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  9. protech prox SE-8400 User manual

protech prox SE-8400 User manual

Ver. Q3
All Rights Reserved. Copyright 2022
Quick
Reference
Guide
Remote
Switch
DC IN
DIO
DVI-I COM3
COM4
COM1
COM2
POE ON
1
2
1
2
I2C
LAN USB 3.0
DC IN 9~36V
Remote
Switch
DVI-I
DIO
COM3
COM4
COM1
COM2
POE ON 1
2
2
1
LAN USB 3.0
I2C
Specifications
SE-8400
System
CPU Support 6th Gen. Intel®Core™ i7/i5/i3 & Pentium/Celeron®LGA1151
socket processor (CPU TDP max. up to 35W)
Chipset Intel®Q170/ H110
Memory Support 2 x DDR4 2133MHz SO-DIMM up to 32 GB
Drive Bay 2 x 2.5” SATAIII HDD/SSD (support RAID 0/1 in Q170 SKU only)
Audio 1 x Line In / 1x Line Out / 1 x Mic
Expansion Slots 1 x Full-sized mini-PCIe (mini PCIe, USB and SIMsignals)
1 x Half-sized mini-PCIe (mini PCIe and USB signals)
1 x SIMcard slot /1x CFast slot
Weight / Dimensions 4.5 kg/ 260mm(W) x 80mm(H) x 200mm(D)
Power Input DC In 9~36V
Certificate FCC/CE
I/O Ports (Front side)
Display 1 x HDMI
USB 2 x USB 3.0 (Q170), 2 x USB 2.0 (H110)
Serial Ports COM 5/6 for RS-232 (optional)
Parallel Port 1 x LPT port (optional)
Intel LAN Chip (optional)
SIM card / CFast slot 1 x SIMcard slot / 1x CFast slot
Power Output 1 x 3-pin terminal block for DC-out 5V/12V (1A max)
I/O Ports (Rear side)
Display 1 x DVI-I (DVI-D+VGA)
USB 4 x USB 3.0
Serial Port COM3/4 for RS-232
COM1/2 for RS-232/422/485 (selectable under BIOS)
[COM1/2 for +5V/+12V/RI selectable by jumper]
LAN 2 x GbE LAN, Wake-On-LAN, PXE
LAN 1: Intel®PHY 219 LM (10/100/1000 Mbps)
LAN 2: Intel®LAN 210 AT (10/100/1000 Mbps)
Digital I/O Port 8 in / 8 out, DSUB-25 type or 16-pin terminal block (optional)
Audio 1 x Line-in / 1x Line-out / 1 x MIC
Power Input DC in 9~36V (DIN type 4-pin connector or 3-pin terminal block)
Power On/Off 1 x power button, 1 x remote switch
Environment
Operating Temp. HDD: 0°C ~ 40°C (32°F ~ 104°F)
(with airflow) SSD: 0°C ~ 50°C (32°F ~ 112°F)
Storage Temp. -20°C ~ 80°C (-4°F ~ 176°F)
Humidity 20% ~ 90%
Note: More Jumper Settings are shown on the next page.
Flash Descriptor Override Selection
Disable
(default)
11
Enable
BIOS Recovery Mode Selection
Normal
(default)
Recovery
11
CFast Voltage Control Selection
3.3V 5V
(default)
1
1
DVI1
COM3
COM4
COM1
COM2
JP4
56
1
2
1
5
2
6JP15
JP12
12
JP7 13
DIO1
115
216
1
3
2
4ATX_PWR1
1 3
JP17
LED1
PWR_IN1
LAN1USB1
AUDIO1
12
3
4
I2C1
1
2
JP16
M_PCIE1
PWR_BTN1
PWR_BTN2
SATA2
SATA_PWR2
SATA1
SATA_PWR1
COM6
COM5
USB2
RST_SW1 HDMI1
PWR_OUT1
1 3
JP9
CFAST1
LVDS1
12
2930
JLPC1
LPT1
HDDLED1
PWRLED1
PCI_E1
INV1
SO-DIMM1
5
6
1
21
2
5
6
1
2
6
5
JP3 JP1 JP2
M_PCIE2
CMOS1
1
1
2
2
1
2
15
16
17
18 52
51
1
2
15
16
17
18
51
52
13
12
1920
114
13
26
1
1
2
2
1
6
LAN2
12
COM1 Pin9 and COM2 PIN18
Definition Selection Guide
JP15JP12
RI
12V
5V
5
1
6
2
2
5
1
6
2
2
5
1
6
2
5
1
6
2
5
1
6
2
2
5
1
6
2
2
(default)
VCCIO Voltage Selection
0.95V 1.0V
(default)
11
Hardware Power
Failure Selection
Disable
(default)
Enable
1
1
Clear CMOS Data Selection
Nromal Clear CMOS
(default)
11
Jumper Setting
SE-8400
SE-8400
LAN3 & LAN4
All Rights Reserved. Copyright 2017
(Unit: mm)
The following messages are reminders for safety on how to protect your system from damages and extend a long life for the system.
1. Check the Cable Voltage
• The range of operating voltage should be between DC 9V ~ 36V. Otherwise, the system could be damaged.
2. Environmental Conditions
• Place your SE-8400 on a sturdy, level surface. Be sure to allow enough space to have easy access around the system.
• Avoid extremely hot or cold place to install the system.
• Avoid exposure to sunlight for a long period of time or in an airtight space.
• Avoid the system from any heating device or using SE-8400 when it’s been left outdoors in a cold winter day.
• Bear in mind that the operating ambient temperature is from 0°C ~ 40°C for HDD & 0°C ~ 50°C for SSD.
• Avoid moving the system rapidly from a hot place to a cold place and vice versa because
condensation may come from inside of the system.
• Placing SE-8400 in strong vibrations may cause hard disk failure.
• Don’t place the system close to any radio-active device in case of signal interference.
3. Handling
• Avoid putting heavy objects on top of the system.
• Don not turn the system upside down. This may cuase the floppy drive and hard drive to mal-function.
• If water or other liquid spills into this product, unplug the power cord immediately.
4. Good Care
• When the outside of the case is stained, remove the stain with a neutral washing agent with a dry cloth.
• Never use strong agents such as benzene and thinner to clean the system.
• If heavy stains are present, moisten a cloth with diluted neutral washing agent or with alcohol and then wipe thoroughly with a dry cloth.
• If dust has been accumulated on the outside, remove it by using a special vacuum cleaner for computers.
CAUTION! Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
WARNING! Some internal parts of the system may have high electrical voltage. And therefore we strongly recommend that qualified engineers
can open and disassemble the system. Please handle LCD and Touchscreen with extra care as they are easily breakable.
System Overview
Rear View
Top ViewFront View (LAN3 and LAN4, optional)
Line-out
Remote
Switch
DIO
DC IN DVI-I
1
2
LAN
I2C
1
2
USB 3.0 MIC-in
Line-in
Power
Button
COM3
COM4
COM1
COM2
POE ON
Front View (Standard)
Din Rail Wall Mount
PCIE
PCI
Installing 2nd Memory and SSD
DRAM CPU
M3 Screw*6
HEATSINK TOP COVER
Installing 1st Memory and CPU
SSD cable *2
M3 screw *6
Bottom Cover
SSD *2
M3 screw *4
SSD Bracket
SSD screw *8
DRAM
Remote
Switch
DVI-I
DIO
1
2I2C
LAN USB 3.0 MIC-in
Line-out
Line-in
1
2
DC IN 9~36V
COM3
COM4
COM1
COM2
POE ON
Power
Button
CFast Reset
HDMI
ANT
USB
SIM Card
ANT
ANT
LAN3 LAN4 COM5 COM6
Side View
DC OUT
260mm
80mm
5V/GND/12V
CFast
ANT
LPT
Reset
HDMI
ANTUSB
COM5 COM6
SIM Card
ANT
Quick Setup
Safety Precaution
4.06mm
80mm
85.5mm
4mm

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