Quectel FC909A User manual

FC909A
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2022-01-13
Status: Preliminary

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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
shall notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it shall be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-01-13
Macky XU
Creation of the document
1.0.0
2022-01-13
Macky XU
Preliminary

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Contents
Safety Information....................................................................................................................................3
About the Document................................................................................................................................4
Contents....................................................................................................................................................5
Table Index ...............................................................................................................................................7
Figure Index..............................................................................................................................................8
1Introduction.......................................................................................................................................9
1.1. Special Mark...........................................................................................................................13
2Product Overview............................................................................................................................14
2.1. General Description................................................................................................................14
2.2. Key Features..........................................................................................................................14
2.3. EVB........................................................................................................................................16
3Application Interfaces.....................................................................................................................17
3.1. General Description................................................................................................................17
3.2. Pin Description .......................................................................................................................17
3.3. Power Supply.........................................................................................................................20
3.3.1. Power Supply Pins......................................................................................................20
3.3.2. Buck Circuit Pins.........................................................................................................21
3.4. WLAN Application Interfaces..................................................................................................22
3.4.1. SDIO Interface.............................................................................................................22
3.4.2. WLAN_EN...................................................................................................................24
3.4.3. WLAN_WAKE .............................................................................................................24
3.4.4. Introduction of WLAN Pin Multiplexing Function..........................................................26
3.5. Bluetooth Application Interfaces.............................................................................................27
3.5.1. UART ..........................................................................................................................27
3.5.2. BT_EN.........................................................................................................................28
3.5.3. BT_WAKE_HOST and HOST_WAKE_BT ..................................................................29
3.5.4. PCM Interface .............................................................................................................29
3.6. Other Interfaces......................................................................................................................30
3.6.1. WLAN_SLP_CLK........................................................................................................30
3.6.2. XTAL_IN/OUT.............................................................................................................30
3.6.3. GPIOs .........................................................................................................................31
4RF Antenna Interfaces....................................................................................................................32
4.1. RF Antenna............................................................................................................................32
4.1.1. Antenna Interface & Frequency Bands........................................................................32
4.1.2. Reference Design........................................................................................................32
4.2. Reference Design of RF Routing............................................................................................33
4.3. Requirements for Antenna Design .........................................................................................35

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4.4. RF Connector Recommendation............................................................................................36
5Electrical Characteristics & Reliability..........................................................................................38
5.1. Electrical Characteristics........................................................................................................38
5.2. I/O Interface Characteristics...................................................................................................39
5.3. Power Consumption...............................................................................................................39
5.4. RF Performance.....................................................................................................................40
5.4.1. Wi-Fi Performance ......................................................................................................40
5.4.2. BLE Performance........................................................................................................41
5.5. ESD Protection.......................................................................................................................41
6Mechanical Information..................................................................................................................42
6.1. Mechanical Dimensions..........................................................................................................42
6.2. Recommended Footprint........................................................................................................44
6.3. Top and Bottom Views ...........................................................................................................45
7Storage, Manufacturing & Packaging............................................................................................46
7.1. Storage Conditions.................................................................................................................46
7.2. Manufacturing and Soldering..................................................................................................47
7.3. Packaging Specifications........................................................................................................49
7.3.1. Carrier Tape................................................................................................................49
7.3.2. Plastic Reel .................................................................................................................49
7.3.3. Packaging Process......................................................................................................50
8Appendix References .....................................................................................................................51

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Table Index
Table 1: Special Mark.............................................................................................................................. 13
Table 2: Key Features............................................................................................................................. 14
Table 3: I/O Parameters Definition.......................................................................................................... 17
Table 4: Pin Description .......................................................................................................................... 18
Table 5: Pin Definition of Power Supply and GND Pins .......................................................................... 20
Table 6: Definition of Buck Circuit Pins ................................................................................................... 21
Table 7: Recommended Inductance Parameters.................................................................................... 22
Table 8: Pin Definition of SDIO Interface................................................................................................. 23
Table 9: Pin Definition of WLAN_EN....................................................................................................... 24
Table 10: Pin Definition of WLAN_WAKE ............................................................................................... 25
Table 11: Pin Setting Description............................................................................................................ 26
Table 12: Pin Definition of SDIO Interface............................................................................................... 26
Table 13: Pin Definition of UART............................................................................................................. 27
Table 14: Pin Definition of BT_EN........................................................................................................... 28
Table 15: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT .......................................... 29
Table 16: Pin Definition of PCM Interface ............................................................................................... 29
Table 17: Pin Definition of WLAN_SLP_CLK .......................................................................................... 30
Table 18: Recommended WLAN_SLP_CLK Parameter ......................................................................... 30
Table 19: XTAL_IN/OUT Parameter Definition........................................................................................ 31
Table 20: Pin Definition of GPIOs............................................................................................................ 31
Table 21: Pin Definition of RF Antenna Interfaces................................................................................... 32
Table 22: FC909A Operating Frequency................................................................................................. 32
Table 23: Antenna Cable Requirements ................................................................................................. 35
Table 24: Antenna requirements............................................................................................................. 35
Table 25: Absolute Maximum Ratings..................................................................................................... 38
Table 26: Recommended Operating Conditions...................................................................................... 38
Table 27: General DC Electrical Characteristics for 1.8 V Domain.......................................................... 39
Table 28: General DC Electrical Characteristics for 3.3 V Domain.......................................................... 39
Table 29: Current Consumption of the Module (Normal Operation)........................................................ 39
Table 30: Conducted RF Output Power at 2.4 GHz Wi-Fi....................................................................... 40
Table 31: Conducted RF Receiving Sensitivity at 2.4 GHz Wi-Fi............................................................ 40
Table 32: BLE Transmitting and Receiving Performance........................................................................ 41
Table 33: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity)................................ 41
Table 34: Recommended Thermal Profile Parameters ........................................................................... 48
Table 35: Carrier Tape Dimension Table (Unit: mm)............................................................................... 49
Table 36: Plastic Reel Dimension Table (Unit: mm)................................................................................ 50
Table 37: Related Documents................................................................................................................. 51
Table 38: Terms and Abbreviations......................................................................................................... 51

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Figure Index
Figure 1: VBAT Circuit Reference Design............................................................................................... 20
Figure 2: Power On Timing ..................................................................................................................... 21
Figure 3: Recommended Reference Design Circuit................................................................................ 22
Figure 4: WLAN Application Interfaces Connection................................................................................. 22
Figure 5: SDIO Interface Connection ...................................................................................................... 24
Figure 6: Block Diagram of Bluetooth Application Interfaces Connection................................................ 27
Figure 7: Reference Design for UART Connection.................................................................................. 28
Figure 8: PCM Interface Connection....................................................................................................... 29
Figure 9: Reference Circuit for RF Antenna Interface ............................................................................. 33
Figure 10: Microstrip Design on a 2-layer PCB ....................................................................................... 33
Figure 11: Coplanar Waveguide Design on a 2-layer PCB ..................................................................... 34
Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)................... 34
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)................... 34
Figure 14: Dimensions of the U.FL-R-SMT Connector (Unit: mm).......................................................... 36
Figure 15: Mechanicals of U.FL-LP Connectors...................................................................................... 36
Figure 16: Space Factor of Mated Connector (Unit: mm)........................................................................ 37
Figure 17: Top and Side Dimensions...................................................................................................... 42
Figure 18: Bottom Dimension.................................................................................................................. 43
Figure 19: Recommended Footprint (Top View)...................................................................................... 44
Figure 20: Top and Bottom Views of FC909A......................................................................................... 45
Figure 21: Recommended Reflow Soldering Thermal Profile.................................................................. 47
Figure 22: Carrier Tape Dimension Drawing....................................................................................... 49
Figure 23: Plastic Reel Dimension Drawing........................................................................................ 49
Figure 24: Packaging Process................................................................................................................. 50

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1Introduction
This document defines the FC909A and describes its air interfaces and hardware interfaces which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. Associated with application notes
and user guides, you can use FC909A to design and set up applications easily.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to
avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna
shall not be less than 20cm (8 inches) during normal operation.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Any changes or modifications not expressly approved by the party responsible forcompliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify