the release number
is
$00
then an error will be displayed.
5.
Read the next byte: this byte is the release number
of
the CD processorfirmware. Display the release
number. If the release number is $00 then an error
will
be
displayed.
6.
Read the next byte: this is a dummy read.
PCS 67 643
ITEM
7:
CLOCK CALIBRATION
This step is not really a test.
It
is a software tool that can be
used to trim the clock&calendar chip so that it runs within 1
minute acc. per month.
If
calibration is not needed, this step
should be executed since a frequency counter is needed to
complete this test successfully. If this test is entered
accidently, just switch off the
power
and restart the lltest.
The clock calibration should be performed with an external
frequency counter.
-Connect the probe of the counter to pin34 of IC7304
(CSCDICN).
-Start the test with the gate time of the frequency counter
set to minimum 5 sec.
-The counter display should
now
show a frequency near to
512Hz.
Jf
not, the chek if everything is set and connected
properly. (range : 511,96724 to 512,03276)
-Press a key on the terminal to stop the measurement.
Now fill in the measured value of the frequency. The lltest
software will now calculate the proper value to be filled
into the calibration register of the clock&calendar IC. The
value of the frequency
at
pin34 of IC7304 will not
be
changed or influenced.
The calibration is done now.
ITEM
8 : ATTEX test
This step is only intended to be used with an oscilloscope.
The software will generate a pattern on some ATTEX pins.
These pins and their signals are described below.
It
is not
guaranteed that this test always runs.
If
one of the devices
connected to the ATTEX is defective ( no
DTACK)
it
will
surely result in a hang-up of the testsoftware.
Within this test the following selections can
be
made:
0. Exit ATTEX menu
Exit the menu for ATTEX test and go back to main menu.
1. Generate full range VDSC-cs
Generate Chip Selects in the Complete VDSC address
range.
Addres range : $000000 -$47FFFF
2. Generate full range CIDIC-cs
Generate Chip Selects in the Complete CIDIC address
range.
Range : CIDIC base address -(CIDIC base address
+ $FFFF)
3. Generate full range Slave-cs
Generate Chip Selects in the Complete slave processor
address range.
Range : Slave base address -(Slave base address
+
$7777).
4. Generate full range NVRAM-cs
Generate Chip Selects in the complete NVRAM address
range.
Range : NVRAM base address -(NVRAM base address
+
$1FFFF)

5.
Generate KillME and DMAEN (toggle)
Generate a toggle function for the KILLME and DMAEN
signals
in
their complete address range.
Range :base address -(base address+$7FFF)
ITEM 9 : X-BUS
test
This tests the X-bus between DSP and servo processor. It
assumes that the SPI communication channel between
slave processor and servois working correctly. First it writes
a X-bus test command into the CIDIC command register
(transparent mode). The DSP will send this command via
the X-bus to the servo processor. The servo processor
recognizes this X-bus test command and sends it back via
the SPI bus to the slave processor.
lf
the X-bus test
ERROR
05
09
10
11
12
13
14
15
16
17
18
19
20
21
DESCRIPTION DISPLAY
ROM checksum error Er05
NVRAM error Er09
NVRAM error (for inverted data) Er10
DRAM error (bank0
&
bank1)
Er11
DRAM error (bank0
&
bank
1,
inverted data) Er12
DRAM bankO error Er13
DRAM bankO error (inverted data) Er14
DRAM bank1 error Er15
DRAM bank1 error (inverted data) Er16
CDIC RAM error Er17
CDIC
RAM
error (inverted data) Er18
CDIC register error Er19
SLAVE error (wrong echo from slave) Er20
Xbus transfer error
Er-21
command
is
received by the slave processor correctly then Table 2. Error codes overview
the test was successful, if not then something could be
wrong with the X-bus
in
such a case an error is displayed.
5.2.7 ERROR CODES
When during a test
an
error occurs the user should be
aware of following conventions:
-For the pcb low level test the error is displayed on the
outermost righthand side of the display.
Example: 1
Er11
An
survey for all error codes
is
given
in
table
2.
-For the terminal low level test the error is displayed on the
outermost lefthand side of the terminal.
In
some cases
(memory tests) the error code is replaced by a more
meaningful erroroutput.
Example: ADDRESS DATA READ EXPECTED
ERROR: 00080000 F0080000 00080000
RETURN to continue, ESC to STOP
Meaning: (assuming long word data is used);
On address $80000 the data was $F0080000
and not $80000 as it should be.
-If RETURN button is pressed, the next address will be
read and checked. With this output
it
will be easier to
debug the MONOboard
-When an error has occurred the program will wait for a
user intervent.ion with following question:
RESTART the test Yes
or
No?
If the answer was 'Y' then the lltest software is
executed again from the beginning.
If the answer was 'N' then the next test is executed as if
nothing happened.
5.2.8 RELEASE NUMBER,
ID
AND CHECKSUM
STORAGE
The release number,ID and checksum are always stored
in
the COi ROM. Step 1 of the pcb lltest as well as the terminal
lltest uses all this information to check if the ROM is
ok.
Where are these bytes stored
in
the ROM's, where
in
the
memory?
ROM address range for the 4Mb :
$00000-$7FFFF)
MONO address range for the 1Mb :
$400000-$47FFFF)
ROM address $7FFFF
=
LSByte
of
the checksum
$7FFFE = MSByte of the checksum
$7FFFD = Release number of this ROM
(BCD coded)
$7FFFC = Player ID (BCD coded)
MONO address $47FFFF = LSByte of the checksum of the
ROM
$47FFFE = MSByte of the checksum of the
ROM
$47FFFD = Release number of the ROM
(BCD coded)
$47FFFC = Player
ID
(BCD coded)
5.2.9
HOW
IS
THE CHECKSUM CALCULATED
?
The checksum is calculated for every ROM separately.
The checksum is the algebraic sum
of
all bytes in that ROM
except the 2 bytes where the checksum is written. Only the
LSWord of the sum is used. To calculate the real checksum
of the ROM just add these 2 bytes
to
the LSWord of the
sum.
The last 1024 bytes are always assumed to
be
all $FF.
ROM checksum =
sum of all bytes of the address range $400000 to $47FFFD
ROM checksum displayed
in
STEP 1
=
ROM checksum + {LSB + MSB)
of
this checksum.
This is also equal to the checksum of the complete ROM.
PCS
67
644

5.3 THE SERVICE SHELL
Introduction.
For service purposes the CD-I set
has
built-in software
modules. These modules can be activated via the service
shell by menu.
The modules are for the testing
of:
-Video circuitry, by means
of
a colorbar testpatern
-CDM and servo circuitry
-
Input/
Output ports
-Audio circuitry
Testing the COM, servo and audio cicuitry
in
the service
shell is only possible with a CD-DA disc.
5.3.1
Starting
the
service shell
The service shell can be started by connecting the RXD and
TXD
lines of port 1 (pin2 and pin3) during start up (insert
testplug before
power
on or reset).
5.3.2
Layo.i.Jt
info
selectable/non selectable items
Each menu of the service ~hell consist
of
a number
of
boxes
and text strings.
Some
of these boxes can be selected by
moving the screen cursor above the box and clicking
on
one
of the joystick buttons. Only the colored boxes can be
selected. Clicking on one
of
the other boxes wilI have no
effect.
(error) messages on the screen
The service shell will provide information and errors in a box
at the top of the screen. To remove such a message and
continue with the
test
a button must be clicked on the
remote control joystick.
menu structure
When the service shell is started, the main menu appears
with a number
of
boxes on it. Selecting some boxes will
result
in
a submenu being displayed, other boxes may result
in
immediate action. Selecting the EXIT box will stop the
service shell and restart the player. Selecting EXIT
in
a
submenu will return you
to
the previous menu.
5.3.3
Subject dependent information
Main menu
The main menu contains four test item boxes and the EXIT
box. Selecting
TEST
IMAGE will give immediate action, the
other three test items will display a submenu.
CD
test
This menu has two information boxes at the top of the
screen. Below itare three test items for the CD player and
below these are three buttons that can be selected only
during the CD drive test. When the menu is first entered,
only the three test item boxes can
be
selected. Subjects of
the CD test are the cd drive itself, the X bus and a test on
Digital Out.
When this menu is selected in the main menu, the
communication channel with the
CD
processor will be
checked first. A message will be displayed giving the result
of
this check (either O.K. or No response). After pressing
one of the buttons (to remove the message) the cd menu
will be displayed.
PCS 67 645
cd status
test
mode
Arm in Arm out Nextstep
(error) message bar
Fig 3.2 CD test menu
The X bus test will result
in
immediate action. It checks the
commul'lication channel between the CDIC and CD proces-
sor that is normally used to send commands (seek, read
etc) to the CD processor. The result is either O.K
or
No re-
sponse.
The Dig. Out test will also give immediate action. It's pur-
pose
is
to check wether the CDIC receives a Digital Out sig-
nal or not. The result of this test is O.K. or
No
Digital Out.
The CD drive test uses a different menu and will therefore
be
described
in
a separate paragraph.
CD drive test
The
CD
drive test will perform the service loop as im-
plemented
in
the Philips
CD
audio players.
A
disc is needed
for this test. Results
of
this test will be displayed
on
the
screen instead
of
a display. When the cd drive test is se-
lected, the same screen will appear, but with other buttons
highlighted. You cannot select the X bus and Dig Out test
anymore. Selecting the EXIT button will return you to the cd
menu. (X bus and Dig Out button highlighted again).
The drive test consist
of
the following steps:
ModeO
Software release number
of
the
CD
micro processor is
displayed
in
the button at the left top of the screen (cd
status button). Mode Ois displayed
in
the button at the right
top ofthe screen (mode button). During the cd drive test this
button will display the current mode.
In
mode 0, the ARM IN and ARM OUT buttons can
be
selected to move the cd lense inwards and outwards.
Selecting
NEXT
STEP will bring the player
in
mode
1.
Mode 1
In
mode 1 the cd driveprocessor
wi
II
try to focus. If it man-
ages to do
so
(a
disc must be present!), the message
IN
FOCUS will appear in the status button. Otherwise, the
message NO FOCUS will appear in the status button after
the cd driveprocessor has tried to focus 16times (this may
take a while).
In
that case (no focus found) the test will
re-
turn to mode
0.
Selecting
NEXT
STEP
will
bring the player
in
mode
2.