2Tableofcontents
1 Description ..................................................................................................................................1
2 Table of contents.........................................................................................................................2
3 Ordering data ..............................................................................................................................4
4 Technical data.............................................................................................................................5
5 Safety regulations and installation notes ...................................................................................11
6 High-voltage test (HIPOT) .........................................................................................................12
6.1 High-voltage dielectric test (dielectric strength test) and why must it be performed?....................................12
6.2 High-voltage dielectric test during the manufacturing process......................................................................12
6.3 High-voltage dielectric test performed by the customer................................................................................12
6.4 Performing high-voltage testing ....................................................................................................................12
7 Basic circuit diagram ................................................................................................................. 13
8Structure.................................................................................................................................................................13
9 Cooling......................................................................................................................................14
10 Mounting position and dimensions ............................................................................................14
10.1 Mounting position .........................................................................................................................................14
10.2 Device dimensions .......................................................................................................................................15
11 Mounting/removal......................................................................................................................16
11.1 Assembly......................................................................................................................................................16
11.2 Removal .......................................................................................................................................................16
12 Device connection terminal blocks.................................................................................................................16
12.1 Push-in connection technology.....................................................................................................................16
13 Input ..........................................................................................................................................17
13.1 Position of input terminals.............................................................................................................................17
13.2 Protection of the primary side .......................................................................................................................17
14 Output .......................................................................................................................................18
14.1 Position of output terminals...........................................................................................................................18
14.2 Protection of the secondary side...................................................................................................................18
14.3 Output characteristic curve...........................................................................................................................18
15 Dynamic boost .......................................................................................................................... 19
16 Signaling.................................................................................................................................................................19
16.1 DC OK-LED ..................................................................................................................................................19
16.2 Floating signal contact..................................................................................................................................19