Quectel BC65 Supplement

BC65 Hardware Design
NB-IoT Module Series
Version: 1.0
Date: 2021-02-08
Status: Released
www.quectel.com

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Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
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Copyright
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2019-07-19
Jerry WANG/
Jack WU/
Louis GU
Creation of the document
1.0
2021-02-08
Jerry WANG/
Jack WU/
Louis GU
First official release

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................7
Figure Index.................................................................................................................................................8
1Introduction..........................................................................................................................................9
1.1. Special Mark ...............................................................................................................................9
2Product Concept................................................................................................................................10
2.1. General Description..................................................................................................................10
2.2. Key Features.............................................................................................................................11
2.3. Functional Diagram...................................................................................................................12
2.4. Development Board..................................................................................................................13
3Application Interfaces .......................................................................................................................14
3.1. General Description..................................................................................................................14
3.2. Pin Assignment .........................................................................................................................15
3.3. Pin Description..........................................................................................................................16
3.4. Operating Modes.......................................................................................................................19
3.5. Power Saving............................................................................................................................20
3.5.1. Light Sleep Mode...........................................................................................................20
3.5.2. Deep Sleep Mode ..........................................................................................................20
3.6. Power Supply............................................................................................................................21
3.6.1. Power Supply Pins.........................................................................................................21
3.6.2. Reference Design for Power Supply..............................................................................22
3.7. Turn On/Off and Reset..............................................................................................................22
3.7.1. Turn On ..........................................................................................................................22
3.7.2. Turn Off ..........................................................................................................................24
3.7.3. Reset the Module...........................................................................................................25
3.8. UART Interfaces........................................................................................................................27
3.8.1. Main UART Interface......................................................................................................28
3.8.2. Debug UART Interface...................................................................................................28
3.8.3. Auxiliary UART Interface* ..............................................................................................29
3.8.4. UARTApplication...........................................................................................................29
3.9. USIM Interface..........................................................................................................................31
3.10. ADC Interface............................................................................................................................33
3.11. RI Behaviors..............................................................................................................................33
3.12. Network Status Indication.........................................................................................................33
4Antenna Interface...............................................................................................................................35
4.1. Antenna Interface......................................................................................................................35
4.1.1. Operating Bands............................................................................................................35

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4.1.2. Antenna Reference Design............................................................................................36
4.1.3. Antenna Requirements..................................................................................................36
4.2. Reference Design of RF Layout ...............................................................................................37
4.3. Recommended RF Connector for Antenna Installation............................................................39
5Reliability, Radio and Electrical Characteristics............................................................................41
5.1. Operating and Storage Temperatures ......................................................................................41
5.2. Current Consumption................................................................................................................42
5.3. RF Output Power ......................................................................................................................43
5.4. RF Receiving Sensitivity...........................................................................................................43
5.5. Electrostatic Discharge.............................................................................................................44
6Mechanical Dimensions....................................................................................................................45
6.1. Mechanical Dimensions of the Module.....................................................................................45
6.2. Recommended Footprint ..........................................................................................................47
6.3. Top and Bottom Views of the Module.......................................................................................48
7Storage, Manufacturing and Packaging..........................................................................................49
7.1. Storage......................................................................................................................................49
7.2. Manufacturing and Soldering....................................................................................................50
7.3. Packaging .................................................................................................................................51
7.3.1. Tape and Reel Packaging..............................................................................................51
8Appendix Reference..........................................................................................................................53

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Table Index
Table 1: Special Mark...................................................................................................................................9
Table 1: Frequency Bands of BC65 Module..............................................................................................10
Table 2: Key Features.................................................................................................................................11
Table 3: I/O Parameters Definition.............................................................................................................16
Table 4: Pin Description ............................................................................................................................. 16
Table 5:AP Operating Modes ....................................................................................................................19
Table 6: Modem Operating Modes............................................................................................................. 19
Table 7: Module Operating Modes............................................................................................................. 19
Table 8: Power Supply Pins .......................................................................................................................21
Table 9: PWRKEY Pin................................................................................................................................22
Table 10: Reset Pin....................................................................................................................................25
Table 11: Pin Definition of UART Interfaces...............................................................................................27
Table 12: Pin Definition of USIM Interface................................................................................................. 31
Table 13: Pin Definition of ADC Interface................................................................................................... 33
Table 14: Module Status Indicated by NETLIGHT..................................................................................... 33
Table 15: Pin Definition of the NB-IoTAntenna Interface.......................................................................... 35
Table 16: Module Operating Bands............................................................................................................35
Table 17:Antenna Cable Insertion Loss Requirements............................................................................. 36
Table 18: Required NB-IoTAntenna Parameters ......................................................................................37
Table 22: Operating and Storage Temperatures........................................................................................ 41
Table 23: Module Current Consumption (3.8 V VBAT Power Supply).......................................................42
Table 19: RF Conducted Output Power.....................................................................................................43
Table 20: RF Receiving Sensitivity Without Retransmission (Throughput ≥ 95 %)................................... 43
Table 21: RF Receiving Sensitivity in 128 Retransmissions (Throughput ≥ 95 %) ...................................44
Table 24: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %)........................44
Table 25: Recommended Thermal Profile Parameters.............................................................................. 51
Table 26: Related Documents....................................................................................................................53
Table 27: Terms and Abbreviations............................................................................................................53

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Figure Index
Figure 1: Functional Diagram.....................................................................................................................13
Figure 2: Pin Assignment (Top View).........................................................................................................15
Figure 3: Module (Modem) Power Consumption in Different Modes ........................................................20
Figure 4: Timing of Waking Up Module from Deep Sleep..........................................................................21
Figure 5: Reference Circuit for Power Supply ........................................................................................... 22
Figure 6: Turn on the Module by Using Driver Circuit................................................................................ 23
Figure 7: Turn on the Module by Using Button..........................................................................................23
Figure 8: Turn-on Timing............................................................................................................................ 24
Figure 9: Turn-off Timing (Turn Off by Disconnecting VBAT) .................................................................... 25
Figure 10: Turn-off Timing (Turn Off by AT Command AT+QPOWD=1)....................................................25
Figure 11: Reference Circuit of RESET_N by Using Driving Circuit..........................................................26
Figure 12: Reference Circuit of RESET_N by Using Button......................................................................26
Figure 13: Reset Timing.............................................................................................................................27
Figure 14: Reference Design for Main UART Interface............................................................................. 28
Figure 15: Reference Design for Debug UART Interface.......................................................................... 28
Figure 16: Reference Design for Auxiliary UART Interface .......................................................................29
Figure 17: Reference Circuit with Level Translator Chip........................................................................... 29
Figure 18: Reference Circuit with Transistor Circuit.................................................................................. 30
Figure 19: Sketch Map for RS-232 Interface Match..................................................................................30
Figure 20: Reference Circuit for USIM Interface with a 6-pin USIM Card Connector............................... 32
Figure 21: RI Timing When a URC Is Received ........................................................................................ 33
Figure 22: Reference Design for NETLIGHT............................................................................................. 34
Figure 23: Reference Design for NB-IoTAntenna Interface......................................................................36
Figure 24: Microstrip Design on a 2-layer PCB .........................................................................................37
Figure 25: Coplanar Waveguide Design on a 2-layer PCB.......................................................................37
Figure 26: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)....................38
Figure 27: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).................... 38
Figure 28: Dimensions of the U.FL-R-SMT Connector (Unit: mm)............................................................39
Figure 29: Mechanicals of U.FL-LP Connectors........................................................................................ 40
Figure 30: Space Factor of Mated Connector (Unit: mm)..........................................................................40
Figure 31: Module Top and Side Dimensions (Unit: mm).......................................................................... 45
Figure 32: Module Bottom Dimension (Bottom View, Unit: mm) ...............................................................46
Figure 33: Recommended Footprint (Top View, Unit: mm)........................................................................ 47
Figure 34: Top View of the Module.............................................................................................................48
Figure 35: Bottom View of the Module.......................................................................................................48
Figure 36: Recommended Reflow Soldering Thermal Profile ...................................................................50
Figure 37: Tape Dimensions (Unit: mm) ....................................................................................................52
Figure 38: Reel Dimensions (Unit: mm).....................................................................................................52

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1Introduction
This document defines Quectel BC65 module and describes its air interface and hardware interfaces
which are connected with your applications.
With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. This document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.

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2Product Concept
2.1. General Description
BC65 is a high-performance NB-IoT module with extremely low power consumption. It is designed to
communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP
Rel-13 and 3GPP Rel-14). BC65 supports a certain range of frequency bands as listed below.
Table 2: Frequency Bands of BC65 Module
BC65 is an SMD type module with LCC package, and has an ultra-compact profile of 17.7 mm ×15.8 mm
×2.2 mm. These features allow the module to be easily embedded into size-constrained applications and
provide reliable connectivity with applications.
BC65 provides abundant external interfaces (UART, ADC, etc.) and protocol stacks (UDP/TCP/MQTT,
etc.), which provide a great convenience for customers’applications.
Due to compact form factor, ultra-low power consumption and extended temperature range, BC65 is one
of the best choices for a certain range of IoT applications, such as smart metering, bike sharing, smart
wearables, smart parking, smart city, home appliances, security and asset tracking, agricultural and
environmental monitoring, etc. It is able to provide a complete range of SMS* and data transmission
services to meet customers’demands.
The module fully complies with the RoHS directive of the European Union.
Mode
Frequency Bands
H-FDD
B1*/B3/B5/B8/B20/B28

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2.2. Key Features
The following table describes the detailed features of BC65 module.
Table 3: Key Features
Feature
Details
Power Supply
⚫Supply voltage range: 3.2–4.2 V
⚫Typical supply voltage: 3.8 V
Power Saving
Typical power consumption: 4 μA
Frequency Bands
B1*/B3/B5/B8/B20/B28
Transmitting Power
23 dBm ±2 dB
USIM Interface
Supports 1.8/3.0 V USIM card
UART Interfaces
Main UART:
⚫Used forAT command communication and data transmission.
⚫When used for AT command communication and data transmission, baud
rates 4800 bps, 9600 bps (default), and 57600 bps are supported.
Debug UART:
⚫Used for firmware debugging and upgrading.
⚫Support 921600 bps baud rate.
Auxiliary UART*:
⚫Used forAT command communication and data transmission.
⚫When used for AT command communication and data transmission, baud
rates 4800 bps, 9600 bps (default), and 57600 bps are supported.
Network Protocols
Supports UDP/TCP/SNTP/MQTT/CoAP*/PPP/TLS*/DTLS*/HTTP* protocols
SMS*
Text/PDU Mode
Data Transmission
Rate
Cat NB1 (Max):
⚫Single-tone: 25.5 kbps (DL)/ 16.7 kbps (UL)
⚫Multi-tone: 25.5 kbps (DL)/ 62.5 kbps (UL)
Cat NB2 (Max):
⚫127 kbps (DL)/ 158.5 kbps (UL)
AT Commands
⚫3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel-13/Rel-14)
⚫Quectel Enhanced AT commands
Firmware Update
⚫DFOTA
⚫Debug UART
Physical
Characteristics
⚫Size: (17.7 ±0.15) mm ×(15.8 ±0.15) mm ×(2.2 ±0.2) mm
⚫Weight: approx. 1.0 ±0.1 g

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1. 1) Within the operating temperature range, the module meets 3GPP specifications.
2. 2) Within the extended temperature range, the module keeps the ability to establish and maintain
functions such as SMS*, data transmission, etc., without any unrecoverable malfunction. Radio
spectrum and radio network will not be influenced, while one or more specifications, such as Pout,
may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the
temperature returns to the operating temperature range, the module will meet 3GPP specifications
again.
2.3. Functional Diagram
The following figure shows a block diagram of BC65 and illustrates the major functional parts.
⚫Radio frequency
⚫Baseband
⚫Power management
⚫Peripheral interfaces
Temperature Ranges
⚫Operating temperature range: -25 °C to +75 °C 1)
⚫Extended temperature range: -40 °C to +85 °C 2)
⚫Storage temperature range: -40 °C to +90 °C
Antenna Interface
⚫50 Ωimpedance control
RoHS
⚫All hardware components are fully compliant with EU RoHS directive
NOTES

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ANT_RF
PA
PMU
BUCK
RF Transceiver
and Subsystem
XO
26 MHz
XTAL
Baseband
RESET_N
ADC
MAIN_UART
AUX_UART
Flash
PSRAM
NETLIGHT
LB TX HPM
HB RX
32 kHz
RTC BLOCK
LDO
PSM_EINT
USIM
PWRKEY DBG_UART
USIM
VBAT
VDD_EXT
Switch
Load
Switch LB TX
Filter HB TX
Filter
HB TX HPM
LB RX
HB TX LPM
LB TX LPM
RI
Figure 1: Functional Diagram
2.4. Development Board
Quectel provides a complete set of development tools to facilitate the use and test of BC65 module. The
development tool kit includes the TE-B board, USB cable, antenna and other peripherals. For more
details, see Document [1].

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3Application Interfaces
3.1. General Description
BC65 is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent
chapters provide detailed descriptions of the following functions and interfaces:
⚫Operating Modes
⚫Power Saving
⚫Power Supply
⚫Turn On/Off and Reset
⚫UART Interfaces
⚫USIM Interface
⚫ADC Interface
⚫RI Behaviors
⚫Network Status Indication

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3.2. Pin Assignment
26
15 16 17 18 19 20
21 22 36
37 38 39 40 41 42 43 44
1
2
3
4
5
6
7
8
9
11
12
13 23
24
25
27
28
29
30
31
32
33
34
35
RESERVED
ADC
GND
USIM_DATA
GND
RESERVED
RESERVED
RESERVED
RESERVED
AUX_TXD
AUX_RXD
GND
RESERVED
VDD_EXT
RESERVED
RESERVED
RI
PSM_EINT
MAIN_TXD
MAIN_RXD
NETLIGHT
RESET_N
USIM_VDD
VBAT
POWER GND UART USIM ANT RESERVED
45
46
47
48
49 50 51
52
53
54
55
565758
VBAT GND
14
ANT_RF
GND GND GND RESERVED
DBG_TXD
DBG_RXD
USIM_RST
USIM_CLK
RESERVED
PWRKEY
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
OTHERS
BC65
Top View
10 RESERVED
Figure 2: Pin Assignment (Top View)
All RESERVED pins should be kept unconnected.
NOTE

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3.3. Pin Description
Table 4: I/O Parameters Definition
Table 5: Pin Description
Type
Description
AI
Analog Input
AO
Analog Output
DI
Digital Input
DO
Digital Output
IO
Bidirectional
PI
Power Input
PO
Power Output
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT
42, 43
PI
Power supply for
the module
Vmax = 4.2 V
Vmin = 3.2 V
Vnorm = 3.8 V
VBAT = 3.2–4.2 V
VDD_EXT
24
PO
Provides 1.8 V
for external
circuit
Vnorm = 1.8 V
No voltage output in
Deep Sleep mode.
It is intended to
supply power for the
module’s pull-up
circuits, and thus it
is not recommended
to be used as the
power supply for
external circuits.
GND
1, 10, 27, 34, 36, 37, 40, 41
Power Key Interface

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Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PWRKEY
7
DI
Turn on the
module
Vnorm = 1.07 V
Active Low
Reset Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RESET_N
15
DI
Reset the
module
Vnorm = 1.07 V
Active Low
PSM_EINT Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PSM_EINT
19
DI
Dedicated
external interrupt
pin.
Used to wake up
the module from
Deep Sleep.
Vnorm = 1.07 V
Valid on the falling
edge
Network Status Indication
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
NETLIGHT
16
DO
Network status
indication
1.8 V power
domain.
If unused, keep this
pin unconnected.
ADC Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ADC
9
AI
General-purpose
ADC interface
Voltage range: 0 –1.8 V
Main UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
MAIN_RXD
18
DI
Main UART
receive
1.8 V power domain.
MAIN_TXD
17
DO
Main UART
transmit
Auxiliary UART Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment

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AUX_RXD
28
DI
Auxiliary UART
receive
1.8 V power domain.
AUX_TXD
29
DO
Auxiliary UART
transmit
Debug UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
DBG_RXD
38
DI
Debug UART
receive
1.8 V power domain.
DBG_TXD
39
DO
Debug UART
transmit
RI Signal
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RI
20
DO
Ring indication
1.8 V power domain.
USIM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USIM_VDD
14
PO
USIM card power
supply
Vnorm = 1.8/3.0 V
All signals of USIM
interface should be
protected against
ESD with a TVS
diode array.
Maximum trace
length from the
module pin to USIM
card connector is
200 mm.
USIM_RST
12
DO
USIM card reset
VOLmax = 0.1 ×USIM_VDD
VOHmin = 0.8 ×USIM_VDD
USIM_DATA
11
IO
USIM card data
VILmax = 0.2 ×USIM_VDD
VIHmin = 0.7 ×USIM_VDD
VOLmax = 0.1 ×USIM_VDD
VOHmin = 0.8 ×USIM_VDD
USIM_CLK
13
DO
USIM card clock
VOLmax = 0.1 ×USIM_VDD
VOHmin = 0.8 ×USIM_VDD
Antenna Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_RF
35
IO
Antenna
interface
50Ω impedance
control
Reserved Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RESERVED
2–6, 8, 21–23, 25, 26, 30–33, 44–58
Keep these pins
unconnected.

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Unused pins should be kept unconnected.
3.4. Operating Modes
The module mainly consists of AP, modem and entire module operating modes, and the tables below
describe the NB-IoT operating modes of them.
Table 6: AP Operating Modes
Table 7: Modem Operating Modes
Table 8: Module Operating Modes
Mode
Description
Normal
In normal mode, the AP handles tasks, such asAT command communication.
Idle
When all tasks are suspended, theAP will enter idle mode.
Mode
Description
Connected
The network is connected and the module supports data transmission. In this case, the
modem can switch to PSM or DRX/eDRX mode.
DRX/eDRX
The modem is in idle mode, and downlink data can only be received during PTW. In this
case, the modem can switch to PSM or connected mode.
PSM
In power saving mode, the modem is disconnected from the network and cannot
receive any downlink data. In this case, the modem can switch to connected mode.
Mode
Description
Active
When theAP is in normal mode or the modem is in connected mode, the module will be
active and support all services and functions.
The current consumption in active mode is higher than that in sleep modes.
Light Sleep
When the AP is in idle mode and the modem is in DRX/eDRX mode, the module will
enter Light Sleep mode. In this case, the AP tasks will be suspended and the modem
will only be able to receive downlink data during PTW.
In Light Sleep mode, the current consumption of the module is reduced greatly.
NOTE